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CHAPTER PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS Intel Product


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Package/Module/PC Card Outlines Dimensions
CHAPTER PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Intel Product Identification Codes
231369-1
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.1. 2.1.1.
CERAMIC SIDE BRAZE DUAL IN-LINE PACKAGE Symbol List Ceramic Side Braze Dual In-Line Family
Description Dimensions Distance from seating plane highest point body (lid) Distance between seating plane base plane Distance from base plane highest point body (lid) Base body thickness Width terminal leads Width terminal lead shoulder which locate seating plane (standoff geometry optional) Thickness terminal leads Largest overall package dimension length body length dimension, lead center lead center Largest overall package width dimension outside lead Body width dimensions including leads Linear spacing between centerlines body standoffs (terminal leads) Linear spacing true minimum lead position center line center line Linear spacing between true lead position outside lead outside lead Distance from seating plane lead total number potentially useable lead positions Distance from true position centerline lead position extremity body Distance from other lead edge positions extremity body Angular spacing between minimum maximum lead positions measured gauge plane
Letter Symbol
NOTES: Controlling dimension: millimeter. Dimension "e1" ("e") non-cumulative Seating plane (standoff) defined board hole size: 0.0415-0.0430 inch
Table 2-1. Packaging Family Attributes
Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch Board Assembly Type
NOTES: Alloy Kovar Leads. Multilayer Co-Fired Ceramic Body.
Ceramic Dual-In-Line C-DIP Side Brazed Sidebraze Gold Plate 0.100" Socket Insertion Mount
2.1.2.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Ceramic Dual In-Line Package
1369-0
Family: Ceramic Side Braze Millimeters Symbol 2.79 0.64 2.16 1.91 0.38 1.37 0.23 20.07 17.78 7.62 7.37 2.29 7.37 7.62 3.18 0.76 0.13 1.78 0.030 0.005 8.38 4.06 8.13 7.62 2.79 Reference 0.300 0.125 0.070 0.30 20.57 4.32 1.27 3.40 3.05 0.56 Notes 0.110 0.025 0.085 0.075 0.015 0.054 0.009 0.790 0.700 0.300 0.290 0.090 0.290 0.330 0.160 0.320 0.300 0.110 0.012 0.810 Inches 0.170 0.050 0.134 0.120 0.022 Notes
Typical Typical Reference
Typical Typical Reference
Typical Reference
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.1.3.
Lead Ceramic Dual In-Line Package
231369-
Family: Ceramic Side Braze Dual In-Line Millimeters Symbol 0.76 0.13 7.62 3.18 1.78 0.030 0.005 7.62 7.37 2.29 7.37 8.38 4.06 0.23 22.61 20.32 8.13 7.62 2.79 Reference 0.300 0.125 0.070
Inches Notes
Notes
2.79 0.64 2.16 1.91 0.38 1.37
4.32 1.27 3.40 3.05 0.56 Typical 0.30 23.11 Reference Typical
0.110 0.025 0.085 0.075 0.015 0.054 0.009 0.890 0.800 0.300 0.290 0.090 0.290
0.170 0.050 0.134 0.120 0.022 Typical 0.012 0.910 Reference 0.320 0.300 0.110 Reference 0.330 0.160 Typical
2.1.4.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Ceramic Dual In-Line Package
231369-
Family: Ceramic Side Braze Dual In-Line Millimeters Symbol
Inches Notes Solid EPROM
Notes
3.18 3.81 1.02 2.16 2.79 1.91 0.38 1.27 0.23 30.10 27.94 15.24 14.86 2.29 14.99 15.24 3.18 0.76 0.13
4.44 5.33 1.52 2.92 3.81 2.54 0.56
0.125 0.150 0.040
0.175 0.210 0.060 0.115 0.150 0.100 0.022 0.050
Solid EPROM
Solid EPROM
0.085 0.110 0.075 0.015
Solid EPROM
Typical 0.30 30.86 Reference 15.75 15.37 2.79 Reference 17.15 4.06 0.600 0.125 0.600 0.585 0.090 Typical 0.009 1.185
Typical 0.012 1.215 Typical
1.100 0.620 0.605 0.110 0.590 0.665 0.160
Reference
Reference
1.78
0.030 0.005
0.070
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.1.5.
Lead Ceramic Dual In-Line Package
231369-
Family: Ceramic Side Braze Dual In-Line Millimeters Symbol
Inches Notes Solid EPROM
Notes
3.30 3.94 1.02 2.29 2.92 2.03 0.38 1.27 0.23 35.18 33.02 15.24 14.86 2.29 14.99 15.24 3.18 0.76 0.13
4.44 5.33 1.52 2.92 3.81 2.54 0.56
0.130 0.155 0.040
0.175 0.210 0.060 0.115 0.150 0.100 0.022 0.050
Solid EPROM
Solid EPROM
0.090 0.115 0.080 0.015
Solid EPROM
Typical 0.30 35.94 Reference 15.75 15.37 2.79 Reference 17.15 4.06 0.600 0.125 0.600 0.585 0.090 Typical 0.009 1.385
Typical 0.012 1.415 Typical
1.300 0.620 0.605 0.110 0.590 0.675 0.160
Reference
Reference
1.78
0.030 0.005
0.070
2.1.6.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Ceramic Dual In-Line Package
231369-
Family: Ceramic Side Braze Dual In-Line Millimeters Symbol
Inches Notes EPROM
Notes
3.94 1.02 3.00 2.03 0.38 1.27 0.23 40.28 38.10 15.24 14.86 2.29 14.99 15.24 3.18 0.76 0.13
5.23 1.52 3.71 2.54 0.56
0.155 0.040
0.206 0.060 0.146 0.100 0.022 0.050
EPROM
EPROM
0.118 0.080 0.015
EPROM
Typical 0.30 41.00 Reference 15.75 15.37 2.79 Reference 17.15 4.06 0.600 0.125 0.600 0.585 0.090 Typical 0.009 1.586
Typical 0.012 1.614 Typical
1.500 0.620 0.605 0.110 0.590 0.675 0.160
Reference
Reference
1.78
0.030 0.005
0.070
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.1.7.
Lead Ceramic Dual In-Line Package
231369-
Family: Ceramic Side Braze Dual In-Line Millimeters Symbol 3.30 4.04 1.02 2.29 3.02 2.03 0.38 1.27 0.23 50.29 48.26 15.24 14.86 2.29 14.99 15.24 3.18 0.76 0.13 1.78 0.030 0.005 17.15 4.06 15.75 15.37 2.79 Reference 0.600 0.125 0.070 0.30 51.31 Reference 0.600 0.585 0.090 0.590 0.675 0.160 5.51 6.58 1.52 3.99 4.87 3.66 0.56 Typical Typical 0.009 1.980 1.900 0.620 0.605 0.110 Reference Solid EPROM Solid EPROM Notes 0.130 0.159 0.040 0.090 0.119 0.080 0.015 0.050 0.012 2.020 Reference Inches 0.217 0.259 0.060 0.157 0.190 0.144 0.022 Typical Typical Solid EPROM Solid EPROM Notes
2.1.8.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Ceramic Dual In-Line Package
231369-
Family: Ceramic Side Braze Dual In-Line Millimeters Symbol
Inches Notes Solid EPROM
Notes
4.24 4.95 1.02 3.23 3.94 2.95 0.38 1.27 0.23 60.45 58.42 15.24 14.86 2.29 14.99 15.24 3.18 0.76 0.13
5.51 6.32 1.52 3.99 4.80 3.66 0.56
0.167 0.195 0.040
0.217 0.249 0.060 0.157 0.189 0.144 0.022 0.50
Solid EPROM
Solid EPROM
0.127 0.155 0.116 0.015
Solid EPROM
Typical 0.30 61.47 Reference 15.75 15.37 2.79 Reference 16.89 4.06 0.600 0.125 0.600 0.585 0.090 Typical 0.009 2.380
Typical 0.012 2.420 Typical
0.620 0.605 0.110 0.590 0.665 0.160
Reference
Reference
1.78
0.030 0.005
0.070
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.2. 2.2.1.
CERAMIC LEADLESS CHIP CARRIER Symbol List Ceramic Leadless Chip Carrier Family
Description Dimensions Thickness base body Total package height Distance from base body highest point body (lid) Width terminal lead Largest overall package dimension length body length dimension, corner cutout corner cutout lead center lead center body length dimension, lead center lead center body length dimension, corner cutout index corner cutout Ceramic body fixture Largest overall package dimension width Linear spacing Linear spacing between edges true lead positions (corner terminal lead pads) lead corner lead corner Depth major index feature Width minor index feature Distance from package edge effective total number potentially useable lead positions
Letter Symbol
Inner notch radius NOTES: Controlling dimension: millimeter. Dimension "e1" ("e") non-cumulative Seating plane (standoff) defined board hole size: 0.0415-0.0430 inch. Dimensions "B", "B1", nominal. Corner configuration optional. Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch Ceramic Leadless Chip Carrier Gold Plate 0.050"
Board Assembly Type Socket Surface Mount NOTES: certified Surface Mount, must socketed. Multilayer Co-Fired Ceramic Body.
2-10
2.2.2.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Ceramic Leadless Chip Carrier
231369-9
Family: Ceramic Leadless Chip Carrier Millimeters Symbol 1.09 1.02 11.18 7.62 1.45 2.29 1.45 1.70 2.39 0.25 0.94 0.51 13.72 10.16 11.68 Reference Typical 0.043 0.040 2.03 2.39 3.12 0.36 1.09 0.76 14.22 Reference 0.440 0.300 0.057 0.090 Solid EPROM Solid EPROM Notes 0.057 0.067 0.094 0.010 0.037 0.020 0.540 0.400 0.460 Reference Typical Inches 0.080 0.094 0.123 0.014 0.043 0.030 0.560 Reference Solid EPROM Solid EPROM Notes
2-11
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.2.3.
