MC74HC08A identical pinout LS08. device inputs compatible with Standar
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MC74HC08A Quad 2-Input Gate
MC74HC08A identical pinout LS08. device inputs compatible with Standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs.
Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance With JEDEC Standard Requirements Chip Complexity: FETs Equivalent Gates Pb-Free Packages Available*
LOGIC DIAGRAM
MARKING DIAGRAMS
PDIP-14 SUFFIX CASE SOIC-14 SUFFIX CASE 751A HC08A AWLYWW
MC74HC08AN AWLYYWW
Assembly Location Wafer Year Work Week TSSOP-14 SUFFIX CASE 948G ALYW
FUNCTION TABLE Pinout: 14-Lead Packages (Top View)
Inputs Output
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2005
May, 2005 Rev.
Publication Order Number: MC74HC08A/D
MC74HC08A
MAXIMUM RATINGS
Symbol Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Vout Output Voltage (Referenced GND) Input Current, Iout Output Current, Supply Current, Pins Power Dissipation Still Air, Plastic SOIC Package TSSOP Package Tstg Storage Temperature Lead Temperature, from Case Seconds Plastic DIP, SOIC TSSOP Package
This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open.
Maximum ratings those values beyond which device damage occur. Maximum ratings applied device individual stress limit values (not normal operating conditions) valid simultaneously. these limits exceeded, device functional operation implied, damage occur reliability affected. Derating Plastic DIP: mW/_C from 125_C SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
Symbol Parameter Unit Supply Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Vin, Vout Operating Temperature, Package Types Input Rise Fall Time (Figure 1000
RECOMMENDED OPERATING CONDITIONS
ORDERING INFORMATION
Device MC74HC08AN MC74HC08ANG MC74HC08AD MC74HC08ADG MC74HC08ADR2 MC74HC08ADR2G MC74HC08ADTR2 MC74HC08AFEL MC74HC08AFELG
Package PDIP-14 PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* SOEIAJ-14 SOEIAJ-14 (Pb-Free)
Shipping 2000 Units 2000 Units Units Rail Units Rail 2500 Units Reel 2500 Units Reel 2500 Units Reel 2000 Units Reel 2000 Units Reel
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free.
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MC74HC08A
CHARACTERISTICS (Voltages Referenced GND)
|Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA |Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA Guaranteed Limit 25°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.48 3.98 5.48 0.26 0.26 0.26 ±0.1 85°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.34 3.84 5.34 0.33 0.33 0.33 ±1.0 125°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.20 3.70 5.20 0.40 0.40 0.40 ±1.0 Unit
Symbol
Parameter Minimum High-Level Input Voltage
Condition Vout 0.1V -0.1V |Iout| 20mA
Maximum Low-Level Input Voltage
Vout 0.1V 0.1V |Iout| 20mA
Minimum High-Level Output Voltage
|Iout| 20mA =VIH
Maximum Low-Level Output Voltage
|Iout| 20mA
Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package)
Iout
NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
CHARACTERISTICS 50pF, Input 6ns)
Symbol tPLH, tPHL Parameter Maximum Propagation Delay, Input Output (Figures Guaranteed Limit 25°C 85°C 125°C Unit
tTLH, tTHL
Maximum Output Transition Time, Output (Figures
Maximum Input Capacitance
NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Buffer)* Used determine no-load dynamic power consumption: VCC2 load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
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MC74HC08A
INPUT tPLH OUTPUT tTLH tTHL tPHL
Figure Switching Waveforms
TEST POINT OUTPUT DEVICE UNDER TEST
*Includes probe capacitance
Figure Test Circuit
Figure Expanded Logic Diagram (1/4 Device)
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MC74HC08A
PACKAGE DIMENSIONS
PDIP-14 SUFFIX CASE 646-06 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 0.015 0.039 MILLIMETERS 18.16 18.80 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 0.38 1.01
SEATING PLANE
0.13 (0.005)
SOIC-14 SUFFIX CASE 751A-03 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50 INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019
0.25 (0.010)
SEATING PLANE
0.25 (0.010)
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MC74HC08A
PACKAGE DIMENSIONS
TSSOP-14 SUFFIX CASE 948G-01 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS INCHES 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 1.20 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 0.026 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 0.252
0.10 (0.004) 0.15 (0.006)
0.25 (0.010)
IDENT.
DETAIL
0.15 (0.006)
SECTION
0.10 (0.004) SEATING
PLANE
DETAIL
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MC74HC08A/D
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