Dedicated Customer Satisfaction seems like such simple request wh

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

Dedicated Customer Satisfaction seems like such simple request wh

Datasheet Thumbnail

Top Searches for this datasheet

Quality
Dedicated Customer Satisfaction
seems like such simple request what want, when want reasonable price. However, complex world integrated circuits, thousands factors influence design manufacture part affect device will perform. Atmel, every employee committed making sure customer gets what wants. From executive level throughout organization, Company's goal hundred percent customer satisfaction. achieve this goal, Atmel's employees have developed philosophy, structure, training tools necessary sustain product quality reliability. result interrelated functions, dedicated quality dedicated reliability. "thread" that ties these functions each other rest Company Continuous Improvement Process. Atmel's corporate philosophy continuous improvement insures that only high quality, reliable devices, that every group within Company operating with your requirements mind. Atmel's hall-mark excellence: quality reliability from circuits service from employees.
Atmel's Policy Quality
Continuous Improvement Process
Reliability
Philosophy Training Tools
Quality
Reliability Modeling
Results Feedback
General Quality Specifications
Design Reliability
Document Control
Reliability Assurance
Audits
Reliability Improvement
Quality Control
0551A
9000 Certification
Certification 9001 9002 product design Manufacturing Processes just example Atmel strives meet needs customers around world. Certification easy result ever-present commitment quality, reliability, continuous improvement. Atmel's commitment 9000 extends major contractors distributors well. Most 9000 certified. Atmel continuing work with others become certified.
past, organization gone through formal training Crosby 14-Step Quality Program; Alamo Problem Solving, Planning Decision Making Program; General Quality Specifications; Statistical Process Control (SPC); Statistical Design Experiments (DOE); inhouse training managerial supervision skills. Today, training continues with emphasis SPC, DOE, sigma concepts team building. figure below represents steps Atmel already taken along journey continuous improvement. Each year, organizational goals functional strategies elevate Company's level quality even higher. addition training, journey continuous improvement involves integrating SPC, DOE, just-in-time (JIT) other techniques into everyday operations. these techniques throughout corporation, just manufacturing, proof Atmel's commitment continuous improvement. Whether order entry, wafer fabrication, review customer specifications, government compliance testing even returning customer's phone call, Atmel strives "zero defects."
Statistical Process Control
Continuous Improvement
Accepting Malcolm Baldrige National Quality Award, recipient said that race without finish line." That good synopsis Atmel's philosophy continuous improvement. responsibility executives, managers employees Atmel constantly forever improve quality products services delivered. Company's objectives include providing leadership training required sustain process continuous quality improvement; implementing total quality system that will allow Atmel compete Malcolm Baldrige National Quality Award; implementing utilizing throughout organization; understanding integrating concepts "six sigma" into culture processes.
Control process parameters heart Atmel's continuous improvement system. involves portrayal process parametric values graphical form display whether operation control control. Through experimentation evaluation, upper lower control limits established each parametric value (continued)
Atmel's Continuous Improvement Process
Quality
Quality
Continuous Improvement (Continued)
given process step. parametric values charted continual basis result easy-to-interpret graph which allows immediate corrections adjustments person closest operation. This type quality measurement applied almost operation within Company. Currently over charts monitored throughout wafer fabrication, test packaging operations. Used crucial points fabrication process, insures compliance with pre-set control limits. Measurements taken critical steps process used development engineering models applied current design. Process data monitored insure integrity each wafer resulting statistics used constantly improve process.
Statistical Design Experiments (DOE)
this technique succeed, however, significant commitment made both supplier customer. implies partnership that gives customer quality devices, reliable deliveries lower costs compared with carrying inventory. Atmel performs design fabrication tasks with such predictability that circuits directly customer's work floor, eliminating incoming inspection.
Payoff
technique been successfully used many years agriculture chemical industries. Only recently technique been used high-technology industries. Using DOE, various problems solved simultaneously determining variables that statistically significant, interaction between variables amount variation possible process product. greatly reduce time required process qualification optimization. This especially useful wafer fabrication where quality depends interaction hundreds different process steps materials. When coupled with computer-aided design process models, used predict relationships outcomes running experiments. Actual experiments only those processes which show most promise. This, turn, reduces time cost designing products processes improving existing ones.
Just-in-time
Quality reliability Atmel cannot separated from life cycle product. Company recognizes that quality reliability must maintained levels organization must constantly improved. Through continuous improvement focus customer requirements, Atmel established dock-to-stock programs with several high-performance computer military system companies. bottom line Atmel customers lower system lifecycle cost faster time-to-market. Atmel's culture puts customer requirements continuous improvement above else, insuring that indeed what want, when want reasonable price.