Ceramic Leadless Chip Carrier
231369-9
Family: Ceramic Leadless Chip Carrier Millimeters Symbol 1.09 1.02 11.18 7.62 1.45 2.29 1.35 1.60 0.25 0.51 11.18 7.62 11.68 Reference Typical 0.043 0.045 1.78 2.13 0.36 0.76 11.68 Reference 0.440 0.300 0.057 0.055 Notes 0.053 0.063 0.010 0.020 0.440 0.300 0.460 Reference Typical Inches 0.070 0.084 0.014 0.030 0.460 Reference Notes
2.2.4.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Ceramic Leadless Chip Carrier
231369-9
Family: Ceramic Leadless Chip Carrier Millimeters Symbol 1.09 1.02 16.13 12.70 1.45 2.29 1.52 1.78 2.46 0.25 0.94 0.51 16.13 12.70 16.89 Reference Typical 0.043 0.040 2.54 2.90 3.63 0.36 1.09 0.76 16.89 Reference 0.635 0.500 0.057 0.090 Solid EPROM Solid EPROM Notes 0.060 0.070 0.097 0.010 0.037 0.020 0.635 0.500 0.665 Reference Typical Inches 0.100 0.114 0.143 0.014 0.043 0.030 0.665 Reference Solid EPROM Solid EPROM Notes
2-13
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.2.5.
Ceramic Leadless Chip Carrier Variation: Down
231369-10
Family: Ceramic Leadless Chip Carrier Millimeters Symbol 16.76 1.04 0.94 0.25 16.76 23.88 21.39 20.32 21.92 17.27 1.50 Typical 1.37 2.16 0.84 23.88 21.39 20.32 21.92 17.27 24.38 21.79 Reference Reference 0.660 0.041 0.037 0.010 1.68 2.72 0.99 24.38 21.39 Reference Reference 0.660 0.940 0.842 0.800 0.863 0.680 0.059 Typical Typical Notes 0.054 0.085 0.033 0.940 0.842 0.800 0.863 0.680 0.960 0.858 Reference Reference Inches 0.066 0.107 0.039 0.960 0.858 Reference Reference Typical Notes
2-14
2.2.6.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Ceramic Leadless Chip Carrier Variation:
231369-11
Family: Ceramic Leadless Chip Carrier Millimeters Symbol 14.33 1.04 1.27 0.25 23.88 21.39 20.32 22.05 15.14 1.50 Typical 1.91 2.92 0.84 23.88 21.39 20.32 22.05 24.38 21.79 Reference Reference 0.564 0.041 0.050 0.010 2.41 3.68 1.12 24.38 21.79 Reference Reference 0.940 0.842 0.800 0.868 0.596 0.059 Typical W/EPROM Notes 0.075 0.115 0.033 0.940 0.842 0.800 0.868 0.960 0.858 Reference Reference Inches 0.095 0.145 0.044 0.960 0.858 Reference Reference W/EPROM Notes
2-15
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.3. 2.3.1.
CERAMIC GRID ARRAY PACKAGE Symbol List Square Ceramic Grid Array Family
Description Dimensions Distance from seating plane highest point body Distance between seating plane base plane Distance from base plane highest point body Distance from seating plane bottom body Heat spreader thickness Diameter terminal lead Largest overall package dimension length body length dimension, outer lead center outer lead center Heat spreader length width Linear spacing between true lead position centerlines Distance from seating plane lead total number potentially useable lead positions Other body dimension, outer lead center edge body
Letter Symbol
NOTES: Controlling dimension: millimeter. Dimension "e1" ("e") non-cumulative. Seating plane (standoff) defined P.C. board hole size: 0.0415 0.0430 inch. Dimensions "B", "B1" normal. Details identifier optional.
Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Material Lead Braze Material Lead Pitch Board Assembly Type Ceramic Grid Array C-PGA Array 132, 168-208, 240-280, 272-320 Gold Plate, Microinches Gold over 100-350 Microinches Nickel Plate Kovar Alloy Copper/Silver Eutectic 0.100" Socket Insertion Mount
NOTES: Alloy Kovar Leads. Multilayer Co-Fired Ceramic Body. 240-280 variable count.
2-16
2.3.2.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Ceramic Grid Array Package
231369-13
Family: Ceramic Grid Array Package (Cabity Millimeters Symbol 1.27 4.06 3.30 1.14 2.16 2.67 0.43 34.04 30.35 2.29 3.05 5.21 4.32 1.40 3.18 3.94 0.51 35.05 30.61 2.79 3.56 2.54 0.050 Solid EPROM Notes EPROM Solid 0.160 0.130 0.045 0.085 0.105 0.017 1.340 1.195 0.090 0.120 Inches 0.205 0.170 0.055 0.125 0.155 0.020 1.380 1.205 0.110 0.140 0.100 Solid EPROM Notes EPROM Solid
2-17
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.3.3.
Lead Ceramic Grid Array Package
231369-14
Family: Ceramic Grid Array Package Millimeters Symbol 1.27 2.72 3.43 1.14 0.43 28.95 25.27 2.29 2.54 3.56 0.76 4.57 1.27 0.41 3.43 4.32 1.40 0.51 29.97 25.53 2.79 3.30 2.54 0.050 Solid EPROM Solid EPROM 0.107 0.135 0.045 0.017 1.140 0.995 0.090 0.100 Notes 0.140 0.030 Inches 0.180 0.050 0.016 0.135 0.170 0.055 0.020 1.180 1.005 0.110 0.130 0.100 Solid EPROM Solid EPROM Notes
2-18
2.3.4.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Ceramic Grid Array Package
231369-15
Family: Ceramic Grid Array Package Millimeters Symbol 1.27 3.56 0.76 2.67 1.14 0.43 34.03 30.35 2.29 2.54 4.57 1.27 3.43 1.40 0.51 35.05 30.61 2.79 3.30 2.54 0.050 Solid Solid Notes 0.140 0.030 0.105 0.045 0.017 1.340 1.195 0.090 0.100 Inches 0.180 0.050 0.135 0.055 0.020 1.380 1.205 0.110 0.130 0.100 Solid Solid Notes
2-19
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.3.5.
Lead Ceramic Grid Array Package
231369-16
Family: Ceramic Grid Array Package Millimeters Symbol 1.27 3.56 0.76 2.67 1.14 0.43 36.57 32.89 2.29 2.54 4.57 1.27 3.43 1.40 0.51 37.59 33.15 2.79 3.30 2.54 0.050 Solid Solid Notes 0.140 0.030 0.105 0.045 0.017 1.440 1.295 0.090 0.100 Inches 0.180 0.050 0.135 0.055 0.020 1.480 1.305 0.110 0.130 0.100 Solid Solid Notes
2-20
2.3.6.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
1.75" Ceramic Grid Array Package
231369-18
Family: Ceramic Grid Array Package Millimeters Symbol 1.52 3.56 0.64 2.79 1.14 0.43 44.19 40.51 2.29 2.54 4.57 1.14 3.56 1.40 0.51 45.21 40.77 2.79 3.30 168/208 2.54 0.060 Solid Solid Notes 0.140 0.025 0.110 0.045 0.017 1.740 1.595 0.090 0.100 Inches 0.180 0.045 0.140 0.055 0.020 1.780 1.605 0.110 0.130 168/208 0.100 Solid Solid Notes
2-21
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.3.7.
1.95" Ceramic Grid Array Package
231369-19
Family: Ceramic Grid Array Package Millimeters Symbol 3.56 0.64 2.79 1.14 0.43 49.27 45.59 2.29 2.54 1.52 4.57 1.14 3.56 1.40 0.51 50.29 45.85 2.79 3.30 2.54 Ceramic Ceramic Notes 0.140 0.025 0.110 0.045 0.017 1.940 1.795 0.090 0.100 0.060 Inches 0.180 0.045 0.140 0.055 0.020 1.980 1.805 0.110 0.130 0.100 Ceramic Ceramic Notes
2-2.3.8.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
1.95" Ceramic Grid Array Package Variation: without Stand-Off Pins
231369-86
Family: Ceramic Grid Array Package Millimeters Symbol 2.51 0.33 2.84 0.43 49.53 45.59 2.29 2.54 1.52 3.07 0.43 3.51 0.51 50.29 45.85 2.79 3.30 2.54 Metal Metal Notes 0.099 0.013 0.112 0.017 1.940 1.795 0.090 0.120 0.060 Inches 0.121 0.017 0.138 0.020 1.980 1.805 0.110 0.130 0.100 Metal Metal Notes
2-23
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.3.9.
2.16" Ceramic Grid Array Package Variation: without Stand-Off Pins
231369-91
Family: Ceramic Grid Array Package Millimeters Symbol 2.62 0.38 2.94 0.43 54.61 50.67 2.29 2.54 1.651 2.97 0.43 3.48 0.51 55.12 50.93 2.79 3.30 2.16 Metal Metal Notes 0.103 0.015 0.116 0.017 2.150 1.995 0.090 0.120 0.065 Inches 0.117 0.017 0.137 0.020 2.170 2.005 0.110 0.130 0.085 Metal Metal Notes
2-24
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.3.10. 2.16" Ceramic Grid Array Package Variation: without Stand-Off Pins, with Heat Spreader
231369-9
Family: Ceramic Grid Array Package Millimeters Symbol 3.59 0.38 2.62 0.97 0.43 54.61 50.67 37.85 2.29 3.05 1.651 4.19 0.43 2.97 1.22 0.51 55.12 50.93 38.35 2.79 3.30 2.16 Notes Metal Metal 0.141 0.015 0.103 0.038 0.017 2.150 1.995 1.490 0.090 0.120 0.065 Inches 0.165 0.017 0.117 0.048 0.020 2.170 2.005 1.510 0.110 0.130 0.085 Notes Metal Metal
2-25
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.3.11. 1.95" Ceramic Grid Array Package Variation: without Stand-Off Pins, Staggered 0.100" Pitch with Heat Spreader
231369-93
Family: Ceramic Grid Array Package Millimeters Symbol 3.59 0.38 2.62 0.97 0.43 49.28 45.59 31.50 2.29 3.05 1.52 4.19 0.43 2.97 1.22 0.51 49.78 45.85 32.00 2.79 3.30 2.54 Notes Metal Metal 0.141 0.015 0.103 0.038 0.017 1.940 1.795 1.240 0.090 0.120 0.060 Inches 0.165 0.017 0.117 0.048 0.020 1.960 1.805 1.260 0.110 0.130 0.100 Notes Metal Metal
2-26
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.3.12. 1.95" Ceramic Grid Array Package Variation: without Stand-Off Pins, Staggered 0.100" Pitch
231369-A0
Family: Ceramic Grid Array Package Millimeters Symbol ISSUE 2.62 0.69 3.31 0.43 49.28 45.59 2.29 3.05 1.52 2.97 0.84 3.81 0.51 49.78 45.85 2.79 3.30 2.54 11/29/88 Ceramic Ceramic Notes 0.103 0.027 0.130 0.017 1.940 1.795 0.090 0.120 0.060 Inches 0.117 0.033 0.150 0.020 1.960 1.805 0.110 0.130 0.100 Ceramic Ceramic Notes
2-27
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.3.13. Ceramic Rectangular Grid Array Package Family
Letter Symbol Description Dimensions Distance from seating plane highest point body Distance between seating plane base plane Distance from base plane highest point body Distance from seating plane bottom body Head spreader thickness center clearance Diameter terminal Largest overall package dimension width Body width dimension, outer lead center outer lead center Heat spreader width Largest overall package dimension length Body length dimension, outer lead center outer lead center Heat spreader length Linear spacing between true lead position centerlines Linear spacing between true lead position centerlines "staggered pitch" Capacitor clearance area Capacitor clearance area Capacitor clearance area Capacitor clearance area Capacitor clearance area Distance from seating plane lead Lead count Other body dimensions, outer lead center edge body
NOTES: Controlling dimensions: Inches. Dimensions "e1" non-cumulative. Details identifier optional.
Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Material Lead Pitch Board Assembly Type
NOTES: Alloy Kovar leads. Multilayer Co-Fired Ceramic Body.
Ceramic Grid Array CPGA, SPGA Array Kovar over Alloy 0.100" Staggered Socket Mount
2-28
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.3.14. Lead Ceramic Grid Array Package
231369-A1
Symbol
3.56 0.97 1.07 0.43 62.23 58.29 30.48 67.31 63.37 56.26 2.29 1.02 9.65 9.65 3.05
Family: Ceramic Grid Array Package Millimeters Notes 4.19 0.140 1.19 Solid 5.46 Solid 1.22 0.038 0.042 0.51 0.017 62.74 2.450 58.55 2.295 35.56 1.200 67.82 2.650 63.63 2.495 56.77 2.215 2.79 0.090 1.52 0.040 26.04 0.290 0.380 4.95 1.22 3.30 0.120 2.54 0.060
Inches 0.165 0.047 0.215 0.048 0.020 2.470 2.305 1.400 2.670 2.505 2.235 0.110 0.060 1.025 0.195 0.048 0.130 0.100
Notes Solid Solid
2-29
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.4. 2.4.1.
CERAMIC QUADPACK PACKAGE Symbol List Ceramic Quadpack Family
Description Dimensions Distance from seating plane highest point body (lid) Ceramic body thickness Width terminal leads Thickness terminal leads Largest overall package dimension length Largest overall package dimension length excluding leads body length dimension, outer lead center outer lead center Linear spacing between centerlines terminal leads Lead dimension free lead length total number potentially useable lead positions Distance from true position centerline lead position extremity body Linear spacing true maximum lead position from lead edge package edge
Letter Symbol
NOTES: Controlling dimension: millimeter. Dimension "e1" ("e") non-cumulative. numbering ascending counterclockwise direction. Dimensions "B1" nominal.
Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch Board Assembly Type NOTES: Alloy Kovar leads. Sold unformed carrier. Ceramic Quadpack CQFP Quad Gold Plate SolderCoat 0.050" Socket Surface Mount
2-30
2.4.2.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Ceramic Quadpack Package
231369-21
Figure 2-1. Principle Dimensions Datums
Detail
231369-Detail 231369-97
231369-23
Detail
231369-97
Figure 2-2. Details
2-31
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.4.3.
Ceramic Quadpack Package
Family: Lead Ceramic Quadpack Family Millimeters Inches Notes Solid EPROM 0.088 0.115 0.078 Places Typical Typical Typical 0.016 0.040 0.030 0.005 0.008 1.640 0.926 Places 11.43 1.52 1.91 1.27 0.050 0.075 0.800 0.050 0.350 0.040 0.450 0.060 0.106 0.145 0.094 0.021 0.060 0.040 0.020 0.012 1.870 0.970 Places Places Typical Typical Typical Notes Solid EPROM
Symbol
2.23 2.91 1.98 0.41 1.02 0.76 0.13 0.20 41.66 23.52 20.32 1.27 8.89
2.69 3.68 2.39 0.53 1.52 1.02 0.51 0.31 47.50 24.64
2.5. 2.5.1.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
CERAMIC QUAD FLATPACK PACKAGE Symbol List Quadpack Family
Description Dimensions Distance From Seating Plane Highest Point Body (Lid) Ceramic Body Thickness Distance From Ceramic Bottom Lead Width Terminal Leads Thickness Terminal Leads Largest Overall Package Dimension Length Largest Overall Package Dimension Length Excluding Leads Body Length Dimension, Outer Lead Center Outer Lead Center Linear Spacing Between Centerlines Terminal Leads Distance From Body Centerline Locator Holes Distance Between Opposite Locator Holes Distance From Lead Centerline Locator Holes Lead Dimension Free Lead Length Total number potentially useable lead positions Distance From True Position Centerline Lead Position Extremity Body Linear Spacing True Maximum Lead Position From Lead Edge Package Edge
Letter Symbol
NOTES: Dimension "e1" ("e") non-cumulative. numbering ascending counterclockwise direction. Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Material Lead Braze Material Lead Pitch Board Assembly Type Ceramic Quad Flatpack CQFP Quad 164, Gold Plate, Microinches Gold over 100-350 Microinches Nickel Plate Kovar Copper/Silver Eutectic 0.025" Socket Surface Mount
2-33
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.5.2.
Lead Ceramic Quad Flatpack Package Variation: Cavity with
231369-24
231369-25
2-34
2.5.3.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Ceramic Quad Flatpack Package Variation: Cavity with (Contd.)
Family: Ceramic Quadpack Millimeters Inches Notes Solid EPROM 0.088 0.115 0.078 0.006 0.007 0.004 2.480 1.120 Basic 0.69 29.21 58.42 16.51 9.27 10.03 1.52 1.52 2.03 1.93 Reference 0.060 0.060 Basic Basic Basic 0.365 0.023 1.150 2.30 0.650 0.395 0.080 0.076 Reference 1.000 0.027 Basic Basic Basic 0.115 0.140 0.094 0.012 0.010 0.006 2.520 1.140 Basic Notes Solid EPROM
Symbol
2.23 2.92 1.98 0.15 0.18 0.10 63.50 28.45 25.40 0.58
2.92 3.56 2.39 0.30 0.25 0.15 64.01 28.96
2-35
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.5.4.
Lead Ceramic Quad Flatpack Package Variation: Cavity with
231369-26
231369-27
2-36
2.5.5.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Ceramic Quad Flatpack Package Variation: Cavity with (Contd.)
Family: Ceramic Quadpack Millimeters Inches Notes Solid EPROM 0.088 0.115 0.078 0.006 0.008 0.004 2.480 1.325 Basic 0.69 29.21 58.42 19.05 9.27 10.03 1.27 1.14 2.03 1.93 Reference 0.050 0.045 Basic Basic Basic 0.365 0.023 1.150 2.30 0.750 0.395 0.080 0.076 Reference 1.200 0.027 Basic Basic Basic 0.115 0.140 0.094 0.012 0.010 0.008 2.520 1.345 Basic Notes Solid EPROM
Symbol
2.23 2.92 1.96 0.15 0.20 0.10 63.50 33.65 30.48 0.58
2.92 3.56 2.39 0.30 0.25 0.20 64.01 34.16
NOTE: Currently Military application only.
2-37
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.6. 2.6.1.
CERDIP DUAL IN-LINE PACKAGE Symbol List Cerdip Dual In-Line Family
Description Dimensions Distance from seating plane highest point body Distance between seating plane base plane Distance from base plane highest point body (lid) Base body thickness Width terminal leads Width terminal lead shoulder which locate seating plane (standoff geometry optional) Thickness terminal leads Largest overall package dimension length body length dimension, lead center lead center Largest overall package width dimension outside lead Body width dimensions including leads Linear spacing true minimum lead position center line center line Linear spacing between true lead position outside lead outside lead Linear spacing between centerlines body standoffs (terminal leads) Distance from seating plane lead total number potentially useable lead positions Distance from true position centerline lead position extremity body Distance from other lead edge positions extremity body Angular spacing between minimum maximum lead positions measured gauge plane
Letter Symbol
NOTES: Controlling dimension: millimeter. Dimension "e1" ("e") non-cumulative. Seating plane (standoff) defined P.C. board hole size: 0.0415 0.0430 inch. Dimension "B1" normal.
Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch Board Assembly Type
Packaging Family Attributes Cerdip Cerdip Dual-In-Line Plate Solder Plate 0.100" Socket Surface Mount
NOTES: Alloy Leads. Pressed Ceramic Body. Window available reprogramming.
2-38
2.6.2.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Cerdip Dual In-Line Package
231369-28
Family: Cerdip Dual In-Line Package Millimeters Symbol 0.25 0.13 8.13 3.18 1.27 7.62 7.11 2.29 7.87 10.16 3.81 Leads 0.010 0.005 0.23 19.05 17.78 8.13 7.90 2.79 Reference 0.320 0.125 0.050 0.38 3.56 3.56 0.41 1.52 0.30 19.94 Reference 0.300 0.280 0.090 0.310 0.400 0.150 Leads 4.44 4.44 0.51 Typical Typical 0.009 0.750 0.700 0.320 0.311 0.110 Reference 5.08 0.015 0.140 0.140 0.016 0.060 0.012 0.785 Reference 0.175 0.175 0.020 Typical Typical Notes Inches 0.200 Notes
2-39
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.6.3.
Lead Cerdip Dual In-Line Package
231369-28
Family: Cerdip Dual In-Line Package Millimeters Symbol 0.64 0.13 8.13 3.18 1.78 7.62 7.11 2.29 7.87 10.16 3.81 Leads 0.025 0.005 0.23 22.35 20.32 8.13 7.90 Reference 0.320 0.125 0.070 0.38 3.56 3.56 0.41 1.52 0.30 23.24 Reference 0.300 0.280 0.090 0.310 0.400 0.150 Leads 4.44 4.44 0.51 Typical Typical 0.009 0.880 0.800 0.320 0.311 0.110 Reference 5.08 0.015 0.140 0.140 0.016 0.060 0.012 0.915 Reference 0.175 0.175 0.020 Typical Typical Notes Inches 0.200 Notes
2-40
2.6.4.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Cerdip Dual In-Line Package
231369-28
Family: Cerdip Dual In-Line Package Millimeters Symbol 0.38 0.13 8.13 3.18 1.78 7.62 7.11 2.29 7.87 10.16 3.81 Leads 0.015 0.005 0.23 24.38 22.86 8.13 7.90 2.79 Reference 0.320 0.125 0.070 0.38 3.56 3.56 0.41 1.52 0.30 25.27 Reference 0.300 0.280 0.090 0.310 0.400 0.150 Leads 4.24 4.24 0.51 Typical Typical 0.009 0.960 0.900 0.320 0.311 0.110 Reference 5.08 0.015 0.140 0.140 0.016 0.060 0.012 0.995 Reference 0.167 0.167 0.020 Typical Typical Notes Inches 0.200 Notes
2-41
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.6.5.
