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High Precision Amps Offset Voltage: ±150 (maximum) Quiescent Curr
Top Searches for this datasheetMCP6051/2/4 High Precision Amps Offset Voltage: ±150 (maximum) Quiescent Current: (typical) Rail-to-Rail Input Output Wide Supply Voltage Range: 1.8V 6.0V Gain Bandwidth Product: (typical) Unity Gain Stable Extended Temperature Range: -40°C +125°C Phase Reversal Description Microchip Technology Inc. MCP6051/2/4 family operational amplifiers amps) input offset voltage (±150 maximum) rail-to-rail input output operation. This family unity gain stable gain bandwidth product (typical). These devices operate with single supply voltage 1.8V, while drawing quiescent current amplifier typical). These features make family amps well suited single-supply, high precision, battery-powered applications. MCP6051/2/4 family offered single (MCP6051), dual (MCP6052), quad (MCP6054) configurations. MCP6051/2/4 designed with Microchip's advanced CMOS process. devices available extended temperature range, with power supply range 1.8V 6.0V. Applications Automotive Portable Instrumentation Sensor Conditioning Battery Powered Systems Medical Instrumentation Test Equipment Analog Filters Package Types MCP6051 SOIC VIN- VIN+ VOUT Design Aids SPICE Macro Models FilterLab® Software MindiCircuit Designer Simulator Microchip Advanced Part Selector (MAPS) Analog Demonstration Evaluation Boards Application Notes MCP6052 SOIC VOUTA VINA- VINA+ VOUTB VINB- VINB+ MCP6051 TDFN VIN- VIN+ MCP6052 TDFN VOUTA VINA- VOUTB VINB- VINB+ Typical Application MCP6051 Gyrator VOUT VOUT VINA+ MCP6054 SOIC, TSSOP VOUTA VINA- VINA+ VINB+ VINB- VOUTB VOUTD VIND- VIND+ VINC+ VINC- VOUTC Includes Exposed Thermal (EP); Table 3-1. 2009 Microchip Technology Inc. DS22182A-page MCP6051/2/4 NOTES: DS22182A-page 2009 Microchip Technology Inc. MCP6051/2/4 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Notice: Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability. 4.1.2 "Input Voltage Current Limits" .7.0V Current Input Pins Analog Inputs (VIN+, VIN-) 1.0V 1.0V Other Inputs Outputs 0.3V 0.3V Difference Input Voltage |VDD VSS| Output Short-Circuit Current .continuous Current Output Supply Pins .±30 Storage Temperature .-65°C +150°C Maximum Junction Temperature (TJ). +150°C protection pins (HBM; 400V Specifications ELECTRICAL SPECIFICATIONS TABLE 1-1: Electrical Characteristics: Unless otherwise indicated, +1.8V +6.0V, VSS= GND, +25°C, VDD/2, VOUT VDD/2, VDD/2 (Refer Figure 1-1). Parameters Input Offset Input Offset Voltage Input Offset Drift with Temperature VOS/TA VOS/TA Power Supply Rejection Ratio Input Bias Current Impedance Input Bias Current Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode Common Mode Input Voltage Range Common Mode Rejection Ratio VCMR VCMR CMRR VSS-0.2 VSS-0.3 Note VDD+0.2 VDD+0.3 1.8V (Note 6.0V (Note -0.2V 2.0V, 1.8V -0.3V 6.3V, 6.0V 3.0V 6.3V, 6.0V -0.3V 3.0V, 6.0V ZDIFF ±1.0 1100 ±1.0 1013||6 1013||6 5000 ||pF ||pF +85°C +125°C PSRR -150 ±1.5 ±4.0 +150 3.0V, VDD/3 Units Conditions µV/°C -40°C +85°C, 3.0V, VDD/3 µV/°C +85°C +125°C, 3.0V, VDD/3 Figure 2-13 shows VCMR changed across temperature. 2009 Microchip Technology Inc. DS22182A-page MCP6051/2/4 TABLE 1-1: ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, +1.8V +6.0V, VSS= GND, +25°C, VDD/2, VOUT VDD/2, VDD/2 (Refer Figure 1-1). Parameters Open-Loop Gain Open-Loop Gain (Large Signal) Output Maximum Output Voltage Swing Output Short-Circuit Current Power Supply Supply Voltage Quiescent Current Amplifier Note 6.0V 0.9VDD VOL, VSS+15 VDD-15 V/V, 0.5V input overdrive 1.8V 6.0V 0.2V VOUT <(VDD-0.2V) Units Conditions Figure 2-13 shows VCMR changed across temperature. TABLE 1-2: ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, +25°C, +1.8 +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2, (Refer Figure 1-1). Parameters Response Gain Bandwidth Product Phase Margin Slew