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MC74HC00A identical pinout LS00. device inputs compatible with Standar
Top Searches for this datasheetMC74HC00A Quad 2-Input NAND Gate MC74HC00A identical pinout LS00. device inputs compatible with Standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. http://onsemi.com Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance With JEDEC Standard Requirements Chip Complexity: FETs Equivalent Gates Pb-Free Packages Available* MARKING DIAGRAMS PDIP-14 SUFFIX CASE SOIC-14 SUFFIX CASE 751A HC00A AWLYWW MC74HC00AN AWLYYWW LOGIC DIAGRAM TSSOP-14 SUFFIX CASE 948G ALYW Assembly Location Wafer Year Work Week FUNCTION TABLE Inputs Output Pinout: 14-Lead Packages (Top View) ORDERING INFORMATION detailed ordering shipping information package dimensions section page this data sheet. *For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2005 April, 2005 Rev. Publication Order Number: MC74HC00A/D MC74HC00A MAXIMUM RATINGS Symbol Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Vout Output Voltage (Referenced GND) Input Current, Iout Output Current, Supply Current, Pins Power Dissipation Still Air, Plastic SOIC Package TSSOP Package Tstg Storage Temperature Lead Temperature, from Case Seconds Plastic DIP, SOIC TSSOP Package This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open. Maximum ratings those values beyond which device damage occur. Maximum ratings applied device individual stress limit values (not normal operating conditions) valid simultaneously. these limits exceeded, device functional operation implied, damage occur reliability affected. Derating Plastic DIP: mW/_C from 125_C SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Symbol Parameter Unit Supply Voltage (Referenced GND) Vin, Vout Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Figure 1000 ORDERING INFORMATION Device MC74HC00AN MC74HC00ANG MC74HC00AD MC74HC00ADG MC74HC00ADR2 MC74HC00ADR2G MC74HC00ADTR2 MC74HC00AF MC74HC00AFG MC74HC00AFEL MC74HC00AFELG Package PDIP-14 Shipping 2000 Units 2000 Units Units Rail Units Rail 2500 Units Reel 2500 Units Reel 2500 Units Reel Units Rail Units Rail 2000 Units Reel 2000 Units Reel PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* SOEIAJ-14 SOEIAJ-14 (Pb-Free) SOEIAJ-14 SOEIAJ-14 (Pb-Free) information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free. http://onsemi.com MC74HC00A CHARACTERISTICS (Voltages Referenced GND) |Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA |Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA Guaranteed Limit 25°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.48 3.98 5.48 0.26 0.26 0.26 ±0.1 85°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.34 3.84 5.34 0.33 0.33 0.33 ±1.0 125°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.20 3.70 5.20 0.40 0.40 0.40 ±1.0 Unit Symbol Parameter Minimum High-Level Input Voltage Condition Vout 0.1V -0.1V |Iout| 20mA Maximum Low-Level Input Voltage Vout 0.1V 0.1V |Iout| 20mA Minimum High-Level Output Voltage |Iout| 20mA =VIH Maximum Low-Level Output Voltage |Iout| 20mA Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) Iout NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). CHARACTERISTICS Input Symbol tPLH, tPHL Parameter Maximum Propagation Delay, Input Output (Figures Guaranteed Limit 25°C 85°C 125°C Unit tTLH, tTHL Maximum Output Transition Time, Output (Figures Maximum Input Capacitance NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Buffer)* Used determine no-load dynamic power consumption: Semiconductor High-Speed CMOS Data Book (DL129/D). VCC. load considerations, Chapter http://onsemi.com MC74HC00A INPUT tPLH OUTPUT tTLH tTHL tPHL Figure Switching Waveforms TEST POINT OUTPUT DEVICE UNDER TEST *Includes probe capacitance Figure Test Circuit Figure Expanded Logic Diagram (1/4 Device) http://onsemi.com MC74HC00A PACKAGE DIMENSIONS PDIP-14 SUFFIX CASE 646-06 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 0.015 0.039 MILLIMETERS 18.16 18.80 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 0.38 1.01 SEATING PLANE 0.13 (0.005) SOIC-14 SUFFIX CASE 751A-03 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50 INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019 0.25 (0.010) SEATING PLANE 0.25 (0.010) http://onsemi.com MC74HC00A PACKAGE DIMENSIONS TSSOP-14 SUFFIX CASE 948G-01 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS INCHES 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 1.20 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 0.026 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 0.252 0.10 (0.004) 0.15 (0.006) 0.25 (0.010) IDENT. DETAIL 0.15 (0.006) SECTION 0.10 (0.004) SEATING PLANE DETAIL Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. 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