Rail-to-Rail Gain Bandwidth Product: (typical) Supply Current: (t

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Rail-to-Rail Gain Bandwidth Product: (typical) Supply Current: (t

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MCP6281/1R/2/3/4/5
Rail-to-Rail
Gain Bandwidth Product: (typical) Supply Current: (typical) Supply Voltage: 2.2V 6.0V Rail-to-Rail Input/Output Extended Temperature Range: -40°C +125°C Available Single, Dual, Quad Packages Single with (MCP6283) Dual with (MCP6285)
Description
Microchip Technology Inc. MCP6281/1R/2/3/4/5 family operational amplifiers amps) provide wide bandwidth current. This family Gain Bandwidth Product (GBWP) phase margin. This family also operates from single supply voltage 2.2V, while drawing (typical) quiescent current. Additionally, MCP6281/1R/2/3/4/5 supports rail-to-rail input output swing, with common mode input voltage range This family operational amplifiers designed with Microchip's advanced CMOS process. MCP6285 Chip Select (CS) input dual amps 8-pin package. This device manufactured cascading amps (the output connected non-inverting input input puts device Low-power mode. MCP6281/1R/2/3/4/5 family operates over Extended Temperature Range -40°C +125°C. also power supply range 2.2V 6.0V.
Applications
Automotive Portable Equipment Photodiode Amplifier Analog Filters Notebooks PDAs Battery-Powered Systems
Design Aids
SPICE Macro Models FilterLab® Software MindiCircuit Designer Simulator MAPS (Microchip Advanced Part Selector) Analog Demonstration Evaluation Boards Application Notes
Package Types
MCP6281 PDIP, SOIC, MSOP
MCP6281 SOT-23-5
VOUT VIN+ VIN-
MCP6281R SOT-23-5
VOUT VIN+ VIN-
MCP6282 PDIP, SOIC, MSOP
VOUTA VINA_ VINA+ VOUTB VINB_ VINB+
VOUT
VIN+
MCP6283 PDIP, SOIC, MSOP
VIN_ VIN+ VOUT VOUT VIN+
MCP6283 SOT-23-6
MCP6284 PDIP, SOIC, TSSOP
VOUTA VINA
VOUTD
MCP6285 PDIP, SOIC, MSOP
VOUTA/VINB+ VINA_ VINA+
VIND_
VIND+ VINC+
VOUTB
VINB
VINA+ VINB+ VINB_ VOUTB
VOUTC
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability. Section 4.1.2 "Input Voltage Current Limits".
Absolute Maximum Ratings
.7.0V Current Input Pins Analog Inputs (VIN+, VIN-) 1.0V 1.0V Other Inputs Outputs 0.3V 0.3V Difference Input Voltage |VDD VSS| Output Short Circuit Current .Continuous Current Output Supply Pins .±30 Storage Temperature.-65°C +150°C Maximum Junction Temperature (TJ) .+150°C Protection Pins (HBM; 400V
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +2.2V +5.5V, GND, VOUT VDD/2, VDD/2, VDD/2, tied low. (refer Figure Figure 1-3). Parameters Input Offset Input Offset Voltage Input Offset Voltage (Extended Temperature) Input Offset Temperature Drift Power Supply Rejection Ratio Input Bias Current Temperature Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode (Note Common Mode Input Range Common Mode Rejection Ratio Common Mode Rejection Ratio Open-Loop Gain Open-Loop Gain (Large Signal) Output Maximum Output Voltage Swing Output Short Circuit Current Power Supply Supply Voltage Quiescent Current Amplifier Note (Note VOL, 0.5V input overdrive VOUT 0.2V 0.2V, (Note VCMR CMRR CMRR -0.3V 2.5V, -0.3V 5.3V, VOS/TA PSRR ZDIFF -3.0 -5.0 ±1.7 ±1.0 ±1.0 1013||6 1013||3 +3.0 +5.0 (Note -40°C +125°C, (Note Units Conditions
µV/°C -40°C +125°C, (Note ||pF ||pF (Note Note +85°C (Note +125°C (Note Note Note Note
Input Bias, Input Offset Current Impedance
MCP6285's (pins VOUTA/VINB+ VINB-) current MCP6285's VINB- specified only. This specification does apply MCP6285's VOUTA/VINB+ pin. MCP6285's VINB- common mode range (VCMR) MCP6285's VOUTA/VINB+ voltage range specified VOL. parts with date codes November 2007 later have been screened ensure operation 6.0V. However, other minimum maximum specifications measured 2.4V and/or 5.5V. 2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.2V +5.5V, GND, VOUT VDD/2, VDD/2, VDD/2, tied low. (refer Figure Figure 1-3). Parameters Response Gain Bandwidth Product Phase Margin Unity-Gain Slew Rate Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density µVP-P nV/Hz fA/Hz GBWP V/µs Units Conditions
MCP6283/MCP6285 CHIP SELECT (CS) SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.2V +5.5V, GND, VOUT VDD/2, VDD/2, VDD/2, tied low. (refer Figure Figure 1-3). Parameters Specifications Logic Threshold, Input Current, High Specifications Logic Threshold, High Input Current, High Current Amplifier Amplifier Output Leakage Dynamic Specifications (Note Valid Amplifier Output, Turn-on Time High Amplifier Output High-Z Hysteresis Note VDD, V/V, VDD/2, VOUT VDD/2, 5.0V High VDD, V/V, VDD/2, VOUT VDD/2 ICSH -0.7 0.01 ICSL 0.01 Units Conditions
tOFF VHYST
0.01
input condition (VIN) specified applies both MCP6285. dynamic specification tested output (VOUTB).
