Package Outline Drawing dimensions means referential values. Term
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means theoretical dimensions. dimensions terminals defined bottom. Notes
Package Outline Drawing
dimensions means referential values. Terminals:Gold plating
Indication Odered monthly Manufactured month (Jan. Sep.: 9,Oct.:O,Nov.:N,Dec.:D) Last digit manufactured year
MS6M 0741
200V JAPAN
6MBP
P:The details terminals
H04-004-03
Dimensions
Descriptions Main circuit Symbol Description Positive input supply voltage. Output (U). Output (V). Output (W). (For connection external shunt-resistor) Negative input supply voltage.
Control circuit Symbol GNDU High side ground (U). VinU VccU Logic input IGBT gate drive (U). High side supply voltage (U). Description
GNDV High side ground (V). VinV VccV Logic input IGBT gate drive (V). High side supply voltage (V).
GNDW High side ground (W). VinW VccW Logic input IGBT gate drive (W). High side supply voltage (W).
VinX VinY VinZ
side ground. side supply voltage. Logic input IGBT gate drive (X). Logic input IGBT gate drive (Y). Logic input IGBT gate drive (Z). side alarm signal output.
MS6M 0741
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Block Diagram
Pre-driver VccU VinU GNDU Pre-driver VccV VinV GNDV Pre-driver VccW VinW GNDW Pre-driver2
SGNDX OUTX SGND SGND SGND
VinX VinY VinZ
SGNDY OUTY
SGNDZ OUTZ PGND
6.75m
RALM
1.5k
Pre-drover includes following functions. (P-side) Amplifier driver Under voltage lockout circuit IGBT chip over heating protection
Pre-drover2 includes following functions. (N-side) Amplifier driver Under voltage lockout circuit IGBT chip over heating protection Over current protection Alarm signal output
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Absolute Maximum Ratings unless otherwise specified. Items Voltage (between terminal Surge Short operating Collector-Emitter Voltage Collector Current Duty=78%
Collector Power Dissipation
Symbol VDC(surge) Vces VALM Topr Tstg Tsol Viso
Min. -0.5 -0.5 -0.5
Max. 1000 1200 Vcc+0.5 AC2500
Units
transistor
Supply Voltage Pre-Driver Input Signal Voltage Input Signal Current Alarm Signal Voltage Alarm Signal Current Junction Temperature Operating Case Temperature Storage Temperature Solder Temperature Isolating Voltage (Terminal base, 50/60Hz sine wave 1min.) Screw Torque Mounting (M4)
Note
Vces shall applied input voltage between terminal Duty=125 /FWD Pc=125 /IGBT Rth(j-c)=125/1.36=92W shall applied input voltage between terminal No.3 shall applied input voltage between terminal No.2
12,13,14 shall applied voltage between terminal No.15 shall applied input current terminal No.15. Immersion time 1sec
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Electrical Characteristics unless otherwise specified. Item Collector Current signal input Collector-Emitter saturation voltage Forward voltage Turn-on time Turn-off time Reverse recovery time Symbol ICES Conditions 1200V terminal open. Terminal Chip Terminal Chip toff 600V Tj=125 Fig.1 Fig.6 600V Control circuit Item Supply current P-side pre-driver (one unit) Supply current N-side pre-driver Input signal threshold voltage Input Zener Voltage Vin(th) Alarm Signal Hold Time tALM Fig.2 Symbol Iccp Iccn Conditions Switching Frequency 6kHz Fig.7 Min. Typ. Max. Units Fig.1 Fig.6 Min. Typ. Max. Units Main circuit
1.25 1425
1.35 1500 6.75
1.95 1575
Current Limit Resistor Shunt-Resistor over current sense RALM Alarm terminal Between terminal
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Protection Section Item
Symbol Conditions Tj=125 Min. Typ. Max. Units
Over Current Protection Level Inverter circuit Over Current Protection Delay time IGBT Chips Over Heating Protection Temperature Level Over Heating Protection Hysteresis Under Voltage Protection Level Under Voltage Protection Hysteresis Thermal Characteristics Item Junction Case Thermal Resistance
tdoc TjOH
Tj=125 Surface IGBT Chips
11.1
11.7
12.4
Symbol IGBT Rth(j-c) Rth(j-c) Rth(c-f)
Min.
