| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
IRS2607DSPbF HIGH SIDE DRIVER Features Floating channel
Top Searches for this datasheet2009 IRS2607DSPbF HIGH SIDE DRIVER Features Floating channel designed bootstrap operation Integrated bootstrap diode suitable Complimentary switching schemes only IRS2607DSPBF suitable sinusoidal motor control applications IRS2607DSPBF recommended Trapezoidal motor control applications Fully operational +600 Tolerant negative transient voltage, dV/dt immune Gate drive supply range from Undervoltage lockout both channels input logic compatible Matched propagation delay both channels Lower di/dt gate driver better noise immunity Outputs phase with inputs RoHS compliant Packages 8-Lead SOIC Applications: *Motor Control *Air Conditioners/ Washing Machines *General Purpose Inverters *Micro/Mini Inverter Drives Description IRS2607D high voltage, high speed power MOSFET IGBT drivers with independent high side referenced output channels. Proprietary HVIC latch immune CMOS technologies enable ruggedized monolithic construction. logic input compatible with standard CMOS LSTTL output, down logic. output drivers feature high-pulse current buffer stage designed minimum driver cross-conduction. floating channel used drive N-channel power MOSFETs IGBTs high side configuration which operates Typical Connection www.irf.com Qualification Information Qualification Level Industrial Comments: This passed JEDEC's Industrial qualification. IR's Consumer qualification level granted extension higher Industrial level. MSL2, 260°C (per IPC/JEDEC J-STD-020) Class (per JEDEC standard JESD22-A114) Class (per EIA/JEDEC standard EIA/JESD22-A115) Class Level (per JESD78) Moisture Sensitivity Level Human Body Model Machine Model Latch-Up Test RoHS Compliant Qualification standards found International Rectifier's site http://www.irf.com/ Higher qualification ratings available should user have such requirements. Please contact your International Rectifier sales representative further information. www.irf.com IRS2607DSPbF Absolute Maximum Ratings Absolute Maximum Ratings indicate sustained limits beyond which damage device occur. voltage parameters absolute voltages referenced COM. thermal resistance power dissipation ratings measured under board mounted still conditions. Symbol dVS/dt RthJA Definition High side floating supply voltage High side floating supply offset voltage High side floating output voltage side logic fixed supply voltage side output voltage Logic input voltage Allowable offset supply voltage transient Package power dissipation Thermal resistance, junction ambient Junction temperature Storage temperature Min. -0.3 -0.3 -0.3 -0.3 Max. 0.625 Units V/ns Lead temperature (soldering, seconds) Note Zener clamps included between COM, (20V). Recommended Operating Conditions proper operation device should used within recommended conditions. offset ratings tested with supplies biased differential. Symbol Definition High side floating supply absolute voltage Static High side floating supply offset voltage Transient High side floating supply offset voltage High side floating output voltage side logic fixed supply voltage side output voltage Logic input voltage Ambient temperature Min. COM- 8(Note (Note2) Max. Units Note Logic operational +600 Logic state held VBS. Note Operational transient negative with pulse width. Guaranteed design. Refer Application Information section this datasheet more details. www.irf.com IRS2607DSPbF Static Electrical Characteristics unless otherwise specified. VIL, VIH, parameters referenced applicable respective input leads. parameters referenced applicable respective output leads: Symbol IQBS IQCC IIN+ IINVCCUV+ VBSUV+ VCCUVVBSUVVCCUVH VBSUVH IORBS Definition Logic input voltage Logic input voltage High level output voltage level output voltage Offset supply leakage current Quiescent supply current Quiescent supply current Logic input bias current Logic input bias current supply undervoltage positive going threshold supply undervoltage negative going threshold supply undervoltage hysteresis Output high short circuit pulsed current Output short circuit pulsed current Bootstrap resistance Min. Typ. Max. Units Test Conditions 1100 1800 Integrated bootstrap diode suitable