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Pentium® Processor Thermal Design Guidelines
Order Number: 243331-003
Information this document provided connection with Intel products. license, express implied, estoppel otherwise, intellectual property rights granted this document. Except provided Intel's Terms Conditions Sale such products, Intel assumes liability whatsoever, Intel disclaims express implied warranty, relating sale and/or Intel products including liability warranties relating fitness particular purpose, merchantability, infringement patent, copyright other intellectual property right. Intel products intended medical, life saving, life sustaining applications. Intel make changes specifications product descriptions time, without notice. Designers must rely absence characteristics features instructions marked "reserved" "undefined." Intel reserves these future definition shall have responsibility whatsoever conflicts incompatibilities arising from future changes them. Pentium® processor contain design defects errors known errata which cause product deviate from published specifications. Current characterized errata available request. Contact your local Intel sales office your distributor obtain latest specifications before placing your product rder. Copies documents which have ordering number referenced this document, other Intel literature obtained calling 1-800548-4725 visiting Intel's website http://www.intel.com.
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Application Note
Pentium® Processor Thermal Design Guidelines
Contents
Introduction
Related Documents. Terms Used this Document
Importance Thermal Management S.E.C.C S.E.C.C.2 Processor Packaging Technology
Single Edge Contact cartridge. Single Edge Contact Cartridge 3.2.1 Plastic Land Grid Array 3.2.2 Organic Line Grid Array. Assumptions.10 Cartridge Cover Temperature Thermal Plate Temperature Thermal Junction Temperature Thermal Case Temperature 4.5.1 S.E.C.C.2-PLGA.11 4.5.2 BSRAM.11 Power Airflow Management.12 Extruded Heatsink Solutions 5.2.1 Heatsink Design 5.2.2 Example Compatible Heatsinks 5.2.3 Example Profile (LPX) Compatible Heatsinks 5.2.4 Heatsink Weight 5.2.4.1 Center Gravity Calculations.16 Example S.E.C.C.2 Passive Heatsink.17 Thermal Interface Management 5.4.1 Bond Line Management 5.4.2 Interface Material Area 5.4.3 Interface Material Performance Fans 5.5.1 Placement 5.5.2 Direction 5.5.3 Size Quantity.21 5.5.4 Venting 5.5.4.1 Placement 5.5.4.2 Area Size 5.5.4.3 Vent Shape.22 Ducting 6.1.1 Duct Placement
Thermal Specifications
Designing Thermal Performance
Alternative Cooling Solutions
Application Note
Pentium® Processor Thermal Design Guidelines
Heatsink Heatsink Measurements System Components. 6.4.1 Placement 6.4.2 Power Common Metrology Intel Processors Using SC242. 7.1.1 Thermal Resistance 7.1.2 Thermal Solution Performance. 7.1.3 Cartridge Cover Measurement Guidelines 7.1.4 Local Ambient Temperature Measurement Guidelines S.E.C. Cartridge Metrology 7.2.1 Measurements Thermal Specifications 7.2.1.1 Thermal Plate Measurements S.E.C.C.2-OLGA Metrology 7.3.1 About HIPOWER Application 7.3.2 Executing High Power Application Software 7.3.3 Thermal Measurements 7.3.3.1 Thermal Junction Measurement Techniques 7.3.3.2 Measurement Procedure. 7.3.4 Simplified Validation Method 7.3.5 Detailed Validation Method 7.3.5.1 Determining High Power Application Software Power Consumption 7.3.5.2 Detailed Tjunction-max Validation Approach S.E.C.C.2-PLGA Metrology. 7.4.1 S.E.C.C.2-PLGA Case Temperature Measurement. 7.4.2 BSRAM Case Temperature Measurement. 7.4.2.1 BSRAM Tcase-BSRAM Validation Method
Thermal Metrology.
Conclusion
Figures
Example Exchange Through Chassis. Thermal Plate View Example Style Heatsink Side View Example Style Heatsink Side View Example Style Heatsink Maximum Distances Center Gravity Heatsink Types Front View Example Style Heatsink Center Gravity Calculation Example Impact Contact Area Grease Properties Interface Material Placement Layout Form Factor Chassis View. Placement Layout Form Factor Chassis View Space Requirements Heatsink (Front View). Space Requirements Heatsink (Side View, Supports Shown). Space Requirements Heatsink (Top View) Thermal Resistance Relationships.
Application Note
Pentium® Processor Thermal Design Guidelines
Example Processor Cover.27 Guideline Locations Local Ambient Temperature Processor Thermal Plate Temperature Measurement Location.29 Layout Max1617EV Kit.32 Measurement Setup Intel SC242 Processors S.E.C.C.2 OLGA Package Tjunction-HIPWR30 Tambient-local Executing HIPWR30.EXE Typical Example Tambient-local Measurement Location Above Center Heatsink Test Setup Power Consumption Measurements.39 PLGA Core Package Case Temperature (Tcase-PLGA) Measurement Location Technique Measuring with Angle Attachment Technique Measuring with Angle Attachment BSRAM Case Temperature (Tcase-BSRAM) Measurement Location Example Tcase-BSRAM Tambient-local
Tables
Related Documents. Definition Terms Thermal Solution Performance Sample S.E.C.C. Packaged Processors Thermal Solution Performance Intel SC242 Processor Processor Core Power Watts Data Points Graph Figure 20.37
Application Note
Pentium® Processor Thermal Design Guidelines
Introduction
system environment, processor's temperature function both system component thermal characteristics. system level thermal constraints consist local ambient temperature processor airflow over processor(s) well physical constraints above processor(s). processor temperature, measured various points, depends component power dissipation, cartridge size material (effective thermal conductivity), type interconnection substrate, presence thermal cooling solution, thermal conductivity, power density substrate. these parameters aggravated continued push technology increase performance levels (higher operating speeds) packaging density (more transistors). operating frequencies increase packaging sizes decrease, power density increases thermal cooling solution space airflow become more constrained. result increased importance system design ensure that thermal design requirements each component system. Single Edge Contact Cartridge (S.E.C.C.) Single Edge Contact Cartridge (S.E.C.C.2) packaged processors introduce temperature constraint specifications thermal parameters manage. Depending type system chassis characteristics, designs required provide adequate cooling processor. goal this document provide understanding these thermal characteristics discuss guidelines meeting thermal requirements imposed single multiple processor systems. Note: This document discusses techniques thermal management only S.E.C.C. S.E.C.C.2 processors primarily intended performance desktop. Single Edge Plastic Package (SEPP) covered.
Related Documents
following related documents available from Intel site http://developer.intel.com.
Table
Related Documents
Document Title Order Number 243502 243335 243657 243337 244458 243397 243333 243334
Pentium® Pentium®
Processor Developer's Manual Processor MHz, MHz, MHz, Datasheet
Pentium® Processor MHz, 450MHz Datasheet Pentium® Processor Specification Update
Single Edge Contact Connector (S.E.C.C. Thermal Interface Material Functional Requirements SC242 Connector Design Guidelines, Application Note Mechanical Assembly Customer Manufacturing Technology S.E.C. Cartridge Processors, Application Note AP-588 Slot Processor Overview, Application Note AP-589
Application Note
Pentium® Processor Thermal Design Guidelines
Terms Used this Document
Table contains definitions terms used throughout this document.
