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Pentium® Processor Mobile Module: Embedded Module Connector-2 Thermal Design Guide
Order Number: 273216-001
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Copyright Intel Corporation, 1998 *Third-party brands names property their respective owners.
EMC-2 Thermal Design Guide
Contents
Introduction Importance Thermal Management EMC-2 Thermal Specifications
Targeted Thermal Performance Parameters. Attach Method 3.2.1 Thermal Transfer Plate (TTP) 3.2.2 Interface Material.
Thermal Parameters
Ambient Temperature.8 Measuring Case Temperature. Calculating Case-to-Ambient Thermal Resistance. Airflow Measurement.
Thermal Solution Options EMC-2
CompactPCI Component Height Requirements (for Heatpipe Solution Only) Heatsink Solutions. 5.2.1 Theory Heatsink Operation 5.2.2 Considerations Implementing Heatsink Thermal Solution Solutions 5.3.1 Theory Operation 5.3.2 Considerations Implementing Thermal Solution Heatpipe Solutions 5.4.1 Theory Heatpipe Operation 5.4.2 Considerations Implementing Heatpipe Thermal Solution
Related Documents Vendor List.
Figures
Placement Thermal Solution Mounting Thermocouple. CompactPCI Height Requirements
Tables
EMC-2 Targeted Thermal Requirements Related Documents. Vendor List
EMC-2 Thermal Design Guide
Introduction
Pentium® Processor Mobile Module: Embedded Module Connector (EMC-2) small, highly integrated assembly containing Intel® Pentium processor core, 443BX Northbridge, Kbytes cache, voltage regulator, SMBus thermal sensor. EMC-2 interfaces system high density 400-pin connector. Interfaces such PCI, DRAM, buses along with some host bridge sideband signals bonded through this connector. thermal transfer plate (TTP), which physically mounted EMC-2 module, provided attachment method thermal solution. consists screw standoffs attaching thermal solution. thermal resistance measured between processor core less than performance thresholds rise becomes increasingly important develop manage effective thermal solutions. This application note:
Introduces targeted thermal requirements EMC-2 module Discusses attachment methods thermal solutions Defines targeted thermal parameters clarifies terminology Identifies concepts airflow calculations design thermal solutions. Sample calculations also provided. EMC-2 design
Identifies z-height constraints thermal solution single slot CompactPCI (CPCI) Discusses theory operation implementation considerations various thermal solutions Provides list thermal solution vendors EMC-2 module
Importance Thermal Management
objective thermal management ensure that temperature each component maintained within specified functional limits. functional temperature limit range within which electrical circuits expected meet their specified performance requirements. Operation outside functional limit degrade system performance cause reliability problems. case temperature surface temperature package hottest point, typically geographical center chip. Temperatures exceeding case temperature limit over length time cause physical destruction result irreversible changes operating characteristics.
EMC-2 Thermal Design Guide
EMC-2 Thermal Specifications
Targeted Thermal Performance Parameters
Pentium processor with 443BX chipset, cache, voltage regulator (VR) dissipates thermal design power maximum (TDP max) 13.4 when case temperature approximately maintained. processor core dissipates majority thermal power. thermal solution should designed ensure that maximum case temperature never exceeded. specified maximum ambient temperature module operation However, thermal solutions targeted operation ambient temperature range 50-70 criteria subject change after thermal validation. thermal solutions EMC-2 module must designed meet thermal specifications indicated Table
Table
EMC-2 Targeted Thermal Requirements
Parameter EMC2 Module Requirements Case Temperature, (TC) Case Temperature, processor processor) Ambient temperature System Airflow fan/heatpipe solution System Airflow heat sink solution EMC-2 Board form factor Tachometer Typical Power Max. Thermal Design Power 63.50 101.6 10.0 required 13.4 Criteria
case temperature values assume °C/W TTP, temperature rise 13.4 maximum power dissipation. Thus case temperature would module processor, -13.4, 86.6 (top surface).
