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TLE7809G Integrated double low-side switch, high-side/LED driver,


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Data Sheet, Rev. 3.01, April 2008
TLE7809G
Integrated double low-side switch, high-side/LED driver, hall supply, wake-up inputs communication with embedded (16kB Flash)
Automotive Power
TLE7809G
Table Contents
Table Contents
Table Contents 4.5.1 4.5.2 4.5.3 6.1.1 6.2.1 16.1 16.2 16.3 16.4 18.1 18.2 18.3 18.4 Overview Block Diagram Definitions Functions Operating Modes Standby Mode Active Mode Active Mode "LIN Sleep" Receive-Only Mode ("LIN RxD-Only") Power Saving Modes Sleep Mode Stop Mode Stop Mode with Cyclic Wake Transceiver Measurement Interface Voltage Measurement Voltage Measurement Calibration Concept Temperature Measurement Temperature Measurement Calibration Concept
Dropout Voltage Regulator (Serial Peripheral Interface) Reset Behavior Window Watchdog Monitoring Wake-Up Inputs MON1 Wake-Up Event Signalling Side Switches Supply Output Hall Sensor Supply High-Side Switch Driver (HS-LED) General Purpose I/Os (GPIO) Error Interconnect (ERR) General Product Characteristics Absolute Maximum Ratings Functional Range Thermal Resistance Electrical Characteristics Application Information Application Diagram Hints Unused Pins Flash Program Mode LIN-Fast-Mode Thermal Resistance
Timing Diagrams
Package Outlines Revision History Rev. 3.01, 2008-04-15
Data Sheet
Integrated double low-side switch, high-side/LED driver, hall supply, wake-up inputs communication with embedded (16kB Flash)
TLE7809G
Overview
Low-Dropout Voltage Regulator (LDO) Transceiver Standard 16-bit SPI-Interface Low-Side Switches, e.g. Relay Driver Supply e.g. Hall Sensor Supply Driver High-Voltage Wake-Up Inputs Programmable. Window Watchdog Power Saving Modes Power-On Undervoltage Reset Generator Overtemperature Protection Short Circuit Protection
Relay Driver System Basis Chip
PG-DSO-28-21
8-bit Microcontroller Compatible 8051 Core clocks machine cycle 8kByte Boot test Flash routines Bootloader (Boot ROM) Byte Byte XRAM 16kByte Flash Memory Program Code Data On-Chip Oscillator Power Saving Modes (slow-down idle mode) Programmable Watchdog Timer 10-bit Converter, e.g. Temperature Vbat-Measurement Three 16-bit Timers Capture/Compare Unit General Purpose I/Os, e.g. with Functionality On-Chip Debug Support (JTAG) UART Synchronous Serial Channel (SSC respective SPI)
General Characteristics Package PG-DSO-28-21 Temperature Range (for industrial applications) Green Package (RoHS compliant)
Type TLE7809G Data Sheet
Package PG-DSO-28-21
Marking TLE7809G Rev. 3.01, 2008-04-15
TLE7809G
Overview Description This single-packaged solution incorporates 8-bit state-of-the-art microcontroller compatible standard 8051 core with On-Chip Debug Support (OCDS), System-Basis-Chip (SBC). equipped with transceiver, low-dropout voltage regulator (LDO) well low-side switches (relay driver) high-side driver e.g. driving LEDs. additional supply, e.g. supply hall sensors (TLE 4966) also available. Micro Controller Unit (MCU) supervision additional protection circuit programmable window watchdog circuit with reset feature, supply voltage supervision integrated temperature sensor implemented SBC. Microcontroller module offer power modes order support terminal connected automotive applications. wake-up from power mode possible message wake-up inputs. This integrated circuit realized Multi-Chip-Module (MCM) PG-DSO-28-21 package, designed withstand severe conditions industrial applications. Note: detailed description 8-bit microcontroller XC866 found dedicated User's Manual Data Sheet.
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Block Diagram
Block Diagram
Vbat
8-bit
On-Chip Oscillator
Supply Output (Hall Sensor) Low-Side Switch Low-Side Switch Wake-Up Inputs
Voltage Regulator Diagnostic Ctrl.
Flash
JTAG GPIOs
Hall Sensor Reset
Watchdog
Temp. Vbat Measurement
10-bit
LED-Driver
Serial
LIN-Bus note: Driver Wake-up input share same (MON5/HS_LED)
Figure Functional Block Diagram (Module Overview)
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Definitions Functions
Definitions Functions
MON3 MON4 MON5 HS_LED RESET P0.3/SCLK_1/COUT63_1 P0.4/MTSR_1/CC62_1 P0.5/MRST_1/EXINT0_0/COUT62_1 VDDC
MON2 MON1
VBAT_SENSE SUPPLY VDDP
TLE7809G
P0.2/CTRAP_2/TDO_0/TXD_1
Figure
Configuration Symbol Function
Monitoring Wake-Up Inputs; bi-level sensitive inputs used monitor signals MON1, example coming from external switch panel MON2, MON3, MON4, MON5/HS_LED MON5 combined with Driver output
VBAT_SENSE
Power Supply Input; recommendation block directly with ceramic capacitor (ferrite bead better behavior) Battery Voltage Sense Input; connection terminal with external serial resistor Voltage Regulator Output; internal supply stabilize block with external capacitor; external loads specified value (see Table "Operating Range" Page Reset; output SBC; "low active"; input Controller
RESET
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Definitions Functions Symbol SUPPLY P0.3 P0.4 P0.5 Function Bus; Line interface, according 9141 specification Supply Output; e.g. Hall Sensor; controlled Side Switch Output; controlled Side Switch Output; controlled General Purpose with Functionality (alternate function: SCK, XC866 data sheet) General Purpose with Capture Functionality (alternate function: MTSR, XC866 data sheet) General Purpose with Functionality (alternate function: MRST EXINT0 ,see XC866 data sheet) Voltage Regulator Output Controller Core (2.5 connection block capacitor GND; used external loads Test Mode Select (JTAG) General Purpose I/O; XC866 data sheet (alternate function: JTAG Clock Input) General Purpose I/O; XC866 data sheet (alternate function: JTAG Serial Data Output; RxD1) General Purpose I/O; XC866 data sheet (alternate function: JTAG Serial Data Input; TxD1) General Purpose Input (digital/analog) with Capture Functionality; e.g. Hall Sensor (alternate function: EXINT1) General Purpose Input (digital/analog) with Capture Functionality; e.g. Hall Sensor (alternate function: EXINT2) Voltage Supply Input Controller I/Os connected with Transceiver Data Output; according 9141 specification 2.0; dominant state; connected General Purpose Input P1.0 Transceiver Data Input; according 9141 specification 2.0; internal pull-up; connected General Purpose Input P1.1 Data Input; receives serial data from control device; serial data transmitted 16-bit control word with Least Significant (LSB) transferred first: input pull-down requires CMOS logic level inputs; will accept data falling edge CLK-signal; connected General Purpose Input P1.3 Data Output; this tri-state output transfers diagnosis data control device; output will remain high-impedance state unless device selected Chip-Select-Not (CSN); connected General Purpose Input P1.4 (EXTINT0_1) Clock Input; clock input shift register; internal pull-down requires CMOS logic level inputs; connected General Purpose Input P1.2 Chip Select Input; active input; serial communication enabled pulling terminal low; input should only transitioned when low; internal pull-up requires CMOS logic level inputs; connected General Purpose Input P1.5 Voltage Reference
VDDC
P0.0 [TCK_0] P0.2 [TDO_0] P0.1 [TDI_0] P2.0 P2.1
VDDP
VAREF
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Definitions Functions Symbol Function Measurement Output (analog); chip temperature battery voltage measurement Error Pin; bi-directional signal; internal pull-up; low-active; connected General Purpose Input P3.6 (RSTOUT) Ground; including Ground; corresponding VDDC Ground; VAGND (ADC) corresponding VDDP Ground; VAGND (ADC); also Measurement Interface