Table
Definition Terms
Term Tambient-local Tambient-OEM Tambient-external Definition measured ambient temperature locally surrounding processor. Measure ambient temperature just "upstream" passive heat sink, inlet active heat sink. target worst-case ambient temperature given external system location defined system designer (OEM). measured ambient temperature defined external system location defined system designer (OEM). target worst-case local ambient temperature. This determined placing system maximum external temperature conditions measuring ambient temperature locally surrounding processor. Under these conditions Tambient-local Tambient-max. This also determined simultaneously measuring Tambient-external, Tambient-local Tjunction_HIPWR30 with following equation: Tambient-max Tambient-OEM Tambient-external Tambient-local (This equation assumes thermally linear system; i.e., temperature controlled fans.) Tjunction-max Tjunction-HIPWR30 Tjunction-proj Tjunction-offset Tsensor-offset Tcase-BSRAM-max Tcase-BSRAM Tcover junction-ambient Pmax PHIPWR30 Tcase-PLGA Intel SC242 Intel SC242 processor maximum core junction temperature processor, specified processor datasheet. measured core junction temperature processor while running High Power Application software (HIPWR30.EXE). projected thermal junction temperature maximum processor power dissipation system under analysis. worst-case difference between thermal reading from on-die thermal diode hottest location processor's core, specified processor datasheet. measurement error diode connected Max1617, specified Max1617 Temperature Sensor datasheet. maximum case temperature cache BSRAM, specified processor datasheet. measured case temperature cache BSRAM, while running HIPWR30.EXE utility. maximum cover temperature S.E.C.C.2 cartridge, specified processor datasheet. thermal resistance between processor's core junction ambient air. This defined controlled system thermal solution. maximum processor power, specified processor's datasheet. processor power running High Power Application software (HIPWR30.EXE). Temperature measured PLGA processor core case while running HIPWR30.EXE Slot Connector (242 contacts): Formally referred "Slot this connector baseboard where processor installed. Intel processor which plugs into Intel SC242, including Pentium® processor
Tambient-max
Application Note
Pentium® Processor Thermal Design Guidelines
Importance Thermal Management
objective thermal management ensure that temperature components system maintained within functional limits. functional temperature limit range within which electrical circuits expected meet their specified performance requirements. Operation outside functional limit degrade system performance, cause logic errors cause component and/or system damage. Temperatures exceeding maximum operating limits result irreversible changes operating characteristics component.
S.E.C.C S.E.C.C.2 Processor Packaging Technology
This processor delivered variety packaging technologies. following sections provide overview each type.
Single Edge Contact cartridge
Intel® Pentium® processor introduced packaging technology known Single Edge Contact cartridge (S.E.C. cartridge, S.E.C.C.). S.E.C. cartridge contains microprocessor second level cache (referred "L2"). cartridge consists plastic cover aluminum thermal plate. thermal plate designed attaching heatsink using techniques described Mechanical Assembly Customer Manufacturing Technology S.E.C. Cartridge Processors application note, AP-588. S.E.C. cartridge connects motherboard through edge connector called Intel SC242 (Slot Connector 242).
Single Edge Contact Cartridge
Further developments have produced second generation S.E.C. cartridge simply referred S.E.C.C.2. This cartridge longer requires aluminum thermal plate. following sections describe separate processor substrate types used S.E.C.C.2.
3.2.1
Plastic Land Grid Array
substrate used this cartridge uses Plastic Line Grid Array (PLGA) packaged processor core BSRAM components cache. This processor type will referred this document S.E.C.C.2-PLGA.
3.2.2
Organic Line Grid Array
substrate used this cartridge uses Organic Line Grid Array (OLGA) packaged processor core BSRAM components cache. This processor type will referred this document S.E.C.C.2-OLGA.
Application Note
Pentium® Processor Thermal Design Guidelines
Thermal Specifications
power dissipation described applicable Pentium processor datasheet. Refer datasheet verify actual thermal specifications particular processor. While processor core dissipates majority thermal power, system designer should also aware thermal power dissipated second level cache. Systems should designed handle highest possible thermal power, even processor with lower power requirement planned, this will allow design accept either processor.
Assumptions
purposes this application note, following assumptions have been made about requirements proper operation reliability processor:
Considering power dissipation levels typical system ambient environments
processor's temperatures cannot maintained below specified guidelines without additional thermal enhancement dissipate heat generated.
thermal characterization data described later sections indicates that both thermalcooling device system airflow needed. size type (passive active) thermal cooling device amount system airflow interrelated traded against each other meet specific system design constraints. typical systems, board layout, spacing, component placement limit thermal solution size. Airflow determined size number fans along with their placement relation components airflow channels within system. addition, acoustic noise constraints limit size and/or types fans that used particular design. develop reliable, cost-effective thermal solution, above variables must considered. Thermal characterization simulation should carried entire system level account thermal requirements each component.
Cartridge Cover Temperature
cover temperature function local ambient temperature, internal temperature processor, various components internal processor. local ambient temperature temperature found within system chassis surrounding cartridge. This discussed temperature measurement process found "Local Ambient Temperature Measurement Guidelines" page "Cartridge Cover Measurement Guidelines" page discusses proper guidelines measuring cover temperature.
Thermal Plate Temperature
thermal plate intended provide common interface multiple types thermal solutions attach location thermal solutions onto S.E.C. cartridge. These solutions active passive. Active solutions incorporate heatsink smaller than passive heatsink. Considerations heatsink design include:
Local ambient temperature heatsink Surface area heatsink Volume airflow over surface area
Application Note
Pentium® Processor Thermal Design Guidelines
Power being dissipated processor Other physical volume constraints placed system
Note: Processors packaged S.E.C.C.2 have thermal plate. Techniques measuring thermal plate temperatures provided "Thermal Plate Measurements" page
Thermal Junction Temperature
introduction S.E.C.C.2 package with OLGA core eliminates thermal plate, which turn requires technique measuring thermal solution's effectiveness. core thermal junction temperature reading used evaluate system's thermal solution. measurement core junction temperature live processor using S.E.C.C.2 packaging technology OLGA processor core critical validate chassis heat sink thermal designs. thermal diode independently routed processor core Intel SC242 connector assist evaluating junction temperature. This diode been used client software monitor processor temperature since introduction Intel SC242 processor. more information thermal diode, refer processor datasheet. Techniques measuring thermal junction temperatures provided "Thermal Junction Measurement Techniques" page
Thermal Case Temperature
S.E.C.C.2 packaged processors also require measurement thermal case temperature. processor core cache (BSRAM) components probed with this method S.E.C.C.2PLGA package. S.E.C.C.2-OLGA, only cache probed this manner.
4.5.1
S.E.C.C.2-PLGA
S.E.C.C.2 package eliminates thermal plate, which requires system designer test core processor temperature. core case temperature reading used evaluate effectiveness system's thermal solution. This parameter should tested S.E.C.C.2-PLGA solutions. Techniques measuring core case temperatures provided "S.E.C.C.2-PLGA Case Temperature Measurement" page
4.5.2
BSRAM
introduction S.E.C.C.2 package eliminates thermal plate, which requires system designer test core processor temperature cache BSRAM components. BSRAM case temperature reading used evaluate system thermal solution's effectiveness. This parameter should tested both S.E.C.C.2-OLGA S.E.C.C.2-PLGA solutions when BSRAMs present. Techniques measuring BSRAM temperatures provided "BSRAM Case Temperature Measurement" page
Power
processor core dissipates majority thermal power. system designer should also aware thermal power dissipated second level cache. Systems should designed handle highest possible thermal power. combination processor core second level cache dissipating heat through thermal plate thermal plate power S.E.C.C.