tOFF Hi-Z -0.7 (typical) (typical)
VOUT
Hi-Z -0.7 (typical) (typical)
-450 (typical) (typical)
FIGURE 1-1: Timing Diagram Chip Select (CS) MCP6283 MCP6285.
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +2.2V +5.5V GND. Parameters Temperature Ranges Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SOT-23 Thermal Resistance, 6L-SOT-23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-MSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note: °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W +125 +150 Note Units Conditions
Junction Temperature (TJ) must exceed Absolute Maximum specification +150°C.
Test Circuits
test circuits used tests shown Figure Figure 1-2. bypass capacitors laid according rules discussed Section "Supply Bypass". VOUT VDD/2
MCP628X
FIGURE 1-2: Test Circuit Most Non-Inverting Gain Conditions.
VOUT
VDD/2
MCP628X
FIGURE 1-3: Test Circuit Most Inverting Gain Conditions.
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
Note:
TYPICAL PERFORMANCE CURVES
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Note: Unless otherwise indicated, +25°C, +2.2V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
Percentage Occurrences
Percentage Occurrences
Samples
Samples -40°C +125°C
-2.8
-2.4
-2.0
-1.6
-1.2
-0.8
-0.4
Input Offset Voltage (mV)
Input Offset Voltage Drift (µV/°C)
FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4:
Input Offset Voltage Drift.
Percentage Occurrences
Percentage Occurrences
Samples +85°C
Samples +125°C
1200
1600
2000
2400
2800
3200
Input Bias Current (pA)
Input Bias Current (pA)
FIGURE 2-2:
Input Bias Current
FIGURE 2-5: +125
Input Bias Current
2.2V
5.5V
Input Offset Voltage (µV)
Input Offset Voltage (µV)
-100 -0.5 +125°C +85°C +25°C -40°C
-100 -0.5 +125°C +85°C +25°C -40°C
Common Mode Input Voltage
Common Mode Input Voltage
FIGURE 2-3: Input Offset Voltage Common Mode Input Voltage 2.2V.
FIGURE 2-6: Input Offset Voltage Common Mode Input Voltage 5.5V.
2008 Microchip Technology Inc.
DS21811E-page
3600
MCP6281/1R/2/3/4/5
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, +25°C, +2.2V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
10,000
Input Offset Voltage (µV)
-100
2.2V
Input Bias, Offset Currents (pA)
Representative Part
5.5V 1,000
Input Bias Current Input Offset Current
5.5V
Output Voltage
Ambient Temperature (°C)
FIGURE 2-7: Output Voltage.
PSRR100
Input Offset Voltage
FIGURE 2-10: Input Bias, Input Offset Currents Ambient Temperature.
CMRR PSRR+
CMRR, PSRR (dB)
PSRR, CMRR (dB)
CMRR
PSRR
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
100k
Frequency (Hz)
Ambient Temperature (°C)
FIGURE 2-8: Frequency.
CMRR, PSRR
FIGURE 2-11: Temperature.
CMRR, PSRR Ambient
Input Bias, Offset Currents (pA)
Input Bias, Offset Currents (nA)
Input Offset Current +85°C 5.5V Input Bias Current
-0.5 -1.0
+125°C 5.5V Input Bias Current
Input Offset Current
Common Mode Input Voltage
Common Mode Input Voltage
FIGURE 2-9: Input Bias, Offset Currents Common Mode Input Voltage +85°C.
FIGURE 2-12: Input Bias, Offset Currents Common Mode Input Voltage +125°C.
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, +25°C, +2.2V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
+125°C +85°C +25°C -40°C
1000
Ouput Voltage Headroom (mV)
Quiescent Current (µA/amplifier)
0.01
Power Supply Voltage
Output Current Magnitude (mA)
FIGURE 2-13: Quiescent Current Power Supply Voltage.
Gain
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08
FIGURE 2-16: Output Voltage Headroom Output Current Magnitude.
5.5V 2.2V Phase Margin 2.2V Gain Bandwidth Product 5.5V
Gain Bandwidth Product (MHz)
Open-Loop Gain (dB)
Open-Loop Phase
Phase -120 -150 -180 -210 100k 100M
Frequency (Hz)
Ambient Temperature (°C)
FIGURE 2-14: Frequency.
Open-Loop Gain, Phase
FIGURE 2-17: Gain Bandwidth Product, Phase Margin Ambient Temperature.