SUPPLY
VDDP
P2.1
P2.0
VBAT_
SENSE
P0.1 [TDI_0]
VAREF MON1 MON3
AREF P2.7 P1.1 P1.0 P1.5 P1.2 P1.3 P1.4 P3.6
P0.2 [TDO_0]
MON2
P0.0 [TCK_0]
8-Bit
MON4
MON5 HS_LED
P0.5
RESET
P0.3
P0.4
Figure
Pinout Module Interconnects
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Operating Modes
Operating Modes
TLE7809G incorporates several operating modes, that listed Table Table Operating Modes Standby Mode OFF3)
Functional Block
Active Mode Stop Mode SPI-controlled SPI-controlled SPI-controlled SPI-controlled
1)2)
Sleep Mode ON2) OFF3)
VCC,
Window Watchdog Monitoring wake-up pins LS1,LS2 -switch Supply Output HS-LED 16-bit wake-up message Transmit Receive Measurement VAREF Voltage Monitoring VBAT
OFF3)
Active wake-up interrupt SPI-controlled (2.5V)
Active wake-up Active wake-up interrupt interrupt
"off" when voltage-regulator output current below "watchdog disable current threshold" default "off" Stop Sleep Mode; active order generate period wake-ups OFF" state inherited from previous operating mode ("OFF" after RESET)
System-Basis-Chip (SBC) offers several operation modes that controlled three mode select bits MS0, within SPI: Active, Sleep Stop mode, well Receive-Only mode. overview operating modes operating mode transitions indicated Figure below. Note: possible directly change from Stand-By Stop Sleep mode, however this might result higher current consumption (~200µA). higher current consumption will occur case power case wake-up from Stop Sleep mode. avoid this conditions recommended prior Active mode before changing Stop Sleep mode.
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Operating Modes
Start Power
Stand-By
Stop Mode
Sleep Mode
Active Mode
Receive-Only
Active Mode: ,,LIN Sleep" wake-up after reset
Figure
State Diagram "SBC Operation Modes"
Standby Mode
After powering-up wake-up from power-saving, automatically starts-up Standby Mode, waiting microcontroller finish startup initialization sequences. However, this mode cannot selected command. From this transition mode switched command into desired operating mode. modes selected bits certain operation conditions, e.g. external wake-up events.
Active Mode
Active Mode used transmit receive messages provides sub-mode "LIN Sleep". Data Sheet Rev. 3.01, 2008-04-15
TLE7809G
Operating Modes
Active Mode "LIN Sleep"
Active Mode "LIN Sleep" SBC's current consumption reduced disabling transceiver. This also means that internal pull-up resistor transceiver turned Active Mode "LIN Sleep". During this mode transceiver remains wake-up capability order react remote frame wake-up pulse (specified Specification V2.0) from master node other slave nodes. case wakeup event message (internal) pulled "low" "bus wake-up bit" within status word set. However, transceiver needs activated switching "SBC Active Mode".
Receive-Only Mode ("LIN RxD-Only")
Receive-Only Mode ("LIN RxD-Only") designed special test procedure check connections. Figure shows network consisting nodes. Node master node, others slave nodes. connection between node node shall tested, nodes switched into Receive-Only Mode. Node node Active Mode. node sends message ("remote frame"), node only node which physically able reply remote frame. other nodes have their outputs drivers disabled. main difference between Active Mode Receive-Only Mode that transmit stage automatically turned-off Receive-Only-Mode. However, receiver still active both modes.
Figure
Network Diagram "LIN Receive-Only Mode"
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Operating Modes
4.5.1
Power Saving Modes Sleep Mode
During Sleep Mode (see Figure lowest power consumption achieved, having main voltage regulator switched-off. microcontroller cannot supplied, integrated window watchdog disabled Sleep Mode dedicated control bit. However, turned-on periodically waking-up system, e.g. ECU, generating reset automatically switching Standby Mode. This mode entered command, turns-off integrated transceiver, main voltage regulator well switches. Upon voltage level change monitoring wake-up pins message Sleep Mode will terminated Standby Mode will automatically entered (turning-on LDO). Note: Upon wake-up message (internal) signal stays "low" until mode switch. Note: Window Watchdog enabled Sleep Mode Window Watchdog starts after wake-up with "long open window" Standby Mode. Note: Sleep Mode with activated watchdog (see Table "SPI Input Data Bits" Page oscillator remains turned
Active Mode
Standby Mode
Start Power
,,single" µController -Command: select Sleep Mode Mode Bits window watchdog activation deactivation [can remain active periodic reset timer
transition caused event MONx inputs message [SPI indicates source]
Sleep Mode
Figure
State Diagram "SBC Sleep Mode"
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Operating Modes
4.5.2
Stop Mode
Stop Mode advantage reducing current consumption minimum, while supplying microcontroller with quiescent current during power saving mode ("Stop"). This mode entered command, turns-off integrated transceivers respective termination, voltage regulator microcontroller supply remains active. microcontroller power saving mode advantage over turned-off microcontroller have reduced reaction time upon wake-up event. voltage level change monitoring/wake-up pins will, contrast behavior Sleep Mode, generate signal that indicates wake-up event microcontroller Power-Down Mode. This realized interconnect from [DO] microcontroller [P1.4]. case wake-up event message, respective Data [DO] will pulled "low". pulled "low" until mode switch, while stays "low" internal cycles. (The microcontroller itself take care switching modes after wake-up event notification (see Figure 7).) Note: window watchdog automatically disabled once output current goes below specified "watchdog current threshold", unless setting On/Off" prevents this (see Figure Watchdog disable current threshold, Table "Window Watchdog Reset Period Settings" Page 22). Note: Window Watchdog enabled Stop Mode Window Watchdog starts after wake-up with "long open window" Standby Mode.
Active Mode
Standby Mode
Start Power
,,single" µController -Command select Stop Mode Mode Bits window watchdog activation deactivation [,,off" once current consumption below threshold
transition caused event MONx inputs message [SPI indicates source]
wake event notification µC]: msg. (,,low") MONx (,,low") Stop Mode
Figure
State Diagram "SBC Stop Mode"
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Operating Modes
4.5.3
Stop Mode with Cyclic Wake
Stop Mode advantage reducing current consumption minimum, while supplying microcontroller with quiescent current during power saving mode ("Stop"). This mode entered command, turns-off integrated transceiver, voltage regulator remains active. periodically generates wake-up "low" pulse ("interconnect signal") that connected interrupt input [P1.4] microcontroller. This period defined "cyclic wake period" field within register. This pulse length internal cycles. case detected wake-up event message MONx pins, stays "low" until first valid command. Note: window watchdog automatically disabled once output current goes below specified "watchdog current threshold", unless setting On/Off" prevents this (see Figure 10). Note: wake-up event message MONx inputs happen independently cyclic wake phase. Note: Window Watchdog starts with "long open window" after mode switch, e.g. Active Mode.