Application Note
Pentium® Processor Thermal Design Guidelines
packaged processors. S.E.C.C.2 packages, this heat dissipated through component case (PLGA-packaged processor, BSRAM, resistors) package (OLGA). processor power total heat dissipated through paths. Note: overall system thermal design must comprehend processor power. cooling solution should designed dissipate processor core cache power.
Designing Thermal Performance
designing thermal performance, goal keep processor(s) within operational thermal specifications. inability will shorten life processor(s). goal requirement thermal design ensure these operational thermal specifications maintained. heat generated components within chassis must removed provide adequate operating environment both processor other system components. requires moving through chassis transport heat generated processor both processor other system components.
Airflow Management
important manage amount that flows within system (and flows) maximize amount that flows over processor. System flow increased adding more fans system increasing output (faster speed) existing system's fan(s). Local flow also increased managing local flow direction using baffles ducts. important consideration airflow management temperature flowing over processor(s). Heating effects from add-in boards, DRAM, disk drives greatly reduce cooling efficiency this air, does recirculation warm interior through system fan. Care must taken minimize heating effects other system components, eliminate warm circulation. example, clear path from external system vents system fan(s) will enable warm from processors efficiently pulled system. path exists across processors, warm from Intel SC242 processors will removed from system, resulting localized heating ("hot spots") around processors. Heatsink designs should aligned with direction airflow. When airflow horizontal fins should horizontally extruded, when airflow vertical fins should vertically extruded. Figure shows examples exchange through style chassis. system left example good exchange. thermal design incorporates power supply additional system fan. system right shows poorly vented system. This design uses only power supply move air; this results inadequate flow. Recirculation warm most common between system chassis, between system intake drive bays behind front bezel. These paths eliminated mounting flush chassis, thereby obstructing flow between drive bays inlet, providing generous intake vents both chassis front bezel.
Application Note
Pentium® Processor Thermal Design Guidelines
Figure Example Exchange Through Chassis
Riser Card Power Supply Vents Riser Card Power Supply
Vents
Good Airflow
Poor Airflow
Drive Bays
Drive Bays
Vents Adequate Venting Good Exchange Poor Venting Poor Exchange
Extruded Heatsink Solutions
method used improve thermal performance increase surface area device attaching metallic heatsink. Heatsinks generally extruded from blocks metal, usually aluminum (due price/performance ratio). maximize heat transfer, thermal resistance from heatsink reduced maximizing airflow through heatsink fins maximizing surface area heatsink itself.
5.2.1
Heatsink Design
Though each designer have mechanical volume restrictions implementation requirements, following diagrams illustrate "generic" system form factors that likely compatible with given type chassis design.
5.2.2
Example Compatible Heatsinks
Figure Figure (thermal plate side view respectively) indicate space available physical outline heatsink style chassis.
Application Note
Pentium® Processor Thermal Design Guidelines
Figure Thermal Plate View Example Style Heatsink
late 4.900
eats 2.100
nsions inches.
Figure Side View Example Style Heatsink
1.228 rocessor herm late over
Heatsin 2.292 2.777 onnector
0.485
2.004
aseboard
ensions inches.
Application Note
Pentium® Processor Thermal Design Guidelines
5.2.3
Example Profile (LPX) Compatible Heatsinks
Figure Figure shows front side view respectively indicating space available physical outline heatsink profile (LPX) style chassis.
Figure Side View Example Style Heatsink
2.088 Therm Plate Cover
Processor Core
Heatsink Area Slot Connector 1.774
0.485
2.804 dimensions inches.
Baseboard
EXAMPLE HEATSINK
Figure Maximum Distances Center Gravity Heatsink Types
Bottom Heat Sink
Thermal Plate Surface Chassis Type 1.2" 1.4" 1.0" 0.7"
Application Note
Pentium® Processor Thermal Design Guidelines
5.2.4
Heatsink Weight
maximum weight heatsink attachment mechanisms should exceed grams. This limit based ability processor retention mechanism heatsink support withstand mechanical shock vibration full assembly with heatsink attached. Figure provides maximum distances center gravity heatsink used with S.E.C. cartridge S.E.C. cartridge Heatsink designers should maintain center mass within "safe" area. This shaded area shown figures below.
Figure Front View Example Style Heatsink
Cover
5.2.4.1
Center Gravity Calculations
Although commonly calculated through solid modeling programs, center gravity calculated through straight forward computations described this section. center gravity object with uniform density geometrical center volume object. center gravity most easily determined dividing object into smaller objects averaging each individual centroid with respect volumes shown following equations:
volumen total volume
volumen total volume
volumen total volume
Where number smaller objects Each individual center gravity (cg) must related single point origin. Once individual calculated, multiply individual individual volume each these individual products. computational example shown Figure
Application Note
Pentium® Processor Thermal Design Guidelines
Figure Center Gravity Calculation Example
1.00 1.00 4.00 5.00
Base Axis
Axis Axes Origin Axis
heatsink thickness square base First heatsink must split into four different volumes: three blocks (1X3X5 each) base block (5X1X5). individual center gravity with respect axis origin Xcg1 0.5, 2.5, Volume Xcg2 2.5, 2.5, Volume Xcg3 4.5, 2.5, Volume Base: Xcgb 2.5, 0.5, Base Volume Total Volume that individual block centroids have been calculated, average centroids with respect volumes described earlier
Example S.E.C.C.2 Passive Heatsink
Intel designed passive heatsink S.E.C.C.2 package. This heatsink designed assuming Tambient Linear Feet Minute (LFM) airflow maximum processor power watts. Information this device located Intel's site http://developer.intel.com/ under design guidelines.
Application Note
Pentium® Processor Thermal Design Guidelines
Thermal Interface Management
optimize heatsink design Intel SC242 processor, important understand impact factors related interface between processor heatsink base. Specifically, bond line thickness, interface material area interface material thermal conductivity should managed realize most effective thermal solution. more information this subject refer Single Edge Contact Connector (S.E.C.C.2) Thermal Interface Material Functional Requirements (order number 244458).
5.4.1
Bond Line Management
between processor heatsink base impacts thermal solution performance. larger between surfaces, greater thermal resistance. thickness determined flatness both heatsink base thermal plate, plus thickness thermal interface material (i.e., thermal grease) used between these surfaces. worst case flatness thermal plate will 0.005" over entire thermal plate surface. attach area thermal plate will have flatness specified greater than 0.001" inch. flatter heatsink base, thinner resultant bond line that achieved. addition, attachment mechanism heatsink needs able supply sufficient clamping force spread interface material form thinnest film possible.
5.4.2
Interface Material Area
size contact area between processor heatsink base impacts thermal resistance. There however, point diminishing returns. Unrestrained incremental increases thermal grease area translate measurable improvement thermal performance. Figure illustrates results empirical measurements different types grease based thermal conductivity. bulk thermal conductivity type grease W/mK type grease W/mK. addition diminishing returns seen with larger grease areas, overall flatness that achieved tends decrease. decrease flatness would have negative impact potentially increasing resistance across interface between processor heatsink.