Rate Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density µVp-p nV/Hz fA/Hz GBWP 0.15 V/µs Units Conditions TABLE 1-3: TEMPERATURE SPECIFICATIONS Parameters 149.5 95.3 +125 +150 Units °C/W °C/W °C/W °C/W Conditions Note Electrical Characteristics: Unless otherwise indicated, +1.8V +6.0V GND. Temperature Ranges Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 8L-2x3 TDFN Thermal Resistance, 8L-SOIC Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note internal junction temperature (TJ) must exceed absolute maximum specification +150°C. DS22182A-page 2009 Microchip Technology Inc. MCP6051/2/4 Test Circuits VIN+ MCP605X VIN- VOUT VDD/2 circuit used most tests shown Figure 1-1. This circuit independently VOUT; Equation 1-1. Note that circuit's common mode voltage ((VP VM)/2), that VOST includes plus effects input offset error, VOST) temperature, CMRR, PSRR AOL. EQUATION 1-1: Where: Differential Mode Gain Amp's Common Mode Input Voltage VOST Amp's Total Input Offset Voltage (V/V) (mV) FIGURE 1-1: Test Circuit Most Specifications. 2009 Microchip Technology Inc. DS22182A-page MCP6051/2/4 NOTES: DS22182A-page 2009 Microchip Technology Inc. MCP6051/2/4 Note: TYPICAL PERFORMANCE CURVES graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range. Note: Unless otherwise indicated, +25°C, +1.8V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2, -150 -120 Input Offset Voltage (µV) Input Offset Voltage (µV) 1244 Samples 3.0V -150 -300 -450 -600 -750 -0.5 Percentage Occurences 6.0V Representative Part -40°C +25°C +85°C +125°C Common Mode Input Voltage FIGURE 2-1: 3.0V. Input Offset Voltage with FIGURE 2-4: Input Offset Voltage Common Mode Input Voltage with 6.0V. -150 -300 -450 -600 -750 -0.2 -0.5 Percentage Occurences Input Offset Voltage (µV) 1244 Samples 3.0V VDD/3 -40°C +85°C 3.0V Representative Part -40°C +25°C +85°C +125°C Input Offset Drift with Temperature (µV/°C) Common Mode Input Voltage FIGURE 2-2: Input Offset Voltage Drift with 3.0V +85°C. Input Offset Drift with Temperature (µV/°C) FIGURE 2-5: Input Offset Voltage Common Mode Input Voltage with 3.0V. Percentage Occurences 1244 Samples 3.0V VDD/3 +85°C +125°C FIGURE 2-3: Input Offset Voltage Drift with 3.0V +85°C. FIGURE 2-6: Input Offset Voltage Common Mode Input Voltage with 1.8V. 2009 Microchip Technology Inc. DS22182A-page MCP6051/2/4 Note: Unless otherwise indicated, +25°C, +1.8V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2, Input Offset Voltage (µV) -150 -250 -350 Output Voltage 1.8V 3.0V 6.0V Representative Part -0.5 Input Noise Voltage Density (nV/Hz) 6.0V Common Mode Input Voltage FIGURE 2-7: Output Voltage. -150 -300 -450 -600 -750 Input Offset Voltage FIGURE 2-10: Input Noise Voltage Density Common Mode Input Voltage. CMRR, PSRR (dB) Input Offset Voltage (µV) +125°C +85°C +25°C -40°C Representative Part PSRR- Representative Part CMRR PSRR+ Power Supply Voltage 1000 10000 Frequency (Hz) 100k 100000 1000000 FIGURE 2-8: Input Offset Voltage Power Supply Voltage. 1,000 FIGURE 2-11: Frequency. CMRR, PSRR Input Noise Voltage Density (nV/Hz) PSRR,CMRR (dB) CMRR (VDD 6.0V, -0.3V 6.3V) PSRR (VDD 1.8V 6.0V, VSS) 10000 100000 1k1000 100k Frequency (Hz) Ambient Temperature (°C) FIGURE 2-9: Frequency. Input Noise Voltage Density FIGURE 2-12: Temperature. CMRR, PSRR Ambient DS22182A-page 2009 Microchip Technology Inc. MCP6051/2/4 Note: Unless otherwise indicated, +25°C, +1.8V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2, 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30 -0.35 6.0V 3.0V 1.8V 1.8V 3.0V 6.0V Common Mode Input Voltage Range Limit Quiescent Current (µA/Amplifier) 6.0V 0.9VDD 1.8V 0.9VDD Ambient Temperature (°C) Ambient Temperature (°C) FIGURE 2-13: Common Mode Input Voltage Range Limit Ambient Temperature. 10000 FIGURE 2-16: Quiescent Current Ambient Temperature with 0.9VDD. Quiescent Current (uA) Input Bias Offset Currents (pA) 6.0V 6.0V 0.9VDD 1000 Input Offset Current Input Bias Current +125°C +85°C +25°C -40°C Ambient Temperature (°C) Power Supply Voltage FIGURE 2-14: Input Bias, Offset Currents Ambient Temperature. 