Current Leakage Cost Small Outline Surface Mount Package Configur
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MMBD4148
Current Leakage Cost Small Outline Surface Mount Package
Configuration View
350mW Volt Silicon Epitaxial Diode
SOT-23
Maximum Ratings
Operating Temperature: -55°C +150°C Storage Temperature: -55°C +150°C Maximum Thermal Resistance; 357K/W Junction Ambient
Electrical Characteristics 25°C Unless Otherwise Specified
Reverse Voltage Peak Reverse Voltage Average Rectified Current Power Dissipation Junction Temperature Peak Forward Surge Current Maximum Instantaneous Forward Voltage Maximum Reverse Current Rated Blocking Voltage Typical Junction Capacitance Reverse Recovery Time PTOT IFSM 100V 150mA 350mW 150°C t=1s,Non-Repetitive Resistive Load 50Hz
DIMENSIONS INCHES .110 .083 .047 .035 .070 .018 .0005 .035 .003 .015 2.80 2.10 1.20 1.78 .013 .085
.855V
10mA; 25°C* 25°C
.120 .098 .055 .041 .081 .024 .0039 .044 .007 .020
3.04 2.64 1.40 1.03 2.05 .100 1.12 .180
NOTE
25nA
Suggested Solder Layout
.031 .800 .035 .900 .079 2.000 inches
Measured 1.0MHz, VR=0V IF=10mA RL=100 *Pulse test: Pulse width µsec, Duty cycle
.037 .950 .037 .950
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MMBD4148
Figure Typical Forward Characteristics MilliAmps 25°C Volts Instantaneous Forward Current Amperesversus Instantaneous Forward Voltage Volts Single Phase, Half Wave 60Hz Resistive Inductive Load Admissable Power Dissipation MilliWattsversus Ambient Temperature Figure Forward Derating Curve
MilliWatts
Figure Junction Capacitance
Volts 1000 TJ=25°C
Junction Capacitance pFversus Reverse Voltage Volts
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MMBD4148
Figure Typical Reverse Characteristics 1000 NanoAmps Instantaneous Reverse Leakage Current NanoAmperes versus Junction Temperature TA=25°C Cycles Peak Forward Surge Current Amperesversus Number Cycles 60Hz Cycles MilliAmps Figure Peak Forward Surge Current 1200 1000
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