Active Mode
Standby Mode
Start Power
,,single" µController -Command: select ,,cyclic wake timing" Timing Bits select Stop Mode Mode Bits window watchdog activation deactivation [,,off" once current consumption below threshold
select operating mode
transition caused event MONx inputs: ,,low" message ,,low" [SPI indicates source] cyclic wake-up
STOP: Cyclic Wake
wake-up inputs
NOTES:
window watchdog activated automatically once current threshold exceeded
wake-up MONx inputs message independent cyclic wake phase (,,asynchronous"
Figure
State Diagram "SBC Stop Mode with Cyclic Wake"
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Transceiver
Transceiver
TLE7809G offers transceiver, which compatible ISO9141 certified according Specification "Physical Layer". transceiver pull-up resistor implemented protected against short battery short GND. transceiver implemented wake-up capability during operation power saving modes. Stop Mode wake-up event indicated (internal) signals, that pulled "low". Sleep Mode wake-up event causes automatic transition into Standby Mode (internal) signals pulled "low". input pulled longer than dominant timeout input ignored goes back recessive state. This fail-safe feature case permanent signal recovers high dominant timeout recovery time. automotive applications United States dedicated mode name "Low Slope Mode" used. This mode reduces maximum data transmission rate kBaud 10.4 kBaud switching different slew rate. using this mode noise emission reduced.
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Measurement Interface
Measurement Interface
measurement interface comprises battery measurement unit (high voltage input Vbat_sense) onchip temperature sensor. multiplexer used select desired input channel that connected This multiplexer controlled interface. Also, reference voltage VAREF provided SBC. Vbat_sense input must protected against voltage transients, like pulses resistor series terminal
VAREF On-Chip Temperature Sensor
VBAT_SENSE
Voltage Attenuator
Driver Amplifier
P2.7
AGND Mode Selection
Figure
Simplified Block Diagram Measurement Interface
Voltage Measurement
input voltage filtered scaled down input voltage range converter. voltage measurement output code calculated using following equation, where VSENS voltage VBAT_SENSE resolution ADC:
SENS VSENS round SENS AREF
input voltage corresponding output code CVSENS calculated with following equation: AREF SENS
VSENS
6.1.1
Voltage Measurement Calibration Concept
Best measurement accuracy obtained applying calibration function:
VSENSCAL round VSENS
CVSENS represents output code analog input voltage VBAT_SENSE. correction
coefficients correct slope variations offset errors measurement transfer function. During production test these calibration figures calculated stored flash memory microcontroller. Data Sheet Rev. 3.01, 2008-04-15
TLE7809G
Measurement Interface Further details implementation calibration function location calibration figures Flash memory found dedicated application note. voltage measurement target parameters found "ADC Battery Voltage Measurement Interface, VBAT_SENSE" Page
Temperature Measurement
temperature measurement mode typical internal analog output voltage on-chip temperature sensor described with first order approximation:
Where:
junction temperature Kelvin moand typical linear fitting parameters (see Table "ADC Temperature Measurement Interface" Page
output code given following equation, where VAREF denote reference voltage resolution ADC:
round AREF AREF
junction temperature corresponding output code given
AREF
273.15 need subtracted convert into Centigrade Scale [°C].
[unit:
temperature measurement target parameters found in"ADC Temperature Measurement Interface" Page
6.2.1
Temperature Measurement Calibration Concept
Best measurement accuracy obtained applying calibration function:
calibration coefficients computed during production test stored flash memory microcontroller. selection between battery voltage temperature measurement done (see "SPI (Serial Peripheral Interface)" Page 19). Further details implementation calibration function location calibration figures found dedicated application note.
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Dropout Voltage Regulator
Dropout Voltage Regulator
Drop-Out Voltage Regulator (LDO) mainly been integrated TLE7809G order supply integrated microcontroller several modules SBC. Note: intended used supply external loads. However, might used supply small external loads (see Table "Operating Range" Page 34). event short circuit condition pin, shutdown/reset TLE7809G occur overcurrent condition. This maximum output current external loads specified electrical characteristics. voltage regulator output protected against overload overtemperature. external reverse current protection required prevent output capacitor from being discharged negative transients voltage.
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
(Serial Peripheral Interface)
(Serial Peripheral Interface)
Control status information between exchanged digital interface, that called "serial peripheral interface" (SPI) side, "synchronous serial channel" (SSC) side. 16-bit wide Programming Input Word (see Table Table read data input (with "LSB first"), which synchronized with clock input supplied Diagnosis Output Word appears synchronously data output (see Table transmission cycle begins when chip selected Chip Select input ("low" active). After input returns from word that been read becomes control word. output switches tri-state status this point, thereby releasing other usage. state shifted into input register with every falling edge CLK. state shifted output register after every rising edge CLK. number received input clocks supervised modulo16 operation Input/Control Word discarded case mismatch. This error flagged "high" data output (interconnect P1.4) following output word before first rising edge clock received. Additionally logic level will "OR-ed" with logic level (P1.3). Note: After wake-up from low-power modes device needs Active Mode first before switches like LS1, LS2, Supply Output Driver turned with second command.
Input Data
Meas. On/Off
Vbat/ Vtemp* MON5 On/Off*
On/Off
Configuration Registers
MON4 On/Off* MON3 On/Off* MON2 On/Off* MON1 Off*
Configuration Select
Mode Selection Bits valid valid Active Sleep Active Sleep
Reset Reset 10.4k* Delay* Thres*
Reserved
HS-LED HS-LED Supply OV/UV Output On/Off On/Off disable /Off On/Off
Reserved
Cyclic Wake Timing* Position: Window Watchdog Timing Position: (Watchdog Trigger Register
Reserved
remains unchanged after Vcc-UV WD-RESET ,,1" command will ignored
valid Only Stop
Figure
16-Bit Input Data Control Word
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
(Serial Peripheral Interface)
Table
Input Data Bits Input Data Mode Selection (MS0) Mode Selection (MS1) Mode Selection (MS2) Configuration Selection (CS0) Configuration Selection (CS1) Configuration Register (meaning based "Configuration Selection Bits") Measurement Interface "on" "off" (setting only valid active mode, power saving modes Measurement interface turned off) Window Watchdog Stop/Sleep mode configuration "on" "off" (the configuration only valid Stop/Sleep mode, Active mode Window Watchdog always on); "on" before Stop Mode entered, watchdog remains active regardless "watchdog disable current threshold" Mode Selection Bits Mode Selection: Mode "reserved" used "reserved" used Active Mode: "LIN Sleep" Active Mode (LIN "on") Sleep (LIN VReg "off") "reserved" used Transceiver: Receive-Only Stop Mode (LIN "off")
Table Table
Configuration Selection Bits Configuration Selection General Configuration Integrated Switch Configuration Cyclic Wake Configuration Window Watchdog Configuration
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
(Serial Peripheral Interface)
Table Pos.