Complimentary schemes only. IRS2607D suitable sinusoidal motor control applications. IRS2607D recommended Trapezoidal motor control applications. Refer Integrated Bootstrap Functionality section this datasheet more details. Dynamic Electrical Characteristics 1000 Symbol toff tfil Definition Turn-on propagation delay Turn-off propagation delay Delay matching, turn-on/off Turn-on rise time Turn-off fall time Minimum pulse input filter time Min. Typ. Max. Units Test Conditions www.irf.com IRS2607DSPbF Lead Definitions Symbol Description Logic input high side gate driver output (HO), phase Logic input side gate driver output (LO), phase High side floating supply High side gate drive output High side floating supply return side logic fixed supply side gate drive output side return Lead Assignments Lead SOIC IRS2607DS www.irf.com IRS2607DSPbF Functional Block Diagrams www.irf.com IRS2607DSPbF Application Information Additional Details Informations regarding following topics included subsections within this section datasheet. IGBT/MOSFET Gate Drive Switching Timing Relationships Matched Propagation Delays Input Logic Compatibility Undervoltage Lockout Protection Advanced Input Filter Short-Pulse Noise Rejection Integrated Bootstrap Functionality Negative Transient Layout Tips Additional Documentation IGBT/MOSFET Gate Drive IRS2607D HVICs designed drive MOSFET IGBT power devices. Figures illustrate several parameters associated with gate drive functionality HVIC. output current HVIC, used drive gate power switch, defined voltage that drives gate external power switch defined high-side power switch low-side power switch; this parameter sometimes generically called VOUT this case does differentiate between high-side low-side output voltage. VCC) VCC) VLO) COM) COM) Figure HVIC sourcing current Figure HVIC sinking current www.irf.com IRS2607DSPbF Switching Timing Relationships relationships between input output signals IRS2607D illustrated below Figures From these figures, definitions several timing parameters (i.e., OUT, tON, tOFF, associated with this device. LINx HINx) PWIN tOFF PWOUT HOx) Figure Switching time waveforms Figure Input/output timing diagram Matched Propagation Delays IRS2607D family HVICs designed with propagation delay matching circuitry. With this feature, IC's response output signal input requires approximately same time duration (i.e., tON, tOFF) both low-side channels high-side channels; maximum difference specified delay matching parameter (MT). propagation turn-on delay (tON) IRS2607D matched propagation turn-on delay (tOFF). www.irf.com IRS2607DSPbF Figure Delay Matching Waveform Definition Input Logic Compatibility inputs this compatible with standard CMOS outputs. IRS2607D been designed compatible with logic-level signals. Figure illustrates input signal IRS2607D, input threshold values, logic state result input signal. Input Signal (IRS23364D) Input Logic Level High Figure input thresholds www.irf.com IRS2607DSPbF Undervoltage Lockout Protection This family provides undervoltage lockout protection both (logic low-side circuitry) power supply (high-side circuitry) power supply. Figure used illustrate this concept; VBS) plotted over time waveform crosses UVLO threshold (VCCUV+/- VBSUV+/-) undervoltage protection enabled disabled. Upon power-up, should voltage fail reach VCCUV+ threshold, will turn-on. Additionally, voltage decreases below VCCUV- threshold during operation, undervoltage lockout circuitry will recognize fault condition shutdown high- low-side gate drive outputs, FAULT will transition state inform controller fault condition. Upon power-up, should voltage fail reach VBSUV threshold, will turn-on. Additionally, voltage decreases below VBSUV threshold during operation, undervoltage lockout circuitry will recognize fault condition, shutdown high-side gate drive outputs UVLO protection ensures that drives external power devices only when gate supply voltage sufficient fully enhance power devices. Without this feature, gates external power switch could driven with voltage, resulting power switch conducting current while channel impedance high; this could result very high conduction losses within power device could lead power device failure. Figure UVLO protection www.irf.com IRS2607DSPbF