10000 Input Bias Current (pA) 6.0V FIGURE 2-17: Quiescent Current Power Supply Voltage with 0.9VDD. Open-Loop Gain (dB) 1.E-01 Open-Loop Gain 1000 +125°C Open-Loop Phase Common Mode Input Votlage +85°C -120 -150 6.0V -180 -210 100k 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 Frequency (Hz) FIGURE 2-15: Input Bias Current Common Mode Input Voltage. FIGURE 2-18: Frequency. Open-Loop Gain, Phase 2009 Microchip Technology Inc. DS22182A-page Open-Loop Phase MCP6051/2/4 Note: Unless otherwise indicated, +25°C, +1.8V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2, Gain Bandwidth Product (MHz) Power Supply Voltage -0.5 Common Mode Input Voltage 6.0V Phase Margin Gain Bandwidth Product Phase Margin Phase Margin Phase Margin DC-Open Loop Gain (dB) 0.2V VOUT 0.2V FIGURE 2-19: Open-Loop Gain Power Supply Voltage. 6.0V 1.8V Large Signal 0.00 0.05 0.10 0.15 0.20 0.25 Output Voltage Headroom FIGURE 2-22: Gain Bandwidth Product, Phase Margin Common Mode Input Voltage. Gain Bandwidth Product (MHz) 6.0V Phase Margin Gain Bandwidth Product DC-Open Loop Gain (dB) Ambient Temperature (°C) FIGURE 2-20: Open-Loop Gain Output Voltage Headroom. Channel Channel Separation (dB) Input Referred FIGURE 2-23: Gain Bandwidth Product, Phase Margin Ambient Temperature. Gain Bandwidth Product (MHz) Ambient Temperature (°C) 1.8V Phase Margin Gain Bandwidth Product 1000 100k 10000 100000 Frequency (Hz) 1000000 FIGURE 2-21: Channel-to-Channel Separation Frequency MCP6052/4 only). FIGURE 2-24: Gain Bandwidth Product, Phase Margin Ambient Temperature. DS22182A-page 2009 Microchip Technology Inc. MCP6051/2/4 Note: Unless otherwise indicated, +25°C, +1.8V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2, Output Voltage Headroom (mV) Output Short Circuit Current (mA) Power Supply Voltage -40°C +25°C +85°C +125°C 16.0 14.0 12.0 10.0 Ambient Temperature (°C) FIGURE 2-25: Ouput Short Circuit Current Power Supply Voltage. Output Voltage Swing P-P) FIGURE 2-28: Output Voltage Headroom Ambient Temperature. 0.30 0.25 Falling Edge, 6.0V Falling Edge, 1.8V 6.0V 1.8V Slew Rate (V/µs) 0.20 0.15 0.10 0.05 Rising Edge, 6.0V Rising Edge, 1.8V 1000 100k 10000 100000 Frequency (Hz) 1000000 0.00 Ambient Temperature (°C) FIGURE 2-26: Frequency. Output Voltage Swing FIGURE 2-29: Temperature. Slew Rate Ambient Ratio Output Headroom Current (mV/mA) (VOL VSS)/(-IOUT) 1.8V (VDD VOH)/IOUT Output Voltage (20mV/div) (VDD VOH)/IOUT (VOL VSS)/(-IOUT) 6.0V 6.0V Output Current (mA) Time µs/div) FIGURE 2-27: Ratio Output Voltage Headroom Output Current Output Current. FIGURE 2-30: Pulse Response. Small Signal Non-Inverting 2009 Microchip Technology Inc. DS22182A-page MCP6051/2/4 Note: Unless otherwise indicated, +25°C, +1.8V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2, Output Voltage (20mV/div) Output Voltage 6.0V 6.0V VOUT Time µs/div) -1.0 Time (0.1 ms/div) FIGURE 2-31: Response. Small Signal Inverting Pulse FIGURE 2-34: MCP6051/2/4 Shows Phase Reversal. 10000 Closed Loop Output Impedance Output Voltage 1000 6.0V 1.0E+01 1.0E+02 Time (0.02 ms/div) 1.0E+04 Frequency (Hz) 1.0E+03 1.0E+05 100k 1.0E+06 FIGURE 2-32: Pulse Response. -0.5 Large Signal Non-Inverting FIGURE 2-35: Closed Loop Output Impedance Frequency. 