Maximum Output Voltage Swing (VP-P)
5.5V
Slew Rate (V/µs)
Falling Edge, 2.2V Falling Edge, 5.5V
2.2V
Rising Edge, 5.5V Rising Edge, 2.2V
1.E+03
1.E+04
1.E+05
1.E+06
1.E+07
100k
Frequency (Hz)
Ambient Temperature (°C)
FIGURE 2-15: Maximum Output Voltage Swing Frequency.
FIGURE 2-18: Temperature.
Slew Rate Ambient
2008 Microchip Technology Inc.
DS21811E-page
Phase Margin
MCP6281/1R/2/3/4/5
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, +25°C, +2.2V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
1,000
Input Noise Voltage Density (nV/Hz)
Input Noise Voltage Density (nV/Hz)
5.0V
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
100k
Frequency (Hz)
Common Mode Input Voltage
FIGURE 2-19: Frequency.
Input Noise Voltage Density
FIGURE 2-22: Input Noise Voltage Density Common Mode Input Voltage kHz.
Channel-to-Channel Separation (dB)
Ouptut Short Circuit Current (mA)
+125°C +85°C +25°C -40°C
Power Supply Voltage
Frequency (kHz)
FIGURE 2-20: Output Short Circuit Current Power Supply Voltage.
FIGURE 2-23: Channel-to-Channel Separation Frequency (MCP6282 MCP6284 only).
1000
Op-Amp shuts here
5.5V Hysteresis swept high
Quiescent Current (µA/Amplifier)
Quiescent Current (µA/Amplifier)
Op-Amp turns here
Hysteresis swept high 2.2V swept high
toggles On/Off here
Chip Select Voltage
Chip Select Voltage
FIGURE 2-21: Quiescent Current Chip Select (CS) Voltage 2.2V (MCP6283 MCP6285 only).
FIGURE 2-24: Quiescent Current Chip Select (CS) Voltage 5.5V (MCP6283 MCP6285 only).
DS21811E-page
swept high
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, +25°C, +2.2V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
+1V/V 5.0V
-1V/V 5.0V
0.E+00 2.E-06 4.E-06 6.E-06 8.E-06 1.E-05 1.E-05 1.E-05 2.E-05 2.E-05 2.E-05
Output Voltage
0.E+00 2.E-06 4.E-06 6.E-06 8.E-06 1.E-05 1.E-05 1.E-05 2.E-05 2.E-05 2.E-05
Output Voltage
Time µs/div)
Time µs/div)
FIGURE 2-25: Pulse Response.
Large-Signal, Non-inverting
FIGURE 2-28: Pulse Response.
Large-Signal, Inverting
Output Voltage mV/div)
Output Voltage mV/div)
+1V/V
-1V/V
Time (500 ns/div)
Time (500 ns/div)
FIGURE 2-26: Pulse Response.
Small-Signal, Non-inverting
FIGURE 2-29: Pulse Response.
Small-Signal, Inverting
Chip Select, Output Voltages
Chip Select, Output Voltages
Voltage
2.2V +1V/V
0.E+00 5.E-06 1.E-05 2.E-05 2.E-05 3.E-05 3.E-05 4.E-05
Voltage
5.5V +1V/V
VOUT Output
VOUT
Output High-Z
0.0E+00 5.0E-06 1.0E-05 1.5E-05 2.0E-05 2.5E-05 3.0E-05 3.5E-05 4.0E-05 4.5E-05 5.0E-05
Output High-Z
Output
4.E-05 5.E-05 5.E-05
Time µs/div)
Time µs/div)
FIGURE 2-27: Chip Select (CS) Amplifier Output Response Time 2.2V (MCP6283 MCP6285 only).
FIGURE 2-30: Chip Select (CS) Amplifier Output Response Time 5.5V (MCP6283 MCP6285 only).
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
Note: Unless otherwise indicated, +25°C, +2.2V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
1.E-02 1.E-03 1.E-04 100µ 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10 1.E-11 1.E-12 Input, Output Voltage
Input Current Magnitude
5.0V
VOUT
+125°C +85°C +25°C -40°C
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 Input Voltage
Time ms/div)
FIGURE 2-31: Measured Input Current Input Voltage (below VSS).
FIGURE 2-32: MCP6281/1R/2/3/4/5 Show Phase Reversal.
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
DESCRIPTIONS
FUNCTION TABLE SINGLE AMPS
MCP6281R SOT-23-5 MCP6283 PDIP, SOIC, MSOP Symbol SOT-23-6 VOUT VIN- VIN+ Analog Output Inverting Input Non-inverting Input Positive Power Supply Negative Power Supply Chip Select Internal Connection Description Descriptions pins listed Table (single amps) Table (dual quad amps).