Lead Cerdip Dual In-Line Package (300 MIL)
231369-29
Family: Cerdip Dual In-Line Package Millimeters Symbol 0.13 8.13 3.18 2.29 0.005 7.62 7.11 2.29 7.87 10.16 4.06 0.23 31.50 27.94 8.13 7.87 2.79 Reference 0.320 0.125 0.090 0.38 3.56 3.56 0.41 1.42 0.30 32.64 Reference 0.300 0.280 0.090 0.310 0.400 0.160 4.83 4.44 0.51 Typical Typical 0.009 1.240 1.100 0.320 0.310 0.110 Reference 5.72 0.015 0.140 0.140 0.016 0.056 0.012 1.285 Reference 0.190 0.175 0.020 Typical Typical Notes Inches 0.225 Notes
2.6.6.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Cerdip Dual In-Line Package (600 MIL)
231369-29
Family: Cerdip Dual In-Line Package Millimeters Symbol 1.40 0.13 15.75 3.18 2.29 15.24 13.08 2.29 15.49 17.78 3.81 0.055 0.005 0.23 31.50 27.94 15.75 15.24 2.79 Reference 0.620 0.125 0.090 0.38 3.56 3.56 0.41 1.52 0.30 32.64 Reference 0.600 0.515 0.090 0.610 0.700 0.150 4.70 4.44 0.51 Typical Typical 0.009 1.240 1.100 0.620 0.600 0.110 Reference 5.08 0.015 0.140 0.140 0.016 0.060 0.012 1.285 Reference 0.185 0.175 0.020 Typical Typical Notes Inches 0.200 Notes
2-43
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.6.7.
Lead Cerdip Dual In-Line Package (300 MIL) Variation: Skinny
231369-29
Family: Cerdip Dual In-Line Package Millimeters Symbol 0.13 8.13 3.18 2.29 0.005 7.62 7.11 2.29 7.87 10.16 4.06 0.23 36.58 33.02 8.13 7.87 2.79 Reference 0.320 0.125 0.090 0.38 3.56 3.56 0.41 1.42 0.30 37.72 Reference 0.300 0.280 0.090 0.310 0.400 0.160 4.83 4.44 0.51 Typical Typical 0.009 1.440 1.300 0.320 0.310 0.110 Reference 5.72 0.015 0.140 0.140 0.016 0.056 0.012 1.485 Reference 0.190 0.175 0.020 Typical Typical Notes Inches 0.225 Notes
2-44
2.6.8.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Cerdip Dual In-Line Package (600 MIL)
231369-29
Family: Cerdip Dual In-Line Package Millimeters Symbol 1.40 0.13 15.75 3.18 2.29 0.055 0.005 15.24 13.08 2.29 15.49 17.78 4.32 0.23 36.58 33.02 15.75 15.37 2.79 Reference 0.620 0.125 0.090 0.38 3.56 3.56 0.41 1.52 0.30 37.72 Reference 0.600 0.515 0.090 0.610 0.700 0.170 4.95 4.70 0.51 Typical Typical 0.009 1.440 1.300 0.620 0.605 0.110 Reference 5.72 0.015 0.140 0.140 0.016 0.060 0.012 1.485 Reference 0.195 0.185 0.020 Typical Typical Notes Inches 0.225 Notes
2-45
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.6.9.
Lead Cerdip Dual In-Line Package
231369-29
Family: Cerdip Dual In-Line Package Millimeters Symbol 1.40 0.13 15.75 3.18 2.29 0.055 0.005 15.24 14.48 2.29 15.49 17.78 4.32 0.23 41.66 41.91 15.75 15.37 2.79 Reference 0.620 0.125 0.090 0.38 3.56 3.56 0.41 1.52 0.30 42.67 Reference 0.600 0.570 0.090 0.610 0.700 0.170 4.95 4.70 0.51 Typical Typical 0.009 1.640 1.650 0.620 0.605 0.110 Reference 5.72 0.015 0.140 0.140 0.016 0.060 0.012 1.680 Reference 0.195 0.185 0.020 Typical Typical Notes Inches 0.225 Notes
2-46
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.6.10. Lead Cerdip Dual In-Line Package
231369-29
Family: Cerdip Dual In-Line Package Millimeters Symbol 1.40 0.13 15.75 3.18 2.29 0.055 0.005 15.24 13.08 2.29 15.49 17.78 4.32 0.23 51.69 48.26 15.75 15.37 2.79 Reference 0.620 0.125 0.090 0.38 3.56 3.56 0.41 1.52 0.30 52.96 Reference 0.600 0.515 0.090 0.610 0.700 0.170 4.95 4.70 0.51 Typical 0.009 2.035 1.900 0.620 0.605 0.110 Reference 5.72 0.015 0.140 0.140 0.016 0.060 0.012 2.085 Reference 0.195 0.185 0.020 Typical Notes Inches 0.225 Notes
2-47
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.6.11. Lead Cerdip Dual In-Line Package
231369-29
Family: Cerdip Dual In-Line Package Millimeters Symbol 1.40 0.13 15.75 3.18 2.29 0.055 0.005 15.24 13.08 2.29 15.49 17.78 4.32 0.23 54.23 50.80 15.75 15.37 2.79 Reference 0.620 0.125 0.090 0.38 3.56 3.56 0.41 1.52 0.30 55.50 Reference 0.600 0.515 0.090 0.610 0.700 0.170 4.95 4.70 0.51 Typical 0.009 2.135 2.000 0.620 0.605 0.110 Reference 5.72 0.015 0.140 0.140 0.016 0.060 0.012 2.185 Reference 0.195 0.185 0.020 Typical Notes Inches 0.225 Notes
2-48
2.7. 2.7.1.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
CERQUAD PACKAGE Symbol List Cerquad Family
Description Dimensions Overall Height Shoulder Board Height Lead thickness Seating Plane Coplanarity Outside Dimension Ceramic Body Dimension Footprint Footprint Outside Dimension Ceramic Body Dimension Footprint Footprint
Letter Symbol
Total number potentially useable leads NOTES: dimensions tolerances conform ANSI 14.5M-1982. determined seating plane -E-. Dimensions included glass protrusion. Controlling dimension, inch. dimensions tolerances include lead trim offset lead plating finish. Packaging Family Attributes
Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch Board Assembly Type
Cerquad Cerquad Quad Solder Coat 0.050" Socket
NOTES: Alloy Leads. Pressed Ceramic body. Window available reprogramming. Compatible with PLCC Footprint. certified Surface Mount, must Socketed.
2-49
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Inches
2.7.2.
Cerquad Package (Square)
Family: Lead Cerquad Square Millimeters
Symbol
3.94 2.29 0.15 0.00 17.40 16.00 15.24 12.70 17.40 16.36 15.24 12.70
4.57 3.05 0.25 0.15 17.65 16.66 15.75
Notes 0.155 0.090 0.006 0.000 0.685 0.630 0.590 0.500
0.180 0.120 0.010 0.006 0.695 0.656 0.630
Notes
0.100 0.007
0.690 0.650 0.620 (Note (Note Reference
17.65 16.66 15.75
0.685 0.635 0.590 0.500
0.695 0.656 0.630
0.690 0.650 0.620 (Note (Note Reference
2-50
2.7.3.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Cerquad Package (Square)
Family: Lead Cerquad Square Millimeters Inches Notes 0.165 0.090 0.006 0.000 0.785 0.730 0.690 0.600 20.19 19.202 18.54 15.24 0.785 0.735 0.690 0.600 0.795 0.756 0.730 0.790 0.750 0.720 (Note (Note Reference 0.190 0.130 0.010 0.006 0.795 0.756 0.73 0.790 0.750 0.720 (Note (Note Reference 0.100 0.007 Notes
Symbol
4.20 2.29 0.15 0.00 19.94 18.542 17.53 15.24 19.94 18.669 17.53
4.83 3.30 0.25 0.15 20.19 19.202 18.54
Family: Lead Cerquad Square Millimeters Symbol 25.02 23.93 22.86 20.32 3.94 2.29 0.15 0.00 25.02 23.62 22.86 20.32 25.27 24.33 23.37 4.83 3.05 0.25 0.15 25.27 24.33 23.37 Notes 0.155 0.090 0.006 0.000 0.985 0.930 0.890 0.800 0.985 0.935 0.890 0.800 0.995 0.958 0.930 0.990 0.950 0.920 (Note (Note Reference 0.190 0.120 0.010 0.006 0.995 0.958 0.930 0.990 0.950 0.920 (Note (Note Reference 0.100 0.007 Inches Notes
2-51
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
(inch)
231369-30
Figure 2-3. Principal Dimensions Datums
(inch)
231369-31
Figure 2-4. Terminal Details
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Detail
(inch)
231369-3
Detail Sides
(inch)
231369-33
2-53
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.8. 2.8.1.
PLASTIC DUAL IN-LINE PACKAGE Symbol List Plastic Dual In-Line Family
Description Dimensions Angular spacing between minimum maximum lead positions measured gauge plane Distance from seating plane highest point body (lid) Distance between seating plane base plane Distance from base plane highest point body (lid) Base body thickness Width terminal leads Width terminal lead shoulder which locates seating plane (standoff geometry optional) Thickness terminal leads Largest overall package dimension length body length dimension, lead center lead center Largest overall package width dimension outside lead Body width dimensions including leads Linear spacing true minimum lead position center line center line Linear spacing between true lead position outside lead outside lead Linear spacing between centerlines body standoffs (terminal leads) Distance from seating plane lead total number potentially useable lead positions Distance from true position centerline lead position extremity body Distance from other lead edge positions extremity body
Letter Symbol
NOTES: Controlling dimension: millimeter. Dimension "e1" ("e") non-cumulative. Seating plane (standoff) defined P.C. board hole size: 0.0415 0.0430 inch. Dimension "B1" normal. Details identifier optional. Packaging Family Attributes Category Plastic Dual-In-Line Acronym PDIP Lead Configuration Dual-In-Line Lead Counts Lead Finish Solder Coat Lead Pitch 0.100" Board Assembly Type Socket Surface Mount NOTES: Alloy Alloy Leads. Novalac Body.