1.E-03 Output Voltage 6.0V 1.E-04 100µ 1.E-05 -IIN 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10 1.E-11 1.E-12 +25°C +85°C +125°C Time (0.02 ms/div) -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 FIGURE 2-33: Response. Large Signal Inverting Pulse FIGURE 2-36: Measured Input Current Input Voltage (below VSS). DS22182A-page 2009 Microchip Technology Inc. MCP6051/2/4 DESCRIPTIONS Descriptions pins listed Table 3-1. TABLE 3-1: MCP6051 SOIC FUNCTION TABLE MCP6052 SOIC TDFN MCP6054 SOIC, TSSOP Symbol VOUT, VOUTA VIN-, VINA- VIN+, VINA+ VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD Description Analog Output Inverting Input Non-inverting Input Positive Power Supply Non-inverting Input Inverting Input Analog Output Analog Output Inverting Input Non-inverting Input Negative Power Supply Non-inverting Input Inverting Input Analog Output Internal Connection Exposed Thermal (EP); must connected VSS. TDFN Analog Outputs Power Supply Pins output pins low-impedance voltage sources. Analog Inputs non-inverting inverting inputs highimpedance CMOS inputs with bias currents. positive power supply (VDD) 1.8V 6.0V higher than negative power supply (VSS). normal operation, other pins voltages between VDD. Typically, these parts used single (positive) supply configuration. this case, connected ground connected supply. will need bypass capacitors. Exposed Thermal (EP) There internal electrical connection between Exposed Thermal (EP) pin; they must connected same potential Printed Circuit Board (PCB). 2009 Microchip Technology Inc. DS22182A-page MCP6051/2/4 NOTES: DS22182A-page 2009 Microchip Technology Inc. MCP6051/2/4 APPLICATION INFORMATION (minimum expected (minimum expected MCP605X MCP6051/2/4 family amps manufactured using Microchip's state-of-the-art CMOS process specifically designed low-power, high precision applications. 4.1.1 Rail-to-Rail Input PHASE REVERSAL MCP6051/2/4 amps designed prevent phase reversal when input pins exceed supply voltages. Figure 2-34 shows input voltage exceeding supply voltage without phase reversal. 4.1.2 INPUT VOLTAGE CURRENT LIMITS protection inputs depicted shown Figure 4-1. This structure chosen protect input transistors minimize input bias current (IB). input diodes clamp inputs when they more than diode drop below VSS. They also clamp voltage that above VDD; their breakdown voltage high enough allow normal operation enough bypass events within specified limits. FIGURE 4-2: Inputs. Protecting Analog also possible connect diodes left resistors this case, currents through diodes need limited some other mechanism. resistors then serve in-rush current limiters; currents into input pins (VIN+ VIN-) should very small. significant amount current flow inputs when common mode voltage (VCM) below ground (VSS). (See Figure 2-36). Bond 4.1.3 NORMAL OPERATION VIN+ Bond Input Stage Bond VIN- Bond input stage MCP6051/2/4 amps uses differential input stages parallel. operates common mode input voltage (VCM), while other operates high VCM. With this topology, device operates with above below VSS. (See Figure 2-13) .The input offset voltage measured 0.3V 0.3V ensure proper operation. transition between input stages occurs when near 1.1V (See Figures 2-4, Figure 2-6). best distortion performance gain linearity, with non-inverting gains, avoid this region operation. FIGURE 4-1: Structures. Simplified Analog Input order prevent damage and/or improper operation these amps, circuit they must limit voltages currents VIN+ VIN- pins (see Absolute Maximum Ratings beginning Section "Electrical Characteristics"). Figure shows recommended approach protecting these inputs. internal diodes prevent input pins (VIN+ VIN-) from going below ground, resistors limit possible current drawn input pins. Diodes prevent input pins (VIN+ VIN-) from going above VDD. When implemented shown, resistors also limit current through Rail-to-Rail Output output voltage range MCP6051/2/4 amps (minimum) (maximum) when connected VDD/2 6.0V. Refer Figures 2-27 2-28 more information. 