TABLE 3-1:
PDIP, SOIC, MSOP 1,5,8
MCP6281 SOT-23-5
TABLE 3-2:
MCP6282
FUNCTION TABLE DUAL QUAD AMPS
MCP6284 PDIP, SOIC, TSSOP MCP6285 Symbol Description Analog Output Inverting Input Non-inverting Input Positive Power Supply Non-inverting Input Inverting Input Analog Output Analog Output Inverting Input Non-inverting Input Negative Power Supply Non-inverting Input Inverting Input Analog Output Analog Output A)/Noninverting Input Chip Select PDIP, SOIC, MSOP VOUTA VINA- VINA+ VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD VOUTA/ VINB+
PDIP, SOIC, MSOP
Analog Outputs
Chip Select Digital Input (CS)
output pins low-impedance voltage sources.
This CMOS, Schmitt-triggered input that places part into low-power mode operation.
Analog Inputs
Power Supply Pins
non-inverting inverting inputs highimpedance CMOS inputs with bias currents.
MCP6285's VOUTA/VINB+
positive power supply (VDD) 2.2V 6.0V higher than negative power supply (VSS). normal operation, other pins between VDD. Typically, these parts used single (positive) supply configuration. this case, connected ground connected supply. will need bypass capacitors.
MCP6285 only, output connected directly non-inverting input this VOUTA/VINB+ pin. This connection makes possible provide Chip Select duals 8-pin packages.
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
APPLICATION INFORMATION
MCP6281/1R/2/3/4/5 family amps manufactured using Microchip's state-of-the-art CMOS process. This family specifically designed lowcost, low-power general purpose applications. supply voltage, quiescent current wide bandwidth makes MCP6281/1R/2/3/4/5 ideal battery-powered applications. VDD, dump currents onto VDD. When implemented shown, resistors also limit current through (minimum expected (minimum expected MCP628X
4.1.1
Rail-to-Rail Inputs
PHASE REVERSAL
MCP6281/1R/2/3/4/5 designed prevent phase reversal when input pins exceed supply voltages. Figure 2-32 shows input voltage exceeding supply voltage without phase reversal.
4.1.2
INPUT VOLTAGE CURRENT LIMITS
protection inputs depicted shown Figure 4-1. This structure chosen protect input transistors, minimize input bias current (IB). input diodes clamp inputs when they more than diode drop below VSS. They also clamp voltages that above VDD; their breakdown voltage high enough allow normal operation, enough bypass quick events within specified limits.
FIGURE 4-2: Inputs.
Protecting Analog
also possible connect diodes left resistors this case, current through diodes needs limited some other mechanism. resistors then serve in-rush current limiters; current into input pins (VIN+ VIN-) should very small. significant amount current flow inputs when common mode voltage (VCM) below ground (VSS); Figure 2-31. Applications that high impedance need limit usable voltage range.
Bond
VIN+ Bond
Input Stage
Bond VIN-
4.1.3
NORMAL OPERATION
Bond
input stage MCP6281/1R/2/3/4/5 amps differential CMOS input stages parallel. operates common mode input voltage (VCM), while other operates high VCM. WIth this topology, device operates with 0.3V above 0.3V below VSS. There transition input behavior changed. occurs when near 1.2V (see Figure Figure 2-6). best distortion performance with non-inverting gains, avoid these regions operation.
FIGURE 4-1: Structures.
Simplified Analog Input
order prevent damage and/or improper operation these amps, circuit they must limit currents voltages VIN+ VIN- pins (see Absolute Maximum Ratings beginning Section "Electrical Characteristics"). Figure shows recommended approach protecting these inputs. internal diodes prevent input pins (VIN+ VIN-) from going below ground, resistors limit possible current drawn input pins. Diodes prevent input pins (VIN+ VIN-) from going above
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
Rail-to-Rail Output
output voltage range MCP6281/1R/2/3/4/5 (min.) (max.) when connected VDD/2 5.5V. Refer Figure 2-16 more information. After selecting RISO your circuit, double-check resulting frequency response peaking step response overshoot. Modify RISO's value until response reasonable. Bench evaluation simulations with MCP6281/1R/2/3/4/5 SPICE macro model helpful.
Capacitive Loads
MCP628X Chip Select (CS)
Driving large capacitive loads cause stability problems voltage feedback amps. load capacitance increases, feedback loop's phase margin decreases closed-loop bandwidth reduced. This produces gain peaking frequency response, with overshoot ringing step response. unity-gain buffer most sensitive capacitive loads, though gains show same general behavior. When driving large capacitive loads with these amps (e.g., when +1), small series resistor output (RISO Figure 4-3) improves feedback loop's phase margin (stability) making output load resistive higher frequencies. bandwidth will generally lower than bandwidth with capacitive load.
MCP6283 MCP6285 single dual amps with Chip Select (CS), respectively. When pulled high, supply current drops (typical) flows through VSS. When this happens, amplifier output into high-impedance state. pulling low, amplifier enabled. internal (typical) pull-down resistor connected VSS, will left floating. Figure shows output voltage supply current response pulse.
