Addendum Intel® Celeron® Processor Series Mobile Intel® Express Chipse

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Intel® Celeron® Processor
Addendum Intel® Celeron® Processor Series Mobile Intel® Express Chipset Family Datasheet
Order Number: 317984-001US
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Intel® Celeron® Processor Datasheet Addendum
August 2007 Order Number: 317984-001US
Contents
Introduction Terminology References Package Mechanical Specifications Addendum. Processor Component Keep-Out Zones Package Loading Specifications Processor Mass Specifications Thermal Specifications Addendum
Figures
1-MB Configuration Micro-FCPGA Processor Package Drawing 1-MB Configuration Micro-FCPGA Processor Package Drawing 1-MB Configuration Micro-FCBGA Processor Package Drawing Configuration Micro-FCBGA Processor Package Drawing
Tables
Thermal Specifications
August 2007 Order Number: 317984-001US
Intel® Celeron® Processor Datasheet Addendum
Intel® Celeron® Processor
Revision History
Date
Revision
Description Initial release
Intel® Celeron® Processor Datasheet Addendum
August 2007 Order Number: 317984-001US
Introduction
Introduction
This document addendum Intel® Celeron® Processor Series Mobile Intel® Express Chipset Family Datasheet. purpose this addendum document mechanical packaging thermal features specific Intel® Celeron processor available only Intel embedded customers. Please refer master Intel® Celeron Processor Series Datasheet other specifications relating this processor. this document, Intel® Celeron® Processor will referred processor. following list provides some features this processor: Supported Intel® Express Chipset Family Single Core On-die, primary 32-kB instruction cache 32-kB write-back data cache On-die, 1-MB second level shared cache with Advanced Transfer Cache Architecture 533-MHz Source-Synchronous Front Side (FSB) Supports Intel Architecture with Dynamic Execution Data Prefetch Logic Supports both Micro-FCPGA Micro-FCBGA packaging technology MMX, Streaming SIMD Extensions (SSE), Streaming SIMD Extensions (SSE2), Streaming SIMD Extensions (SSE3), Supplemental Streaming SIMD Extensions (SSSE3) Digital Thermal Sensor (DTS) Execute Disable support enhanced security Intel® architecture (formerly Intel® EM64T) Architectural performance enhancements Core micro-architecture.
Note:
Intel® requires computer system with processor, chipset, BIOS, operating system, device drivers applications enabled Intel processor will operate (including 32-bit operation) without Intel 64-enabled BIOS. Performance will vary depending your hardware software configurations. http:// more information including details which processors support Intel consult with your system vendor more information. Unless specified otherwise, references processor this document references Intel Celeron processor with 533-MHz FSB.
Note:
August 2007 Order Number: 317984-001US
Intel® Celeron® Processor Datasheet Addendum
Terminology
Term Front Side (FSB) Intel® FCPGA FCBGA
Definition Refers interface between processor system core logic (also known chipset components). 64-bit memory extensions IA-32 architecture. Micro flip-chip Grid Array Package Micro flip-chip Ball Grid Array Package
References
following documents should used references this document:
Document
Intel® Celeron® Series Mobile Intel® Express Chipset Family Datasheet
Order Number1
316205
Intel® Celeron® Processor Datasheet Addendum
August 2007 Order Number: 317984-001US
Package Mechanical Specifications Addendum
Package Mechanical Specifications Addendum
processor available packages: 478-pin Micro-FCPGA 479-pin MicroFCBGA. Package mechanical dimensions shown Figure through Figure provide details processor keep-out zones, package loading specifications, processor mass specifications.
Processor Component Keep-Out Zones
