SP3243 Family Products Prepared Velvet Doung Greg West Date: 2006
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SP3243 Family Products
Prepared Velvet Doung Greg West Date: 2006
SP3243 Product Family Characterization Report
Table Contents
Section Introduction Characterization Procedure Data Summary Parameters Conclusions Data Histograms Page Appendix
Page 8/17/2006
SP3243 Product Family Characterization Report
Introduction: This product family characterization done part qualification Sipex's fabrication site transfer from Sipex's Hillview Milpitas, contract foundry, Episil, Taiwan. This characterization report summarizes data SP3243 product family characteristics contains distributions parameters. complete listing product numbers covered this characterization report included "Conclusion" section this report. Wafer Fab: Episil Location: Taiwan Process: Episil SC2- 1105 Assembly location: Carsem Characterization Procedure: Episil number(s): C30P44 Hillview number(s): 96890 Temperatures: Ambient (25C), 85C, -40C Tester: Test Program: SP3243ECH.AT
Page 8/17/2006
SP3243 Product Family Characterization Report Data Summary: Parameter Data Summary Across Temperature
Parameter 3.000: -1MA Vcc, 3.005:232 1.6MA Vcc, 7.000:232 VOH, LOAD Vcc, 6.000: Vcc, 6.003: Vcc, 4.000: Vcc, 4.001: Vcc, 4.002: Vcc, 4.003: Vcc, 4.004: Vcc, 17.004: SKEW Vcc, 17.006: SKEW Vcc, 17.008: SKEW Vcc,
Units Hillview Distribution Mean Hillview Distribution Variance Hillview (across temp) Episil Distribution Mean Episil Distribution Variance Episil (across temp)
2.577
11.449E-03 5.472 44.693E-03 212.550 207.095 0.1167 0.1178 0.1180 0.1184 0.1139 50.234 52.083 38.223
>4.0000 >4.0000 1.3074 >4.0000 >4.0000 >4.0000 >4.0000 >4.0000
2.594 257.773 5.208 -0.01682 0.01774 3.099 3.070 3.104 3.116 3.080 483.666 466.999 443.333
5.898E-03 5.427 39.081E-03 959.638 521.131 0.1434 0.1393 0.1381 0.1390 0.1359 180.067 147.465 29.046
>4.0000 >4.0000 1.7717 >4.0000 >4.0000 0.2304 0.1672 0.2513 0.2775 0.1970 0.0302 0.0746 0.6503
267.375
5.175
-0.01175
0.01791
4.474
4.464
4.465
4.462
>4.0000 >4.0000
4.465
427.878
435.757
407.878
Page 8/17/2006
SP3243 Product Family Characterization Report Conclusion: Characterization data over temperature range show datasheet parameters meet spec. Cpk's most parameters comparable between Hillview Episil although some show temperature dependence that tends produce lower Cpk's this analysis. performance SP3243 parts fabricated Episil comparable current SP3243 parts built from Hillview fab. This characterization report applies following SP3243 family product part numbers:
SP3243CR SP3243CR-L SP3243BCA SP3243BCA-L SP3243BCR SP3243BCR-L SP3243BCT SP3243BCT-L SP3243BCY SP3243BCY-L SP3243BEA SP3243BEA-L SP3243BER SP3243BER-L SP3243BET SP3243BET-L SP3243BEY SP3243BEY-L SP3243CA SP3243CA-L SP3243CT SP3243CT-L SP3243CY SP3243CY-L SP3243EA SP3243EA-L SP3243EBCA SP3243EBCA-L SP3243EBCR SP3243EBCR-L SP3243EBCT SP3243EBCT-L SP3243EBCY SP3243EBCY-L SP3243EBEA SP3243EBEA-L SP3243EBER SP3243EBER-L SP3243EBET SP3243EBET-L SP3243EBEY SP3243EBEY-L SP3243ECA SP3243ECA-L SP3243ECR SP3243ECR-L SP3243ECT SP3243ECT-L SP3243ECY SP3243ECY-L SP3243EEA SP3243EEA-L SP3243EER SP3243EER-L SP3243EET SP3243EET-L SP3243EEY SP3243EEY-L SP3243ER SP3243ER-L SP3243ET SP3243ET-L SP3243EY SP3243EY-L SP3243EHET SP3243EHET-L SP3243EHEY SP3243EHEY-L SP3243EHCA SP3243EHCA-L SP3243EHCR SP3243EHCR-L SP3243EHCT SP3243EHCT-L SP3243EHCY SP3243EHCY-L SP3243EHEA-L SP3243EHER SP3243EHER-L SP3243EUCA SP3243EUCA-L SP3243EUCR SP3243EUCR-L SP3243EUCT SP3243EUCT-L SP3243EUCY SP3243EUCY-L SP3243EUEA SP3243EUEA-L SP3243EUER SP3243EUER-L SP3243EUET SP3243EUET-L SP3243EUEY SP3243EUEY-L SP3243HCA SP3243HCA-L SP3243HCT-L SP3243HEA SP3243HEA-L SP3243HET-L SP3243UCA SP3243UCA-L SP3243UCR SP3243UCR-L SP3243UCT SP3243UCT-L SP3243UCY SP3243UCY-L SP3243UEA SP3243UEA-L SP3243UER SP3243UER-L SP3243UET SP3243UET-L SP3243UEY SP3243UEY-L
Page 8/17/2006
SP3243 Product Family Characterization Report
Appendix Characterization Data Histograms
Page 8/17/2006
This page intentionally left blank
3V,85oCHistogram: Test.Number=1.000, Test.Name=TI1 OPEN/SHORT
Section
2006, 11:32
Test.Number=1.000, Test.Name=TI1 OPEN/SHORT
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -624.231E-03 NOutsideSpec
-625.778E-03 -609.455E-03 -613.651E-03 3.527E-03 -615.019E-03 -603.070E-03
-1.8173 -610.708E-03 16.324E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=1.000, Test.Name=TI1 OPEN/SHORT