General Integrated Switch Configuration General Configuration1) Reset Threshold: "default" "SPI option" (see Table Reset Generator; RESET) Reset Delay: "default" "SPI option" (see Table Reset Generator; RESET) "Low Slope Mode" (10.4 kBaud) Integrated Switch Configuration2) Supply Output "on" "off" HS-LED "on" "off" HS-LED OV/UV disable "0": HS-LED will turned case Vbat OV/UV "1": HS-LED will turned case Vbat OV/UV "on" "off" "on" "off" "reserved" used "reserved" used "reserved" used "reserved" used
MON1 Input Activation MON2 Input Activation MON3 Input Activation MON4 Input Activation MON5 Input Activation Measurement: Vbat Vtemp ("0" Vbat; Vtemp)
enable, disable
Table Pos.
Cyclic Wake Window Watchdog Period Settings1)2) Cyclic Sense Wake Config. Cyclic Period (T0) Cyclic Period (T1) Cyclic Period (T2) Cyclic Period (T3) Cyclic Period (T4) "reserved" used "reserved" used "reserved" used "reserved" used Window Watchdog Config. Watchdog Period (T0) Watchdog Period (T1) Watchdog Period (T2) Watchdog Period (T3) Watchdog Period (T4) Watchdog Period (T5) (mandatory) "reserved" used "reserved" used
Cyclic wake window watchdog period settings Table "Cyclic Wake Period Settings (Stop Mode only)" Page
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
(Serial Peripheral Interface)
Table
Cyclic Wake Period Settings (Stop Mode only) Cyclic Wake Period Cyclic Wake "off"
Table Table Pos.
Window Watchdog Reset Period Settings Window Watchdog Reset Period "not valid selection" 1008
Output Data Output Data1) Output Data after Wake-up2)
Temperature Prewarning
HS-LED fail
Temperature Prewarning
HS-LED fail
VINT-Fail ("active low")
LS1/2 Window Watchdog Reset MON1 Logic Input Level MON2 Logic Input Level MON3 Logic Input Level MON4 Logic Input Level MON5 Logic Input Level "reserved" used Failure
VINT-Fail ("active low")
LS1/2 Window Watchdog Reset Wake-Up MON1 Wake-Up MON2 Wake-Up MON3 Wake-Up MON4 Wake-Up MON5 "reserved" used Wake-Up Msg. Cyclic Wake Period "low"4)
Vbat Range (UV)3) [only "SBC Active Mode"] Vbat Range (OV) [only "SBC Active Mode"]
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
(Serial Peripheral Interface) Table Pos. Output Data (cont'd) Output Data1) Supply Output Output Data after Wake-up2) Supply Output "low"
UV5) [only "SBC Active Mode"]
enable, disable, overcurrent, undervoltage, overtemperature (temp. shut-down) OFF, overcurrent, undervoltage, overtemperature (temp. shut-down) Becomes valid after start-up time voltage monitoring Voltage monitoring active Standby Mode This needs read twice indicate undervoltage condition (only ramping down bit15 "1")
Table Module
Diagnostic, Protection Safety Functions Function
Effect Reset; Table "Reset Behavior SBC" Page current limitation Reset, Table "Reset Behavior SBC" Page Reset, Table "Reset Behavior SBC" Page only disabled
Concept status latched until next read-out Condition occurs below operating range enabled VCC-current threshold
Window Watchdog Failure (VReg) OC2) voltage regulator condition related)
VCC-UV
current threshold (Stop Mode) OT3)
VCC-current threshold
enabled
VCC-shutdown, Reset soon automatically enabled with falls below reset threshold, thermal hysteresis
Table "Reset Behavior SBC" Page
prewarning internal supply [SBC] related) LS-Switches
status output (internal) Reset; register settings cleared; status output; Table "Reset Behavior SBC" Page LSx-shutdown; status output; signalization
status latched until next read-out
VINT-UV
re-activation command; status latched until next read-out
microcontroller error signalization (ERR) Supply Output
LSx-shutdown; "Error re-activation Interconnect (ERR)" Page command Supply-shutdown; status output re-activation command; status latched until next read-out
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
(Serial Peripheral Interface) Table Module HS-LED Diagnostic, Protection Safety Functions (cont'd) Function Effect HS-LED-shutdown; status output HS-LED-shutdown (optional), status output HS-LED-shutdown (optional), status output HS-LED-shutdown (optional), status output HS-LED-shutdown (optional), status output status output status output Concept re-activation command; status latched until next read-out re-activation command; status latched until next read-out re-activation command; status latched until next read-out status latched until next read-out status latched until next read-out status latched until next read-out
VBAT-UV
VBAT-OV
VBAT-Monitor VBAT_SENSE pin)
VBAT-UV VBAT-OV
VS-Monitor
VS-UV
LIN-Failure (OT, time-out) Wake-up
signalization interconnect (RxD "low") status output signalization interconnect "low") status output signalled interconnect "high" OR-ed with once active
MONx-Inputs
Wake-up Failure Indicator
(Window) Watchdog overcurrent detection overtemperature detection
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Reset Behavior Window Watchdog
Reset Behavior Window Watchdog
VINT-UV: reset upon undervoltage detection internal supply voltage VCC-UV: reset upon undervoltage detection supply voltage (VCC)
Watchdog: reset caused integrated window watchdog
provides three different resets:
Should internal supply voltage become lower than internal threshold VINT-Fail will reset order indicate undervoltage condition (VINT-UV). other settings also reset this condition. VINT-Fail feature also used give indication that system supply disconnected therefore pre-setting routine microcontroller started. When voltage falls below reset threshold voltage VRTx time duration longer than filter time reset output switched will released after programmable delay time (default setting PowerOn-Reset) when VRTx. This necessary defined start microcontroller when application switched after Power-On-Reset. soon undervoltage condition output voltage (VCC VRTx) appears, reset output switched again (VCC-UV). reset delay time shortened bit. Please refer Figure Table Reset Watchdog Timer Operating Mode LS-Switches Supply Output HS-LED Configuration Settings Reset Behavior
Affected Reset
VINT-UV
"low" long open window Standby "off" "off" "off" Reset ("all bits cleared")
VCC-UV Watchdog-Reset
"low" long open window Standby "off" "off" "off" Figure "16-Bit Input Data Control Word" Page
After above described delayed reset (LOW HIGH transition RESET pin) window watchdog circuit started opening long open window Standby Mode. long open window allows microcontroller initialization sequences then trigger watchdog SPI. Within long open window period watchdog trigger detected write access "window watchdog period field" within control word. trigger accepted when input becomes HIGH after transmission word. correct watchdog trigger results starting window watchdog opening closed window with width selected window watchdog period. This period, selected window watchdog timing field, programmable wide range. closed window followed open window with width selected period. microcontroller service watchdog periodically writing window watchdog timing field. This write access meet open window. correct watchdog service immediately results starting next closed window. Should trigger signal meet open window watchdog reset generated setting reset output low. Then watchdog again starts opening long open window. addition, "window watchdog reset flag" within monitor watchdog reset. fail safe reasons TLE7809G automatically switched Standby mode watchdog trigger failure occurs. This minimizes power consumption case permanent faulty microcontroller. This "window watchdog reset flag" will cleared access SPI. When entering power mode watchdog requested enabled bit. Stop Mode watchdog only turned once current consumption falls below "watchdog current threshold".