2009 Microchip Technology Inc. DS22182A-page MCP6051/2/4 Capacitive Loads Driving large capacitive loads cause stability problems voltage feedback amps. load capacitance increases, feedback loop's phase margin decreases closed-loop bandwidth reduced. This produces gain peaking frequency response, with overshoot ringing step response. While unity-gain buffer most sensitive capacitive loads, gains show same general behavior. When driving large capacitive loads with these amps (e.g., when +1), small series resistor output (RISO Figure 4-3) improves feedback loop's phase margin (stability) making output load resistive higher frequencies. bandwidth will generally lower than bandwidth with capacitance load. After selecting RISO your circuit, double-check resulting frequency response peaking step response overshoot. Modify RISO's value until response reasonable. Bench evaluation simulations with MCP6051/2/4 SPICE macro model very helpful. Supply Bypass With this family operational amplifiers, power supply (VDD single-supply) should have local bypass capacitor (i.e., 0.01 within good high frequency performance. bulk capacitor (i.e., larger) within provide large, slow currents. This bulk capacitor shared with other analog parts. Unused Amps MCP605X RISO VOUT FIGURE 4-3: Output Resistor, RISO Stabilizes Large Capacitive Loads. Figure gives recommended RISO values different capacitive loads gains. x-axis normalized load capacitance (CL/GN), where circuit's noise gain. non-inverting gains, Signal Gain equal. inverting gains, 1+|Signal Gain| (e.g., gives V/V). 10000 unused quad package (MCP6054) should configured shown Figure 4-5. These circuits prevent output from toggling causing crosstalk. Circuits sets minimum noise gain. resistor divider produces desired reference voltage within output voltage range amp; buffers that reference voltage. Circuit uses minimum number components operates comparator, draw more current. MCP6054 VREF MCP6054 Recommended 1000 FIGURE 4-5: Unused Amps. 1.E-11 1.E-10 1.E-09 1.E-08 1.E-07 1.E-06 100p 0.1µ Normalized Load Capacitance; CL/GN FIGURE 4-4: Recommended RISO Values Capacitive Loads. DS22182A-page 2009 Microchip Technology Inc. MCP6051/2/4 Surface Leakage 4.7.1 Application Circuits GYRATOR applications where input bias current critical, Printed Circuit Board (PCB) surface leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current flow; which greater than MCP6051/2/4 family's bias current +25°C (±1.0 typical). easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. example this type layout shown Figure 4-6. MCP6051/2/4 amps used gyrator applicaitons. gyrator electric circuit which make capacitive circuit behave inductively. Figure shows example gyrator simulating inductance, with approximately equivalent circuit below. have similar values typical applications. primary application gyrator reduce size cost system removing need bulky, heavy expensive inductors. example, bandpass filter characteristics realized with capacitors, resistors operational amplifiers without using inductors. Moreover, gyrators will typically have higher accuracy than real inductors, lower cost precision capacitors than inductors. Guard Ring VIN- VIN+ MCP6051 Equivalent Circuit VOUT FIGURE 4-6: Inverting Gain. Example Guard Ring Layout Gyrator Non-inverting Gain Unity-Gain Buffer: Connect non-inverting (VIN+) input with wire that does touch surface. Connect guard ring inverting input (VIN-). This biases guard ring common mode input voltage. Inverting Gain Transimpedance Gain Amplifiers (convert current voltage, such photo detectors): Connect guard ring non-inverting input (VIN+). This biases guard ring same reference voltage (e.g., VDD/2 ground). Connect inverting (VIN-) input with wire that does touch surface. FIGURE 4-7: Gyrator. 2009 Microchip Technology Inc. DS22182A-page MCP6051/2/4 4.7.2 INSTRUMENTATION AMPLIFIER 4.7.3 PRECISION COMPARATOR MCP6051/2/4 amps well suited conditioning sensor signals battery-powered applications. Figure shows instrumentation amplifier, using MCP6052, that works well applications requiring rejection common mode noise higher gains. reference voltage (VREF) supplied impedance source. single supply applications, VREF typically VDD/2. VREF VOUT MCP6052 MCP6052 high gain before comparator improve latter's input offset performance. Figure shows gain placed before comparator. reference