Application Note
Pentium® Processor Thermal Design Guidelines
Figure Impact Contact Area Grease Properties Interface Material
Type Type 0.28 0.26 0.24 0.22 Type
0.32
Plate-Sink
(°C/W)
0.18 0.16 0.14 0.12 0.08 0.06 0.04 0.02 1.7" 1.7" 1.7" Grease Area 2.5" 1.7" 1.7"
5.4.3
Interface Material Performance
factors impact performance interface material between processor heatsink base:
Thermal resistance material Wetting/filling characteristics material
Thermal resistance description ability thermal interface material transfer heat from surface another. higher thermal resistance, less efficient interface transferring heat. thermal resistance interface material significant impact thermal performance overall thermal solution. higher thermal resistance, higher temperature drop across interface more efficient thermal solution must wetting/filling thermal interface material ability, under load applied heatsink attach mechanism, spread fill between processor heatsink. Since extremely poor thermal conductor, more completely interface material fills gaps, lower temperature drop across interface. this case, grease area-size also becomes significant, larger desired grease area size, higher force required spread thermal interface material. Thermal pads available from various vendors provide adequate thermal interface solution. Also, some vendors supply their heatsinks with pre-applied thermal grease reduce handling, assembly time assembly steps attach thermal solution.
Application Note
Pentium® Processor Thermal Design Guidelines
Fans
Fans needed move through chassis. airflow rate usually directly related acoustic noise level system. Maximum acceptable noise levels limit output number fans selected system. Fan/heatsink assemblies type advanced solution which used cool processor. Intel worked with fan/heatsink vendors computer manufacturers make fan/heatsink cooling solutions available industry. Please consult such vendor acquire proper solution your needs.
5.5.1
Placement
Proper placement fans ensure that processor being properly cooled. Because difficulty building, measuring modifying mechanical assembly, models typically developed used simulate proposed prototype thermal effectiveness, determine optimum location fans vents within chassis. Prototype assemblies also built tested verify that system components processor thermal specifications met. Ideally, intake centered vertically placed along axis with respect Intel SC242 processor with heatsink. should also approximately inches from leading edge Intel SC242 processor heatsink. Figure Figure show recommended placement form factor layout form factor, respectively.
Figure Placement Layout Form Factor Chassis View
Front
S.E.C.C.
otherboard Peripherals Power Supply Exhaust Power Supply Vent
Application Note
Pentium® Processor Thermal Design Guidelines
Figure Placement Layout Form Factor Chassis View
Motherboard
Power Supply
Card Slots
Power Supply
Heatsink
Peripherals
Peripherals
Front Vent
5.5.2
Direction
fan(s) moving across heatsink, little cooling occur. This cause processor operate well above recommended specification values. possibilities exist blowing across heatsink Intel SC242 processor. blown down vertically horizontally across heatsink. This depend layout other components board within chassis. intake should blow through S.E.C. cartridge heatsink lengthwise. heatsink fins shorter this case. vertically extruded heatsink fins might need longer. Both these factors considerations when laying components board chassis. direction flow modified with baffles ducts direct flow over processor. This increases local flow over processor eliminate need second fan, larger fan, higher speed fan.
5.5.3
Size Quantity
always true that larger more blows. small blower using ducting might direct more over heatsink than large blowing non-directed over heatsink. following provide some guidelines size quantity fan(s). should minimum (3.150") square, with minimum airflow approximately (linear feet minute). Ideally fans should used. intake would blow directly into S.E.C. cartridge with heatsink, while second (most likely power supply) would exhaust system.
Application Note
Pentium® Processor Thermal Design Guidelines
5.5.4
Venting
Intake vents should placed front (user side) system. They should located optimize cooling processor peripherals (drives add-in cards). good starting point would lower front panel (bezel). Intake vents directly front intake optimal location. ideal design provides airflow directly over processor heatsink.
5.5.4.1
Placement
most cases, exhaust vent located power supply sufficient. However, depending number, location types add-in cards, exhaust vents necessary near cards. This should modeled prototyped optimum thermal dissipation potential. system should modeled worst case, i.e., expansion slots should occupied with typical add-in options.
5.5.4.2
Area Size
area size intake vents should designed with size shape fan(s) mind. Adequate volume requires appropriately sized vents. Intake vents should located front intake fan(s) adjacent drive bays. Vents should approximately open containment area constraints. Outside containment area, open percentage greater needed aesthetic appeal (i.e., bezel/cosmetics). more information concerning constraints Intel SC242 processor based system design, Slot Processor Overview application note (order number 243334).
5.5.4.3
Vent Shape
Round, staggered pattern openings best containment, acoustics airflow balance.
Alternative Cooling Solutions
addition extruded heatsink system fans, other solutions exist cooling integrated circuit devices. example, ducted blowers, heat pipes liquid cooling capable dissipating heat. their varying attributes, each these solutions appropriate particular system implementation. More information this topic located Intel's site http://developer.intel.com/.
Ducting
Ducts designed isolate processor(s) from effects system heating (such add-in cards), maximize processor cooling temperature budget. provided blower channeled directly over processor heatsink, split into multiple paths cool multiple processors. This method also employed provide some level redundancy system requiring redundant capabilities fault tolerance. This accomplished channeling from more fans through same path across processor. Each fan, each fans, must designed provide sufficient cooling event that other failed.
Application Note
Pentium® Processor Thermal Design Guidelines
6.1.1
Duct Placement
When ducting used, should direct airflow evenly from through length heatsink. duct design should smooth, gradual turns enhance airflow characteristics. Sharp turns ducting should avoided. Sharp turns increase friction drag greatly reduce volume reaching processor heatsink.
Heatsink
active heatsink employed alternative mechanism cooling Intel SC242 processor. This acceptable solution most chassis. Adequate clearance must provided around heatsink ensure unimpeded flow proper cooling. Intel boxed processor uses this implementation shown here example heatsink implementation. space requirements dimensions heatsink Intel boxed processor shown Figure (front view), Figure (side view) Figure (top view). dimensions inches.
Figure Space Requirements Heatsink (Front View)
Power Cable Connector
4.90
2.19
1.25
Figure Space Requirements Heatsink (Side View, Supports Shown)
1.291
Heatsink
S.E.C. Cartridge Cover
Slot Connector
0.485
Application Note
Pentium® Processor Thermal Design Guidelines
Figure Space Requirements Heatsink (Top View)
Heatsink Measurements
heatsink must able keep processor temperature, Tplate Tjunction, within specifications. This requires that airflow through heatsink unimpeded that temperature entering below Figure measurement location. Airspace required around ensure that airflow through heatsink blocked. Blocking airflow heatsink reduces cooling efficiency decreases life. Figure illustrates acceptable airspace clearance heatsink.
6.4.1
System Components
Placement
Peripherals such CD-ROMs, floppy drives, hard drives, placed take advantage fan's movement ambient (i.e., near intake exhaust fans vents). Some add-in cards often have tolerance temperature rise. These components should placed near additional vents they downstream S.E.C. cartridge minimize temperature rise.
6.4.2
Power
Some types drives, such floppy drive, dissipate much heat, while others (read/write CD-ROM, SCSI drives) dissipate great deal heat. These hotter components should placed near fans vents whenever possible. same said some types add-in cards. Some cards very wattage while others high watts, specification. Great care should taken ensure that these cards have sufficient cooling.
Application Note
Pentium® Processor Thermal Design Guidelines
Thermal Metrology
following sections will discuss techniques testing thermal solutions under three package types: S.E.C. cartridge, S.E.C.C.2-OLGA, S.E.C.C.2-PLGA. should noted that determining processor sufficiently cooled simple seem. Carefully read following instructions interpretation steps validate your cooling solution. "S.E.C. Cartridge Metrology" page describes steps necessary test S.E.C. cartridge thermal plate temperature. "S.E.C.C.2-OLGA Metrology" page describes steps testing S.E.C.C.2-OLGA cartridge processor temperature. "S.E.C.C.2-PLGA Metrology" page covers steps testing S.E.C.C.2-PLGA cartridge processor temperature. next section describes steps common three packages.