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Monitoring Wake-Up Inputs MON1 Wake-Up Event Signalling
Monitoring Wake-Up Inputs MON1 Wake-Up Event Signalling
addition wake-up from Stop Sleep Mode line also possible wake-up TLE7809G from power mode monitoring/wake-up inputs. These inputs sensitive transition voltage level, either from high vice versa. Monitoring available Active Mode indicates voltage level inputs status bits. positive negative voltage edge MONx Sleep Stop Mode results signalling wake-up event (via [DO] [P1.4] interconnect). After wake-up MONx first transmission diagnosis word Standby mode indicates wake-up source. Further status word transmissions show logic level monitoring input pins. Note: Immediately before switching TLE7809G into power saving mode activated MONx initialized with actual logic level detected MONx. case MONx deactivated neither used wake-up source used detect logic levels. However, there should minimum delay three times "CSN high time" (see Table "SPI Data Input Timing1)" Page between activation MONx entering power saving mode. monitoring input module consists input circuit with pull-up pull-down current sources define certain voltage level with open inputs filter function avoid wake-up events caused unwanted voltage transients module inputs. voltage level monitoring pins VMON_th VMONx pull-up current source becomes active, while VMONx VMON_th pull-down sink activated (see Figure guaranteeing stable levels monitoring/wake-up inputs. Below above these voltage ranges current minimized leakage current (see "Monitoring Inputs MONx" Page 37).
MONx
Figure
Monitoring Input Block Diagram
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Monitoring Wake-Up Inputs MON1 Wake-Up Event Signalling
IMON
VMONth_min Pull-down current
VMONth_max
VMON
Pull-up current
Figure
Monitoring Input Characteristics
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Side Switches
Side Switches
side switches have been designed drive relays, e.g. window lift applications. continuous output current dimensioned 300mA (each) maximum. Active Receive-Only mode side outputs switched off, respectively input bit. Protection against overcurrent, overtemperature overvoltage conditions integrated low-side drivers. case load current that exceeding overcurrent threshold both drivers switched-off after filter time. thermal protection circuit included well, switching-off drivers case overtemperature threshold reached. both cases diagnostic information updated accordingly interconnect pulled "low" internal cycle (see "SBC Oscillator" Page 36). drivers have re-activated command. overvoltage protection been implemented active clamping inductive loads preventing occurrence voltage peaks. Moreover switches automatically disabled when reset watchdog reset occurs. However, switches automatically switched case overvoltage condition, e.g. load dump. double-failure occurs same time causing overcurrent (OC) overtemperature (OT) condition, than turned order protect Note: case turned condition second turned automatically (bidirectional interconnect pulled "low"). also switched microcontroller pulling bi-directional interconnect "low" least internal cycle (see "SBC Oscillator" Page 36).
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Supply Output Hall Sensor Supply
Supply Output Hall Sensor Supply
SUPPLY Output intended used Hall Sensor supply. Active Receive-Only mode this output switched off, respectively input bit. Note: SUPPLY Output needs turned-off prior entering Stop Mode command will inherit state" from previous operation mode. case entering Sleep Mode turned-off automatically. This output provides output voltage limitation protected against overcurrent overtemperature. protection mechanisms low-sides switches also apply this high-side switch. case overcurrent shutdown supply output re-activated command. order prevent unintended shut-down overcurrent situation when capacitive load connected, specified blanking time after switching-on been implemented applied directly after activation this output.
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
High-Side Switch Driver (HS-LED)
High-Side Switch Driver (HS-LED)
high side output HS_LED intended driving LEDs small lamps. This function wake-up function MON5 input realized same (MON5/HS_LED). Active Receive-Only mode high side output switched off, respectively input (automatically "off" Stop Mode). high-side driver protected against overcurrent overtemperature. HS-LED automatically disabled case undervoltage (Vbat-UV) overvoltage condition (Vbat-OV) only re-activated command. This HS-LED OV/UV feature disabled (see Table "General Integrated Switch Configuration" Page 21).
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
General Purpose I/Os (GPIO)
General Purpose I/Os (GPIO)
pins P0.3 P0.4 P0.5 P2.0 P2.1 provide general purpose functionality, like Hall Sensor inputs, output capture. GPIOs P0.0, P0.1 P0.2 available user mode only (alternate JTAG functionality). further information dedicated XC866 User's Manual and/or Data Sheet.
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Error Interconnect (ERR)
Error Interconnect (ERR)
interconnect provides bi-directional error signalization. output (active low) immediately signals that side switch been shut down overcurrent overtemperature condition. signal pulled "low" microcontroller least internal cycle (see "SBC Oscillator" Page 36), side switches LS1/LS2 turned (see Table "Diagnostic, Protection Safety Functions" Page 23).
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
General Product Characteristics
16.1
Table
General Product Characteristics
Absolute Maximum Ratings
Absolute Maximum Ratings1)
+125 voltages with respect ground, positive current flowing into
(unless otherwise specified) Pos. Voltages 16.1.1 16.1.2 16.1.3 Supply voltage Regulator output voltage Input voltage MON1-4 Parameter Symbol Limit Values Min. Max. also pulses according 7637; external series resistor required MON5 input voltage limited driver functionality. required also pulses according 7637; external series resistor required limited output clamping voltage clamping energy EIA/JESD22-A114-B Unit Conditions
VMONx
-0.3 -0.3
16.1.4
Input voltage MON5/HS_LED VMON5 (output)
16.1.5
Input voltage VBAT_SENSE
VBATSENSE
16.1.6 16.1.7 16.1.8 16.1.9 16.1.10 16.1.11
Low-Side Switches SUPPLY Output
VLSx VSupply
-0.3 -0.3 -0.3 -0.3
VLSx_CL
Logic input voltages (TMS, TCK, TDI, CLKIN) Logic output voltage (TDO, RESET) line input voltages Electrostatic discharge voltage "HBM" LIN, MONx, VBAT_SENSE Electrostatic discharge voltage "HBM" VDDC Electrostatic discharge voltage "HBM" other Electrostatic discharge voltage "CDM"
VDRI,RD Vbus VESD
-600 -500 EIA/JESD22-A114-B
16.1.12 16.1.13 16.1.14
VESD VESD VESD
EIA/JESD22-A114-B
Charged device model; according Q100-011 Rev-B
Temperatures 16.1.15 16.1.16 Junction temperature Storage temperature
Tstg
subject production test, specified design.
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
General Product Characteristics Note: Stresses above ones listed here cause permanent damage device. Exposure absolute maximum rating conditions extended periods affect device reliability. Note: Integrated protection functions designed prevent destruction under fault conditions described data sheet. Fault conditions considered "outside" normal operating range. Protection functions designed continuous repetitive operation.
