Input- mixer stages UHF- VHF-tuner Features Integrated gate

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Input- mixer stages UHF- VHF-tuner Features Integrated gate

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BF998/BF998R
Input- mixer stages UHF- VHF-tuner
Features
Integrated gate protection diodes noise figure feedback capacitance High cross modulation performance input capacitance
High AGC-range High gain Available with reverse configuration
request
9279
9278
BF998 Marking: Plastic case (SOT 143) Source; Drain; Gate Gate
BF998R Marking: Plastic case (SOT 143R) Source; Drain; Gate Gate
Absolute Maximum Ratings
Parameters Drain source voltage Drain current Gate 1/gate 2-source peak current Gate 1/gate 2-source voltage Total power dissipation Tamb Channel temperature Storage temperature range Symbol ±IG1/G2SM ±VG1S/G2S Ptot Tstg Value +150 Unit
Maximum Thermal Resistance
Parameters Channel ambient glass fibre printed board plated with Symbol RthChA Value Unit
TELEFUNKEN Semiconductors Rev. 17-Apr-96
BF998/BF998R
Electrical Characteristics
Tamb Parameters Test Conditions Drain-source breakdown voltage mA,-VG1S -VG2S Gate 1-source breakdown voltage ±IG1S VG2S Gate 2-source breakdown voltage ±IG2S VG1S Gate 1-source leakage current ±VG1S VG2S Gate 2-source leakage current ±VG2S VG1S Drain current VG1S VG2S Type Symbol V(BR)DS ±V(BR)G1SS ±V(BR)G2SS ±IG1SS ±IG2SS Unit
IDSS IDSS IDSS
10.5
Gate 1-source cut-off voltage VG2S Gate 2-source cut-off voltage VG1S
-VG1S(OFF) -VG2S(OFF)
Electrical Characteristics
VG2S MHz, Tamb Parameters Test Conditions Forward transadmittance Gate input capacitance Gate input capacitance VG1S VG2S Feedback capacitance Output capacitance Power gain range VG2S Noise figure Symbol y21s Cissg1 Cissg2 Crss Coss 1.05 Unit
16.5
TELEFUNKEN Semiconductors Rev. 17-Apr-96
BF998/BF998R
Common Source S-Parameters VG2S
VDS/V ID/mA f/MHz -0.03 -0.15 -0.34 -0.57 -0.83 -1.10 -1.35 -1.62 -1.84 -2.09 -2.33 -2.52 -2.72 -0.04 -0.15 -0.38 -0.62 -0.91 -1.19 -1.45 -1.74 -2.01 -2.27 -2.52 -2.73 -2.94 -0.04 -0.16 -0.39 -0.64 -0.93 -1.22 -1.50 -1.80 -2.06 -2.32 -2.59 -2.78 -3.00 -7.2 -14.1 -20.9 -27.4 -33.6 -39.3 -45.0 -50.1 -55.6 -60.6 -65.4 -70.2 -74.9 -7.6 -14.8 -21.9 -28.6 -35.0 -41.0 -46.6 -52.0 -57.5 -62.5 -67.2 -72.0 -76.6 -7.6 -14.9 -22.1 -28.9 -35.3 -41.5 -47.1 -52.6 -58.0 -62.9 -67.7 -72.4 -77.0 5.71 5.51 5.20 4.84 4.39 3.98 3.57 3.16 2.80 2.43 2.11 1.79 1.52 7.92 7.72 7.42 7.02 6.60 6.15 5.73 5.32 4.95 4.58 4.23 3.92 3.62 8.75 8.54 8.24 7.83 7.40 6.94 6.52 6.12 5.73 5.35 5.00 4.68 4.38 168.8 157.3 145.9 135.5 125.3 116.0 107.2 98.9 90.6 83.0 75.3 67.5 60.4 168.9 157.6 146.7 136.4 126.5 117.4 108.9 100.8 92.8 85.4 78.1 70.6 63.9 169.1 157.8 147.0 136.7 126.8 117.9 109.3 101.5 93.6 86.4 79.0 71.7 65.2 -55.94 -50.26 -47.29 -45.68 -44.98 -44.62 -45.51 -45.88 -46.46 -47.88 -49.66 -49.70 -47.29 -55.74 -49.95 -47.09 -45.38 -44.69 -44.43 -45.21 -45.48 -46.06 -47.18 -48.75 -48.80 -46.98 -55.44 -49.75 -46.89 -45.18 -44.49 -44.23 -44.91 -45.08 -45.56 -46.48 -47.85 -48.20 -46.78 83.6 76.8 70.6 65.5 60.1 58.6 56.2 58.4 64.0 70.0 89.8 116.0 145.4 83.2 76.8 70.5 65.4 60.1 58.8 57.0 59.5 65.2 71.5 89.0 111.9 139.8 83.4 76.8 70.5 65.5 60.3 59.4 57.6 60.2 65.8 71.4 87.0 107.0 133.8 -0.08 -0.13 -0.21 -0.28 -0.37 -0.47 -0.55 -0.65 -0.72 -0.77 -0.82 -0.89 -0.89 -0.10 -0.16 -0.24 -0.33 -0.43 -0.53 -0.61 -0.72 -0.79 -0.85 -0.90 -0.96 -0.97 -0.13 -0.19 -0.28 -0.35 -0.46 -0.57 -0.66 -0.76 -0.84 -0.90 -0.95 -1.00 -1.01 -3.6 -7.0 -10.4 -13.5 -16.7 -19.5 -22.5 -25.1 -28.2 -30.9 -33.7 -36.7 -39.6 -3.6 -7.1 -10.5 -13.8 -17.1 -19.8 -22.6 -25.4 -28.4 -31.1 -33.8 -36.9 -39.7 -3.7 -7.2 -10.6 -13.9 -17.2 -20.0 -22.8 -25.7 -28.6 -31.3 -34.0 -36.9 -39.9
1000 1100 1200 1300 1000 1100 1200 1300 1000 1100 1200 1300
TELEFUNKEN Semiconductors Rev. 17-Apr-96
BF998/BF998R
Dimensions BF998
12240
Dimensions BF998R
12239
TELEFUNKEN Semiconductors Rev. 17-Apr-96
BF998/BF998R
Ozone Depleting Substances Policy Statement
policy TEMIC TELEFUNKEN microelectronic GmbH Meet present future national international statutory requirements. Regularly continuously improve performance products, processes, distribution operating systems with respect their impact health safety employees public, well their impact environment. particular concern control eliminate releases those substances into atmosphere which known ozone depleting substances ODSs). Montreal Protocol 1987) London Amendments 1990) intend severely restrict ODSs forbid their within next years. Various national international initiatives pressing earlier these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division been able policy continuous improvements eliminate ODSs listed following documents. Annex list transitional substances Montreal Protocol London Amendments respectively Class ozone depleting substances Clean Amendments 1990 Environmental Protection Agency EPA) Council Decision 88/540/EEC 91/690/EEC Annex transitional substances respectively. TEMIC certify that semiconductors manufactured with ozone depleting substances contain such substances.
reserve right make changes improve technical design without further notice. Parameters vary different applications. operating parameters must validated each customer application customer. Should buyer TEMIC products unintended unauthorized application, buyer shall indemnify TEMIC against claims, costs, damages, expenses, arising directly indirectly, claim personal damage, injury death associated with such unintended unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 7131 2831, number: 7131 2423
TELEFUNKEN Semiconductors Rev. 17-Apr-96

Input- mixer stages UHF- VHF-tuner Features Integrated gate

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