7.1.1
Common Metrology Intel Processors Using SC242
Thermal Resistance
thermal resistance value plate-to-ambient (PA) S.E.C.C. packages, core-to-ambient (CA) S.E.C.C.2 packages used measure cooling solution's thermal performance. Thermal resistance measured units °C/W. thermal resistance plate-to-local ambient, comprised plate-to-sink thermal resistance (PS) sink-to-local ambient thermal resistance (SA). measure thermal resistance along heat flow path from processor cartridge bottom thermal cooling solution. thermal resistance core-to-ambient, comprised case (PLGA) processor core (OLGA) thermal resistance sink-to-local ambient thermal resistance (SA). This value strongly dependent thermal conductivity thickness material used interface between heatsink surface processor. measure thermal resistance from bottom cooling solution local ambient air. dependent heatsink's material, thermal conductivity, geometry, strongly dependent velocity through fins heatsink.
Figure Thermal Resistance Relationships
Tplate
Application Note
Pentium® Processor Thermal Design Guidelines
thermal parameters related following equations: (Tplate TLA)/PD Where: Tplate= Thermal resistance from plate-to-local ambient (°C/W) Processor thermal plate temperature (°C) Local ambient temperature chassis around processor (°C) Device power dissipation assume power goes other side) Thermal resistance from plate-to-sink (°C/W) Thermal resistance from heatsink-to-local ambient (°C/W)
7.1.2
Thermal Solution Performance
processor thermal solutions should attach processor cartridge. thermal solution must adequately control processor local ambient around processor (thermal plate local ambient). lower thermal resistance between processor local ambient air, more efficient thermal solution required thermal plate local ambient depends maximum allowed processor temperature (Tcartridge), local ambient temperature (TLA) processor power (Pcartridge). This expressed following equation: (Tcartridge TLA) Pcartridge function system design. Table Table provide resultant thermal solution performance Intel SC242 processor different local ambient temperatures around processor.
Table
Thermal Solution Performance Sample S.E.C.C. Packaged Processors
Tambient Intel SC242 Processor (°C/W) Thermal Plate Power 41.4 Watts 0.85 0.99 1.11 Thermal Plate Power 26.4 Watts 1.33 1.52 1.70
NOTE: applicable processor datasheet required power specifications
Application Note
Pentium® Processor Thermal Design Guidelines
Table
Thermal Solution Performance Intel SC242 Processor Processor Core Power Watts
Tambient
(°C/W) Processor Core Power
1.25 1.42 1.61
Intel SC242 Processor
NOTE: applicable processor datasheet required power specifications
value made primary components: thermal resistance between processor heatsink (PS) thermal resistance between heatsink local ambient around processor (SA). critical controllable factor decrease resultant value between processor heatsink. Thermal interfaces addressed later section. other controllable factor (SA) determined design heatsink airflow around heatsink. Heatsink design constraints discussed later section.
7.1.3
Cartridge Cover Measurement Guidelines
cartridge cover temperature specification maximum There several components substrate that comprise Intel SC242 processor. Each these components generates heat since some components reside opposite side substrate from processor core, cover must also meet specified temperature proper operation. Techniques similar those presented "Thermal Plate Measurements" page measuring thermal plate temperature used cover measurements. HIPWR30.EXE application should running when Tcover measurement made. Refer "About HIPOWER Application" page information HIPWR30.EXE application. Please contact your local Intel Field Sales representative receive copy.
Figure Example Processor Cover
7.1.4
Local Ambient Temperature Measurement Guidelines
Local ambient temperature, TLA, temperature ambient surrounding cartridge. system environment, ambient temperature temperature upstream cartridge close vicinity; active cooling system, inlet active cooling device.
Application Note
Pentium® Processor Thermal Design Guidelines
Note:
ambient temperature specified Intel SC242 processor. only restriction that Tcover (cover temperature) Tplate (thermal plate temperature) requirements met. worthwhile determine local ambient temperature chassis around processor better understand effect have thermal plate temperature cover temperature. determine values, following equation used: Tcover Where: Tcover Local ambient temperature (°C) Cover temperature device under test (°C) Total power dissipated Intel SC242 processor Cover-to-local ambient thermal resistance (°C/W)
following guidelines meant alleviate non-uniform measurements found typical systems. local ambient temperature best measured average localized surrounding processor. following guidelines meant enable accurate determination localized temperature around processor during system thermal testing. These guidelines meant reasonable expectation ensure product specifications met.
During system thermal testing, minimum thermocouples should placed
approximately 0.5" away from cartridge cover heatsink shown Figure This placement guideline meant minimize localized spots processor, heatsink, other system components.
thermocouples should placed approximately inches above baseboard. This
placement guideline meant minimize localized spots from baseboard components.
should average thermocouple measurements during system thermal
testing. Figure Guideline Locations Local Ambient Temperature
Approximately inch places Approximately inch places
Centered Bottom, thermocouples
Processor Cover
View
Application Note
Pentium® Processor Thermal Design Guidelines
7.2.1
S.E.C. Cartridge Metrology
Measurements Thermal Specifications
appropriately determine thermal properties system, measurements must made. Guidelines have been established proper techniques measuring processor temperatures. following sections describe these guidelines measurement.
7.2.1.1
Thermal Plate Measurements
ensure functionality reliability, Intel SC242 processor specified proper operation when Tplate (thermal plate temperature) maintained below surface temperature thermal plate directly above center processor core measured. Figure shows location Tplate measurement. Figure Processor Thermal Plate Temperature Measurement Location
Cover 2.673 Measure from edge thermal plate. Measure TPLATE this point.
Approx. location recommended heatsink attachment.
1.089 Processor Core
Substrate Recommended location 0.35 thermal grease application. dimensions inches.
Special care required when measuring Tplate temperature ensure accurate temperature measurement. Thermocouples often used measure Tplate. Before temperature measurements made, thermocouples must calibrated. When measuring temperature surface which different temperature from surrounding local ambient air, errors could introduced measurements. measurement errors could having poor thermal contact between thermocouple junction surface thermal plate, heat loss radiation, convection, conduction through thermocouple leads, contact between thermocouple cement heatsink base. minimize these measurement errors, following approach recommended:
gauge finer diameter type thermocouples. Ensure that thermocouple been properly calibrated. Attach thermocouple bead junction surface thermal plate location
specified Figure using high thermal conductivity cements.
Application Note
Pentium® Processor Thermal Design Guidelines
thermocouple should attached angle there heatsink interference with
thermocouple attach location leads. Refer Figure example.
thermocouple should attached angle heatsink attached thermal
plate heatsink covers location specified Tplate measurement. Refer Figure example.
hole size through heatsink base route thermocouple wires should smaller
than 0.150" diameter.
Make sure there contact between thermocouple cement heatsink base. Contact
will affect thermocouple reading.
S.E.C.C.2-OLGA Metrology
This section describes procedure measuring core junction temperature Intel SC242 processors Single Edge Contact Cartridge (S.E.C.C.2) package with OLGA core packaging technology. metrology involves High Power Application software (HIPWR30.EXE) perform system level analysis cooling solutions. Using methodologies described this section, system designer will able validate system cooling solutions compatibility with specified processor worst-case power consumption. specific measurements involved, processor core temperature utilizing on-die thermal diode (described this section) cache BSRAM using temperature probe BSRAM case (described "BSRAM Case Temperature Measurement" page 42). Currently only reliable accurate method measuring Tjunction OLGA with Maxim Tool. While tempting place measurement device OLGA package results correlated Tjunction. Extensive experiments were conducted Intel using OLGA package measurement method, results were very inconsistent highly variable.