2-54
2.8.2.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Plastic Dual In-Line Package Variation: Lead
231369-34
Family: Plastic Dual In-Line Package Millimeters Symbol 7.62 3.05 0.51 0.23 6.10 2.29 7.37 10.16 3.68 0.20 18.78 17.78 8.13 6.60 2.79 Typical Reference 0.300 0.120 0.240 0.090 0.290 0.400 0.145 0.38 3.18 0.41 1.52 0.36 19.81 Reference 3.56 0.53 Typical Typical 0.008 0.740 0.700 0.320 0.260 0.110 Typical Reference 5.08 0.015 0.125 0.016 0.060 0.014 0.780 Reference 0.140 0.021 Typical Typical Notes Inches 0.200 Notes
Lead
Lead
0.020 0.009 0.040
2-55
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.8.3.
Lead Plastic Dual In-Line Package Variation: Lead/Widebody
231369-34
Family: Plastic Dual In-Line Package Millimeters Symbol 0.51 0.23 7.62 3.05 1.02 6.73 2.29 7.37 10.16 3.68 Leads/Widebody 0.020 0.009 Reference 0.23 19.18 0.38 3.18 0.41 1.52 0.30 19.81 Reference 8.13 6.99 0.265 0.090 3.61 0.51 Typical Typical 5.08 0.015 0.125 0.016 0.142 0.020 Typical Typical Notes 0.200 Inches Notes
0.060 0.009 0.755 0.012 0.780
17.78
0.700 0.320 0.275 0.110
Reference
0.290 0.300 0.120 0.040 0.400 0.145
Reference
Lead/Widebody
2-56
2.8.4.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Plastic Dual In-Line Package Variation: Lead
231369-34
Family: Plastic Dual In-Line Package Millimeters Symbol 3.05 0.120 6.27 2.54 7.62 8.13 6.53 Typical Typical Typical 0.320 0.247 0.257 Typical Typical Typical 0.20 22.83 3.57 0.51 3.06 0.36 1.27 0.30 23.09 4.06 0.56 Typical 4.57 Notes 0.140 0.020 0.120 0.014 0.160 0.022 Typical 0.180 Inches Notes
0.050 0.008 0.899 0.012 0.909
0.100 0.300
Lead
Lead
2-57
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.8.5.
Lead Plastic Dual In-Line Package Variation: Lead/Widebody
231369-34
Family: Plastic Dual In-Line Package Millimeters Symbol 3.00 3.68 Widebody 0.118 Widebody 2.54 7.62 7.37 Typical 0.300 0.290 0.100 Typical Typical 0.51 3.43 0.41 1.19 0.20 21.84 3.68 0.58 1.49 0.30 22.37 5.004 0.020 0.135 0.016 0.047 0.008 0.860 0.145 0.023 0.065 0.012 0.875 Notes 0.197 Inches Notes
2-58
2.8.6.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Plastic Dual In-Line Package
231369-35
Family: Plastic Dual In-Line Package Millimeters Symbol 1.02 0.23 7.62 3.05 1.52 0.040 0.009 6.10 2.29 7.66 10.16 3.68 0.20 21.34 0.38 3.18 0.41 1.52 0.36 23.37 Reference 8.26 7.37 2.79 Reference 0.240 0.090 3.68 0.53 Typical Typical 5.08 0.015 0.125 0.016 0.145 0.021 Typical Typical Notes 0.200 Inches Notes
0.060 0.008 0.240 0.014 0.920
20.3
0.800 0.320 0.290 0.110
Reference
0.290 0.300 0.120 0.060 0.400 0.145
Reference
2-59
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.8.7.
Lead Plastic Dual In-Line Package Variation: Widebody
231369-35
Family: Plastic Dual In-Line Package Millimeters Symbol 1.02 0.23 7.62 3.18 1.52 6.73 2.29 7.37 10.16 3.68 Widebody 0.040 0.009 0.23 22.73 0.38 3.18 0.41 1.52 0.30 23.37 Reference 8.13 6.98 2.79 Reference 0.265 0.090 3.56 0.51 Typical Typical 5.08 0.015 0.125 0.016 0.140 0.020 Typical Typical Notes 0.200 Inches Notes
0.060 0.009 0.895 0.012 0.920
20.3
0.800 0.320 0.275 0.110
Reference
0.290 0.300 0.125 0.060 0.400 0.145
Reference
Widebody
2-60
2.8.8.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead Plastic Dual In-Line Package
231369-35
Family: Plastic Dual In-Line Package Millimeters Symbol 7.62 3.00 1.40 0.61 1.91 0.38 3.18 0.41 1.19 0.20 24.43 3.68 0.58 1.52 0.30 26.67 Reference 8.13 6.48 2.79 7.37 10.16 3.68 0.055 0.024 0.075 Reference 5.08 0.015 0.125 0.016 0.047 0.008 0.962 0.145 0.023 0.060 0.012 1.050 Reference Notes 0.200 Inches Notes
22.86 7.62 6.22 2.29
0.900 0.300 0.245 0.090 0.320 0.255 0.110
0.290 0.300 0.118 0.400 0.145
Reference
2-61
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.8.9.
Lead Plastic Dual In-Line Package (300 MIL) Variation: Skinny
231369-35
Family: Plastic Dual In-Line Package Millimeters Symbol 1.78 1.02 7.62 3.05 2.03 0.38 3.18 0.41 1.40 0.20 31.34 7.62 6.35 2.54 7.62 10.16 3.68 0.070 0.040 27.94 8.26 8.26 Reference Reference 3.65 0.51 1.65 0.30 31.88 Reference 4.32 0.015 0.130 0.016 0.055 0.008 1.245 0.300 0.250 0.020 0.065 0.012 1.255 Reference 0.325 0.325 Reference Reference Notes 0.170 Inches Notes
1.100
0.100 0.300 0.300 0.120 0.080 0.400 0.145
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.8.10. Lead Plastic Dual In-Line Package (600 MIL)
231369-35
Family: Plastic Dual In-Line Package Millimeters Symbol 1.52 0.74 13.59 2.29 14.99 15.24 3.18 2.03 17.78 3.68 0.060 0.029 0.23 31.37 27.94 15.75 13.84 2.79 Reference 0.535 0.090 0.600 0.125 0.080 0.38 3.68 0.41 1.52 0.30 32.00 Reference 4.06 0.51 Typical Typical 5.08 0.015 0.145 0.016 0.009 1.235 0.160 0.020 Typical Typical Reference 0.012 1.260 0.620 0.545 0.110 Reference 0.700 0.145 Notes 0.200 Inches Notes
0.060
1.100
0.590
2-63
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.8.11. Lead Plastic Dual In-Line Package (300 MIL)
231369-35
Family: Plastic Dual In-Line Package Millimeters Symbol 0.38 3.30 0.41 1.14 0.20 34.16 7.62 6.86 2.54 7.62 7.62 3.18 0.051 0.23 0.76 10.16 3.43 0.020 0.009 33.02 8.62 7.37 Reference Reference 0.51 1.40 0.30 34.42 Reference Typical 4.32 0.015 0.130 0.016 0.045 0.008 1.345 0.300 0.270 0.020 0.055 0.012 1.355 Reference 0.339 0.290 Reference Reference Typical Notes 0.170 Inches Notes
1.300
0.100 0.300 0.300 0.125 0.030 0.400 0.135
2-64
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.8.12. Lead Plastic Dual In-Line Package (600 MIL)
231369-35
Family: Plastic Dual In-Line Package Millimeters Symbol 1.65 0.86 13.59 2.29 14.99 15.24 3.18 2.16 17.78 3.68 0.065 0.034 0.23 36.70 0.38 3.68 0.36 1.52 0.30 37.34 Reference 4.06 0.56 Typical 5.08 0.015 0.145 0.014 0.160 0.022 Typical Notes 0.200 Inches Notes
0.060 0.009 1.445 0.012 1.470
33.02 15.75 14.00 2.79
1.300 0.620 0.535 0.090 0.551 0.110
Reference
Reference
0.590 0.600 0.125 0.085 0.700 0.145
Reference
2-65
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.8.13. Lead Plastic Dual In-Line Package (600 MIL)
231369-35
Family: Plastic Dual In-Line Package Millimeters Symbol 1.78 1.14 0.41 1.14 0.20 41.78 0.38 3.81 0.51 1.40 0.30 42.04 Reference Typical 4.83 0.015 0.150 0.016 0.045 0.008 1.645 0.020 0.055 0.012 1.655 Reference Typical Notes 0.190 Inches Notes
38.10 15.24 13.46 2.54 15.24 15.24 3.18 2.03 17.78 3.43 15.88 13.97
1.500 0.600 0.530 0.625 0.550
Reference Reference
0.100 0.600 0.600 0.125 0.700 0.135 0.070 0.045 0.080
Reference Reference
2-66
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.8.14. Lead Plastic Dual In-Line Package
231369-35
Family: Plastic Dual In-Line Package Millimeters Symbol 1.65 0.99 13.59 2.29 14.99 15.24 3.18 2.16 0.065 0.039 17.78 3.68 0.23 51.94 0.38 3.94 0.41 1.27 0.30 52.58 Reference 4.19 0.51 Typical 5.08 0.015 0.155 0.016 0.165 0.020 Typical Notes 0.200 Inches Notes
0.050 0.009 2.045 0.012 2.070
48.26 15.75 13.84 2.79
1.900 0.620 0.535 0.090 0.545 0.110
Reference
Reference
0.590 0.600 0.125 0.085 0.700 0.145
Reference
2-67
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.8.15. Lead Plastic Dual In-Line Package Variation: Lead
231369-34
Family: Plastic Dual In-Line Package Millimeters Symbol 1.65 3.00 2.16 3.60 3.30 0.118 0.065 0.080 0.141 2.29 14.74 2.79 15.74 2.54 15.24 0.090 0.580 0.110 0.619 13.50 13.09 13.70 0.531 0.547 4.55 0.38 3.75 0.35 1.40 0.25 3.95 0.51 1.60 0.45 52.30 0.35 3.85 Notes 0.179 0.015 0.147 0.014 0.055 0.009 0.155 0.020 0.063 0.018 2.06 Inches Notes
Lead
Lead
2-68
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.8.16. Lead Plastic Dual In-Line Package
231369-35
Family: Plastic Dual In-Line Package Millimeters Symbol 1.65 0.99 13.84 2.29 14.99 15.24 3.18 2.16 1.40 0.065 0.039 17.78 3.68 0.23 61.60 0.38 3.94 0.41 1.27 0.30 61.98 Reference 4.32 0.51 Typical 5.08 0.015 0.155 0.016 0.170 0.020 Typical Notes 0.200 Inches Notes
0.050 0.009 2.425 0.012 2.440
58.42 15.75 14.10 2.79
2.300 0.620 0.545 0.090 0.555 0.110
Reference
Reference
0.590 0.600 0.125 0.085 0.055 0.700 0.145
Reference
2-69
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.8.17. Lead Plastic Dual In-Line Package (Shrink)
231369-36
Family: Plastic Dual In-Line Package Millimeters Symbol 16.80 1.60 19.05 19.50 3.00 21.00 3.60 17.20 1.96 0.661 0.063 0.677 0.077 0.20 57.80 0.51 4.15 0.35 1.00 0.30 58.20 Reference 4.35 0.55 Typical 5.65 0.020 0.163 0.014 0.171 0.022 Typical Notes 0.22 Inches Notes
0.040 0.008 2.28 2.170 0.012 2.29
55.1
Reference
0.745 0.767 0.118 0.826 0.14
2-70
2.9. 2.9.1.