3.2.1
Attach Method
Thermal Transfer Plate (TTP)
EMC-2 module contains thermal transfer plate (TTP). Figure shows area (dashed lines) where thermal solution should mounted dimensions thermal solution designer work within. thermal resistance measured between processor core thermal interface (the thermal attach point TTP) less than equal °C/W. thermal transfer plate physically mounted EMC-2 different other generations Intel mobile modules.
EMC-2 Thermal Design Guide
Figure Placement Thermal Solution
2.00 2.00
6.24 36.19 24.54 51.64 7.97 0.28
5.21 PLCS 79.19 4.00 78.58 32.48 52.10 51.49 101.60 4.95 PLCS 63.41 49.10 Board-to-Board Connector 0.00 22.15 25.15 25.25 Usable Area Thermal Solution
0.00
63.50
A6204-01
3.2.2
Interface Material
Heat generated semiconductor device must removed ambient environment ensure reliable operation device. Unless space available provide sufficient forced convection cooling, this requires series physical interfaces provide thermally conductive path. These interfaces must offer minimum resistance heat flow often must provide electrical isolation. Such requirements using interface materials thermal interface materials. Thermal interface materials reduce contact resistance conforming mating surfaces eliminating gaps. optimal material interfacing surface thermal solution surface must determined each application. proposed interface material Thermagon T-Pli thermally conductive dielectric elastomeric material. thickness approximately 5-10 mils processor 10-40 mils chipset. This elastomer value approximately 0.76 °C/W. Shin-etsu grease also option. Shin-etsu grease 0.46
EMC-2 Thermal Design Guide
Thermal Parameters
Ambient Temperature
Ambient temperature (TA) temperature undistributed surrounding module. Ambient temperature usually measured specified distance from module. system environment, ambient temperature temperature upstream module close vicinity. typical laboratory test environment, ambient temperature measured inches close inches possible) upstream from module represent ambient temperature with flowing past system. When natural convection used system, ambient temperature measured directly underneath board module. active cooling system, ambient temperature inlet active cooling device.
Measuring Case Temperature
verify that proper case temperature (TC) maintained EMC-2, should measured surface TTP, centered above processor package. minimize measurement errors, following techniques materials recommended:
finer diameter type thermocouples. Intel's laboratory testing
performed using thermocouple offered Omega Engineering, Inc. (part number: 5TCTTK-36-36).
Attach thermocouple bead junction center surface package using
cement glue that highly thermally conductive. Intel's laboratory testing performed using Omega Bond* (Part number: OB-101).
Attach thermocouple angle center surface above
processor chipset packages, shown Figure Figure Mounting Thermocouple
above chipset
above Processor
Measure Case Temp center above processor chipset
EMC-2 Thermal Design Guide
Calculating Case-to-Ambient Thermal Resistance
case-to-ambient thermal resistance determines performance thermal solution calculated using following equation:
Equation TA)/P where:
case-to-ambient thermal resistance (°C/W) ambient temperature (°C) case temperature (°C) device power dissipation (Watts)
lower thermal resistance between case ambient air, more efficient thermal solution. thermal resistance values depend material, thermal conductivity, thermal interface material, geometry thermal cooling solution airflow rates. example, assuming worst case conditions: case temperature surface (with power dissipation thermal resistance °C/W) ambient temperature dissipated EMC-2 module 13.4 then case-to-ambient thermal resistance (CA) 2.31 °C/W. Knowing value allows system designer estimate airflow required keep case temperature determine best orientation board satisfy minimum airflow requirement.
Airflow Measurement
airflow, velocity flowing across components, measured using portable velocity meter (anemometer). meter contains temperature sensing elements. element used track stream temperature second element heated electrical current maintain constant temperature above stream temperature. stream takes heat energy away from heated element, more current required maintain temperature differential. required electrical current proportional mass velocity displayed meter. This meter available from Kurz Instruments. Refer vendor list Section vendor information.