7.3.1
About HIPOWER Application
High Power Application software (HIPWR30.EXE) intended thermal evaluation purposes only. This software general purpose application. software does generate absolute worst-case thermal power dissipation defined processor's datasheet. Differences between observed thermal power measurements maximum power dissipation indicated datasheet attributed process variation, manufacturing tester guardbands, system configuration differences potential High Power Application software optimizations. This software does provide system designers with application nearing worst-case power consumption analysis validation system cooling solutions. systems should designed with ability dissipate worst case thermal power indicated datasheet. High Power Application software, utilizing methodologies presented this document, enable system designers design validate robust cooling solutions that adequately cool processor maximum specifications. High Power Application software maximizes current consumption processor core. execution stages various functional units core cache fully utilized. software performs minimal system accesses, with minimal cache utilization. This mode operation produces large amount thermal power from processor.
Application Note
Pentium® Processor Thermal Design Guidelines
newer High Power Application ("HIPWR30.EXE") incorporates functionality "HIPWR30.EXE" utility cache exerciser. "HIPWR30.EXE" modes, which only exercises processor's core power another which only runs cache utilization code. mode that concentrates processor's core same application HIPWR30.EXE executing "HIPWR30 command window. purpose this document procedures that involve High Power Application "HIPWR30.EXE" equivalent using "HIPWR30 /P". references "HIPWR30.EXE", "HIPWR30 used alternatively. "HIPWR30.EXE" utility also mode cache utilization that used produce large amount thermal power from cache BSRAMS. execute this utility cache mode execute "HIPWR30 command window.
7.3.2
Executing High Power Application Software
High Power Application software Windows* Windows* 95/98 application. application should executed from window command prompt from within Windows Windows 95/98 environment, from only environment. High Power Application software puts processor into infinite loop locks command prompt environment. HIPWR30.EXE utility on-screen message with version number information usage help. halt execution application, Windows Task Manager* Windows 95/98 Task Bar* stop execution command prompt environment. maximum processor power consumption, software should only application executing system under evaluation. recommended that Windows Windows 95/98 operating environment configured default settings.
7.3.3
Thermal Measurements
High Power Application software used design validate cooling solutions compatible with maximum power dissipation values specified processor's datasheet. methodologies presented validating worst-case processor compliance using this software. "Simplified Validation Method" page presents simplified approach that system designers check worst-case processor power dissipation compatibility. those designs that prove compatible appear marginal using simplified approach, "Detailed Validation Method" page provides more detailed, accurate methodology validating worst-case power compliance. detailed approach does require significant increase effort over simplified approach, provides more accurate measurement method using specific characteristics processor under analysis.
7.3.3.1
Thermal Junction Measurement Techniques
Purpose purpose this procedure explain take junction (die) level temperature measurements live Intel SC242 processors S.E.C.C.2 package technology with OLGA processor core package using Max1617EV kit. electrical connections software keystrokes needed take no-power power-on temperature measurements included. Background measurement junction temperature live processor using S.E.C.C.2 packaging technology OLGA processor core critical validate chassis heat sink thermal design. thermal diode independently routed processor core SC242 connector
Application Note
Pentium® Processor Thermal Design Guidelines
assist evaluating junction temperature. order simplify measurement diode temperature, recommended Max1617EV kit. advantage using that requires calibration diode. Max1617EV tool provided Maxim Integrated Products which includes Max1617 temperature sensor additional circuitry software needed take temperature measurements with Max1617 typical (see Figure layout kit). Max1617 essentially 8-bit converter integrated controller which measures difference between voltage drop across diode using exciting currents derive junction temperature. 8-bit temperature data accessed external applications 2-wire SMBus. conditions output from Max1617 read standard 25-pin parallel port terminal Software included with display temperature measurements running Windows Windows 95/98 Max1617 Max1617EV datasheets more detailed information measurement tools. Figure Layout Max1617EV
Equipment Needed
Max1617EV (with software) from Maxim Integrated Products (www.maxim-ic.com) off-the-shelf battery battery connector with extension wires Pentium class with available parallel port Windows Windows 95/98 take temperature measurements (measuring parallel port cable with straight-through connector, male-to-female type twisted, shielded pair cable, long, gauge stranded copper insulated wire, gauge stranded copper, same length shielded pair cable long) alligator clip wire (only make room temperature measurements) soldering iron live chassis with processor diode evaluated (test
Application Note
Pentium® Processor Thermal Design Guidelines
7.3.3.2
Measurement Procedure
Electrical Hookups This section outlines electrical connectivity Max1617EV measure on-die diode. Figure diagram test setup. details locating SC242 pins refer Figure SC242 Connector Design Guidelines (order number 243397).
Figure Measurement Setup
Wires SC242 Pins B14, B15,
Parallel Port Cable
Max1617EV TEST Running KPOWER.EXE MEASURING Running Maxim measurement software
Remove motherboard from test Strip insulation ends insulated wire twisted, shielded pairs, wire tips. Solder insulated wire SC242 connector ground (Vss). Ensure that motherboard thermal sensor disconnected from processor. motherboard provides zero resistors this purpose, remove them, otherwise traces going B15. Solder wire twisted, shielded pair SC242 connector B14/THERMDP (diode anode). Solder other wire twisted, shielded pair SC242 connector B15/THERMDN (diode cathode). reduced noise conditions recommended solder shield twisted pair ground processor side. alternate SC242 connector, such A18, chosen. Tape ground wire twisted, shielded pair wires backside motherboard relieve stress solder joints. Route wires edge motherboard which enough clearance allow wires pass through. Replace motherboard chassis (you wish take room temperature measurements processor before replacing chassis components verify good solder joints). Route wires chassis through slot other convenient hole chassis), taking care ensure wires obstruct critical airflow paths. Solder ground wire (pin A10) GND1 Max1617EV substrate (see Figure page 32). Solder diode anode wire (pinB14) DXP1 Max1617EV substrate (see Figure 18).