Typ. 0.05
Max. 1.36 3.46
Units
Case Thermal Resistance with Compound *9:(For 1device, Case under device) Noise Immunity Item Common mode rectangular noise Common mode lightning surge
Vdc=600V Vcc=15V Test Circuit Conditions Pulse width 1us,polarity ±,10 minutes Judge over-current, miss operating
Rise time 1.2us,Fall time 50us Interval 20s,10 times
Min. ±2.0
Typ.
Max.
Units
±5.0
Judge over-current, miss operating
Recommended Operating Conditions Item Voltage Power Supply Voltage Pre-Driver Screw Torque (M4) Weight Item Weight Symbol Min. Typ. Max. Units Symbol Min. 13.5 Typ. 15.0 Max. 16.5 Units
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Figure Switching Time Waveform Definitions
/Vin (Inside IPM) Fault (Inside IPM) /ALM
Gate Gate normal alarm tALM Max. tALM Max.
tALM
2ms(typ.)
Fault
Over-current,Over-heat Under-voltage
Figure Input/Output Timing Diagram
Necessary conditions alarm reset (refer
figure2.)
This represents case when failure-causing Fault lasts period more than tALM. alarm resets when input Fault disappeared. This represents case when condition input lasts period more than tALM. alarm resets when turns under Fault conditions. This represents case when Fault disappears turns within tALM. alarm resets after lasting period specified time tALM.
/Vin
/ALM
tdoc
alarm tdoc
Figure Over-current Protection Timing Diagram
Period
When collector current over level flows command input within period less than trip delay time tdoc, current hard-interrupted alarm output.
Period
When collector current over level flows period more than trip delay time tdoc, current soft-interrupted. this detected lower IGBTs, alarm output.
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IALM
IALM
IALM
Figure.4 Definition
VccU
VinU
AC200V
GNDU
VinX
4700p Noise
Earth
Cooling
Figure Noise Test Circuit
HCPL450
300V
Figure Switching Characteristics Test Circuit
Figure Test Circuit
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Truth table 10.1 IGBT Control following table shows IGBT ON/OFF status with respect input signal Vin. IGBT turn-on when "Low" level under alarm condition.
Input (Vin) High
Alarm High
Output (IGBT)
10.2 Fault Detection When fault detected high side, only detected stops output. that time dosen't alarm. When fault detected side, lower arms stop their outputs outputs alarm side.
Cause Fault
Alarm Output High side (U-phase) High side (V-phase) High side (W-phase) High High High High High High side
High side (U-phase) High side (V-phase) High side (W-phase)
TjOH TjOH TjOH
side
TjOH
Depend input logic.
MS6M 0741
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Cautions design application Trace routing layout should designed with particular attention least stray capacity between primary secondary sides optical isolators minimizing wiring length between optical isolators input terminals possible.
Mount capacitor between each high-speed optical isolator close possible.
Vcc-GND
high-speed optical isolator, high-CMR type with tpHL, tpLH
tpHL,tpLH 0.8us
0.8µs.
alarm output circuit, low-speed type optical isolators with
100%
100%.
control power Vcc, four power supplies isolated each. they should designed reduce voltage variations.
Suppress surge voltages possible reducing inductance between connecting some capacitors between terminals.
prevent noise intrusion from lines, connect capacitor some 4700pF between three-phase lines each ground.
external circuit, never connect control terminal GNDU main terminal U-phase, GNDV V-phase, GNDW W-phase, N-phase. Otherwise, malfunctions caused.
Take note that optical isolator's response primary input signal becomes slow capacitor connected between input terminal GND.
-GND
Taking used isolator's into account, design with sufficient allowance decide primary forward current optical isolator.
MS6M 0741
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Apply thermal compound surfaces between heat sink reduce thermal contact resistance.
Finish heat sink surface within roughness 10µm flatness (camber) between screw positions +50µm. flatness minus, heat radiation becomes worse between heat sink IPM. And, flatness over +50µm, there danger that copper base deformed this cause dielectric breakdown.
10um +50um 50um
Heat sink
Mounting holes
This product designed assumption that applies inverter use. Sufficient examination required when applying converter use. Please contact Fuji Electric Co.,Ltd would like applying converter use.