EMC-2 Thermal Design Guide
Thermal Solution Options EMC-2
Thermal solutions vendors have developed reference designs EMC-2 module. Refer Section list vendors each type solution. Three types thermal solutions available accommodate various system design requirements:
heat sink heat sink heatpipe with cooling device
CompactPCI Component Height Requirements (for Heatpipe Solution Only)
Hybrid heatpipe solutions have been developed meet single slot CompactPCI z-height constraints. Standard heatsinks fans used designs with relaxed z-height constraints dual slot CPCI solutions. Figure illustrates height restrictions faced single-slot CPCI application. minimum z-height EMC-2 module, including mated connectors, 10.00 single slot CPCI solution, maximum z-height EMC-2 module, connector, thermal solution should 13.71 Thus, remaining height thermal solution 3.71 measured from screw hole stand-offs thermal transfer plate (TTP).Vendors have 5.71 from except mounting hole location mounting thermal solution.
Figure CompactPCI Height Requirements
Thermal Solution
Thermal solution height, above screws 3.71
Thermal solution height 5.71
3.28 18.8 10.0 13.71
Module Height with connector
screw locations
Motherboard Thickness maximum
Backside Clearance 1.52 warpage
EMC-2 Thermal Design Guide
5.2.1
Heatsink Solutions
Theory Heatsink Operation
heatsink simply metal surface with pins fins rising surface. Heatsinks used cool electronic devices expanding surface area part which attached, increasing amount heat that cooled ambient air. main characteristic heatsinks thermal resistance measured °C/W. example, design heatsink with thermal resistance °C/W, then every watt heat dissipates temperature increases larger heatsink, i.e., more surface area has, better thermal resistance. simple (rough) formula calculating area needed heatsink where area expressed cm2.
5.2.2
Considerations Implementing Heatsink Thermal Solution
following points should considered when evaluating heatsink thermal solutions:
Cost. Heatsink solutions typically cheaper than heatpipe solutions. Flexibility dimensions. Based amount airflow available system,
design require larger block heatsink dissipate specified amount heat. System designers need flexible least dimensions.
System airflow. desirable have some system airflow allow heat removed from
heatsink.
Solutions
Passive-active heatsink solutions provide airflow require little system airflow. Active heatsink solutions incorporate that attached solution. They handle load watts.
5.3.1
Theory Operation
typical involves motor propeller. motor either induction motor brushless motor. that produces blows parallel fan's blade axis. These fans made blow significant amount air, they work against pressure. Fans used alone ventilate cool intake through processor, pushing warm out. they used passive thermal solutions blow heatsinks.
5.3.2
Considerations Implementing Thermal Solution
following points should considered when evaluating thermal solutions:
Performance moderate cost. solutions typically cost more than heatsink solutions
less than heatpipe solutions.
System airflow. When there system airflow, solution provides excellent source
dedicated airflow, which critical ensuring prompt removal heat from heat source.
EMC-2 Thermal Design Guide
Flexibility dimensions. size required solution vary according
amount heat that must dissipated, availability system airflow, other factors. achieve certain thermal requirements, system designer need flexible with more dimensions design.
Heatpipe Solutions
Another type thermal solution phase change recirculating system. This solution uses heatpipes that either contain wick helped gravity. This solution handle loads approximately watts.
5.4.1
Theory Heatpipe Operation
heatpipe, simplest sense, heat mover spreader; acquires heat from source, such embedded module, moves spreads region where more readily rejected. typical heatpipe sealed evacuated tube, porous wick structure very small amount working fluid inside. porous wick structure, such sintered powder metal, lines internal diameter tube. center core tube left open permit vapor flow. heatpipe three sections: evaporator, adiabatic, condenser. heat enters evaporator section, absorbed vaporization working fluid. generated vapor travels down center tube through adiabatic section condenser section where vapor condenses, giving latent heat fusion. condensed fluid returned evaporator section gravity capillary pumping porous wick structure. Heatpipe operation completely passive continuous. heatpipe moves this heat with very little drop temperature. Most electronic cooling applications copper heatpipe with water working fluid.
5.4.2
Considerations Implementing Heatpipe Thermal Solution
following points should considered when evaluating heatpipe solutions:
Limited single slot CPCI z-height. some applications, height over embedded
module does provide sufficient space provide direct cooling this location. heatpipe this situation used move heat location where effectively dissipated natural forced convection.