16.2
Table Pos. 16.2.1
Functional Range
Operating Range Parameter Supply voltage Symbol Limit Values Min. Max. load dump; jump start; 60s; (min) valid ramp-down Unit Conditions
16.2.2
Voltage range pins
VLSx
-0.3
load dump; 0.4s; withstand short circuit external loads kHz; parallel recommended min. time between commands; "high"
16.2.3 16.2.4 16.2.5 16.2.6
External output current ICC_ext Supply voltage slew rate Logic input voltage (TMS, TCK, TDI, CLKIN) Output capacitor connected dVS/dt
-0.5 -0.3
16.2.7 16.2.8 16.2.9
clock frequency Junction temperature Delay time operating mode change
fclk tchmode
16.3
Pos. 16.3.1 16.3.2
Thermal Resistance
Parameter Junction Soldering Point Junction Ambient1)
Symbol Min.
Limit Values Typ. Max.
Unit
Conditions measured 7,8,22
RthJSP RthJA
subject production test, specified design Specified RthJA value according Jedec JESD51-2,-7 natural convection 2s2p board; Product (Chip+Package) simulated 76.2 114.3 board with inner copper layers 70µm 35µm Cu).
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
General Product Characteristics
16.4
Table
Electrical Characteristics
Electrical Characteristics
13.5 +125 voltages with respect ground, positive current flowing into
(unless otherwise specified) Pos. Parameter Symbol Min. Current Consumption 16.4.1 Current Consumption IMCM_norm (MCM): IMCM_norm ISBC_AM IµC_NM Current Consumption (SBC): Active Mode Current Consumption (C): Normal Mode Quiescent Current (MCM): STOP Mode STOP Mode with "cyclic wake" STOP Mode without "cyclic wake" Power Down Mode Quiescent Current (MCM): STANDBY Power Down Mode STANDBY Mode STANDBY Mode Limit Values Typ. Max. Unit Conditions
SBC: active mode normal mode
16.4.2
ISBC_AM
data transmission; only SBC; switches "off" only IMCM ISBC
16.4.3 16.4.4 16.4.5 16.4.6 16.4.7 16.4.8 16.4.9 16.4.10 16.4.11
IµC_NM IMCM_Stop ISBC_Stop ISBC_Stop IµC_Stop IMCM_Stby
IMCM ISBC
Supply Output (Hall Supply) turned-off
IµC_PWR_DWN ISBC_Stby ISBC_Stby
Quiescent Current Supply Output (Hall Supply) turned-off; after wake-up/power-up
16.4.12
Quiescent Current (MCM): IMCM_Sleep Sleep Mode
IMCM ISBC IµC;
"turned-off"
Voltage Regulator; 16.4.13 Output voltage
Vpp; CVCC
16.4.14 16.4.15 16.4.16
Line regulation Load regulation Power supply ripple rejection1)
PSRR
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
General Product Characteristics Table Electrical Characteristics (cont'd)
13.5 +125 voltages with respect ground, positive current flowing into (unless otherwise specified)
Pos. 16.4.17 Parameter Output current limit Symbol Min. Limit Values Typ. Max. Unit Conditions
ICCmax
power transistor thermally monitored
16.4.18 16.4.19 16.4.20 16.4.21 16.4.22 16.4.23
Drop voltage
TjPW TjPW_hys TjSD TjSD_hys TjSD/TjPW
1.25
thermal prewarning
temperature
thermal prewarning
hysteresis
thermal shutdown
temperature
thermal shutdown
hysteresis
ratio
temp.
Under-/Overvoltage Detection Vbat_sense 16.4.24 Undervoltage Threshold "ramp-up" Undervoltage Threshold "ramp-down" Undervoltage Threshold hysteresis Overvoltage Threshold "ramp-up" Overvoltage Threshold "ramp-down" Overvoltage threshold hysteresis Undervoltage threshold "ramp-down" Undervoltage threshold hysteresis Internal cycling time
VUVT_Vbat
7.65
indicated within output word; Driver turned indicated within output word; Driver turned
16.4.25
VUVT_Vbat
7.25
7.65
16.4.26 16.4.27
VUVT_Vbat_hys VOVT_Vbat
17.6
18.5
19.4
indicated within output word; Driver turned indicated within output word; Driver turned
16.4.28
VOVT_Vbat
16.6
17.4
18.2
16.4.29
VOVT_Vbat_hys
Undervoltage Detection 16.4.30 16.4.31
VUVT_Vs VUVT_Vs_hys
indicated within output word
Oscillator 16.4.32
tCYL
internal oscillator
fOSC (typ.)
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
General Product Characteristics Table Electrical Characteristics (cont'd)
13.5 +125 voltages with respect ground, positive current flowing into (unless otherwise specified)
Pos. Parameter Symbol Min. Reset Generator; RESET 16.4.33 Reset threshold voltage (for condition indication) Reset threshold voltage hysteresis Reset output voltage Limit Values Typ. 4.65 3.15 Max. VCC, default setting VCC, option
Unit
Conditions
VRT1 VRT2 VRT1_hys VRT2_hys VRESET
16.4.34 16.4.35
IRESET VRTx; IRESET VRTx
16.4.36 16.4.37 16.4.38 16.4.39
Reset high output voltage VRESET Reset pull-up current Reset reaction time Reset delay time
-150
-500
IRESET tRD1 tRD2
VRESET
RESET "low" default setting; after Power-On-Reset setting option only Stop Mode
Watchdog Generator 16.4.40 16.4.41
Watchdog disable current IWDI,th
Long open window threshold
Monitoring Inputs MONx 16.4.42 Wake-up/monitoring threshold voltage
VMONth
modes; without serial resistor (with IPD/PU (drops linearly without serial resistor (with IPD/PU
16.4.43 16.4.44 16.4.45 16.4.46 16.4.47
Threshold hysteresis Wake-up/monitoring filter time Pull-up current Pull-down current Input leakage current (except MON5 alternative supply voltage functionality) Input leakage current MON5
VMONth,hys tMON IPU, MONx IPD, MONx ILK,I ILK,I ILK_MON5,I
16.4.48
VMON_th VMONx VMONx VMON_th VMONx VMONx VMON V;VS general: VMONx VMON5 VMON5
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
General Product Characteristics Table Electrical Characteristics (cont'd)
13.5 +125 voltages with respect ground, positive current flowing into (unless otherwise specified)
Pos. Parameter Symbol Min. Side Output 16.4.49 Static Drain-Source ON-Resistance Limit Values Typ. Max. Unit Conditions
RDSON
125°C;
25°C;
output "off"; current pulse: ILS1/2 condition during production test
16.4.50
Output clamping voltage
VLSx_CL
16.4.51 16.4.52 16.4.53 16.4.54
Leakage current Switch time Switch time Overcurrent shutdown threshold
IQLLSx tONLSx tOFFLSx ISDLSx
1000
VLSx
high resistive load high off; resistive load prevent shutdown overvoltage conditions higher limits have been chosen2) after continuos overcurrent detection tdSDLSx affected will shutdown overcurrent condition will indicated output word
16.4.55
Overcurrent shutdown filter time
tdSDLSx
16.4.56 16.4.57 16.4.58
LS1/2 thermal shutdown temp. LS1/2 thermal shutdown temp. hysteresis Output Clamping Energy pins Drop voltage VSupply Output voltage range