Cascaded Dual Amps (MCP6285)
MCP628X
RISO VOUT
MCP6285 dual with Chip Select (CS). Chip Select input available what would non-inverting input standard dual (pin This available because output connects non-inverting input shown Figure 4-5. Chip Select input, which connected microcontroller line, puts device Low-power mode. Refer Section "MCP628X Chip Select (CS)".
VOUTA/VINB+ VINB-
FIGURE 4-3: Output Resistor, RISO stabilizes large capacitive loads.
Figure gives recommended RISO values different capacitive loads gains. x-axis normalized load capacitance (CL/GN), where circuit's noise gain. non-inverting gains, Signal Gain equal. inverting gains, 1+|Signal Gain| (e.g., gives V/V).
1,000 Recommended RISO
VINA- VINA+
VOUTB
MCP6285
FIGURE 4-5:
Cascaded Gain Amplifier.
1,000 10,000 Normalized Load Capacitance; (pF)
output loaded input impedance which typically 1013||6 specified specification table (Refer Section "Capacitive Loads" further details regarding capacitive loads). common mode input range these amps specified data sheet However, since output limited from rails with load), non-inverting input range limited common mode input range
FIGURE 4-4: Recommended RISO Values Capacitive Loads.
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
Supply Bypass
VIN- VIN+ With this family operational amplifiers, power supply (VDD single-supply) should have local bypass capacitor (i.e., 0.01 within good, high-frequency performance. also needs bulk capacitor (i.e., larger) within provide large, slow currents. This bulk capacitor shared with nearby analog parts.
Unused Amps
FIGURE 4-7: Inverting Gain.
Guard Ring
unused quad package (MCP6284) should configured shown Figure 4-6. These circuits prevent output from toggling causing crosstalk. Circuits sets minimum noise gain. resistor divider produces desired reference voltage within output voltage range amp; buffers that reference voltage. Circuit uses minimum number components operates comparator, draw more current. MCP6284 VREF MCP6284
Example Guard Ring Layout
Inverting Gain Transimpedance Amplifiers (convert current voltage, such photo detectors): Connect guard ring non-inverting input (VIN+). This biases guard ring same reference voltage (e.g., VDD/2 ground). Connect inverting (VIN-) input with wire that does touch surface. Non-inverting Gain Unity-Gain Buffer: Connect non-inverting (VIN+) input with wire that does touch surface. Connect guard ring inverting input (VIN-). This biases guard ring common mode input voltage.
FIGURE 4-6:
Unused Amps.
Surface Leakage
applications where input bias current critical, Printed Circuit Board (PCB) surface-leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current flow, which greater than MCP6281/1R/2/3/4/5 family's bias current +25°C typical). easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. example this type layout shown Figure 4-7.
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
4.9.1
Application Circuits
SALLEN-KEY HIGH-PASS FILTER
4.9.3
CASCADED APPLICATIONS
MCP6281/1R/2/3/4/5 amps used active-filter applications. Figure shows secondorder Sallen-Key high-pass filter with gain output bias voltage VDD/2 reference, which changed voltage within output voltage range.
VDD/2 MCP6281 VOUT
MCP6285 provides flexibility Low-power mode dual amps 8-pin package. MCP6285 eliminates added cost space battery-powered applications using single amps with Chip Select lines 10-pin device with Chip Select line both amps. Since amps internally cascaded, this device cannot used circuits that require active passive elements between amps. However, there several applications where this configuration with Chip Select line becomes suitable. circuits below show possible applications this device.
4.9.3.1
Load Isolation
FIGURE 4-8:
Sallen-Key High-Pass Filter.
With cascaded configuration, used isolate load from applications where driving capacitive resistance loads feedback loop (such integrator circuit filter circuit), have sufficient source current drive load. this case, used buffer.
This filter, others, designed using Microchip's Design Aids; Section "FilterLab® Software" Section "MindiCircuit Designer Simulator". VOUTB Load
4.9.2
INVERTING MILLER INTEGRATOR
MCP6285
Analog integrators used filters, control loops measurement circuits. Figure shows most common implementation, inverting Miller integrator. non-inverting input VDD/2 that properly biases switch (SW) used zero output some applications. Other applications feedback loop keep output within linear range operation.
FIGURE 4-10: Buffer. 4.9.3.2
Isolating Load with
Cascaded Gain
VDD/2 MCP6281 VOUT VOUT
Figure 4-11 shows cascaded gain circuit configuration with Chip Select. amps configured non-inverting amplifier configuration. this configuration, important note that input offset voltage amplified gain shown below: Where: VOSA VOSB gain gain input offset voltage input offset voltage
FIGURE 4-9:
Miller Integrator.
Therefore, recommended most gain with with relatively small gain (e.g., unity-gain buffer).