Power Consumption. Cooling with requires electricity. heatpipe allows developer
acquire additional surface area heat rejection natural convection, thus eliminating need fan. natural convection cooling solution needed, heatpipe miniature heatsink might more economical than large system solution.
noise noise reduction). Cooling natural convection eliminates noise. volume
constraints limit natural convection cooling solution, heatpipe miniature fan/ sink will result less noise than large system solution.
maintenance. electro-mechanical devices such fans have finite life. heatpipe
thermal solution moving parts fail; consequently product maintenance requirements eliminated reduced.
Sealed enclosure cooling. some applications, EMC-2 module sealed
enclosure protect from environment. example industrial located unclean environment. Heat this situation, needs rejected outside sealed enclosure. heatpipe provides thermal path enclosure wall.
EMC-2 Thermal Design Guide
system airflow available. Extended ambient temperatures. Requires heatpipe solution have thermal solution
with lowest thermal resistance (1-2 °C/W).
Related Documents
These documents available download from Intel's World Wide site http://www.intel.com.
Table
Related Documents
Document Order Number 243668 243724 240800
Intel datasheet
Pentium®
Processor Mobile Module: Mobile Module Connector (MMC-2)
AP-825, Mobile Pentium® Processor Pentium Processor Mobile Module Thermal Sensor Interface Specifications application note Intel Packaging Handbook
Vendor List
This vendor list provided service customers reference only. inclusion this list should considered recommendation product endorsement Intel Corporation.
Table
Vendor List (Sheet
Heat Sink Vendors Aavid Thermal Products, Inc. Main St., Ste. Concord, 03301 Phone: 223-1700 Fax: 603-223-1738 Heat Sink Vendors Electronic Devices America, Inc. 4645 Lakeshore Drive Suite Tempe, 85282 Phone: 602-820-9889
North America:
Sourceline, Inc. (Panasonic) 2833 Junction Ave. Ste. Jose, 95134 Phone: 800-891-0649 Fax: 408-570-0675 Sanyo Denki America, Inc. Amapola Ave. Torrance, 95134 Phone: 800-891-0649 Fax: 408-570-0675
Japan:
Kyushu Matsushita Electric 2111 UEDA OITA, 879-04 Japan Phone: (0978)37-1991 Fax: (0978)37-3502
other areas, please contact your local Panasonic Sales Office.
EMC-2 Thermal Design Guide
Table
Vendor List (Sheet
Heat Pipe Heat Exchanger Vendors Fujikura America, Inc. 3001 Oakmead Village Drive Santa Clara, 95051 Phone: 408-988-7408 408-988-7415 Fax: 408-727-3515 Furukawa Electric Westpark Dr., Ste. Peachtree City, 30269 Phone: 770-487-1234 Fax: 770-487-9910 Interface Material Vendors MicroSi (Thermal Grease) 1028 51st Phoenix, 85044 Phone: 602-893-8898 Fax: 602-893-8637 Velocity Meter Supplier Kurz Instruments, Inc. 2411 Garden Road Monterrey, 93940 Phone: 800-424-7356 Copper Heat Spreader Supplier Chomerics Dragon Court Woburn, 01888-4014 Phone: 617-935-4850 Fax: 617-933-4318 CompactPCI Specification Rogers Communication Edgewater Place, Suite Wakefield, 01880 Phone: 617-224-1100 Fax: 617-224-1239 Temperature Measurement Suppliers Omega Engineering, Inc. Omega Drive P.O. 4047 Stamford, 06906 Phone: 1-800-622-2378 other areas, please contact your local Panasonic Sales Office. Thermagon, Inc. (Elastomer) 3256 25th Cleveland, 44109-1668 Phone: 888-246-9050 Fax: 216-741-3943 Thermacore, Inc. Eden Road Lancaster, 17601 Phone: 717-569-6551 Fax: 717-569-4797 Denso Sales California, Inc. 3900 Ave. Long Beach, 90810 Fax: 310-513-7319 Phone: 310-513-8544
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