section1
Test.Number=1.000, Test.Name=TI1 OPEN/SHORT
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -641.527E-03
-640.312E-03 -609.868E-03 -617.998E-03 7.843E-03 -619.635E-03 -594.468E-03
-610.737E-03 30.443E-03
-1.5091
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=1.001, Test.Name=TI2 OPEN/SHORT
Section
2006, 11:32
Test.Number=1.001, Test.Name=TI2 OPEN/SHORT
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -624.603E-03 NOutsideSpec
-625.859E-03 -610.142E-03 -614.117E-03 3.495E-03 -615.706E-03 -603.630E-03
-1.7436 -610.790E-03 15.717E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=1.001, Test.Name=TI2 OPEN/SHORT
section1
Test.Number=1.001, Test.Name=TI2 OPEN/SHORT
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -641.714E-03
-640.312E-03 -609.868E-03 -617.990E-03 7.908E-03 -619.711E-03 -594.265E-03
-610.131E-03 30.443E-03
-1.4709
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=1.002, Test.Name=TI3 OPEN/SHORT
Section
2006, 11:32
Test.Number=1.002, Test.Name=TI3 OPEN/SHORT
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -624.615E-03 NOutsideSpec
-625.778E-03 -610.142E-03 -614.152E-03 3.487E-03 -614.637E-03 -603.690E-03
-1.7113 -610.973E-03 15.637E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=1.002, Test.Name=TI3 OPEN/SHORT
section1
Test.Number=1.002, Test.Name=TI3 OPEN/SHORT
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -641.489E-03
-640.312E-03 -608.505E-03 -617.855E-03 7.878E-03 -619.635E-03 -594.222E-03
-609.944E-03 31.807E-03
-1.4755
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=2.000, Test.Name=TX1 ROUT POWER VO=2V
Section
2006, 11:32
Test.Number=2.000, Test.Name=TX1 ROUT POWER VO=2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
553.279E03 1.718E06 955.750E03 340.385E03 676.950E03 1.977E06 -65.405E03 0.9357
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.7154 1.444E06 1.164E06
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=2.000, Test.Name=TX1 ROUT POWER VO=2V
section1
Test.Number=2.000, Test.Name=TX1 ROUT POWER VO=2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
382.114E03 1.715E06 590.385E03 226.548E03 487.877E03 1.270E06 -89.258E03 0.8682 4.0536
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
717.556E03 1.333E06 0.8682
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=2.001, Test.Name=TX2 ROUT POWER VO=2V
Section
2006, 11:32
Test.Number=2.001, Test.Name=TX2 ROUT POWER VO=2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
515.261E03 1.596E06 917.128E03 297.177E03 662.706E03 1.809E06 25.596E03 1.0284
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.8781 1.389E06 1.081E06
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=2.001, Test.Name=TX2 ROUT POWER VO=2V
section1
Test.Number=2.001, Test.Name=TX2 ROUT POWER VO=2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
364.540E03 848.079E03 549.738E03 118.944E03 467.725E03 906.570E03 192.906E03 1.5398 0.8627
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
711.119E03 483.540E03 1.5398
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=2.002, Test.Name=TX3 ROUT POWER VO=2V
Section
2006, 11:32
Test.Number=2.002, Test.Name=TX3 ROUT POWER VO=2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
534.496E03 1.630E06 960.714E03 302.275E03 733.719E03 1.868E06 53.890E03 1.0591
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.5557 1.424E06 1.095E06
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=2.002, Test.Name=TX3 ROUT POWER VO=2V
section1
Test.Number=2.002, Test.Name=TX3 ROUT POWER VO=2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
327.307E03 955.423E03 588.354E03 149.381E03 511.489E03 1.036E06 140.211E03 1.3122 0.7753
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
821.705E03 628.116E03 1.3122
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=2.003, Test.Name=TX1 ROUT POWER VO=-2V
Section
2006, 11:32
Test.Number=2.003, Test.Name=TX1 ROUT POWER VO=-2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
434.270E03 3.231E06 933.808E03 527.474E03 668.335E03 2.516E06 -648.613E03 0.5899
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
3.1278 1.463E06 2.797E06
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=2.003, Test.Name=TX1 ROUT POWER VO=-2V
section1
Test.Number=2.003, Test.Name=TX1 ROUT POWER VO=-2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
364.540E03 1.030E06 582.788E03 186.664E03 458.258E03 1.143E06 22.797E03 1.0402 1.1069
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
