KOOL-PADS offer cost alternative other types thermally conductive insu

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

KOOL-PADS offer cost alternative other types thermally conductive insu

Datasheet Thumbnail

Top Searches for this datasheet

Insulating
KOOL-PADS offer cost alternative other types thermally conductive insulators constructed from thermally conductive silicone rubber compound coated onto layer woven glassfibre, they provide strong flexible clean insulator, which will crack, permit contamination. Used mainly between heatsinks semiconductors, KOOL-PADS soft pliable surfaces allow consistent efficient heat transfer while maintaining good electrical insulation when replacing mica grease, KOOL-PADS will allow reduced assembly through ease application they contain organic materials, will support fungus growth resist most cleaning fluids KOOL-PADS.
Specifications:
Adhesive coating: KOOL-PAD insulators available with pressure sensitive adhesive which assembly does affect wide operating temperature range. Custom standard shapes: Materials available from stock most standard outlines materials available custom cutting with moderate tool charges quick delivery sheets. Mounting pressures: Typical mounting pressures 21-42 Kg/CM2 this achieved using torque 04-0 transistor mounting screw, depending upon package size most clip mounting methods provide lower pressure which will result higher thermal resistance. Breakdown voltage: insulating materials tested in-house ASD149 procedure determining dielectric strengeth involve punched holes test sample. When screw mounting semiconductor with nut, bolt insulating bush there danger flash-through from underside semiconductor heatsink outside insulating bush depending insulator thickness other mechanical factors this flash-through could volts should your flash test requirements higher then suggest mounting clips thermaflex contact technical department advice. Plastic encapsulated semiconductors: electrical insulation required particularly when using plastic encapsulated devices then very much higher thermal conductance achieved using ZEMREX CM20 pads.
http://www.farnell.com http://www.newark.com http://www.cpc.co.uk
Page
21/02/09 V1.1
Insulating
Typical Properties KOOL-PADS
Part Prefix Code Thickness (mm) Breakdown Voltage 50Hz Normal Moist Approximate Thermal Resistance (TO-3 Transistor)°C/Watt Thermal Conductivity W/°Km Hardness, Shore Micro Specific Gravity Elongation Percent Continuous Temperature Colour K177 0.177 ±0.02 4000 2000 0.40 0.710 Grey
Part Number
Description Insulating Part Number K177-NA-403+BQ35
Disclaimer This data sheet contents (the "Information") belong Premier Farnell Group (the "Group") licensed licence granted other than information purposes connection with products which relates. licence intellectual property rights granted. Information subject change without notice replaces data sheets previously supplied. Information supplied believed accurate Group assumes responsibility accuracy completeness, error omission from made Users this data sheet should check themselves Information suitability products their purpose make assumptions based information included omitted. Liability loss damage resulting from reliance Information (including liability resulting from negligence where Group aware possibility such loss damage arising) excluded. This will operate limit restrict Group's liability death personal injury resulting from negligence. Multicomp registered trademark Group. Premier Farnell 2009.
http://www.farnell.com http://www.newark.com http://www.cpc.co.uk
Page
21/02/09 V1.1

KOOL-PADS offer cost alternative other types thermally conductive insu

Top Searches for this datasheet

Other recent searches