Application Note
Pentium® Processor Thermal Design Guidelines
Solder diode cathode wire (pin B15) DXN1 Max1617EV substrate (see Figure 18). Solder battery connector wires POS9 pads Max1617EV substrate, taking care ensure correct polarity. soldering iron remove transistor component Max1617EV (just north DXP1 DXN1 pads Figure Using parallel port cable, connect measuring Max1617EV kit. Software Installation This section describes install temperature measurement software. software disk which comes with Max1617EV into floppy drive. Start Windows Program manager application. Select drive. install software hard drive, INSTALL.EXE application. This will automatically program group containing test software, help document, uninstall application. test software from floppy disk. No-Power (Test Measurement This section optional describes take no-power test temperature measurements processor diode. useful gain confidence Max1617EV accuracy, however, requires extra electrical hookup. Plug battery into battery connector. Slide switch, kit, from "off" "on". Using wire with alligator clips ends, short together wires connected GND1 (Vss) DXN1 (diode cathode) kit. This step needed room temperature measurements only, diode properly biased when test processor running. Start test program from floppy hard drive starting MAX1617.EXE application. dialog will appear listing three possible parallel port addresses. auto-detect routine successful finding kit, addresses will automatically selected. Select "OK". none addresses selected, there probably problem with parallel port connection with kit. Close application check connections. there addressing problems, window containing temperature measurement data collection control features will start there slave addressing problems, check make sure that electrical connections properly made that switch "on" position. that does solve addressing problem, please refer Max1617 data sheet resolve problem). Select measurement rate Temperature measurements from processor diode will automatically update labeled "Remote." temperatures displayed "local" measurements taken using Max1617 temperature sensor. temperatures displayed should read ambient temperature (provided test processor been heated up). This typically around
Application Note
Pentium® Processor Thermal Design Guidelines
Power-On (Test Temperature Measurement This process outlines processor diode take temperature measurements while processor powered This procedure that should used validate chassis heat sink thermal designs while running high power application software. Plug battery into battery connector. Slide switch, kit, from "off" "on". Important: Remove alligator clips from between GND1 DXN1 used no-power measurement. Start test program from floppy hard drive starting MAX1617.EXE application. dialog will appear listing three possible parallel port addresses. auto-detect routine successful finding kit, addresses will automatically selected. Select "OK". none addresses selected, there probably problem with parallel port connection with kit. Close application check connections. there addressing problems, window containing temperature measurement data collection control features will start there slave addressing problems, check make sure that electrical connections properly made that switch "on" position. that does solve addressing problem, please refer Max1617 data sheet resolve problem). Select measurement rate Temperature measurements from processor diode will automatically update labeled "Remote." temperatures displayed "local" measurements taken using Max1617 temperature sensor. Temperatures will unpredictable this time diode properly biased until test powered Turn test high power application software. Allow High Power Application software least hour allow chassis components come thermal equilibrium. Note temperature displayed "remote" box. This test processor Tjunction-HIPWR30 temperature.
7.3.4
Simplified Validation Method
This section assumes familiarity with terms defined processor datasheets. These available http://developer.intel.com. technique described here used verify system under test from Tambient Tambient-max. Performing simplified validation cooling solution junction temperature maximum specified processor power dissipation values requires measurement Tjunction-HIPWR30 Tambient-local temperatures while executing High Power Application software. system processor under analysis should prepared gather Tjunction-HIPWR30 temperature measurement described "S.E.C.C.2-OLGA Metrology" page Tambient-local temperature just "upstream" passive heat sink inlet active heat sink using thermocouple (see Figure page 41). Once system ready data collection, HIPWR30.EXE High Power Application software should executed. With HIPWR30.EXE executing, after temperatures have stabilized, gather Tjunction-HIPWR30 Tambient-local temperature measurements.
Application Note
Pentium® Processor Thermal Design Guidelines
graph shown Figure page plots maximum acceptable. Tjunction-HIPWR30 temperatures measured Tambient-local temperature given target Tambient-max while running High Power Application software. junction temperature shown maximum temperature value given Tambient-local while running High Power Application software that ensures compliance with worst-case power dissipation values specified processor's datasheet. measured Tjunction-HIPWR30 less than equal temperature graph measured Tambient-local specific target Tambient-max, then system cooling solution compliant worst-case specification provided datasheet. systems with non-linear thermal behavior, like those with thermally controlled fan(s), system designer should exercise caution ensure that processor temperature specifications given dependencies airflow different activation patterns. change airflow effectively changes qjunction-ambient processor's thermal solution. Therefore, various system conditions should evaluated when determining worst-case target Tambient-max, Tambient-local Tjunction-HIPWR30. measured Tjunction-HIPWR30 temperature measured Tambient-local exceeds value specified graph, then detailed measurement approach presented "Detailed Validation Method" page should used. detailed approach incorporates actual power consumed processor while executing High Power Application software effectiveness particular cooling solution eliminate guard-banding added account "HIPWR30.EXE" power dissipation variances across processors. Tjunction-HIPWR30 temperatures shown Figure were derived using empirical worst-case power dissipation values executing High Power Application using Max1617EV kit. example, determining compliance processor Tjunction-max specification stated processor's datasheet: Stated Conditions: Processor Core Freq. Tambient-local 35.0 (measured local processor running HIPWR30.EXE) Tjunction-HIPWR30 62.0 (measured temperature running HIPWR30.EXE) Tambient-OEM 35.0 (maximum target ambient temp. from system designer) Tambient-external 25.0 (measured external ambient temperature) Using equation from definition table, have: Tambient-max Tambient-OEM Tambient-external Tambient-local Tambient-Max 35.0 25.0 35.0 Tambient-max 45.0 From graph Figure drawing vertical line from Tambient-local 35.0 intersecting Tambient-max 45.0 draw horizontal line y-axis determine Tjunction-HIPWR30 66.0 Since measured junction temperature 62.0 while running HIPWR30.EXE less that y-axis value 66.0 cooling solution compliant with example processor's maximum junction temperature using S.E.C.C.2 package.
Application Note
Pentium® Processor Thermal Design Guidelines
Figure Intel SC242 Processors S.E.C.C.2 OLGA Package Tjunction-HIPWR30 Tambient-local Executing HIPWR30.EXE
Tjunction-KPOWER [deg. bient-local easured) [deg. Ta,max=35C Ta,max=45C Ta,max=55C
Table
Data Points Graph Figure
Tambient-local (Measured) Tambient-max Tjunction-HIPWR30 (°C) Tambient-max Tambient-max
Application Note
Pentium® Processor Thermal Design Guidelines
Figure Typical Example Tambient-local Measurement Location Above Center Heatsink
tsin
stra
cover
7.3.5
Detailed Validation Method
detailed validation method uses actual power dissipation values processor under test while running High Power Application software effectiveness cooling solution determine projected Tjunction-proj temperature worst-case specifications. This projected temperature then used determine worst-case compliance.
7.3.5.1
Determining High Power Application Software Power Consumption
Gathering valid processor power consumption dissipation data requires isolation processor power source from power source other system components. isolation requires external supplies provide power processor. Isolation processor's power systems accomplished masking power source edge fingers processor from baseboard power delivery paths. This isolation attained modifications either system baseboard SC242 connector/baseboard connection. external supplies used source processor power should able provide voltage current readings regular intervals during system operation. This data then stored analyzed maximum average power consumption figures. Figure illustrates test setup that used collect power consumption data. External power supplies should used source both VccCORE VccL2 power gather data processor power consumption measurements. isolated power supply required minimal activity system during execution High Power Application software. should provided processor from system supply.
Application Note
Pentium® Processor Thermal Design Guidelines
Figure Test Setup Power Consumption Measurements
HOST
Power Supply
Power Supply
sense CORE 2.8V Test Platform
sense VccL2 3.3V
Current voltage data should sampled from external power supplies several times second over span several seconds. Increasing number data collection points will improve precision test results. While impossible determine absolute maximum power consumed processor using periodic sampling methodology, average power consumption data derived. High Power Application software, this maximum power consumption value adequate approximation maximum thermal power dissipation processor.