906.264E03 665.365E03 1.0402
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=2.004, Test.Name=TX2 ROUT POWER VO=-2V
Section
2006, 11:32
Test.Number=2.004, Test.Name=TX2 ROUT POWER VO=-2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
488.103E03 3.596E06 975.650E03 630.795E03 657.183E03 2.868E06 -916.736E03 0.5154
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.8532 1.705E06 3.108E06
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=2.004, Test.Name=TX2 ROUT POWER VO=-2V
section1
Test.Number=2.004, Test.Name=TX2 ROUT POWER VO=-2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
356.344E03 1.311E06 557.372E03 197.079E03 425.081E03 1.149E06 -33.865E03 0.9422 2.1270
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
809.120E03 954.647E03 0.9422
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=2.005, Test.Name=TX3 ROUT POWER VO=-2V
Section
2006, 11:32
Test.Number=2.005, Test.Name=TX3 ROUT POWER VO=-2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
522.094E03 2.510E06 959.510E03 492.341E03 577.622E03 2.437E06 -517.511E03 0.6494
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.4885 1.648E06 1.988E06
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=2.005, Test.Name=TX3 ROUT POWER VO=-2V
section1
Test.Number=2.005, Test.Name=TX3 ROUT POWER VO=-2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
360.395E03 1.202E06 639.932E03 216.986E03 469.108E03 1.291E06 -11.025E03 0.9826 0.8536
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
949.695E03 841.279E03 0.9826
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=3.000, Test.Name=232 -1MA
Section
2006, 11:32
Test.Number=3.000, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
2.583 2.610 2.594 5.898E-03 2.589 2.612 2.576 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.4968 2.601 26.310E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=3.000, Test.Name=232 -1MA
section1
Test.Number=3.000, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
2.532 2.600 2.577 11.449E-03 2.570 2.611 2.542 >4.0000 -1.6842
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.586 67.760E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=3.001, Test.Name=232 -1MA
Section
2006, 11:32
Test.Number=3.001, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
2.577 2.607 2.592 6.293E-03 2.587 2.611 2.573 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.0676 2.599 29.881E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=3.001, Test.Name=232 -1MA
section1
Test.Number=3.001, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
2.528 2.600 2.577 12.497E-03 2.572 2.615 2.540 >4.0000 -1.8151
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.588 71.819E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=3.002, Test.Name=232 -1MA
Section
2006, 11:32
Test.Number=3.002, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
2.578 2.602 2.590 6.529E-03 2.586 2.610 2.570 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.2126 2.599 23.921E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=3.002, Test.Name=232 -1MA
section1
Test.Number=3.002, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
2.527 2.601 2.579 12.090E-03 2.573 2.615 2.542 >4.0000 -2.3429
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.588 74.760E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=3.003, Test.Name=232 -1MA
Section
2006, 11:32
Test.Number=3.003, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
2.580 2.606 2.590 6.716E-03 2.584 2.610 2.570 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.4526 2.600 26.451E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=3.003, Test.Name=232 -1MA
section1
Test.Number=3.003, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
2.518 2.601 2.577 13.680E-03 2.570 2.618 2.536 >4.0000 -2.4214
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.587 83.307E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=3.004, Test.Name=232 -1MA
Section
2006, 11:32
Test.Number=3.004, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
2.575 2.604 2.587 7.410E-03 2.581 2.609 2.565 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.4710 2.599 29.132E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=3.004, Test.Name=232 -1MA
section1
Test.Number=3.004, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
2.506 2.601 2.576 15.155E-03 2.571 2.621 2.530 3.8681 -3.0541
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.587 94.939E-03 3.8681
