Scheuermann, Grisko, Hermwille Semikron International, Sigmundstr. 200

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Scheuermann, Grisko, Hermwille Semikron International, Sigmundstr. 200

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SKiM Advanced Power Module Family Inverters
Scheuermann, Grisko, Hermwille Semikron International, Sigmundstr. 200, 90431 Nuremberg, Germany Tel. +49.911.6559.159 Fax: +49.911.6559.293 E-mail: li.yi@semikron.com Abstract: SKiM advanced power module family medium power based pressure contact technology presented. baseless structure SKiM leads improved reliability allows easy variation substrates flexible current rating within same package. thermal behaviour SKiM with different substrates analysed. Together with intelligent snap-on gate driver SKiM forms base compact self-protecting inverter. Introduction growing demand power semiconductor modules high power density, high reliability cost effectiveness continuously pushed industry applications such drives, UPS, electrical vehicles, etc. leads continuous progress packaging technology, where SKiiP technology baseless modules with pressure contact systems made revolution. basic consideration SKiiP technology improve reliability modules applying pressure contact system instead solder contact connections base plate. later used traditional modules factors limiting reliability these modules. SKiiP pressure contact system functions: realise thermal contact DBC-substrate (Direct Bonded Copper) heat sink with defined pressure. This makes copper base plate dispensable. other provide electrical connections from DBC-substrate external gate driver board using spring contacts. Construction SKiM SKiM (SEMIKRON integrated Module) based SKiiP technology. shown Fig.1, DBC-substrate carrying semiconductor chips located frame (2). This frame aligns bridge element which transfers vertical pressure substrate through distributed pressure columns. pressure itself generated screwing pressure plate onto heat sink, with spring inserted between pressure plate bridge element order ensure even pressure distribution. electrical interface from gate driver (Printed Circuit Board) DBC-substrate realised spring contacts (see also Fig. which integrated bridge element, while power terminals bolt connections soldered substrate. most important feature SKiM thermal pressure contact between DBCsubstrate heat sink. eliminating base plate thus soldering process between base plate substrate, thermal fatigue solder joint avoided. This leads higher power cycling capability compared traditional modules with base plate [2]. Another advantage SKiM profile design. height power terminals only 17.5mm. elevated driver position enables customer connect DC-link either from outside from central terminals.
pressure plate
spring
bridge element
frame
substrate
Fig. Exploded view SKiM4
gate driver simply snapped onto module. This assembly process self-aligning automatically installs electrical connections between gate driver module spring contacts. This allows quick assembly production easy maintenance. Additional mounting positions bridge element allow mechanically secure gate driver board application strongly vibrating environments. insulated temperature sensor integrated DBC-substrate continuous monitoring heat sink temperature order protect semiconductor chips against overheating. wide power range from covered with packaging sizes six-pack configuration (Table available 600V 1200V. series with 1700V will released soon. Using SKiM dual-pack configuration maximum power almost tripled. Module Voltage type SKiM4 SKiM5 SKiM4 SKiM5 SKiM4 SKiM5 1700 1200 Current Current 300, 350, 220, 270,
175, 235, 135, 180,
Tab. SKiM family six-pack configuration
SKiM pressure contact system conventional module architecture,
mounting positions
where DBC-substrates soldered solid base plate, variety problems have solved achieve reliable flexible module design. large footprint sizes, several substrates have attached base plate large area solder joints. Besides difficulty achieving void-free large area solder connections, difference coefficients thermal expansion (CTE) base plate substrate below solidification temperature solder will cause curvage system. This curvage will affect thermal interface between module base heat sink surface thus interfere with demand thermal resistance. avoid this drawback, base plates large size modules shaped with defined compensate curvage incorporated strain between substrate base plate. Since curvage influenced thermal history system during production process also changing creep processes solder with time constant sometimes hundreds hours this compensation method difficult [3]. Further, material substrate cannot exchanged easily, because changing material will change stress solder joint thus influence geometry well lifetime solder interface. Finally, design with several substrates requires interconnections between substrates, which increase number potential failure positions therefore decrease reliability system. SKiM pressure contact system designed avoid these problems (Fig. substrate size limited pressure
spring contact
bridge element spring
steel inlay pressure plate
pressure columns
substrate
Fig. Cross section SKiM5
contact system, because rigid connection established. substrate floats thermal grease interface heat sink surface. tight contact between substrate heat sink, required thermal resistance, achieved bridge element, which consists numerous pressure columns, that transfer pressure substrate exactly those positions, where good thermal contact needed (i.e. close power chips). bridge element connects these columns flexibly compensate internal tolerances (Fig.