Advanced Input Filter advanced input filter allows improvement input/output pulse symmetry HVIC helps reject noise spikes short pulses. This input filter been applied inputs. working principle filter shown Figures Figure shows typical input filter asymmetry input output. upper pair waveforms (Example show input signal with duration much longer then tFIL,IN; resulting output approximately difference between input signal tFIL,IN. lower pair waveforms (Example show input signal with duration slightly longer then tFIL,IN; resulting output approximately difference between input signal tFIL,IN. Figure shows advanced input filter symmetry between input output. upper pair waveforms (Example show input signal with duration much longer then tFIL,IN; resulting output approximately same duration input signal. lower pair waveforms (Example show input signal with duration slightly longer then tFIL,IN; resulting output approximately same duration input signal. Figure Typical input filter Figure Advanced input filter Short-Pulse Noise Rejection This device's input filter provides protection against short-pulses (e.g., noise) input lines. duration input signal less than tFIL,IN, output will change states. Example Figure shows input output state with positive noise spikes durations less than tFIL,IN; output does change states. Example Figure shows input output high state with negative noise spikes durations less than tFIL,IN; output does change states. Example Figure Noise rejecting input filters www.irf.com Example IRS2607DSPbF Figures present data that illustrates characteristics input filters while receiving pulses. input filter characteristic shown Figure left side illustrates narrow pulse (short positive pulse) characteristic while left shows narrow pulse (short negative pulse) characteristic. x-axis Figure shows duration while y-axis shows resulting duration. seen that duration less than tFIL,IN, that resulting duration zero (e.g., filter rejects input signal/noise). also that once duration exceed tFIL,IN, that durations mimic durations very well over this interval with symmetry improving duration increases. ensure proper operation HVIC, suggested that input pulse width high-side inputs difference between signals both narrow narrow cases shown Figure careful reader will note scale y-axis. x-axis Figure shows duration while yaxis shows resulting OUT-PW duration. This data illustrates performance near symmetry this input filter. Figure IRS2607D input filter characteristic Figure Difference between input pulse output pulse www.irf.com Time (ns) IRS2607DSPbF Integrated Bootstrap Functionality IRS2607D embeds integrated bootstrap that allows alternative drive bootstrap supply wide range applications. bootstrap connected between floating supply (see Fig. 13). BootFet Figure Semplified BootFET connection bootstrap suitable complimentary switching schemes only. Complimentary refers schemes where input signals alternately switched off. IRS2607D suitable sinusoidal motor control integrated bootstrap feature used either parallel with external bootstrap network (diode resistor) replacement integrated bootstrap replacement external bootstrap network have some limitations very high duty cycle, corresponding very short pulses, bootstrap equivalent resistance RBS. IRS2607D recommended trapezoidal motor control, even external bootstrap network employed parallel. summary bootstrap state follows: Bootstrap turns-off (immediately) stays when least following conditions met: goes/is high goes/is high 1.1*VCC) Bootstrap turns-on when: high (low side ~1.1(VCC)) after transition from output tri-state) goes (<1.1*VCC) before fixed time 20us. after transition from output tri-state) goes (<1.1(VCC)) before retriggerable time 20us. this case time counter kept reset state until goes high (>1.1VCC). Please refer BootFET timing diagram more details. www.irf.com IRS2607DSPbF timer Timer reset counter Timer reset Timer expired BootStrap 1.1*Vcc Figure BootFET timing diagram www.irf.com IRS2607DSPbF Tolerant Negative Transients common problem today's high-power switching converters transient response switch node's voltage power switches transition quickly while carrying large current. typical 3-phase inverter circuit shown Figure here define power switches diodes