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=3.005, Test.Name=232 1.6MA
Section
2006, 11:32
Test.Number=3.005, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
249.335E-03 271.325E-03 257.773E-03 5.427E-03 254.250E-03 274.055E-03 241.491E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.8414 266.441E-03 21.990E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=3.005, Test.Name=232 1.6MA
section1
Test.Number=3.005, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
256.599E-03 276.569E-03 267.375E-03 5.472E-03 263.781E-03 283.791E-03 250.959E-03 >4.0000 -0.0564
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
274.410E-03 19.970E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=3.006, Test.Name=232 1.6MA
Section
2006, 11:32
Test.Number=3.006, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
249.144E-03 268.111E-03 256.721E-03 4.762E-03 252.930E-03 271.006E-03 242.436E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.5955 263.189E-03 18.967E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=3.006, Test.Name=232 1.6MA
section1
Test.Number=3.006, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
257.912E-03 275.913E-03 267.590E-03 4.951E-03 264.185E-03 282.444E-03 252.736E-03 >4.0000 -0.0643
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
273.829E-03 18.000E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=3.007, Test.Name=232 1.6MA
Section
2006, 11:32
Test.Number=3.007, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
251.964E-03 271.465E-03 258.672E-03 4.604E-03 255.622E-03 272.486E-03 244.859E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.0582 265.298E-03 19.501E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=3.007, Test.Name=232 1.6MA
section1
Test.Number=3.007, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
259.028E-03 279.276E-03 269.751E-03 5.112E-03 265.372E-03 285.086E-03 254.416E-03 >4.0000 -0.0363
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
276.897E-03 20.248E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=3.008, Test.Name=232 1.6MA
Section
2006, 11:32
Test.Number=3.008, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
250.898E-03 272.647E-03 259.705E-03 5.122E-03 256.461E-03 275.071E-03 244.339E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.8601 266.384E-03 21.748E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=3.008, Test.Name=232 1.6MA
section1
Test.Number=3.008, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
259.811E-03 279.756E-03 270.257E-03 5.008E-03 266.306E-03 285.281E-03 255.232E-03 >4.0000 -0.0174
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
276.367E-03 19.945E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=3.009, Test.Name=232 1.6MA
Section
2006, 11:32
Test.Number=3.009, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
250.187E-03 272.405E-03 258.733E-03 5.493E-03 255.330E-03 275.211E-03 242.255E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.0533 267.299E-03 22.219E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=3.009, Test.Name=232 1.6MA
section1
Test.Number=3.009, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
260.076E-03 279.642E-03 269.816E-03 5.128E-03 265.839E-03 285.201E-03 254.431E-03 >4.0000 0.0240
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
276.481E-03 19.566E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=3.010, Test.Name=R2OUTB 1.6MA
Section
2006, 11:32
Test.Number=3.010, Test.Name=R2OUTB 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
246.247E-03 257.986E-03 251.076E-03 2.565E-03 249.246E-03 258.771E-03 243.381E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.3601 254.181E-03 11.740E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=3.010, Test.Name=R2OUTB 1.6MA
section1
Test.Number=3.010, Test.Name=R2OUTB 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
252.749E-03 271.779E-03 263.574E-03 5.072E-03 260.506E-03 278.791E-03 248.357E-03 >4.0000 -0.1359
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
270.453E-03 19.030E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=3.011, Test.Name=R2OUTB -1MA
Section
2006, 11:32
Test.Number=3.011, Test.Name=R2OUTB -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
2.572 2.606 2.590 8.714E-03 2.587 2.616 2.564 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.5384 2.601 34.607E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=3.011, Test.Name=R2OUTB -1MA
section1
Test.Number=3.011, Test.Name=R2OUTB -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