There thermal interference between nearby power devices,because P619 compact package. Therefore measure case temperature just under IGBT chips that showed report MT6M04858, estimate chip temperature.
MT6M04858
Please
Fuji IGBT-IPM SERIES APPLICATION MANUAL RH983 Fuji IGBT
MODULES SERIES APPLICATION MANUAL RH982
IGBT-IPM RH983 IGBT
RH982
MS6M 0741
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Example applied circuit
Opto-Coupler 0.1µF 10µF 0.1µF 10µF 0.1µF 10µF
Motor
0.1µF 33µF
Package Marking Please MT6M4140 that packing specification
Cautions storage transportation Store modules normal temperature humidity 35°C, 75%).
75%)
Avoid sudden change ambient temperature prevent condensation module surfaces. Avoid places where corrosive generates much dust exists. Store module terminals under unprocessed conditions
Avoid physical shock falls during transportation.
Scope application This specification applied IGBT-IPM (type: 6MBP15RA120). IGBT-IPM Based safety standards UL1557 6MBP15RA120)
MS6M 0741
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7.Characteristics .Inverter
Collector current Collector-Emitter voltage (typ.) Tj=25°C Chip
Vcc=15V Collector Current Vcc=17V Vcc=13V Collector Current
Collector current Collector-Emitter voltage (typ.) Tj=25°C Terminal
Vcc=15V
Vcc=17V Vcc=13V
Collector-Emitter voltage
Collector-Emitter voltage
Collector current Collector-Emitter voltage (typ.) Tj=125°C Chip
Vcc=15V Vcc=17V Vcc=13V
Collector current Collector-Emitter voltage (typ.) Tj=125°C Terminal
Vcc=15V Collector Current
Collector Current
Vcc=17V Vcc=13V
Collector-Emitter voltage
Collector-Emitter voltage
Forward current Forward voltage (typ.) Chip
125°C Forward Current 25°C Forward Current
Forward current Forward voltage (typ.) Terminal
125°C
25°C
Forward voltage
Forward voltage
MS6M 0741
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Switching Loss Collector Current (typ.) Edc=600V,Vcc=15V,Tj=25°C
Switching loss Eon,Eoff,Err (mJ/cycle) Switching loss Eon,Eoff,Err (mJ/cycle) Collector current Eoff
Switching Loss Collector Current (typ.) Edc=600V,Vcc=15V,Tj=125°C
Eoff
Collector current
Collector current
Reversed biased safe operating area Vcc= 5V,Tj (max.)
Thermal resistance Rth(j-c) (°C/W)
Transient thermal resistance (max.)
IGBT
SCSOA (non-repetitive pulse)
RBSOA (Repetitive pulse)
0.01 0.001 0.01
Collector-Emitter voltage
Pulse width (sec)
Power derating IGBT (per device) (max.)
Collecter Power Dissipation Collecter Power Dissipation
Power derating (per device) (max.)