TjSD TjSD_hys
based 250.000 switching cycles
Supply Output (Hall Sensor Supply) 16.4.59 16.4.60
VDROP_Supply VSUPPLY
18.0
16.4.61 16.4.62 16.4.63 16.4.64
Leakage current Switch time Switch time Overcurrent shutdown threshold
IQL_SUPPLY tON_SUPPLY tOFF_SUPPLY ISD_SUPPLY
ISupply 13.5 27.0 27.0 40.0 VSupply
high SUPPLY high SUPPLY
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
General Product Characteristics Table Electrical Characteristics (cont'd)
13.5 +125 voltages with respect ground, positive current flowing into (unless otherwise specified)
Pos. 16.4.65 16.4.66 Parameter Switch overcurrent shutdown blanking time Shutdown filter time Symbol Min. Limit Values Typ. Max. overcurrent will indicated/shutdown will initiated after continuous detection overcurrent condition
Unit
Conditions
tblank_ON
_SUPPLY
tdSDHSUPPLY
16.4.67 16.4.68
Thermal shutdown temp. Thermal shutdown temp. hysteresis Static Drain-Source ON-Resistance
TjSD_SUPPLY TjSD
_SUPPLY_hys
Driver (HS-LED) 16.4.69
RDSONHS_LED
20.0
16.4.70 16.4.71 16.4.72 16.4.73 16.4.74
Leakage current Switch time Switch time Overcurrent shutdown threshold Overcurrent shutdown filter time
IHS_LED tONHS_LED tOFFHS_LED ISDHS_LED tdSDHS_LED
-120
125°C; IHS-LED 25°C; IHS-LED VHS_LED
high HS_LED high HS_LED overcurrent will indicated/shutdown will initiated after continuous detection overcurrent condition
16.4.75 16.4.76
Thermal shutdown temp. Thermal shutdown temp. hysteresis Receiver threshold voltage, recessive dominant edge Receiver dominant state Receiver threshold voltage, dominant recessive edge Receiver recessive state Receiver center voltage
TjSDHS_LED TjSDHS_hys
Receiver 16.4.77
Vbus,rd
0.42 0.48
0.42 (LIN Spec (2.0); Line 10.1.9 (3.1.9))
16.4.78 16.4.79
Vbusdom Vbus,dr
0.52 0.58
0.58
0.525
Vbus,rec Vbus
16.4.80 16.4.81
Vbusrec Vbuscent
0.475
(LIN Spec (2.0); Line 10.1.10 (3.1.10)) (LIN Spec (2.0); Line 10.1.11 (3.1.11))
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
General Product Characteristics Table Electrical Characteristics (cont'd)
13.5 +125 voltages with respect ground, positive current flowing into (unless otherwise specified)
Pos. 16.4.82 Parameter Receiver hysteresis Symbol Min. Limit Values Typ. Max. 0.02 0.04 Unit Conditions
Vbus,hys
Vbus,hys Vbus,rec Vbus,dom
(LIN Spec (2.0); Line 10.1.12 (3.1.12))
16.4.83 16.4.84
Wake-up threshold voltage filter time
Vwake tRxD_filter
0.85
Note: filter between signal
Transmitter 16.4.85 16.4.86 serial diode voltage drop dominant output voltage
Vserdiode Vbus,dom
VTxD high Level VTxD
(LIN Spec 1.3; Line 10.1.13)
(LIN Spec 1.3; Line 10.1.14)
16.4.87
dominant output voltage
Vbus,dom
VTxD
(LIN Spec 1.3; Line 10.1.15)
(LIN Spec 1.3; Line 10.1.16) Vbus,short
(LIN Spec (2.0); Line 10.1.4 (3.1.4))
16.4.88
short circuit current (current limitation) Leakage current
Ibus,sc
16.4.89
Ibus,lk
-500
-140
Vbus
(LIN Spec (2.0); Line 10.1.7 (3.1.7))
Vbus
(LIN Spec (2.0); Line 10.1.8 (3.1.8))
Vbus
(LIN Spec (2.0); Line 10.1.5 (3.1.5))
Vbus
(LIN Spec (2.0); Line 10.1.6 (3.1.6))
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
General Product Characteristics Table Electrical Characteristics (cont'd)
13.5 +125 voltages with respect ground, positive current flowing into (unless otherwise specified)
Pos. 16.4.90 Parameter pull-up resistance Symbol Min. Limit Values Typ. Max. Active/Standby Mode (LIN Spec (2.0); Line 10.2.2 (3.2.2)) Sleep mode; Vbus Vbus 40%; Cbus) 13.5 Active Mode (LIN Spec 1.3; Line 10.3.1) Vbus 60%; Cbus) 13.5 Active Mode (LIN Spec 1.3; Line 10.3.1) Unit Conditions
Rbus
16.4.91 16.4.92
output current Slew rate falling edge
Ilin Sfslope
Dynamic Transceiver Characteristics3)
16.4.93
Slew rate rising edge
Srslope
16.4.94
Slope symmetry
tslopesym
tfslope trslope; 13.5
(LIN Spec 1.3; Line 10.3.3)
16.4.95 16.4.96 16.4.97
Propagation delay Propagation delay HIGH Propagation delay dominant Propagation delay recessive HIGH Receiver delay symmetry
td(L),T td(H),T td(L),R
(LIN Spec 1.3; Line 10.3.6) (LIN Spec 1.3; Line 10.3.6)
CRxD RRxD
(LIN Spec 1.3; Line 10.3.7)
16.4.98
td(H),R
CRxD RRxD
(LIN Spec 1.3; Line 10.3.7)
16.4.99
tsym,R
tsym,R td(L),R td(H),R
(LIN Spec 1.3; Line 10.3.8)
16.4.100 Transmitter delay symmetry 16.4.101 Wake-up delay time 16.4.102 dominant time 16.4.103 dominant time recovery time Data Sheet
tsym,T
tsym,T td(L),T td(H),T
(LIN Spec 1.3; Line 10.3.9)
twake ttimeout ttorec
VTxD VTxD
Rev. 3.01, 2008-04-15
TLE7809G
General Product Characteristics Table Electrical Characteristics (cont'd)
13.5 +125 voltages with respect ground, positive current flowing into (unless otherwise specified)
Pos. Parameter Symbol Min. Transfer Rate kbit/s; Cbus 16.4.104 Duty cycle 0.396 duty cycle THRec(max) 0.744 THDom(max) 0.581 tbit tbus_rec(min) tbit; (LIN Spec 2.0; Line 3.3.1) duty cycle THRec(min) 0.422 THDom(min) 0.284 tbit tbus_rec(max) tbit; (LIN Spec 2.0; Line 3.3.2) duty cycle THRec(max) 0.778 THDom(max) 0.616 tbit tbus_rec(min) tbit; (LIN Spec 2.0; Line 3.4.1) duty cycle THRec(min) 0.389 THDom(min) 0.251 tbit tbus_rec(max) tbit; (LIN Spec 2.0; Line 3.4.2) Rev. 3.01, 2008-04-15 Limit Values Typ. Max. Unit Conditions
16.4.105 Duty cycle
0.581
Transfer Rate 10.4 kbit/s; Cbus 16.4.106 Duty cycle 0.417
16.4.107 Duty cycle
0.590
Data Input Timing1) 16.4.108 Clock period 16.4.109 16.4.110 16.4.111 16.4.112 16.4.113 16.4.114 16.4.115
tpCLK Clock high time tCLKH Clock time tCLKL Clock before tbef setup time tlead setup time tlag Clock after high tbeh setup time tDISU
Data Sheet
TLE7809G
General Product Characteristics Table Electrical Characteristics (cont'd)
13.5 +125 voltages with respect ground, positive current flowing into (unless otherwise specified)
Pos. Parameter Symbol Min. Limit Values Typ. Max. Unit Conditions
tDIHO 16.4.117 Input signal rise time trIN
16.4.116 hold time 16.4.118 Input signal fall time tfIN 16.4.119 Delay time mode tfIN change from Normal Mode Sleep Mode 16.4.120 high time Data Output Timing
tCSN(high) trDO tfDO tENDO tDISDO VAREF Vbat_fs Rbat_sense
2.45 19.2 -0.5 -300
2.55 20.8