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
PLASTIC FLATPACK PACKAGE Symbol List Plastic Flatpack Family
Description Dimensions
Letter Symbol
Distance from seating plane highest point body (lid) Width terminal leads Thickness terminal leads Largest overall package dimension length Largest overall package dimension length excluding leads body length dimension, outer lead center outer lead center Linear spacing between centerlines terminal leads Lead dimension free lead length total number potentially useable lead positions Lead plane body plane distance Distance from true position centerline lead position extremity body Linear spacing true maximum lead position from lead edge package edge
NOTES: Controlling dimension: millimeter. Dimension "e1" ("e") non-cumulative. Seating plane (standoff) defined P.C. board hole size: 0.0415 0.0430 inch. Dimensions "B", "B1" normal.
2-71
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.9.2.
Lead Plastic Flatpack Package
(inch)
231369-37
Family: Plastic Flatpack Package Millimeters Symbol 2.01 1.73 1.47 4.19 0.46 0.18 44.45 24.08 20.22 1.22 10.16 2.06 2.08 0.079 0.068 0.058 4.34 0.56 0.25 45.21 24.26 20.42 1.32 10.80 Typical Notes 0.165 0.018 0.007 1.750 0.948 0.796 0.048 0.400 0.081 0.082 0.171 0.022 0.010 1.780 0.955 0.804 0.052 0.425 Typical Typical Typical Inches Notes
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.10. PLASTIC LEADED CHIP CARRIER PACKAGE 2.10.1. Symbol List Plastic Leaded Chip Carrier Family
Letter Symbol Description Dimensions Overall Height: Distance from seating plane highest point body Distance from lead shoulder seating plane Seating plane coplanarity Overall package dimension D1/E1 Plastic body dimension D2/E2 Footprint Lead thickness Total number potentially useable lead positions Total number leads short side Total number leads long side Tweezing coplanarity NOTES RECTANGLE PACKAGE: dimensions tolerances conform ANSI 14.5M-1982. Datum plane located mold parting line coincident with lead, where lead exits plastic body. Datums determined where center leads exit plastic body datum plane -H-. determined seating plane -C-. Dimensions include mold protrusion. identifier located within defined zone. These dimensions determine maximum angle lead certain socket applications. unit intended socketed, advisable review these dimensions with socket supplier. denotes number leads short sides package, which contains denotes number leads long sides package. Controlling dimension, inch. dimensions tolerances include lead trim offset lead plating finish. Tweezing surface planarity defined furthest lead side from datum. datum established touching outermost lead that side parallel -D-. Packaging Family Attributes Category Plastic Leaded Chip Carrier Acronym PLCC Lead Configuration Quad Lead Counts Lead Finish Solder Plate Lead Pitch 0.050" Board Assembly Type Socket Surface Mount NOTES: Copper Alloy Leads. Novalac Body. Bake desiccant packaging required.
2-73
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead 3.56 2.29 Notes
Family: Plastic Lead Ship Carrier-Rectangular (mm) Lead Symbol 0.00 0.00 0.23 3.20 1.93 9.78 8.81 7.37 14.90 13.90 12.40 0.10 0.10 0.38 0.00 0.00 0.23 3.56 2.29 10.0 8.97 8.38 15.10 14.00 13.50 Notes 3.20 1.93 12.30 11.40 9.91 14.90 13.90 12.40 0.10 0.10 0.38
12.60 11.50 10.90 15.10 14.00 13.50
Family: Plastic Lead Ship Carrier-Rectangular (inch) Lead Symbol 0.000 0.000 0.009 0.126 0.076 0.385 0.347 0.290 0.585 0.547 0.490 0.004 0.004 0.015 0.000 0.000 0.009 0.140 0.090 0.395 0.353 0.330 0.595 0.553 0.530 Notes 0.126 0.076 0.485 0.447 0.390 0.585 0.547 0.490 0.004 0.004 0.015 0.140 0.090 0.495 0.453 0.430 0.595 0.553 0.530 Lead Notes
2-74
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
231369-38
Principal Dimensions Datums
231369-39
Molded Details
2-75
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
23136940-
Terminal Details Side
231369-41
Terminal Details Side
2-76
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
(inch)
231369-4
Standard Package Bottom View
(inch)
231369-43
Detail terminal Details
(inch)
231369-44
Detail Terminal Details
2-77
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Lead
Family: Plastic Leaded Chip Carrier-Rectangular (mm) Lead Symbol 0.00 0.000 0.009 4.19 2.29 9.78 8.89 7.37 9.78 8.89 7.37 0.10 0.004 0.015 0.00 0.000 0.009 4.57 3.05 10.0 9.04 8.38 10.0 9.04 8.38 Notes 4.19 2.29 12.3 11.4 9.91 12.3 11.4 9.91 0.10 0.004 0.015 0.00 0.000 0.009 Lead 4.57 3.05 12.6 11.6 10.9 12.6 11.6 10.9 Notes 4.19 2.29 17.4 16.5 15.0 17.4 16.5 15.0 0.10 0.004 0.015
4.57 3.05 17.7 16.7 16.0 17.7 16.7 16.0
Notes
Family: Plastic Leaded Chip Carrier-Rectangular (inch) Lead Symbol 0.000 0.000 0.009 0.165 0.090 0.385 0.350 0.290 0.385 0.350 0.290 0.004 0.004 0.015 0.000 0.000 0.009 0.180 0.120 0.395 0.356 0.330 0.395 0.356 0.330 Notes 0.165 0.090 0.485 0.450 0.390 0.485 0.450 0.390 0.004 0.004 0.015 0.000 0.000 0.009 Lead 0.180 0.120 0.495 0.456 0.430 0.495 0.456 0.430 Notes 0.165 0.090 0.685 0.650 0.590 0.685 0.650 0.590 0.004 0.004 0.015 Lead 0.180 0.120 0.695 0.656 0.630 0.695 0.656 0.630 Notes
2-78
Lead Symbol 0.00 0.00 0.23 4.19 2.29 19.90 19.10 17.50 19.90 19.10 17.50 0.10 0.10 0.38 4.57 3.05 20.20 19.20 18.50 20.20 19.20 18.50
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Family: Plastic Leaded Chip Carrier-Rectangular (mm) Lead Notes 4.19 2.29 25.00 24.10 22.60 25.00 24.10 22.60 0.00 0.00 0.20 0.10 0.10 .036 0.00 0.00 0.20 4.83 3.05 25.30 24.30 23.60 25.30 24.30 23.60 Notes 4.19 2.29 30.10 29.20 27.70 30.10 29.20 27.70 0.10 0.10 0.36 Lead 4.83 3.05 30.40 29.40 28.70 30.40 29.40 28.70 Notes
Family: Plastic Leaded Chip Carrier-Rectangular (inches) Lead Symbol 0.000 0.000 0.009 0.165 0.090 0.785 0.750 0.690 0.785 0.750 0.690 0.004 0.004 0.015 0.000 0.000 0.008 0.180 0.120 0.795 0.756 0.730 0.795 0.756 0.730 Notes 0.165 0.090 0.985 0.950 0.890 0.985 0.950 0.890 0.004 0.004 0.014 0.000 0.000 0.008 Lead 0.190 0.120 0.995 0.958 0.930 0.995 0.958 0.930 Notes 0.165 0.090 1.185 1.150 1.090 1.185 1.150 1.090 0.004 0.004 0.014 Lead 0.190 0.120 1.195 1.158 1.130 1.195 1.158 1.130 Notes
2-79
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
231369-45
Principal Dimensions Datums
231369-46
Molded Details
2-80
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
231369-47
Terminal Details
231369-48
Standard Package Bottom View (Tooling Option
2-81
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
231369-49
Standard Package Bottom View (Tooling Option II.)
231369-50
Detail Terminal Detail
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
231369-51
Detail Terminal Details
NOTES SQUARE PACKAGE: dimensions tolerances conform ANSI 14.5M-1982. Datum plane located mold parting line coincident with lead, where lead exits plastic body. Datums determined where center leads exit plastic body datum plane -H-. determined seating plane -C-. Dimensions include mold protrusion. identifier located within defined zones. Locations datum determined plane -H-. These dimensions determine maximum angle lead certain socket applications. unit intended socketed, advisable review these dimensions with socket supplier. Controlling dimension, inch. dimensions tolerances include lead trim offset lead plating finish. Tweezing surface planarity defined furthest lead side from datum. datum established touching outermost lead that side parallel F-G.
