SKiM industrial standard IGBT-modules SKiiP® technology Author: R

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SKiM industrial standard IGBT-modules SKiiP® technology Author: R

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SKiM industrial standard IGBT-modules SKiiP® technology
Author: Rickmer Heubeck, Product Manager SEMIKRON International Introduction packaging technology power semiconductors demands high power output with reliable compact design. issues reduction material process costs combined with improved long-term reliability reduced failure rate. structure module ensure required electrical insulation with minimized size optimal thermal capability. These requirements realized SKiiP® technology, pressure contact packaging developed SEMIKRON. SKiiP technology also used SKiM modules, which define industrial standard their compact, reliable height packaging. three module types cover wide range power levels, leading considerable reduction logistic cost.
SKiiP technology (SEMIKRON intelligent integrated Power) forms basis SKiiPPACK
well SEMITOP MiniSKiiP product families. SEMIKRON presents generation three-phase IGBT-modules with SKiM family (SEMIKRON integrated Module) which also based SKiiP® technology. module family designed drive applications various applications such uninterrupted power supplies (UPS), welding, electric vehicles, wind power plants, etc. SEMIKRON developed their SKiM product range joint co-operation with international market leaders thereby ensuring global compatibility modules fulfilling requirements industrial standard. Presently, module family comprises versions SKiM SKiM SKiM
SKiiP technology
main objective SKiiP® technology (figure improve reliability conventional module structures simultaneously design very compact low-cost packaging. SKiiP® technology achieves highly integrated isolated power circuit configurations shows unique features: direct thermal pressure contact ceramic (Direct Bonded Copper) heat sink connection control terminals ceramic through electrical pressure contacts.
Figure principle SKiiP® technology ceramic carries bonded chips used electrical insulation heat transfer. thermal pressure contact between ceramic heat sink achieved special pressure contact system through distributed vertical pressure mounting. This eliminates need copper baseplate bolt down module heat sink. Figure compares conventional power module SKiiP® module. obvious that junction temperature pressure contact package lower than soldered construction. Conventional modules characterized mismatch coefficients thermal expansion (CTE) therefore thermal stress silicon, ceramic copper baseplate. SKiiP modules material sequence where match better. Therefore reliability power modules with incorporated SKiiP® technology, remarkably higher than power modules with soldered baseplate.
Figure Comparison between conventional module SKiiP® module
Another unique feature SKiiP® technology that control terminals connected ceramic using electrical spring terminals. conventional power modules, printed-circuit board contacted using solder connection. low-power levels, MiniSKiiP family already offers no-soldering solution; contact (driver) printed-circuit board achieved simple snap-on mounting. With SKiM SKiM modules, snap-on mounting also possible medium high power range when mounting driver board pressure contact power module. integration driver longer requires additional soldering, result simple mounting with reduced costs improved reliability.
Figure Exploded view SKiM components SKiM® family
SKiiP
Figure Assembly with driver board
technology which forms basis SKiM module family ensures
following advantages: modules require baseplate thermal pressure contacts spring terminals adapting driver board control terminals (SKiM4 SKiM5) integrated temperature sensor (SKiM SKiM ultra-low, compact housing with low-inductance homogeneous current distribution
SKiM
SKiM
SKiM
pressure contact packaging, copper baseplate required which results elimination thermal resistance solder layer copper baseplate reduction mechanical stress. Last least, innovative pressure contact packaging outstanding through increased reliability comparison power modules with soldered baseplate. Whereas SKiM equipped with solder contacts suitable manufacturing lines which wave soldering, SKiM SKiM equipped with spring terminals. matrix spring contacts integrated these modules enable easy adaptation driver boards without soldering. Moreover, replacement required components simple. special construction power modules, components also mounted underneath printed-circuit board, result being compact design whole inverter unit. heat sink temperature permanently monitored integrated temperature sensor. total height modules been considerably reduced ultra-low, lowinductance housing. special packaging SKiM modules simplifies overall mounting system. SKiM modules available three different sizes (SKiM SKiM SKiM either six-pack dual-pack configuration, cover power range from to1200 1200 components. footprint SKiM six-pack configuration, corresponds dimensions three SEMITRANS modules, thus providing easy redesign. equipped with three DC-connector pairs connection laminated bars. internal structure dual-pack configuration possible with six-pack module without derating output current. module connection height 17,5 SKiM basically identical SKiM with regards module structure. difference that SKiM equipped with DC-connectors that it`s footprint corresponds that SEMITRANS modules. Presently, different variants SKiM available with standard 1200 NPTIGBT =25°C). 1200 different chip variants used SKiM SKiM modules: IGBT3 Infineon, which characterized combination trench thin-wafer technology optimized NPT-structure. other variant 1200V-IGBT ABB, which so-called SPT-IGBT (soft-punch-through). chip planar structure thin-wafer technology. addition 1200 versions, SKiM module family will also available 1700 versions.
Module type
Voltage VCES 600V
Current THS=70°C
Package
Circuit schematic
SKiM
SKiM
SKiM
1200V
SKiM
1200V
SKiM
600V
SKiM
SKiM 600V
SKiM
1200V
SKiM
1200V
SKiM
1700V
SKiM
600V
SKiM
SKiM
1200V
SKiM
1700V
under development
Conclusion With SKiM module family SEMIKRON setting standard IGBT power modules with regards compactness reliability high-power output. combination outstanding reliability SKiiP® technology, comprehensive standardization, well cooperation with other market leaders bear potential defining industrial standard.
power levels ranging from 1200 (1200V) switch, these power modules offer significant advantages with respect logistics system integration.

SKiM industrial standard IGBT-modules SKiiP® technology Author: R

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