inverter. high-side switch (e.g., IGBT Figures switches off, while phase current flowing inductive load, current commutation occurs from high-side switch (Q1) diode (D2) parallel with low-side switch same inverter leg. same instance, voltage node VS1, swings from positive voltage negative voltage. Figure Three phase inverter Figure conducting Figure conducting Also when phase current flows from inductive load back inverter (see Figures 19), IGBT switches current commutation occurs from same instance, voltage node, VS2, swings from positive voltage negative voltage. www.irf.com IRS2607DSPbF Figure conducting Figure conducting However, real inverter circuit, voltage swing does stop level negative bus, rather swings below level negative bus. This undershoot voltage called "negative transient". circuit shown Figure depicts three phase inverter; Figures show simplified illustration commutation current between parasitic inductances power circuit from bonding tracks lumped together each IGBT. When high-side switch below voltage voltage drops associated with power switch parasitic elements circuit. When high-side power switch turns off, load current momentarily flows low-side freewheeling diode inductive load connected (the load shown these figures). This current flows from (which connected HVIC) load negative voltage between induced (i.e., HVIC higher potential than pin). Figure Parasitic Elements Figure positive Figure negative typical motor drive system, dV/dt typically designed range V/ns. negative transient voltage exceed this range during some events such short circuit over-current shutdown, when di/dt greater than normal operation. International Rectifier's HVICs have been designed robustness required many today's demanding applications. indication IRS2607D's robustness seen Figure where there represented IRS2607D Safe Operating Area VBS=15V based repetitive negative spikes. negative transient voltage falling grey area (outside SOA) lead permanent damage; viceversa unwanted functional anomalies permanent damage appear negative transients fall inside SOA. VBS=15V case transients greater than -16.5 period time greater than HVIC will hold design high-side outputs state www.irf.com IRS2607DSPbF Figure Negative transient IRS2607D VBS=15V Even though IRS2607D been shown able handle these large negative transient conditions, highly recommended that circuit designer always limit negative transients much possible careful layout component use. Layout Tips Distance between high voltage components: It's strongly recommended place components tied floating voltage pins near respective high voltage portions device. Please Case Outline information this datasheet details. Ground Plane: order minimize noise coupling, ground plane should placed under near high voltage floating side. Gate Drive Loops: Current loops behave like antennas able receive transmit noise (see Figure 24). order reduce coupling improve power switch turn on/off performance, gate drive loops must reduced much possible. Moreover, current injected inside gate drive loop IGBT collector-to-gate parasitic capacitance. parasitic auto-inductance gate loop contributes developing voltage across gate-emitter, thus increasing possibility self turn-on effect. www.irf.com IRS2607DSPbF Figure Antenna Loops Supply Capacitor: recommended place bypass capacitor (CIN) between pins. ceramic ceramic capacitor suitable most applications. This component should placed close possible pins order reduce parasitic elements. Routing Placement: Power stage parasitic elements contribute large negative voltage transients switch node; recommended limit phase voltage negative transients. order avoid such conditions, recommended minimize high-side emitter low-side collector distance, minimize low-side emitter negative rail stray inductance. However, where negative spikes remain excessive, further steps taken reduce spike. This includes placing resistor less) between switch node (see Figure 25), some cases using clamping diode between (see Figure 26). DT04-4 www.irf.com more detailed information. Figure resistor Figure clamping diode Additional Documentation Several technical documents related HVICs available www.irf.com; Site Search function document number quickly locate them. Below short