2-83
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.11. PLASTIC QUAD FLATPACK PACKAGE 2.11.1. Symbol List Plastic Quad Flatpack Family
Symbol Package height Standoff Terminal dimension Package body Foot print Bumper distance Foot radius location Foot length Leadcount Description
NOTES: dimensions tolerances conform ANSI 14.5M-1982. Datum plane located mold parting line coincident with lead, where lead exits plastic body. Datums determined where center leads exit plastic body datum plane -H-. Controlling dimension, inch. Dimensions measured mold parting line. include allowable mold protrusion 0.25 (0.010 side. include total allowable mold protrusion 0.25 (0.010 maximum package size. identifier located within zones indicated. Measured datum plane -H-. Measured seating plane datum -C-. Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch Plastic Quad Flatpack PQFP Gull-Wing 100, 132, 164, Solder Plate 0.025"
Board Assembly Type Surface Socket Mount
2-84
Symbol Description Package Height Standoff Terminal Dimension Package Body Bumper Distance Lead Dimension Foot Radius Location Foot Length Leadcount INCH
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Plastic Quad Flatpack (PQFP) 0.025 Inch (0.635mm) Pitch
0.160 0.020 0.770 0.647 0.797
0.180 0.040 0.790 0.653 0.803
0.160 0.020 0.870 0.747 0.897
0.180 0.040 0.890 0.753 0.903
0.160 0.020 1.070 0.947 1.097
0.180 0.040 1.090 0.953 1.103
0.160 0.020 1.270 1.147 1.297
0.180 0.040 1.290 1.153 1.303
0.160 0.020 1.470 1.347 1.497
0.180 0.040 1.490 1.353 1.503
0.500 0.723. 0.737 0.020 0.030
0.600 0.823 0.020 0.837 0.030
0.800 1.023 0.020 1.037 0.030
1.000 1.223 0.020 1.237 0.030
1.200 1.423 0.020 1.437 0.030
Plastic Quad Flatpack (PQFP) 0.025 Inch (0.635mm) Pitch Symbol Description Package Height Standoff Terminal Dimension Package Body Bumper Distance Lead Dimension Foot Radius Location Foot Length Leadcount
4.06 0.51 19.56 16.43 20.24
4.57 1.02 20.07 16.59 20.39
4.06 0.51 22.01 18.97 22.78
4.57 1.02 22.61 19.13 22.93
4.06 0.51 27.18 24.05 27.86
4.57 1.02 27.69 24.21 28.01
4.06 0.51 32.26 29.13 32.94
4.57 1.02 32.77 29.29 33.09
4.06 0.51 37.34 34.21 38.0
4.57 1.02 37.85 34.37 38.18
12.70 18.36 0.51 18.71 0.76
15.24 20.90 0.51 21.25 0.76
20.32 25.89 0.51 26.33 0.76
25.40 31.06 0.51 31.41 0.76
30.48 36.14 0.51 36.49 0.76
2-85
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
(inch)
231369-5
Principal Dimensions Datums
(inch)
231369-53
Molded Details
2-86
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
(inch)
231369-54
Terminal Details
(inch)
Detail
Detail
231369-55
Typical Lead
(inch)
231369-56
Detail
2-87
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.12. QUAD FLATPACK PACKAGE 2.12.1. Symbol List Quad Flatpack Family
Letter Symbol Overall Height Standoff Lead True Position Lead Width Lead Thickness Terminal Dimension Body Package Terminal Dimension Body Package Lead Pitch Foot Length Leadcount Lead Angle Coplanarity Description Dimensions
NOTES RECTANGLE PACKAGE: packages available with products. Contact local further package information.
Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch Quad Flatpack QFP, SQFP, TQFP Quad 100, SQFP 100, 128, TQFP 100, 144, Solder Plate 0.65,
Board Assembly Type Surface Socket Mount NOTES: Alloy 42/copper some lead frames. SQFP TQFP copper lead frames only. Novalac Body. packages available with products. Contact local further package information.
2-88
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
231369-94
NOTE: dimensions millimeters Optional Exposed Heatslug
Principal Dimensions Data (Square)/TQFP/SQFP Packages
231369-95
Terminal Details
2-89
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Quad Flatpack (Square Packages) Symbol Description Lead Count Overall Height Stand Lead Width Lead Thickness Terminal Dimension Package Body Terminal Dimension Package Body Lead Pitch Foot Length Lead Angle Coplanarity 0.65 0.38 0.0° 12.0 0.05 0.20 0.10 12.0 0.30 0.15 12.4 10.0 12.4 10.0 0.80 0.58 0.95 0.78 10.0° 0.10 12.8 .040 0.20 12.8 2.35 0.05 0.25 0.11 15.1 11.9 15.1 11.9 0.70 0.65 0.0° 0.30 0.15 15.3 12.0 15.3 12.0 0.80 0.85
2.55 0.25 0.40 0.20 15.5 12.1 15.5 12.1 0.90 1.05 7.0° 0.10
Quad Flatpack (Square Packages) (Contd.) Symbol Description Lead Count Overall Height Stand Lead Width Lead Thickness Terminal Dimension Package Body Terminal Dimension Package Body Lead Pitch Foot Length Lead Angle Coplanarity 0.53 0.65 0.0° 14.9 0.05 0.20 0.10 14.9 0.30 0.15 15.3 12.0 15.3 12.0 0.65 0.85 0.77 1.05 10.0° 0.10 15.7 0.40 0.20 15.7 2.55 3.23 0.05 0.25 0.150 31.6 27.9 31.6 27.9 0.70 0.60 3.75 0.45 0.188 32.4 28.1 32.4 28.1 0.90 0.05 0.20 0.150 30.2 27.9 30.2 27.9 0.55 0.60 4.00 0.30 0.45 0.188 31.0 28.1 31.0 28.1 0.75
2-90
Symbol
D2/E
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
Shrink Quad Flatpack Description
Overall Height Stand Lead Width Lead Thickness Terminal Dimension Package Body Terminal Dimension Package Body Lead Pitch Foot Length Lead Count Lead Angle Coplanarity Heatspreader 0.40 0.35 13.70 0.00 0.14 0.117 13.70 0.20 0.127 14.00 12.0 14.00 12.0 0.50 0.50 0.10 0.60 0.70 0.40 0.30 14.30 15.70 0.26 0.177 14.30
3.15
3.75
0.00 0.14 0.117 15.70 0.20 0.127 16.00 14.00 16.00 14.00 0.50 0.50 0.10 0.60 0.70 16.30 0.26 0.177 16.30
0.05 0.14 0.10 17.5 0.22 0.15 17.9 14.0 23.5 23.9 20.0 0.40 0.60 0.50 0.80
0.40 0.28 0.20 18.3
0.05 0.14 0.150 30.2 27.9
0.30 0.26 0.188 31.0 28.1 31.0 28.1 0.60 0.70
24.3
30.2 27.9
0.60 1.00
0.40 0.30
0.10
0.08
Thin Quad Flatpack Symbol Description Overall Height Stand Lead Width Lead Thickness Terminal Dimension Package Body Terminal Dimension Package Body Lead Pitch Foot Length Lead Count Lead Angle Coplanarity 0.10 0.05 0.16 0.117 15.70 13.9 15.7 13.9 0.40 0.30 0.20 0.28 0.127 16.30 14.1 16.30 14.1 0.60 0.70 0.05 0.16 0.122 21.6 19.9 21.6 19.9 0.40 0.40 0.20 0.28 0.160 22.4 20.1 22.4 20.1 0.60 0.80 0.50 0.16 0.122 25.6 23.9 25.6 23.9 0.40 0.40 0.28 0.160 26.4 24.1 26.4 24.1 0.60 0.80
2-91
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
231369-96
Principle Dimensions Data (Rectangular) Packages
Quad Flatpack (Rectangular Packages) Symbol Description Lead Count Overall Height Stand Lead Width Lead Thickness Terminal Dimension Package Body Terminal Dimension Package Body Lead Pitch Foot Length Lead Angle Coplanarity 0.65 0.60 23.5 0.05 0.25 0.10 17.5 0.35 0.15 17.9 14.0 23.9 20.0 0.80 0.80 0.95 1.00 0.10 0.53 0.60 24.3 23.5 3.15 0.40 0.45 0.20 18.3 0.05 0.20 0.10 17.5 0.30 0.15 17.9 14.0 23.9 20.0 0.65 0.80 0.77 1.00 0.10 24.3 3.15 0.40 0.40 0.20 18.3
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.13. SMALL OUT-LINE J-LEAD PACKAGE (SOJ) 2.13.1. Symbol List Small Out-Line J-Lead Family
Letter Symbol Overall Height Distance from Base Plane Highest Point Body (Lid) Width Terminal Leads Width Terminal Lead Shoulder Which Locate Seating Plane (Standoff Geometry Optional) Largest Overall Package Dimension Length Largest Over Package Width Dimension Outside Leads Body Width Dimension Including Leads Linear Spacing Between Center Line Body Terminal Leads (Standoffs) Linear Spacing True Minimum Lead Position Center Line Center Line Total Number Potentially Useable Llead Positions Description Dimensions
Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch Small Outline J-Lead Dual-In-Line Solder Plate 0.050"
Board Assembly Type Surface Mount NOTES: Alloy Leads Novalac body.
2-93
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.13.2. Lead Small Out-Line Package (SOJ) Variation: J-Lead
231369-61
Family: Small Out-Line J-Lead Package Millimeters Symbol 6.60 7.62 3.04 2.36 0.38 0.58 17.02 8.31 7.49 3.61 3.00 0.51 0.84 17.27 8.64 7.75 1.27 6.99 10.16 Typical Notes 0.120 0.093 0.015 0.023 0.67 0.327 0.295 0.142 0.118 0.020 0.033 0.680 0.340 0.305 0.050 0.260 0.300 0.275 0.400 Typical Inches Notes
2-94
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.13.3. Lead Small Out-Line Package (SOJ) Variation: J-Lead
231369-6
Family: Small Out-Line J-Lead Package Millimeters Symbol Notes Inches Notes
6.60 8.38 7.49 1.27 6.99 8.64 7.75 Typical 0.330 0.295 0.340 0.305 Typical 0.38 15.75 0.51 16.18 0.015 0.620 0.020 0.637 2.74 3.00 0.180 0.118 3.35 3.61 0.132 0.14
0.050 0.260 0.275
2-95
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.13.4. Plastic Small Out-Line Package/Shrink Small Outline Package (PSOP/SSOP)
NOTE
more package information refer package guide Order #296514
Letter Symbol Description Dimensions
Packaging Family Attributes Category Acronym Lead Counts Lead Finish Lead Pitch Board Assembly Type Standard Registration
Overall Height Standoff Package Body Thickness Lead Height Width Terminal Leads Thickness Terminal Leads Plastic Body Length Package Body Width Lead Pitch Terminal Dimension Lead Length Total Number Potentially Useable Lead Positions Seating Plane Coplanarity Lead Package Offset Lead Angle
Plastic Small Outliine Package/Shrink Small Outline Package PSOP/SSOP 44/56 Solder Plate 1.27 mm/0.8 Surface Mount JEDEC EIAJ
NOTES: Copper Alloy Novalac body. Profile Tolerance zones include mold protrusion. (Allowable mold protrusion 0.25 side 0.15 side.) Lead Plating Thickness 0.007 0.015 (Not part dimensions).