Atmel's Quality System
foundation Atmel's quality system MIL-M-38535 MIL-STD-883. These specifications translated into company policies covering areas design, qualification, manufacturing customer service. Atmel chosen operate high standards military order meet exceed needs commercial industrial customers. Company's employees trained, certified audited these policies, which outlined Atmel's Quality Manual.
Quality Control
concept receiving products exactly when they needed system what about. order
Atmel's quality efforts focus customer their system. example, through strict attention customers' component system requirements Atmel achieved preferred supplier status. attain this level customer confidence Company demonstrates com(continued)
Example Process Control Chart
Atmel's Quality System (Continued)
mitment quality control areas operation. This includes purchase control, in-process quality control, statistical quality control. gram built understanding assumptions restrictions inherent practical reliability testing.
Design Reliability
Purchase Control Every manufacturing process relies materials, incoming inspection plays vital role quality those materials. Atmel, incoming inspection supplemented supplier audits, historical review supplier quality insistence that suppliers SPC. In-process Quality Control Once materials controlled, processes that transform them into final product must also controlled. This done through inspection product critical, interim stages manufacturing. Also included auditing personnel operations insure that proper procedures being followed. Statistical Quality Control Immediate action taken manufacturing organization when discrepancies found during inspection. Atmel, typical discrepancy results permanent corrective action.
However, another vital function quality control reporting longer-term trends statistics based upon individual control functions. Statistical quality control used highlight increases defects errors department, example. Atmel uses this information take preventative action when negative trend detected.
Audits
Many reliability concerns minimized with proper design techniques. example ESD, which contributes production yield loss potential reliability problem, reduced eliminated through establishment adequate design rules. Atmel's reliability assurance systems insure that data taken from actual product testing back design groups verification models design rule updates.
Reliability Assurance Concepts
Accelerated Testing During life cycle, integrated circuit passes through three distinct phases which best defined failure rate device. order determine actual interval associated with each phase, significant number cumulative failures (usually percent) must observed. dramatically small failure rates integrated circuits, testing under normal operating conditions provides little useful data forecasting reliability. alternative increase stress levels above normal, thereby accelerating development failure mechanisms over time. Determining proper stress conditions that lead realistic failures (those that could occur under normal conditions) without introducing unwanted mechanisms primary concern Reliability Engineer.
Atmel's Reliability group uses variety tests designed accelerate specific failures reduce probability spurious results. Variables such temperature, voltage, currents, humidity radiation controlled during testing influence operational parameters device. Stress also selectively increased affect specific circuit elements. quantify degree failure acceleration increased stress, industry developed number physical models. utilizing these models, relatively short-term, high-stress test results used predict device performance under normal operating conditions.
Atmel maintains self-audit group that continually monitors compliance internal procedures customer specifications. findings this group routinely reported management insure that adequate corrective actions taken deficiencies.
Understanding Reliability
integrated circuits, reliability commonly defined probability that device will operate properly given period time, under specific environmental electrical conditions. Although various methods exist expressing reliability, most commonly presented terms probability failure.
Reliability Modeling
Applying test data general failure distribution curves, such Weibull lognormal curves, requires that data distribution that model physically mathematically reasonable with respect failure mechanism. Developing accurate reliability model requires consideration non-test-related failures well unidentified failure mechanisms. Atmel's reliability pro-
Failure Rates Because failure rate integrated circuit varies during life span, product reliability best described failure rate units operating after specified number hours. This called Instantaneous Failure Rate, IFR. Other measures include Average Failure Rate, average over period time, Cumulative Failure Rate, total number failures occurring during operation. Because integrated circuit failure rates remarkably low, they normally measured with respect billions device hours. This value, referred FIT, (continued)
Quality
Quality
Reliability Assurance Concepts (Continued)
defined failures billion hours device operation.
Failure Mechanisms Integrated circuit failure mechanisms classified either process anomalies wear-out mechanisms. Process anomalies result from less than ideal process conditions include product defects such contamination, step coverage deficiencies electrostatic discharge (ESD) damage. Often termed "quality" problems, these mechanisms normally detected through process screens such visual inspection, thermal cycling burn-in. Process anomalies that escape manufacturing screens often accelerate encourage wear-out mechanisms. example, weaken insulating oxides thin metallization allowing dielectric breakdown electromigration failures occur earlier life cycle.