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
MCP6285
VOUT
VOUT
MCP6285
FIGURE 4-11: Configuration. 4.9.3.3
Cascaded Gain Circuit
FIGURE 4-13: Buffered Non-inverting Integrator with Chip Select. 4.9.3.5 Inverting Integrator with Active Compensation Chip Select
Difference Amplifier
Figure 4-12 shows configured difference amplifier with Chip Select. this configuration, recommended well-matched resistors (e.g., 0.1%) increase Common Mode Rejection Ratio (CMRR). used provide additional gain isolate load from difference amplifier. VIN2 MCP6285 VOUT
Figure 4-14 uses active compensator compensate non-ideal characteristics introduced higher frequencies. This circuit uses unity-gain buffer isolate integration capacitor from drives capacitor with low-impedance source. Since both amps matched very well, they provide higher quality integrator.
VIN1
VOUT MCP6285
FIGURE 4-12: 4.9.3.4
Difference Amplifier Circuit.
Buffered Non-inverting Integrator FIGURE 4-14: Compensation. 4.9.3.6
Figure 4-13 shows lossy non-inverting integrator that buffered Chip Select input. configured non-inverting integrator. this configuration, matching impedance each input recommended. used provide feedback loop frequencies 1/(2R1C1) makes this lossy integrator finite gain DC). used isolate load from integrator.
Integrator Circuit with Active
Second-Order Low-Pass Filter with Extra Pole-Zero Pair
Figure 4-15 second-order multiple feedback lowpass filter with Chip Select. FilterLab® software from Microchip determine values second-order filter. used pole-zero pair using
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
4.9.3.8
Capacitorless Second-Order Low-Pass filter with Chip Select
VOUT
MCP6285
FIGURE 4-15: Second-Order Multiple Feedback Low-Pass Filter with Extra Pole-Zero Pair. 4.9.3.7 Second-Order Sallen-Key Low-Pass Filter with Extra Pole-Zero Pair
low-pass filter shown Figure 4-17 does require external capacitors uses only three external resistors; amp's GBWP sets corner frequency. used circuit gain used avoid gain peaking frequency response, needs (lower values need selected R3). Note that amplifier bandwidth varies greatly over temperature process. However, this configuration provides lowcost solution applications with high bandwidth requirements.
Figure 4-16 second-order Sallen-Key low-pass filter with Chip Select. FilterLab® software from Microchip determine values second-order filter. used pole-zero pair using
VREF MCP6285
VOUT
FIGURE 4-17: Capacitorless Second-Order Low-Pass Filter with Chip Select.
VOUT
MCP6285
FIGURE 4-16: Second-Order Sallen-Key Low-Pass Filter with Extra Pole-Zero Pair Chip Select.
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
DESIGN AIDS
Microchip provides basic design tools needed MCP6281/1R/2/3/4/5 family amps.
Analog Demonstration Evaluation Boards
SPICE Macro Model
latest SPICE macro model MCP6281/1R/2/ 3/4/5 amps available Microchip site www.microchip.com. This model intended initial design tool that works well amp's linear region operation over temperature range. model file information capabilities. Bench testing very important part design cannot replaced with simulations. Also, simulation results using this macro model need validated comparing them data sheet specifications characteristic curves.
Microchip offers broad spectrum Analog Demonstration Evaluation Boards that designed help achieve faster time market. complete listing these boards their corresponding user's guides technical information, visit Microchip site www.microchip.com/analogtools. boards that especially useful are: SOIC8EV: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board SOIC14EV: 14-Pin SOIC/TSSOP/DIP Evaluation Board
Application Notes
FilterLab® Software
Microchip's FilterLab® software innovative software tool that simplifies analog active filter (using amps) design. Available cost from Microchip site www.microchip.com/filterlab, FilterLab design tool provides full schematic diagrams filter circuit with component values. also outputs filter circuit SPICE format, which used with macro model simulate actual filter performance.
following Microchip Application Notes available Microchip site www.microchip. com/ appnotes recommended supplemental reference resources. ADN003: "Select Right Operational Amplifier your Filtering Circuits", DS21821 AN722: "Operational Amplifier Topologies Specifications", DS00722 AN723: "Operational Amplifier Specifications Applications", DS00723 AN884: "Driving Capacitive Loads With Amps", DS00884 AN990: "Analog Sensor Conditioning Circuits Overview", DS00990 These application notes others listed design guide: "Signal Chain Design Guide", DS21825
MindiCircuit Designer Simulator
Microchip's MindiCircuit Designer Simulator aids design various circuits useful active filter, amplifier power-management applications. free online circuit designer simulator available from Microchip site www.microchip.com/mindi. This interactive circuit designer simulator enables designers quickly generate circuit diagrams, simulate circuits. Circuits developed using Mindi Circuit Designer Simulator downloaded personal computer workstation.
MAPS (Microchip Advanced Part Selector)
MAPS software tool that helps semiconductor professionals efficiently identify Microchip devices that particular design requirement. Available cost from Microchip site www.microchip.com/ maps, MAPS overall selection tool Microchip's product portfolio that includes Analog, Memory, MCUs DSCs. Using this tool define filter sort features parametric search devices export side-by-side technical comparison reports. Helpful links also provided Data sheets, Purchase, Sampling Microchip parts.