substrate material used. Since rigid connection base plate material considered, available substrate materials implemented. Today, Al2O3-DBCs AlNDBCs part production program, pressure system open future developments such Si3N4-substrates. Al2O3-substrates composed 0.5mm ceramic with 0.4mm Cu-layers both sides. thick Cu-layers favourable affecting thermal resistance increasing thermal spreading effect also increasing current capabilities power circuit. AlN-substrates composed 0.635mm ceramic which standard thickness with 0.3mm Cu-layers both sides. difference total thickness nominal 0.065mm between substrate versions easily tolerated flexible pressure contact system. measured static thermal resistance between junction heat sink SKiM5 module with Al2O3-substrate given Fig. seen comparison values before after temperature cycles, thermal resistance decreases from initial value after temperature cycles. reason this decreasing behaviour small formed pressure system between module heat sink, containing thermal grease. This small high flow resistance thermal grease, resulting large time constant distribution grease. This process accelerated influence thermal expansion during temperature cycling.
SKiM5 with Al2O 3-substrate IGBT SKiM 0,20 Rth,jh [K/W] 0,15 0,10 0,05 0,00
IGBT initial
Fig. SKiM5 with Trench IGBTs AlN-substrates DBCs aligned frame with bridge element
spring consisting layer compressible high reliable foam material transfers pressure from rigid pressure plate bridge element ensures even distribution pressure. pressure plate steel inlay mechanical stability moulded with plastic material insulation. This rigid pressure plate, which located module, electrically connected heat sink potential mounting bolts therefore shields possible electromagnetic interference from gate driver board. also protection gate driver case explosion power circuit, because location between power circuit gate driver will prevent housing fragments electric arcs reach control circuit [4]. Thermal resistance reliability major advantage pressure contact system flexibility with respect
diode initial
IGBT temp. cycles
Fig. Thermal resistance SKiM5 six-pack with IGBT before after temperature cycles (-40/+125°C)
same effect observed with AlNversion SKiM5 (Fig. Here Trench IGBT been used, which same size SPT. decrease thermal
resistance also observed active power cycling.
SKiM5 with AlN-substrate Trench IGBT
(SKiM
0,20 0,15 0,10 0,05 0,00
diode initial
IGBT initial
IGBT after power cycling
Fig. Thermal resistance SKiM5 six-pack with Trench IGBT before after end-of-life active power cycling test
These results demonstrate wide flexibility system, allowing various substrate types IGBT-types without changes package. Intelligent snap-on gate driver quality power electronic systems only defined power semiconductor, also interaction between components (power section, driver section) overall system. meet these demands, optimised six-pack gate driver SKiM been developed. This driver provides complete solution with integrated protection monitoring functions, potential insulation, connectors external current sensors interface micro- DSP-controller. There only gate driver SKiM4 SKiM5, which used available voltage current ranges. Both drivers fulfil requirements concerning creepage distance 1700V modules therefore also 600V 1200V. adaptation gate driver individual modules realised DIP-switches. SKiM gate drivers snap-on technology need soldering, wire plug-in connection. electrical connections realised spring contacts integrated SKiM power modules (Fig. landing pads bottom side gate driver. After assembly, landing pads gate driver press onto spring contacts power module, establishing pressure contacted electrical connection (Fig.
gate driver connected unregulated supply voltage (13V 30V). required voltage primary side generated wide range power supply. driving energy control signals CMOS level) bottom IGBTs transmitted transformers. addition gate driver function, several protection monitoring features short pulse suppression, interlock bottom IGBT, under-voltage monitoring, CE-monitoring (de-saturation monitoring), overtemperature protection, over-current protection, DC-link voltage detection, error memory error feedback implemented. interlock time adjusted individually user. Furthermore, possible disable interlock between bottom switch, order drive bottom switch simultaneously overlap mode (e.g. topologies).
Rth,jh [K/W]
Fig. Assembly snap-on gate driver
With combination Over-Current Protection system (OCP) de-saturation monitoring, short-circuit currents overcurrents detected. These functions able turn-off IGBTs safely during fault conditions. system requires detection AC-output current phase. This realised external closed loop current sensors. These sensors connected gate driver integrated plug connectors. Electrical supply current sensors (supply
compensation current) provided gate driver. reacts within less than provides reliable protection SKiM module. contrast VCE-protection, independent junction temperature. additional de-saturation monitoring protects phase against internal short-circuit ("shoot through" protection). actual values heat sink temperature, AC-current DC-link voltage available analogue voltage signals user interface. order design gate driver with above mentioned features fulfilling creepage distance 1700V modules, large printed circuit board usually required. With specially developed ASICs size gate driver number discrete components reduced. This helps improve reliability gate driver overall system. Conclusion pressure contact technology adapted develop baseless module family SKiM. SKiM allows easy interchange substrate therefore flexible. Furthermore
compact reliable. This, together with intelligent snap-on gate driver, enables easy design compact self-protecting inverter range 300kVA. References K.Backhaus, Performance Compact Power Semiconductor Module Families Featuring Pressure Contact Technology, Proc. PCIM 1999, Part Power Conversion. U.Scheuermann, Novel Power Module Design Technology Improved Power Cycling Capability, Microelectronic Reliability 9-10 (2001), 1713 1718. M.H.Poech, R.Eisele, Modelling Approach Assess Creep Behaviour Large-Area Solder Joints Microelectronic Reliability (2000) 1653-1658. Modular SCALE Driver Solution EconoPACK+, Proc. PCIM, PC10.5, 625-628, Nuremberg, 2001. U.Hecht, U.Scheuermann, Static Transient Thermal Resistance Advanced Power Modules Proc. PCIM, PC10.3, 299-305, Nuremberg, 2001.