Case Temperature (°C)
Case Temperature (°C)
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Switching time Collector current (typ.) Edc=600V,Vcc=15V,Tj=25°C
10000 Switching time ton,toff,tf (nSec) Switching time ton,toff,tf (nSec) 10000
Switching time Collector current (typ.) Edc=600V,Vcc=15V,Tj=125°C
toff 1000
toff 1000
Collector current
Collector current
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Reliability Test Items
Test categories Reference Number Acceptnorms EIAJ ance ED-4701 sample number
Test Method Method Test Method method Test Method Condition code
Test items Terminal strength Pull force
Test methods conditions
(main terminal) (control terminal) (Pull test) Test time sec. (M4) Mounting Strength Screw torque Test time sec. Vibration Range frequency Sweeping time min. Acceleration m/s2 Sweeping direction Each X,Y,Z axis Test time (2hr./direction) Shock Maximum acceleration: 5000 m/s2 Pulse width Direction Each X,Y,Z axis Test time times/direction Solderabitlity Solder temp. Immersion duration ±0.5 sec. Test time time Each terminal should Immersed solder within 1~1.5mm from body. Resistance Solder temp. soldering heat Immersion time ±1sec. Test time time Each terminal should Immersed solder within 1~1.5mm from body. High temperature Storage temp. storage Test duration 1000 temperature Storage temp. storage Test duration 1000 Temperature Storage temp. humidity storage Relative humidity Test duration 1000hr. Unsaturated Test temp. pressure cooker Atmospheric pressure 1.7x105 Test humidity Test duration Temperature Test temp. Minimum storage temp. cycle Maximum storage temp. Normal temp. Dwell time Tmin Tmax 1hr. 0.5hr. 1hr. 0.5hr. Number cycles cycles Thermal shock Test temp. High temp. side
(0:1)
(0:1) (0:1)
Mechanical Tests
Test Method Condition code
(0:1)
Test Method Condition code
(0:1)
Test Method Condition code
(0:1)
Test Method Test Method Test Method Test code Test Method Test code
(0:1) (0:1) (0:1)
(0:1)
Environment Tests
Test Method
(0:1)
Test Method method Condition code
(0:1)
Fluid used Dipping time Transfer time Number cycles
temp. side Pure water (running water) min. each temp. sec. cycles
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Test categories
Test items High temperature Test temp. reverse bias Bias Voltage Bias Method Test duration time time Test temp.
Test methods conditions Applied voltage 1000 sec. sec. Tj=100 ±5deg Ta=25 15000 cycles
Reference norms Number AcceptEIAJ ance ED-4701 sample number Test Method
(1:0)
Endurance Endurance Tests Tests
Intermitted operating life (Power cycle)
Test Method
(1:0)
Number cycles
Failure Criteria
Item Electrical characteristic Characteristic Leakage current Saturation voltage Forward voltage Thermal resistance IGBT Symbol ICES VCE(sat) th(j-c) th(j-c) tALM TcOH Viso Failure criteria Lower limit Upper limit Unit Note
Over Current Protection Alarm signal hold time Over heating Protection Isolation voltage Visual inspection Visual inspection Peeling Plating others
Broken insulation visual sample
Lower specified limit. Upper specified limit. Note Each parameter measurement read-outs shall made after stabilizing components room ambient hours minimum, hours maximum after removal from tests. case wetting tests, example, moisture resistance tests, each component shall made wipe completely before measurement.
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Warnings This product shall used within absolute maximum rating (voltage, current, temperature). This product broken case using beyond ratings.
Connect adequate fuse protector circuit between three-phase line this product prevent equipment from causing secondary destruction.
When studying device normal turn-off action, make sure that working paths turn-off voltage current within RBSOA specification. ,when studying device duty short-circuit current non-repetitive interruption, make sure that paths also within SCSOA specification. case IGBT-IPM over these specifications,it might possible broken.
RBSOA SCSOA
this product after realizing enough working environment considering product's reliability life. This product broken before target life system case using beyond product's reliability life.
product been used environment with acid, organic matter, corrosive (For example hydrogen sulfide, sulfurous acid gas), product's performance appearance ensured easily.
thermal stress generated from rise fall restricts product lifetime.
should estimate from power losses thermal resistance, design inverter lifetime
MT6M4057)
within number cycles provided from power cycle curve. (Technical Rep. No.: MT6M4057)
Never mechanical stress deform main control terminal. deformed terminal cause poor contact problem.
excessive static electricity applied control terminals, devices broken. Implement some countermeasures against static electricity.
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Caution Fuji Electric constantly making every endeavor improve product quality reliability. However, semiconductor products rarely happen fail malfunction. prevent accidents causing injury death, damage property like fire, other social damage resulted from failure malfunction Fuji Electric semiconductor products, take some measures keep safety such redundant design, spread-fire-preventive design, malfunction-protective design.
application examples described this specification only explain typical ones that used Fuji Electric products. This specification never ensure enforce industrial property other rights, license enforcement rights.
product described this specification designed made being applied equipment systems used under life-threatening situations. When consider applying product this specification particular used, such vehicle-mounted units, shipboard equipment, aerospace equipment, medical devices, atomic control systems submarine relaying equipment systems, please apply after confirmation this product satisfied about system construction required reliability.
there unclear matter this specification, please contact Fuji Electric Co., Ltd.
MS6M 0741
H04-004-03
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