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
PACKAGING INFORMATION
Package Marking Information
5-Lead SOT-23 (MCP6281 MCP6281R) Example:
Device
Code CHNN EUNN
XXNN
MCP6281 MCP6281R
CH25
Note: Applies 5-Lead SOT-23.
6-Lead SOT-23 (MCP6283)
Example:
XXNN
CL25
8-Lead MSOP XXXXXX YWWNNN
Example: 6281E 722256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Example: MCP6281 E/P256 0722 MCP6281 0722
Legend: XX.X
Customer-specific information Year code (last digit calendar year) Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code Pb-free JEDEC designator Matte (Sn) This package Pb-free. Pb-free JEDEC designator found outer packaging this package.
Note:
event full Microchip part number cannot marked line, will carried over next line, thus limiting number available characters customer-specific information.
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
Package Marking Information (Continued)
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW Example: MCP6281 E/SN0722 MCP6281E 0722
14-Lead PDIP (300 mil) (MCP6284) XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
Example:
MCP6284-E/P 0722256
MCP6284 0722256
14-Lead SOIC (150 mil) (MCP6284)
Example:
XXXXXXXXXX XXXXXXXXXX YYWWNNN
MCP6284ESL 0722256
MCP6284 E/SL^^ 0722256
14-Lead TSSOP (MCP6284)
Example:
XXXXXX YYWW
6284EST 0437
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
5-Lead Plastic Small Outline Transistor (OT) [SOT-23]
Note: most current package drawings, please Microchip Packaging Specification located
Units Dimension Limits Number Pins Lead Pitch Outside Lead Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness 0.90 0.89 0.00 2.20 1.30 2.70 0.10 0.35 0.08 MILLIMETERS 0.95 1.90 1.45 1.30 0.15 3.20 1.80 3.10 0.60 0.80 0.26
Lead Width 0.20 0.51 Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.127 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-091B
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
6-Lead Plastic Small Outline Transistor (CH) [SOT-23]
Note: most current package drawings, please Microchip Packaging Specification located
LASER MARK
Units Dimension Limits MILLIMETERS 0.95 1.90 0.90 0.89 0.00 2.20 1.30 2.70 0.10 0.35 0.08 1.45 1.30 0.15 3.20 1.80 3.10 0.60 0.80 0.26
Number Pins Pitch Outside Lead Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness
Lead Width 0.20 0.51 Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.127 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-028B
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Note: most current package drawings, please Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness
MILLIMETERS 0.65 0.75 0.00 0.85 4.90 3.00 3.00 0.40 0.08 0.60 0.95 0.23 0.80 1.10 0.95 0.15
Lead Width 0.22 0.40 Notes: visual index feature vary, must located within hatched area. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-111B
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
8-Lead Plastic Dual In-Line Body [PDIP]
Note: most current package drawings, please Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing .115 .015 .290 .240 .348 .115 .008 .040 .014
INCHES .100 .130 .310 .250 .365 .130 .010 .060 .018 .210 .195 .325 .280 .400 .150 .015 .070 .022
.430 Notes: visual index feature vary, must located with hatched area. Significant Characteristic. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-018B
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
14-Lead Plastic Dual In-Line Body [PDIP]
Note: most current package drawings, please Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing .115 .015 .290 .240 .735 .115 .008 .045 .014 INCHES .100 .130 .310 .250 .750 .130 .010 .060 .018 .210 .195 .325 .280 .775 .150 .015 .070 .022
.430 Notes: visual index feature vary, must located with hatched area. Significant Characteristic. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-005B
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
8-Lead Plastic Small Outline (SN) Narrow, 3.90 Body [SOIC]
Note: most current package drawings, please Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom 0.17 0.31 0.25 0.40 1.25 0.10
MILLIMETERS 1.27 6.00 3.90 4.90 1.04 0.25 0.51 0.50 1.27 1.75 0.25
Notes: visual index feature vary, must located within hatched area. Significant Characteristic. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-057B
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
/HDG 3ODVWLF 6PDOO 2XWOLQH 1DUURZ %RG\ >62,&@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
14-Lead Plastic Small Outline (SL) Narrow, 3.90 Body [SOIC]
Note: most current package drawings, please Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom 0.17 0.31 0.25 0.40 1.25 0.10
MILLIMETERS 1.27 6.00 3.90 8.65 1.04 0.25 0.51 0.50 1.27 1.75 0.25
Notes: visual index feature vary, must located within hatched area. Significant Characteristic. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-065B
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
14-Lead Plastic Thin Shrink Small Outline (ST) Body [TSSOP]
Note: most current package drawings, please Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Footprint Foot Angle Lead Thickness
MILLIMETERS 0.65 0.80 0.05 4.30 4.90 0.45 0.09 1.00 6.40 4.40 5.00 0.60 1.00 0.20 4.50 5.10 0.75 1.20 1.05 0.15
Lead Width 0.19 0.30 Notes: visual index feature vary, must located within hatched area. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-087B
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
NOTES:
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
APPENDIX REVISION HISTORY
Revision (February 2008)
following list modifications: Updated notes Section "Electrical Characteristics". Increased absolute maximum voltage range input pins. Increased maximum operating supply voltage (VDD). Added Section "Test Circuits". Added Figure 2-32. Updated Table Table Section "Pin Descriptions". Added Section 4.1.1 "Phase Reversal", Section 4.1.2 "Input Voltage Current Limits", Section 4.1.3 "Normal Operation". Added Section "Unused Amps". Updated Section "Design AIDS". Updated package outline drawings Section "Packaging Information".