voltage VREF value between supply rails. MCP6051 VREF MCP6541 VOUT FIGURE 4-9: Comparator. Precision, Non-inverting FIGURE 4-8: Instrumentation Amplifier. obtain best CMRR possible, limit performance resistor tolerances, high gain with resistor. DS22182A-page 2009 Microchip Technology Inc. MCP6051/2/4 DESIGN AIDS Microchip provides basic design tools needed MCP6051/2/4 family amps. Analog Demonstration Evaluation Boards SPICE Macro Model latest SPICE macro model MCP6051/2/4 amps available Microchip site www.microchip.com. This model intended initial design tool that works well amp's linear region operation over temperature range. model file information capabilities. Bench testing very important part design cannot replaced with simulations. Also, simulation results using this macro model need validated comparing them data sheet specifications characteristic curves. Microchip offers broad spectrum Analog Demonstration Evaluation Boards that designed help achieve faster time market. complete listing these boards their corresponding user's guides technical information, visit Microchip site www.microchip.com/ analogtools. Some boards that especially useful are: MCP6XXX Amplifier Evaluation Board MCP6XXX Amplifier Evaluation Board MCP6XXX Amplifier Evaluation Board MCP6XXX Amplifier Evaluation Board Active Filter Demo Board 5/6-Pin SOT-23 Evaluation Board, VSUPEV2 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board, SOIC8EV 14-Pin SOIC/TSSOP/DIP Evaluation Board, SOIC14EV FilterLab® Software Microchip's FilterLab® software innovative software tool that simplifies analog active filter (using amps) design. Available cost from Microchip site www.microchip.com/filterlab, FilterLab design tool provides full schematic diagrams filter circuit with component values. also outputs filter circuit SPICE format, which used with macro model simulate actual filter performance. Application Notes following Microchip Analog Design Note Application Notes available Microchip site www.microchip.com/appnotes recommended supplemental reference resources: ADN003: "Select Right Operational Amplifier your Filtering Circuits", DS21821 AN722: "Operational Amplifier Topologies Specifications", DS00722 AN723: "Operational Amplifier Specifications Applications", DS00723 AN884: "Driving Capacitive Loads With Amps", DS00884 AN990: "Analog Sensor Conditioning Circuits Overview", DS00990 AN1177: Precision Design: Errors", DS01177 AN1228: Precision Design: Random Noise", DS01228 These application notes others listed design guide: "Signal Chain Design Guide", DS21825 MindiCircuit Designer Simulator Microchip's MindiCircuit Designer Simulator aids design various circuits useful active filter, amplifier power-management applications. free online circuit designer simulator available from Microchip site www.microchip.com/mindi. This interactive circuit designer simulator enables designers quickly generate circuit diagrams, simulate circuits. Circuits developed using Mindi Circuit Designer Simulator downloaded personal computer workstation. Microchip Advanced Part Selector (MAPS) MAPS software tool that helps semiconductor professionals efficiently identify Microchip devices that particular design requirement. Available cost from Microchip website www.microchip.com/ maps, MAPS overall selection tool Microchip's product portfolio that includes Analog, Memory, MCUs DSCs. Using this tool define filter sort features parametric search devices export side-by-side technical comparasion reports. Helpful links also provided Datasheets, Purchase, Sampling Microchip parts. 