7.3.5.2
Detailed Tjunction-max Validation Approach
Detailed evaluation cooling solution cool Tjunction-max uses power dissipation data along with actual Tambient-local Tjunction-HIPWR30 temperatures while running High Power Application software determine effectiveness cooling solution. This effectiveness characterized junction ambient thermal resistance junction-ambient should calculated using measured system Tambient-local, Tjunction_HIPWR30, PHIPWR30, shown Equation Equation Thermal Junction Ambient Thermal Resistance junction-ambient (Tjunction-HIPWR30 Tjunction-offset Tsensor-offset Tambient-local) PHIPWR30 following example shows junction-ambient example system. junction-ambient should calculated using actual system measurements processor specifications: Stated Conditions Processor Core Freq. Tambient-local 40.0 (measured temperature) Tjunction-HIPWR30 70.0 (measured temperature) PHIPWR30 25.0 (measured power) Pmax 28.0 (from processor's datasheet) Tjunction-max 90.0 (from processor's datasheet) Tjunction-offset (from processor's datasheet)
Application Note
Pentium® Processor Thermal Design Guidelines
Tsensor-offset (from Max1617 datasheet) junction-ambient (70.0 40.0 25.0 1.51 °C/W Using calculated junction-ambient measured system Tambient-local, possible determine projected processor junction temperature maximum specified processor junction power. This accomplished using Equation Equation Projected Junction Temperature Maximum Power Tjunction-proj (junction-ambient Pmax) Tambient-max calculated Tjunction-proj lower than specified maximum processor junction temperature, Tjunction-max, then system cooling solution compatible with maximum processor power specifications given core frequency. Continuing previous example determine worst case processor compatibility: Stated Conditions Tambient-max Tjunction-proj 45.0 (maximum target local ambient temperature from system designer) (1.51 °C/W 28.0 45.0 87.3 Tjunction-max 87.3 90.0 Since 87.3 less than specified maximum junction temperature 90.0 example cooling solution compliant with example processors.
S.E.C.C.2-PLGA Metrology
ensure functional reliable operation, processor's core case temperature (Tcase-PLGA) must maintained below maximum Tcase-PLGA above minimum Tcase-PLGA specified processor datasheet. addition cache BSRAM's case temperature must kept within operating parameters.
7.4.1
S.E.C.C.2-PLGA Case Temperature Measurement
Figure shows location Tcase-PLGA measurement, assuming external heating factors which cause other areas processor's core case reach higher temperatures. Thermocouples used measure Tcase-PLGA; special care required ensure accurate temperature measurement. Before taking temperature measurements, thermocouples must calibrated. When measuring temperature surface, errors introduced measurement handled properly. Such measurement errors poor thermal contact between thermocouple junction surface processor's core case, conduction through thermocouple leads, heat loss radiation convection, contact between thermocouple cement heatsink base. minimize these errors, following approach recommended:
gauge finer diameter type thermocouples. Intel's laboratory testing
done using thermocouple made Omega* (part number: 5TC-TTK-36-36).
Attach thermocouple bead junction surface processor's core case
location specified Figure page using high thermal conductivity cements.
Application Note
Pentium® Processor Thermal Design Guidelines
thermocouple should attached angle heatsink attached processor's
core case. heatsink attached processor's core case, heatsink does cover location specified Tcase-PLGA measurement, thermocouple should attached angle (refer Figure
thermocouple should attached angle heatsink attached processor's
core case heatsink covers location specified Tcase-PLGA measurement (refer Figure
hole size through heatsink base route thermocouple wires should smaller
than 0.150" diameter.
Make sure there contact between thermocouple cement heatsink base. This
contact will affect thermocouple reading. Figure PLGA Core Package Case Temperature (Tcase-PLGA) Measurement Location
Measurement Location
Figure Technique Measuring with Angle Attachment
Figure Technique Measuring with Angle Attachment
000900
Application Note
Pentium® Processor Thermal Design Guidelines
7.4.2
BSRAM Case Temperature Measurement
ensure functional reliable operation, Cache BSRAM case temperature (Tcase-BSRAM) should maintained below maximum Tcase-BSRAM above minimum TcaseBSRAM specified processor datasheet. Figure shows location Tcase-BSRAM measurement, assuming external heating factors that cause other areas BSRAM's case reach higher temperatures. Before taking Tcase-BSRAM measurement, execute HIPWR30.EXE utility approximately hour maximize power dissipation BSRAM devices allow stable reading. select cache power portion utility execute with "/L" switch from command window: "HIPWR30 /L". Thermocouples used measure Tcase-BSRAM. Special care required ensure accurate temperature measurement. Before taking temperature measurements, thermocouples must calibrated. When measuring temperature surface, errors introduced measurement handled properly. Such measurement errors poor thermal contact between thermocouple junction surface processor's core case, conduction through thermocouple leads, heat loss radiation convection, contact between thermocouple cement heatsink base. minimize these errors, following approach recommended:
gauge finer diameter type thermocouples. Attach thermocouple bead junction using high thermal conductivity cements
center BSRAM package. Figure
Ensure thermocouple attached angle heat sink makes contact with
BSRAM case. heat sink makes contact with BSRAM case, heat sink does cover location specified Tcase-BSRAM measurement, thermocouple should attached angle (refer Figure thermocouple should attached angle heat sink makes contact with BSRAM case heat sink covers location specified Tcase-BSRAM measurement (refer Figure
Drill hole through heat sink base route thermocouple wires out. Ensure this hole
smaller than 0.150" diameter.
Make sure there contact between thermocouple cement heat sink base. This
contact will affect thermocouple reading. Figure BSRAM Case Temperature (Tcase-BSRAM) Measurement Location
cache BSRAM
Application Note
Pentium® Processor Thermal Design Guidelines
7.4.2.1
BSRAM Tcase-BSRAM Validation Method
Once Tcase-BSRAM been obtained, simple equation used determine compliance specified maximum BSRAM case temperature. Equation relates measured case temperature running High Power Application software cache with measured ambient temperature given target maximum ambient temperature processor frequency. Figure page example graph three given target ambient maximum temperatures. Equation valid determining compliance maximum BSRAM case temperature processors using S.E.C.C.2 OLGA package. Equation BSRAM Case Temperature Limit Maximum Power Tcase-BSRAM 105.56 0.0392 frequency (Tambient-max Tambient-local) Where frequency processor's operating frequency MHz. Equation developed accommodate different frequencies. 105.56 equation from empirical data nothing with BSRAM case specified maximum temperature. Figure Example Tcase-BSRAM Tambient-local
Tcase (measured) [deg. bient-local, easured [deg. Tambient-max
determining compliance processor Tcase-BSRAM specification following example illustrates simplified equation: Stated Conditions Processor Core Freq. Tambient-local 47.1 (measured temperature) Tcase-BSRAM 80.6 (measured temperature running HIPWR30 Tambient-max 45.0 (maximum target ambient temperature from system designer) Using Equation have: Tcase-BSRAM 105.56 0.0392 frequency (Tambient-max Tambient-local)
Application Note
Pentium® Processor Thermal Design Guidelines
105.56 0.0392 (45.0 47.1) 80.6 105.56 17.64 (-2.1) 90.02 Since measured Tcase-BSRAM 80.6 less than calculated maximum case temperature from Equation cooling solution compliant with example processor using S.E.C.C.2 package.
Conclusion
complexity today's microprocessors continues increase, power dissipation requirements. Care must taken ensure that additional power properly dissipated. Heat dissipated using passive heatsinks, fans and/or active cooling devices. Further solutions achieved through ducting solutions. simplest most cost effective method extruded heatsink system fan. size heatsink output varied balance size space constraints with acoustic noise. This document presented conditions requirements properly designing heatsink solution Intel SC242 processor based system. Properly designed solutions provide adequate cooling maintain Intel SC242 processor. This accomplished providing local ambient temperature creating minimal thermal resistance that local ambient temperature. Active heatsinks ducting used cool processor(s) proper cover package temperatures cannot maintained otherwise. maintaining processor's cover temperature processor temperature values specified processor datasheet, system guarantee proper functionality reliability these processors.
Application Note

Order Number: 243331-003 Information this document provided conne

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