Begleittext Vortrag
Ladies gentlemen! Today I'll introduce advanced power module family inverters. name this module SKiM, stands Semikron integrated Module (0:30 1:00) after short introduction pressure contact system, I'll details mechanical construction SKiM; Then, several measurements thermal resistances will presented. After that, I'll show snap-on driver close presentation with summary. (1:15 2:30) Let's look this picture. upper figure shows module with copper base plate: substrate soldered base plate, base plate screwed against heat sink. three substrate, base plate heat sink have different thermal expansion coefficients. That means, they expand different scale heated. result, base plate becomes deformed. There more full contact between substrate base plate (and between base plate heat sink). further temperature changes load change module becomes fatigue reaches life after certain cycles. order overcome this shortcoming, pressure contact system patent Semikron -was found. substrate pressed directly heat sink, without applying base plate. special pressure contact system guarantees even, vertical pressure over whole area, providing always good mechanical contact. heated, substrate free movements thermal expansion, just like floated heat sink, without bending. material fatigue less with temperature changes during load cycling. life time much longer according various tests. (3:45 7:50) let's mechanical construction SKiM. bottom substrate, located within frame. Above there bridge element. pressure plate generates pressure, through tightening screws. This pressure transferred through spring even pressure distribution then bridge element, then substrate heat sink below substrate. (4:45 9:30) pressure plate, steel inlay, moulded with plastics. Besides, pressure plate connected heat sink electrically screws therefore earth potential. functions like shield between power chips below other components above. (5:30 11:00) next picture shows bridge element with many columns. These contact area substrate. blank area power chips. see, pressure points just near chips, order provide defined, even pressure every chip. (6:15 12:30) This picture shows finished substrate with chips IGBT, diode, terminals, temperature sensor, frame. different types substrates, even thermal expansion coefficients substrate heat sink match very well, because substrate fixed this direction. (7:00 14:00)
like present some measurements did. measured object SKiM250GD128D with aluminium-oxide substrate. measured thermal resistance between chip heat sink each IGBT various position. distribution this thermal resistance over whole area. blue curve with steel plate, with moulded pressure plate this using. difference thermal distribution influenced type pressure plate here distribution pressure columns bridge element, depending mechanical layout. series tests were done order find optimised compromise between various factors. (9:00 18:00) Another type measurement have done investigate changes thermal resistance during power cycling. measured SKiM601GD126DM with aluminium-nitride substrate. columns thermal resistances IGBT before power cycling test, blue after test. see, initial value changed, fact smaller. reason that, that thermal grease becomes fluid after warming fills space between substrate heat sink better. Therefore thermal contact better warming state. (10:30 21:00) next picture shows driver. SKiM wide range current (from about 200A 600A), implemented through different chip layout different substrates, three voltage classes 600, 1200 1700V. only building sizes call SKiM4 SKiM5. each size there only universal driver. That means, even driven current, voltage class different, same driver. driver mechanically fitted module, snapped onto module simply click, finish. There solder connection, wire connection, plug-in connection. connections will established through spring contacts. (12:00 24:00) this picture shows spring contact. see, driver snapped module, printed circuit board driver presses spring, contact substrate gate connections, temperature signals etc. (12:30 25:00) Back driver: many intelligent functions integrated like Vce-monitoring, current sensing, temperature monitoring, dc-link voltage monitoring etc. case abnormal operation over current, over voltage, over temperature SKiM will shut down. (13:00 26:00) summarise presentation: SKiM base-plate-free power module; It's easy implement different substrates. Therefore it's flexible. SKiM applies pressure contact technology which proofed have better load cycling capability. It's more reliable. SKiM profile design, that it's compact. same fitted driver. driver board SKiM snap-on connections spring contact. It's very easy assembly every size SKiM there only universal driver, which intelligent optimised module. going build compact inverter with various protecting functions, choose SKiM. (15:00 30:00)

Scheuermann, Grisko, Hermwille Semikron International, Sigmundstr. 200

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