2.529 2.600 2.575 12.290E-03 2.569 2.612 2.539 >4.0000 -1.5630
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.586 70.417E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=4.000, Test.Name=232
Section
2006, 11:32
Test.Number=4.000, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
4.353E03 4.642E03 4.535E03 76.585 4.522E03 4.765E03 4.305E03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.0357 4.612E03 288.949
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=4.000, Test.Name=232
section1
Test.Number=4.000, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
4.736E03 5.016E03 4.889E03 80.116 4.831E03 5.129E03 4.648E03 >4.0000 0.0077
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
4.999E03 279.551 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=4.001, Test.Name=232
Section
2006, 11:32
Test.Number=4.001, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
4.338E03 4.632E03 4.527E03 77.212 4.512E03 4.759E03 4.296E03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.0846 4.604E03 294.375
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=4.001, Test.Name=232
section1
Test.Number=4.001, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
4.731E03 5.013E03 4.882E03 78.887 4.825E03 5.119E03 4.646E03 >4.0000 0.1066
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
4.991E03 281.656 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=4.002, Test.Name=232
Section
2006, 11:32
Test.Number=4.002, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
4.347E03 4.641E03 4.534E03 75.122 4.516E03 4.759E03 4.308E03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.1015 4.611E03 294.895
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=4.002, Test.Name=232
section1
Test.Number=4.002, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
4.729E03 5.017E03 4.882E03 81.339 4.826E03 5.126E03 4.638E03 >4.0000 0.1004
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
4.996E03 287.863 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=4.003, Test.Name=232
Section
2006, 11:32
Test.Number=4.003, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
4.326E03 4.641E03 4.535E03 76.840 4.504E03 4.765E03 4.304E03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.1405 4.607E03 314.914
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=4.003, Test.Name=232
section1
Test.Number=4.003, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
4.730E03 5.011E03 4.882E03 81.873 4.829E03 5.128E03 4.637E03 >4.0000 0.1044
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
5.004E03 280.578 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=4.004, Test.Name=232
Section
2006, 11:32
Test.Number=4.004, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
4.310E03 4.632E03 4.526E03 77.156 4.509E03 4.757E03 4.294E03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.1715 4.602E03 321.523
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=4.004, Test.Name=232
section1
Test.Number=4.004, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
4.740E03 5.025E03 4.883E03 78.411 4.831E03 5.119E03 4.648E03 >4.0000 0.1583
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
4.997E03 285.379 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=6.000, Test.Name=232
Section
2006, 11:32
Test.Number=6.000, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-18.154E-03 -14.146E-03 -16.820E-03 959.638E-06 -17.687E-03 -13.941E-03 -19.699E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.5636 -15.822E-03 4.008E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=6.000, Test.Name=232
section1
Test.Number=6.000, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-18.105E-03 -17.081E-03 -17.524E-03 212.550E-06 -17.645E-03 -16.886E-03 -18.162E-03 >4.0000 -0.5551
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-17.309E-03 1.024E-03 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=6.001, Test.Name=232
Section
2006, 11:32
Test.Number=6.001, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-37.907E-06 187.507E-09 -16.216E-06 9.440E-06 -21.250E-06 12.104E-06 -44.536E-06 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.5738 -5.916E-06 38.095E-06
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=6.001, Test.Name=232
section1
Test.Number=6.001, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-18.120E-03 -17.050E-03 -17.531E-03 213.672E-06 -17.649E-03 -16.890E-03 -18.172E-03 >4.0000 -0.4884