processor contain components substrate that define component keepout zone requirements. thermal mechanical solution design must intrude into required keep-out zones. Decoupling capacitors typically mounted keepout areas. location quantity capacitors change will remain within component keep-in. Figure Figure keep-out zones.
Package Loading Specifications
Maximum mechanical package loading specifications given Figure Figure Micro-FCPGA Micro-FCBGA packages respectively. These specifications static compressive loading direction normal processor. This maximum load limit should exceeded during shipping conditions, standard condition, thermal solution. addition, there additional load limitations against transient bend, shock, tensile loading. These limitations more platform specific should obtained contacting your field support. Moreover, processor package substrate should used mechanical reference load-bearing surface thermal mechanical solution.
Processor Mass Specifications
typical mass Micro-FCPGA Micro-FCBGA packages given Figure Figure This mass includes components that included package.
August 2007 Order Number: 317984-001US
Intel® Celeron® Processor Datasheet Addendum
Figure
1-MB Configuration Micro-FCPGA Processor Package Drawing
Bottom View
View
Pins
Front View
Side View
Underfill Package Substrate 0.37
SYMBOL
MILLIMETERS
COMMENTS
0.65
2.03±0.08 0.65
Detail Scale
34.95 35.05 34.95 35.05 10.5 13.8 0.89 1.903 2.163 31.75 BASIC 31.75 BASIC 15.875 BASIC 15.875 BASIC 1.27 BASIC 1.27 BASIC 0.255 0.355 Keying Pins
B6150-01
Intel® Celeron® Processor Datasheet Addendum
August 2007 Order Number: 317984-001US
Package Mechanical Specifications Addendum
Figure
1-MB Configuration Micro-FCPGA Processor Package Drawing
7.00 7.00
Edge Keep Zone
5.00
Corner Keep Zone
Side View
View
13.97 6.985
1.625
1.625
13.97 6.985
Allowable Component Height
Bottom View
B6210-01
August 2007 Order Number: 317984-001US
Intel® Celeron® Processor Datasheet Addendum
Figure
1-MB Configuration Micro-FCBGA Processor Package Drawing
View
Bottom View
Balls
Front View
Detail Scale
SYMBOL MILLIMETERS 34.95 35.05 34.95 35.05 10.5 13.8 0.89 1.903 2.163 31.75 BASIC 31.75 BASIC 15.875 BASIC 15.875 BASIC 1.27 BASIC 1.27 BASIC 0.61 0.69
COMMENTS
Side View
Package Substrate
Underfill
0.203
Detail Scale
B6597-01
Intel® Celeron® Processor Datasheet Addendum
August 2007 Order Number: 317984-001US
Package Mechanical Specifications Addendum
Figure
Configuration Micro-FCBGA Processor Package Drawing
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. DISCLOSED CONFIDENCE CONTENTS DISCLOSED, REPRODUCED, DISPLAYED MODIFIED, WITHOUT PRIOR WRITTEN CONSENT INTEL CORPORATION. 7.00 7.00
Edge Keep Zone
5.00
View
13.97 6.985
Corner Keep Zone
Side View
1.625
1.625
13.97 6.985
0.55 Allowable Component Height
Bottom View
B6598-01
August 2007 Order Number: 317984-001US
Intel® Celeron® Processor Datasheet Addendum
Thermal Specifications Addendum
Thermal Specifications Addendum
complete thermal solution includes both component system level thermal management features. processor requires thermal solution maintain temperatures within operating limits.
Caution:
attempt operate processor outside operating limits result permanent damage processor potentially other components system. system/processor thermal solution should remain within minimum maximum junction temperature (Tj) specifications corresponding thermal design power (TDP) value listed Table
Table
Thermal Specifications
Symbol Processor Number Core Frequency Voltage 1.73GHz Variant Configuration Thermal Design Power Unit Notes 1,2,3,4
Note:
specification should used design processor thermal solution. maximum theoretical power processor generate. Intel Thermal Monitor automatic mode must enabled processor operate within specifications. 100°C units will display processor family 06F6h
August 2007 Order Number: 317984-001US
Intel® Celeron® Processor Datasheet Addendum

Addendum Intel® Celeron® Processor Series Mobile Intel® Express Chipse

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