Revision (December 2004)
following list modifications: Added SOT-23-5 packages MCP6281 MCP6281R single amps. Added SOT-23-6 package MCP6283 single amp. Added Section "Pin Descriptions". Corrected application circuits (Section "Application Circuits"). Added SOT-23-5 SOT-23-6 packages corrected package marking information (Section "Packaging Information"). Added Appendix Revision History.
Revision (June 2004)
following list modifications: Undocumented changes.
Revision (October 2003)
following list modifications: Undocumented changes.
Revision (June 2003)
Original data sheet release.
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
NOTES:
DS21811E-page
2008 Microchip Technology Inc.
MCP6281/1R/2/3/4/5
PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device
Package
Examples:
Extended Temperature, SOIC package. MCP6281-E/MS: Extended Temperature, MSOP package. MCP6281-E/P: Extended Temperature, PDIP package. MCP6281T-E/OT: Tape Reel, Extended Temperature, SOT-23 package. MCP6281RT-E/OT: Tape Reel, Extended Temperature, SOT-23 package. MCP6282-E/SN: MCP6282-E/MS: MCP6282-E/P: MCP6282T-E/SN: Extended Temperature, SOIC package. Extended Temperature, MSOP package. Extended Temperature, PDIP package. Tape Reel, Extended Temperature, SOIC package. Extended Temperature, SOIC package. Extended Temperature, MSOP package. Extended Temperature, PDIP package. Tape Reel, Extended Temperature, SOT-23 package. Extended Temperature, 14LD PDIP package. Tape Reel, Extended Temperature, 14LD SOIC package. Extended Temperature, 14LD SOIC package. Extended Temperature, 14LD TSSOP package. Extended Temperature, SOIC package. Extended Temperature, MSOP package. Extended Temperature, PDIP package. Tape Reel, Extended Temperature, SOIC package. MCP6281-E/SN:
Temperature Range
Device:
MCP6281: MCP6281T:
MCP6281RT: MCP6282: MCP6282T: MCP6283: MCP6283T:
MCP6284: MCP6284T: MCP6285: MCP6285T:
Single Single (Tape Reel) (SOIC, MSOP, SOT-23-5) Single (Tape Reel) (SOT-23-5) Dual Dual (Tape Reel) (SOIC, MSOP) Single with Single with (Tape Reel) (SOIC, MSOP, SOT-23-6) Quad Quad (Tape Reel) (SOIC, TSSOP) Dual with Dual with (Tape Reel) (SOIC, MSOP)
MCP6283-E/SN: MCP6283-E/MS: MCP6283-E/P: MCP6283T-E/CH:
Temperature Range:
-40°C +125°C
Package:
Plastic Small Outline Transistor (SOT-23), 6-lead (MCP6283 only) Plastic MSOP, 8-lead Plastic (300 body), 8-lead, 14-lead Plastic Small Outline Transistor (SOT-23), 5-lead (MCP6281, MCP6281R only) Plastic SOIC (3.90 body), 14-lead Plastic SOIC, (3.90 body), 8-lead Plastic TSSOP (4.4 body), 14-lead
MCP6284-E/P: MCP6284T-E/SL:
MCP6284-E/SL: MCP6284-E/ST: MCP6285-E/SN: MCP6285-E/MS: MCP6285-E/P: MCP6285T-E/SN:
2008 Microchip Technology Inc.
DS21811E-page
MCP6281/1R/2/3/4/5
NOTES:
DS21811E-page
2008 Microchip Technology Inc.
Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip devices life support and/or safety applications entirely buyer's risk, buyer agrees defend, indemnify hold harmless Microchip from damages, claims, suits, expenses resulting from such use. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights.
Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, MATE, rfPIC SmartShunt registered trademarks Microchip Technology Incorporated U.S.A. other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, UNI/O, WiperLock ZENA trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2008, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper.
Microchip received ISO/TS-16949:2002 certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona; Gresham, Oregon design centers California India. Company's quality system processes procedures PIC® MCUs dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified.
2008 Microchip Technology Inc.
DS21811E-page
WORLDWIDE SALES SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Address: www.microchip.com Atlanta Duluth, Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, Tel: 765-864-8360 Fax: 765-864-8387 Angeles Mission Viejo, Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 China Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049
ASIA/PACIFIC
India Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934 Malaysia Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Hsin Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
01/02/08
DS21811E-page
2008 Microchip Technology Inc.

Rail-to-Rail Gain Bandwidth Product: (typical) Supply Current: (t

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