list some these documents. DT97-3: Managing Transients Control Driven Power Stages AN-1123: Bootstrap Network Analysis: Focusing Integrated Bootstrap Functionality DT04-4: Using Monolithic High Voltage Gate Drivers AN-978: Floating MOS-Gate Driver www.irf.com IRS2607DSPbF Figures 27-48 provide information experimental performance IRS2607DS HVIC. line plotted each figure generated from actual data. large number individual samples from multiple wafer lots were tested three temperatures (-40 order generate experimental (Exp.) curve. line labeled Exp. consist three data points (one data point each tested temperatures) that have been connected together illustrate understood trend. individual data points curve were determined calculating averaged experimental value parameter (for given temperature). Turn-on Propagation Delay (ns) 1200 Exp. Turn-off Propagation Delay (ns) 1500 1000 Exp. Temperature (oC) Temperature Fig. Turn-on Propagation Delay Temperature Fig. Turn-off Propagation Delay Temperature Turn-On Rise Time (ns) Turn-Off fall Time (ns) Exp. Exp. Temperature Temperature Fig. Turn-on Rise Time Temperature Fig. Turn-off Rise Time Temperature www.irf.com IRS2607DSPbF Output short circuit pulsed current Output High pulsed current Exp. Exp. Temperature (oC) Temperature Fig. Output High Pulsed Current Temperature Fig. Output Short Circuit Pulsed Current Temperature 1500 1200 Tbson_TYP (ns) Exp. supply hysteresis Exp. Temperature Temperature (oC) Fig. Tbson_TYP Temperature Fig. Supply Hysteresis Temperature Quiescent Supply Current (mA) supply hysteresis Exp. Exp. Temperature Temperature Fig. Supply Hysteresis Temperature Fig. Quiescent Supply Current Temperature www.irf.com IRS2607DSPbF Quiescent Supply Current (uA) Exp. VCCUV+ Threshold Exp. Temperature Temperature Fig. Quiescent Supply Current Temperature Fig. VCCUV+ Threshold Temperature VCCUV- Threshold BSUV+ Threshold Exp. Exp. Temperature Temperature Fig. VCCUV- Threshold Temperature level output voltage (mV) Fig. VBSUV+ Threshold Temperature 1500 High level output voltage (mV). 1200 Exp. EXP. Temperature (oC) Temperature Fig. Level Output Voltage vs.vs. Fig. Level Output Voltage Temperature Temperature www.irf.com Fig. High Level Output Voltage Temperature IRS2607DSPbF Bootstrap resistance type (Ohm) Exp. VBSUV- Threshold Exp. Temperature Temperature Fig. Bootstrap Resistance type Temperature Fig. VBSUV- Threshold Temperature Lin_VTH+ Lin_VTH- Exp. Exp. Temperature (oC) Temperature (oC) Fig. Lin_VTH+ Temperature Fig. Lin_VTH- Temperature Hin_VTH+ Exp. Hin_VTH- Exp. Temperature Temperature Fig. Hin_VTH+ Temperature www.irf.com Fig. Hin_VTH- Temperature IRS2607DSPbF Case Outlines www.irf.com IRS2607DSPbF Tape Reel Details: 8L-SOIC LOADED TAPE FEED DIRECTION NOTE CONTROLLING ENSION CARRIER TAPE DIMENSION Metric Code 7.90 8.10 3.90 4.10 11.70 12.30 5.45 5.55 6.30 6.50 5.10 5.30 1.50 1.50 1.60 8SOICN Imperial 0.311 0.318 0.153 0.161 0.46 0.484 0.214 0.218 0.248 0.255 0.200 0.208 0.059 0.059 0.062 REEL DIMENSIONS 8SOICN Metric Code 329.60 330.25 20.95 21.45 12.80 13.20 1.95 2.45 98.00 102.00 18.40 14.50 17.10 12.40 14.40 Imperial 12.976 13.001 0.824 0.844 0.503 0.519 0.767 0.096 3.858 4.015 0.724 0.570 0.673 0.488 0.566 www.irf.com IRS2607DSPbF ORDER INFORMATION 8-Lead SOIC IRS2607DSPbF 8-Lead SOIC Tape Reel IRS2607DSTRPbF information provided this document believed accurate reliable. However, International Rectifier assumes responsibility consequences this information. International Rectifier assumes responsibility infringement patents other rights third parties which result from this information. license granted implication otherwise under patent patent rights International Rectifier. specifications mentioned this document subject change without notice. This document supersedes replaces information previously supplied. technical support, please contact IR's Technical Assistance Center WORLD HEADQUARTERS: Kansas St., Segundo, California 90245 Tel: (310) 252-7105 www.irf.com Other recent searchesNT332 - NT332 NT332 Datasheet FDB3632 - FDB3632 FDB3632 Datasheet FDP3632 - FDP3632 FDP3632 Datasheet FDI3632 - FDI3632 FDI3632 Datasheet ENA1379 - ENA1379 ENA1379 Datasheet SBE818 - SBE818 SBE818 Datasheet CAT3647 - CAT3647 CAT3647 Datasheet
Privacy Policy | Disclaimer |