2-96
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.13.5. Lead Plastic Small Out-Line Package (PSOP)
231369-80
Family: Small Out-Line Package Millimeters Symbol 15.75 0.75 0.050 2.20 0.35 0.13 28.00 13.10 2.30 0.40 0.150 28.20 13.30 1.27 16.00 0.80 16.25 0.85 0.620 0.030 2.40 0.50 0.20 28.40 13.50 2.95 0.020 0.087 0.014 0.005 1.102 0.516 0.091 0.016 0.006 1.110 0.524 0.050 0.630 0.031 0.640 0.033 0.094 0.020 0.008 1.118 0.531 Notes Inches 0.116 Notes
0.10
0.004
2-97
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.13.6. 56-Lead Shrink Small Outline Package (SSOP)
231369-99
Family: Small Outline Package Millimeters Symbol Package height Standoff Package body thickness Lead width Lead thickness Plastic body length Package body width Lead pitch Terminal dimension Lead count Lead length Seating plane coplanarity Lead height Lead angle 1.30 1.40 0.750 15.70 0.47 1.18 0.25 0.13 23.40 13.10 1.28 0.30 0.15 23.70 13.30 0.80 16.00 0.80 0.85 0.10 1.50 0.051 0.055 0.030 16.30 0.618 1.38 0.40 0.20 24.00 13.50 1.80 1.90 0.018 0.046 0.010 0.005 0.921 0.516 0.050 0.012 0.006 0.933 0.524 0.031 0.630 0.315 0.033 0.004 0.059 0.642 0.054 0.016 0.008 0.945 0.531 Notes Inches 0.070 0.075 Notes
2-98
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.14. THIN SMALL OUT-LINE PACKAGE (TSOP)
NOTE
more package information refer package guide Order #296514
2.14.1. Symbol List Thin Small Out-Line Package Family
Letter Symbol Description Dimensions Overall Height Standoff Package Body Thickness Lead Height Width Terminal Leads Thickness Terminal Leads Plastic Body Length Package Body Width Lead Pitch Terminal Dimension Lead Foot Length Total Number Potentially Useable Lead Positions Seating Plane Coplanarity Lead Package Offset Lead Angle
Packaging Family Attributes Category Thin Small Out-Line Package Acronym TSOP Lead Configuration Dual-In-Line, Type Lead Counts Lead Finish Solder Plate Lead Pitch Board Assembly Type Surface Mount NOTES: Alloy Leads Novalac body. Offered Reverse Pin-Out special circuit layout, (32L, only) Profile Tolerance zones include mold protrusion. (Allowable mold protrusion 0.25 side 0.15 side.) Lead plating thickness 0.007 0.015 (Not part dimensions).
2-99
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.14.2. 32-Lead Thin Small Out-Line Package (TSOP)
231369-64
231369-65
Family: Thin Small Out-Line Package Millimeters Symbol NOTE: 0.050 0.965 0.150 0.115 18.200 7.800 19.800 0.500 0.150 1.200 1.025 0.300 0.135 18.600 8.200 20.200 0.700 0.100 0.350 Notes 0.002 0.038 0.006 0.004 0.717 0.307 0.780 0.020 0.006 Inches 0.047 0.040 0.012 0.0053 0.732 0.323 0.795 0.028 0.004 0.014 Notes
0.995 0.200 0.125 18.400 8.000 0.500 20.000 0.600 0.250
0.039 0.008 0.0049 0.724 0.315 0.0197 0.787 0.024 0.010
dimple package denotes dimples, larger dimple denotes will always upper left corner package, reference product mark.
2-100
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.14.3. 40-Lead Thin Small Out-line Package (TSOP)
231369-81
Family: Thin Small Out-Line Package Millimeters Symbol 19.800 0.500 0.050 0.965 0.150 0.115 18.200 9.800 0.995 0.200 0.125 18.400 10.000 0.500 20.00 0.600 0.100 20.200 0.700 0.780 0.020 1.025 0.300 0.135 18.600 10.200 1.200 0.002 0.038 0.006 0.0045 0.717 40.386 0.039 0.008 0.0049 0.724 0.394 0.0197 0.787 0.024 0.004 0.795 0.028 0.040 0.012 0.0053 0.732 0.402 Notes Inches 0.047 Notes
NOTE:
0.150 0.250 0.350 0.006 0.010 0.014 dimple package denotes dimples, larger dimple denotes will always upper left corner package, reference product mark.
2-101
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.14.4. 48-Lead Thin Small Out-line Package (TSOP)
231369-98
Package Height Standoff Package Body Thickness Lead Width Lead Thickness Plastic Body Length Package Body Width Lead Pitch Terminal Dimension Lead Length Lead Count Lead Angle Seating Plane Coplanarity Lead Package Offset
NOTE:
Family: Thin Small Out-Line Package Millimeters Symbol Notes 1.200 0.050 0.950 1.000 1.050 0.150 0.200 0.300 0.100 0.150 0.200 18.200 18.400 18.600 11.800 12.000 12.200 0.500 19.800 20.000 20.200 0.500 0.600 0.700 0.100 0.150 0.250 0.350
0.002 0.037 0.006 0.004 0.717 0.465 0.780 0.020 0.006
Inches
0.047
Notes
0.039 0.008 0.006 0.724 0.472 0.0197 0.787 0.024 0.010
0.041 0.012 0.008 0.732 0.480 0.795 0.028 0.004 0.014
dimple package denotes dimples, larger dimple denotes will always upper left corner package, reference product mark
2-10
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.14.5. 56-Lead Thin Small Out-line Package (TSOP)
231369-90
Family: Thin Small Out-Line Package Millimeters Symbol 19.800 0.500 0.050 0.965 0.150 0.115 18.200 9.800 0.995 0.200 0.125 18.400 10.000 0.500 20.00 0.600 0.100 20.200 0.700 0.780 0.020 1.025 0.300 0.135 18.600 10.200 1.200 0.002 0.038 0.006 0.0045 0.717 40.386 0.039 0.008 0.0049 0.724 0.394 0.0197 0.787 0.024 0.004 0.795 0.028 0.040 0.012 0.0053 0.732 0.402 Notes Inches 0.047 Notes
NOTE:
0.150 0.250 0.350 0.006 0.010 0.014 dimple package denotes dimples, larger dimple denotes will always upper left corner package, reference product mark.
2-103
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.15. SINGLE IN-LINE LEADED MEMORY MODULE PACKAGE (SIP) 2.15.1. Symbol List Single In-Line Leaded Memory Module Family
Letter Symbol Overall Height Width Terminal Leads Thickness Terminal Leads Largest Overall Package Width Dimension Outside Leads Linear Spacing between Centerline body Terminal Leads (Standoffs) Distance from Seating Plane Lead Description Dimensions
Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch Single In-Line Leaded Package Single Tin/Nickel 2.5mm
Board Assembly Type Socket Insertion Mount
2-104
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.15.2. 30-Lead Single In-line Leaded Memory Package (SIP)
231369-67
Family: Small In-Line Leaded Memory Module (SIP) Millimeters Symbol 2.54 3.18 Typical 16.43 0.557 0.229 78.61 16.59 0.559 0.279 78.87 5.08 Notes 0.647 0.018 0.009 3.095 0.653 0.022 0.011 3.105 0.200 0.110 0.125 Typical Inches Notes
2-105
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.16. SINGLE IN-LINE LEADLESS MEMORY MODULE (SIMM) 2.16.1. Symbol List Single In-Line Leadless Memory Module Family
Letter Symbol Width Terminal Leads Thickness Terminal Leads Largest Overall Package Dimension Length Largest Overall Package Width Dimension Outside Leads Linear Spacing between Centerline body Terminal Leads (Standoffs) Total Number Potentially Useable Lead Positions Description Dimensions
Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch Board Assembly Type NOTES: Alloy Plastic Body Single In-Line Leadless Memory Module SIMM Single Solder Coat 0.100" Socket Insertion Mount
2-106
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.16.2. Single In-Line Leadless Memory Module (SIMM)
231369-68
Family: Single In-Line Leadless MemoryModule Millimeters Symbol 2.54 1.19 88.77 1.78 1.40 89.03 5.08 Typical 0.100 Notes Typical 0.047 3.495 0.070 0.055 3.505 0.200 Typical Inches Notes Typical
2-107
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.16.3. Single In-Line Leadless Memory Module (SIMM)
231369-69
Family: Single In-Line Leadless MemoryModule Millimeters Symbol 1.19 117.98 8.38 1.27 Typical 1.04 1.37 118.24 Notes Typical 0.047 4.645 0.33 0.050 Typical 0.041 0.054 4.655 Inches Notes Typical
2-108
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.16.4. PCMCIA Card Type Type
231369-76
Type
231369-77
Type
2-109
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.16.5. Type Card Package Dimensions
231369-78
2-110
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.16.6. Type Card Package Dimensions
231369-8
2-111
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.16.7. Card Physical Dimensions
Length Type 3.370 0.008 (8.56 0.20) Type 0.008 (85.6 0.20) Width 2.126 0.004 (54.0 0.10) 2.126 .004 (54.0 0.10) Interconnect Area 0.65 0.002 (1.65 0.06) .065 0.002 (1.65 0.06) Substrate Area 0.65 0.002 (1.65 0.06) 0.098 (2.5)
NOTES: Interconnect area substrate area thickness specified from memory card center line either bottom surface. Millimeters parentheses
2.16.8. Host Connector Configuration Both Type Type
Type Detect 0.134 General 0.163 Power 0.193 Length (3.6) (3.4) (4.35) (4.15) (5.1) (4.9) Other Pins
2-11
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.16.9. Host Connector Configuration Both Type Type
231383-83
2.16.10. Card Connection Socket Type Type
231369-84
2-113
PACKAGE/MODULE/PC CARD OUTLINES DIMENSIONS
2.16.11. Card Connector Type Type
231369-85
2.17. REVISION SUMMARY
main differences between following:
Revised Dimensions Revised TSOP Dimensions Added SQFP Heat Slug Dimensions
2-114

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