16.4.121 rise time 16.4.122 fall time 16.4.123 enable time 16.4.124 disable time 16.4.125 reference voltage 16.4.126 Max. measurement input voltage (full scale) 16.4.127 Measurement input impedance 16.4.128 Vbat_sense input filter bandwidth 16.4.129 Measurement input leakage current 16.4.130 Measurement accuracy after Controller-based calibration 16.4.131 Settling time
impedance high impedance
Measurement Interface (general) interconnect Battery Voltage Measurement Interface, VBAT_SENSE measurement
Ibat_sense
measurement off;
Vbat_sense 13.5 Vbat_sense Vbat_fs;
Tset
high settled output voltage
Temperature Measurement Interface 16.4.132 Temp. Measurement Range 16.4.133 Temp. sensor offset voltage 16.4.134 Temp. coefficient
3.82 5.94
mV/K
on-chip sensor
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Timing Diagrams Table Electrical Characteristics (cont'd)
13.5 +125 voltages with respect ground, positive current flowing into (unless otherwise specified)
Pos. Parameter Symbol Min. 16.4.135 Measurement accuracy after Controller-based calibration 16.4.136 Settling time Limit Values Typ. Max. 125°C Unit Conditions
Tset
after measurement mode change; "high" settled output voltage interconnect
subject production test, specified design. normal operation continuous current should exceed 300mA (for each low-side LS2) Production testing kbit/s mode
Tested wafer level only.
Timing Diagrams
high low: enabled. Status information transferred output shift register time high: data from shift register transferred output functions time Actual data will accept data falling edge signal Previous status will change state rising edge signal e.g. switch data Actual data time data time
Actual status time
Figure
SPI-Data Transfer Timing
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Timing Diagrams
Figure
SPI-Input Timing
tCWmax tCWmin
closed window
tOWmax tOWmin
open window
safe trigger area
[tWDPER]
Figure
Watchdog Time-Out Definitions
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Timing Diagrams
Trigger
+tOW
Reset
Watchdog timer reset
normal operation timeout (too long) normal operation timeout (too short) normal operation
Figure
Watchdog Timing Diagram
VRTx
Trigger
tRD1
tRDx
Reset
tRDx
Watchdog timer reset
start normal operation undervoltage start
Figure
Reset Timing Diagram
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Timing Diagrams
VTxD
td(L),T d(H),T
Vbus
Vbus,rd
Vbus,dr
td(L),R
d(H),R
VRxD
0.3*VCC d(L),TR td(H),TR
0.7*VCC
Figure
Dynamic Characteristics Timing Diagram
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Application Information
18.1
Application Information
Application Diagram
Note: following information given hint implementation device only shall regarded description warranty certain functionality, condition quality device
VBAT_SENSE
10uF
MON1 MON2 MON3 MON4
VBAT
MON5/HS_LED
220nF
TLE7809G
VDDC
100nF
Logic Level e.g. IPD15No6S2L-64
VDDP
SUPPLY
Double Hall Sensor e.g. TLE4966 Speed Direction
CCPOS0 CCPOS1
Figure
Application Diagram
Note: This very simplified example application circuit. function must verified real application. Note: inverse-polarity protection protection against pulses diode 10µF capacitor required.
18.2
Hints Unused Pins
SUPPLY: connect MON1/2/3/4: connect leave open MON5/HS-LED, LIN: leave open
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Application Information
18.3
Flash Program Mode LIN-Fast-Mode
flash programming transmission rate integrated transceiver changed maximum kBaud command. dedicated BROM routine XC866 takes care periodically servicing watchdog during this LIN-Fast-Mode. Further details available XC866 User's Manual.
Input Data
FLASH mode FLASH mode
Figure
Flash mode command
18.4
Thermal Resistance
RthJA) Junction temperature [°C] Ambient temperature [°C] Total chip power dissipation PINT Chip internal power dissipation Power dissipation caused currents RthJA Package thermal resistance [K/W]; junction-ambient
total power dissipation calculated from:
PINT
Data Sheet
Rev. 3.01, 2008-04-15
TLE7809G
Package Outlines
Package Outlines
-0.1
2.65 MAX.
0.35
2.45 -0.2
1.27 0.35 +0.15
+0.8 10.3 ±0.3
Index Marking
18.1 -0.4
Does include plastic metal protrusion 0.15 max. side Does include dambar protrusion 0.05 max. side
MAX.
-0.2
0.23 +0.09
GPS05123
Figure
PG-DSO-28-21 (Plastic Dual Small Outline Package)
Green Product (RoHS compliant) meet world-wide customer requirements environmentally friendly products compliant with government regulations device available green product. Green products RoHS-Compliant (i.e Pb-free finish leads suitable Pb-free soldering according IPC/JEDEC J-STD-020).
further information alternative packages, please visit website: Data Sheet
Dimensions Rev. 3.01, 2008-04-15
TLE7809G
Revision History
Revision 3.01 3.00
Revision History
Date 2008-04-15 2008-04-04 Changes Chapter 16.3 Thermal Resistance corrected RthJSP (16.3.1) Initial datasheet version
Data Sheet
Rev. 3.01, 2008-04-15
Edition 2008-04-15 Published Infineon Technologies 81726 Munich, Germany 2008 Infineon Technologies Rights Reserved. Legal Disclaimer information given this document shall event regarded guarantee conditions characteristics. With respect examples hints given herein, typical values stated herein and/or information regarding application device, Infineon Technologies hereby disclaims warranties liabilities kind, including without limitation, warranties non-infringement intellectual property rights third party. Information further information technology, delivery terms conditions prices, please contact nearest Infineon Technologies Office (www.infineon.com). Warnings technical requirements, components contain dangerous substances. information types question, please contact nearest Infineon Technologies Office. Infineon Technologies components used life-support devices systems only with express written approval Infineon Technologies, failure such components reasonably expected cause failure that life-support device system affect safety effectiveness that device system. Life support devices systems intended implanted human body support and/or maintain sustain and/or protect human life. they fail, reasonable assume that health user other persons endangered.

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