2009 Microchip Technology Inc. DS22182A-page MCP6051/2/4 NOTES: DS22182A-page 2009 Microchip Technology Inc. MCP6051/2/4 PACKAGING INFORMATION Package Marking Information 8-Lead SOIC (150 mil) (MCP6051, MCP6052) XXXXXXXX XXXXYYWW Example: MCP6051E SN^^0919 8-Lead TDFN (MCP6051, MCP6052) Example: 14-Lead SOIC (150 mil) (MCP6054) Example: XXXXXXXXXXX XXXXXXXXXXX YYWWNNN MCP6054 E/SL^^ 0919256 14-Lead TSSOP (MCP6054) Example: XXXXXXXX YYWW MCP6054E 0919 Legend: XX.X Note: Customer-specific information Year code (last digit calendar year) Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code Pb-free JEDEC designator Matte (Sn) This package Pb-free. Pb-free JEDEC designator found outer packaging this package. event full Microchip part number cannot marked line, will carried over next line, thus limiting number available characters customer-specific information. 2009 Microchip Technology Inc. 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DS22182A-page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page 2009 Microchip Technology Inc. MCP6051/2/4 1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWS PLFURFKLS SDFNDJLQJ 2009 Microchip Technology Inc. DS22182A-page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page 2009 Microchip Technology Inc. MCP6051/2/4 APPENDIX REVISION HISTORY Revision (May 2009) Original Release this Document. 2009 Microchip Technology Inc. DS22182A-page MCP6051/2/4 NOTES: DS22182A-page 2009 Microchip Technology Inc. MCP6051/2/4 PRODUCT IDENTIFICATION SYSTEM order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device Temperature Range Package Examples: MCP6051-E/SN: MCP6051T-E/SN: MCP6051-E/MNY: MCP6051T-E/MNY: SOIC package Tape Reel, SOIC package TDFN package Tape Reel, TDFN package SOIC package Tape Reel, SOIC package TDFN package Tape Reel TDFN package 14LD SOIC package Tape Reel, 14LD SOIC package 14LD TSSOP package Tape Reel, 14LD TSSOP package Device: MCP6051: MCP6051T: MCP6052: MCP6052T: MCP6054: MCP6054T: Single Single (Tape Reel) (SOIC TDFN) Dual Dual (Tape Reel) (SOIC TDFN) Quad Quad (Tape Reel) (SOIC TSSOP) MCP6052-E/SN: MCP6052T-E/SN: MCP6052-E/MNY: MCP6052T-E/MNY: Temperature Range: -40°C +125°C Package: Plastic Dual Flat, Lead, (2x3 TDFN 8-lead Plastic SOIC (150 Body), 14-lead Plastic SOIC, (150 Body), 8-lead Plastic TSSOP (4.4mm Body), 14-lead MCP6054-E/SL: MCP6054T-E/SL: MCP6054-E/ST: MCP6054T-E/ST: Nickel palladium gold manufacturing designator. Only available TDFN package. 2009 Microchip Technology Inc. DS22182A-page MCP6051/2/4 NOTES: DS22182A-page 2009 Microchip Technology Inc. Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable." Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act. Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip devices life support and/or safety applications entirely buyer's risk, buyer agrees defend, indemnify hold harmless Microchip from damages, claims, suits, expenses resulting from such use. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights. Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt UNI/O registered trademarks Microchip Technology Incorporated U.S.A. other countries. FilterLab, Hampshire, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, WiperLock ZENA trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2009, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper. Microchip received ISO/TS-16949:2002 certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona; Gresham, Oregon design centers California India. Company's quality system processes procedures PIC® MCUs dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified. 2009 Microchip Technology Inc. DS22182A-page WORLDWIDE SALES SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Address: www.microchip.com Atlanta Duluth, Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, Tel: 765-864-8360 Fax: 765-864-8387 Angeles Mission Viejo, Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 China Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4080 India Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934 Malaysia Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Hsin Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 03/26/09 DS22182A-page 2009 Microchip Technology Inc. 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