surface mounted application. Glass passivated junction chip. forward v

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surface mounted application. Glass passivated junction chip. forward v

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surface mounted application. Glass passivated junction chip. forward voltage drop. High current capability. Easy pick place. High surge current capability. Plastic material. High temperature soldering: 260°C/10 seconds terminals.
SMC/DO-214AB
Dimensions Inches (Millimetres)
Mechanical Data:
Cases Terminals Polarity Packaging Weight Moulded plastic. Pure plated, lead free. Indicated cathode band. 16mm tape RS-481. 0.21 gram.
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25/07/08 V1.1
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Maximum Ratings Electrical Characteristics
Rating 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive inductive load. capacitive load, derate current 20%. Type Number Maximum Recurrent Peak Reverse Voltage Maximum Voltage Maximum Blocking Voltage Maximum Average Forward Rectified Current 105°C Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed Rated Load (JEDEC method Maximum Instantaneous Forward Voltage 3.0A Maximum Reverse Current 25°C Rated Blocking Voltage 125°C Maximum Reverse Recovery Time (Note Typical Junction Capacitance (Note Typical Thermal Resistance (Note Operating Temperature Range Storage Temperature Range Symbol VRRM VRMS
(AV)
1000 1000
Units
IFSM
TSTG
1.15 10.0 +150
°C/W
Notes: Reverse Recovery Test Conditions: 0.5A, 1.0A, 0.25A. Measured 1MHz Applied Volts. Measured Board with inches (16mm 16mm) Copper Areas.
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Ratings Characteristic Curves (S3B, S3M)
Maximum Forward Current Derating Curve Typical Reverse Characteristics
Average Forward Current
Lead Temperature (°C) Maximum Non-Repetitive Forward Surge Current Peak Forward Surge Current
Instantaneous Reverse Current (µA)
Percent Rated Peak Reverse Voltage Typical Forward Characteristics
Number Cycles 60Hz Typical Junction Capacitance
Junction Capacitance (pF)
Instantaneous Forward Current
Forward Voltage Reverse Voltage
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25/07/08 V1.1
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Reverse Recovery Time Characteristic Test Circuit Diagram
Note: Rise Time Maximum Input Impedance megohm 22pf Rise Time 10ns Maximum Source Impedance ohms
Part Number Table
Description Diode, Standard, 100V Diode, Standard, 800V Diode, Standard, 1000V Part Number
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Notes:
International Sales Offices:
AUSTRALIA Farnell
++61 1300 ++61 1300
FINLAND Farnell
7780 5411
ITALY Farnell
SPAIN Farnell
AUSTRIA Farnell
2180 2180
FRANCE Farnell
MALAYSIA Farnell-Newark 7873 8000 7873 7000
SWEDEN Farnell
BELGIUM Farnell
2810 3648
GERMANY Farnell
NETHERLANDS Farnell
7373 7333
SWITZERLAND Farnell
BRAZIL Farnell-Newark
4066 9400 4066 9410
HONG KONG
Farnell-Newark 2268 9888
ZEALAND Farnell
0800 0800
Farnell
8701 8701
2268 9899
CHINA Farnell-Newark
++86 6238 5152 ++86 6238 5022
HUNGARY Farnell
1200 1200
NORWAY Farnell
8701 8701
CZECH REPUBLIC Farnell
1200 1200
INDIA Farnell
1200 1200
PORTUGAL Farnell
8804 5288
Newark
9275
DENMARK Farnell
IRELAND Farnell
9277 9016
RUSSIA Farnell
1200 1200
export
EXPORT Farnell
8701 8701
enquiries from other markets
ESTONIA Farnell
7780 5411
ISRAEL Farnell
0015 0014
SINGAPORE Farnell-Newark 6788 0200
6788 0300
http://www.farnell.com http://www.newark.com http://www.cpc.co.uk
Disclaimer This data sheet contents (the "Information") belong Premier Farnell Group (the "Group") licensed licence granted other than information purposes connection with products which relates. licence intellectual property rights granted. Information subject change without notice replaces data sheets previously supplied. Information supplied believed accurate Group assumes responsibility accuracy completeness, error omission from made Users this data sheet should check themselves Information suitability products their purpose make assumptions based information included omitted. Liability loss damage resulting from reliance Information (including liability resulting from negligence where Group aware possibility such loss damage arising) excluded. This will operate limit restrict Group's liability death personal injury resulting from negligence. Multicomp registered trademark Group. Premier Farnell 2008.
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25/07/08 V1.1

surface mounted application. Glass passivated junction chip. forward v

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