Wear-out mechanisms directly related useful life device materials, their physical properties, interactions occurring material interfaces. Because wearout mechanisms result from intrinsic physical properties materials, reducing these failures requires attention design level, strict control process variation, high quality materials composites. failure mechanisms studied Reliability, electromigration, time-dependent dielectric breakdown latch-up primary concerns. ELECTROMIGRATION: more studied problems integrated circuit design production electromigration. Devices utilizing aluminum conductors most susceptible phenomena. Electrons flowing conductor effectively collide with aluminum atoms, pushing them away eventually forming open circuit. Design, wafer process control, metal composition,
temperature current density determine long device will operate before electromigration results failure. Atmel's experimental electromigration models associated research have resulted design production techniques which decrease this risk. such technique adds small quantity copper aluminum. This greatly enhances current carrying capability metal, reducing occurrence electromigration. TIME-DEPENDENT DIELECTRIC BREAKDOWN: Reduced dielectric strength capacitors caused accumulation electric charge gate oxide, which limits operational life device. Experiments performed CMOS Bipolar Enhanced (BEMOS) devices indicate that Atmel's dielectrics related processes provide excellent resistance long-term degradation failure, even high voltage levels typical non-digital circuit applications. LATCH-UP: Latch-up CMOS device allows extremely high current flow, often resulting open circuit traces bond wires. condition occur PNPN structure. Proper design Atmel's proprietary process have eliminated this problem before occurs.
Bathtub Curve
traditional "bathtub" curve used describe failure rate product actually combination exponential failure rate models. first model begins with high failure rate rapidly declines low, nearly constant level. This model describes early-life reliability integrated circuit. Atmel's incoming material inspection, production test process controls identify remove potential phase failures before they shipped customer. Test screening limits have been established through characterization qualification
(continued)
Reliability Life (Bathtub) Curve
PHASE
INFANT MORTALITY
PHASE
RANDOM
PHASE
WEAROUT
FAILURE RATE
TIME
Bathtub Curve (Continued)
processes used fabrication. used maintain process stability repeatability throughout design, product development production. second model that makes "bathtub curve" starts with low, relatively constant failure rate climbs exponentially after some period time. This phase three wear-out stage where mechanisms such electromigration oxide breakdown predominate. Through rigorous analysis phase three failures, Atmel developed techniques optimize material life. result forestalled phase three period consequently, increased phase period. combining these models, bathtub-shaped curve representing lifetime product formed. nearly flat portion curve result mathematical summation "tails" models represents phase two. low, stable failure rate characteristic this stage failures observed during this period random nature. These random failures usually result sudden exposure over-stress conditions rare occurrences wear-out type mechanisms. Devices shipped customer this stable portion their lifetime.
Commercial Grade. This product follows Test Flow (1), Figure guaranteed over temperature range +70°C. Industrial Grade. This product follows Test Flow (2), Figure guaranteed over temperature range -40°C +85°C. Quality Enhancement Flow. This product follows Test Flow (3), Figure which specifies burn-in industrial product standard flow. Military Grade. Three classes military products offered Atmel (MIL-STD-883D, Class standard product, Standard Military Drawing (SMD) product, Source Control Drawing (SCD) product). Military Section discusses test procedures these products detail.
Payoff
focus Atmel's quality reliability efforts customer system. common goals highest field reliability lowest system life cycle cost achieved through close working relationships using programs such "ship stock", "just time", "failure trend analysis". Under these programs incoming Atmel circuits straight customers' workfloors- they through incoming inspection cycle. This, course, lowers manufacturing costs testimony trust that been established. addition, long term field failures analyzed that corrective action plans implemented. Atmel developed programs such these with many major customers.
Manufacturing Quality Reliability
ceramic Atmel products manufactured standards Military Standard 883D, Class through wafer fabrication assembly shown Figure products then follow different test flows that correspond different classes products that Atmel offers.
Figure MIL-STD-883D, Class Product Flow. ceramic Atmel products manufactured these standards.
Wafer Processing Monitors
Wafer Sort Electrical Test
Monitors
Assembly. Internal Visual Method 2010 Condition Mechanical Tests Method 2011 Method 2019
Monitors
Test Flow
Quality
Quality
Figure Test Flow (1), Commercial Grade Test Flow.
100% Electrical Screening Monitors
Topside Mark
Monitors
100% Electrical Screening +70°C
100% External Visual Method 2009
Monitors
Pre-Ship Inspection
Shipment
Figure Test Flow (2), Industrial Grade Test Flow.
100% Electrical Screening Monitors
Topside Mark
Monitors
100% Electrical Screening +85°C
100% External Visual Method 2009
Monitors
Pre-Ship Inspection
Shipment
Figure Test Flow (3), Quality Enhancement Flow (-9).
6-10
Quality

Dedicated Customer Satisfaction seems like such simple request wh

Top Searches for this datasheet

Other recent searches