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-17.310E-03 1.070E-03 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=6.002, Test.Name=232
Section
2006, 11:32
Test.Number=6.002, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-18.158E-03 -14.126E-03 -16.838E-03 961.393E-06 -17.706E-03 -13.953E-03 -19.722E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.6188 -15.831E-03 4.032E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=6.002, Test.Name=232
section1
Test.Number=6.002, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-18.073E-03 -16.958E-03 -17.514E-03 220.009E-06 -17.638E-03 -16.854E-03 -18.174E-03 >4.0000 -0.2786
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-17.304E-03 1.116E-03 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=6.003, Test.Name=232
Section
2006, 11:32
Test.Number=6.003, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
16.096E-03 18.551E-03 17.744E-03 521.131E-06 17.394E-03 19.308E-03 16.181E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.8969 18.406E-03 2.455E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=6.003, Test.Name=232
section1
Test.Number=6.003, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
17.618E-03 18.445E-03 17.906E-03 207.095E-06 17.753E-03 18.528E-03 17.285E-03 >4.0000 0.7771
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
18.186E-03 827.242E-06 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=6.004, Test.Name=232
Section
2006, 11:32
Test.Number=6.004, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-31.059E-06 -2.789E-06 -13.885E-06 7.270E-06 -18.868E-06 7.926E-06 -35.697E-06 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.3397 -4.130E-06 28.270E-06
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=6.004, Test.Name=232
section1
Test.Number=6.004, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
17.636E-03 18.476E-03 17.929E-03 209.418E-06 17.759E-03 18.557E-03 17.301E-03 >4.0000 0.7833
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
18.220E-03 839.975E-06 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=6.005, Test.Name=232
Section
2006, 11:32
Test.Number=6.005, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
16.146E-03 18.617E-03 17.807E-03 531.071E-06 17.414E-03 19.401E-03 16.214E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.8624 18.484E-03 2.471E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=6.005, Test.Name=232
section1
Test.Number=6.005, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
17.682E-03 18.533E-03 17.969E-03 211.043E-06 17.800E-03 18.602E-03 17.336E-03 >4.0000 0.8048
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
18.257E-03 850.927E-06 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=8.003, Test.Name=TX1 LEAKAGE, VOUT=12V
Section
2006, 11:32
Test.Number=8.003, Test.Name=TX1 LEAKAGE, VOUT=12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -200.820E-09 NOutsideSpec
95.906E-09 568.518E-09 205.051E-09 135.290E-09 131.353E-09 610.923E-09
1.6756 462.817E-09 472.612E-09
1.9586
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=8.003, Test.Name=TX1 LEAKAGE, VOUT=12V
section1
Test.Number=8.003, Test.Name=TX1 LEAKAGE, VOUT=12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -127.633E-09 >4.0000
20.429E-09 451.769E-09 119.754E-09 82.462E-09 74.433E-09 367.141E-09
227.556E-09 431.340E-09 >4.0000 >4.0000 >4.0000
2.4118
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=8.004, Test.Name=TX2 LEAKAGE, VOUT=12V
Section
2006, 11:32
Test.Number=8.004, Test.Name=TX2 LEAKAGE, VOUT=12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -249.559E-09 NOutsideSpec
95.911E-09 559.884E-09 226.030E-09 158.530E-09 136.456E-09 701.619E-09
1.4051 536.168E-09 463.973E-09
1.6274
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=8.004, Test.Name=TX2 LEAKAGE, VOUT=12V
section1
Test.Number=8.004, Test.Name=TX2 LEAKAGE, VOUT=12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -121.721E-09 >4.0000
-17.216E-09 410.705E-09 119.519E-09 80.413E-09 70.526E-09 360.758E-09
209.928E-09 427.921E-09 >4.0000 >4.0000 >4.0000
1.6926
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=8.005, Test.Name=TX3 LEAKAGE, VOUT=12V
Section
2006, 11:32
Test.Number=8.005, Test.Name=TX3 LEAKAGE, VOUT=12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -299.487E-09 NOutsideSpec
129.492E-09 676.444E-09 254.216E-09 184.568E-09 151.290E-09 807.919E-09
1.5110 612.079E-09 546.952E-09
1.3469
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=8.005, Test.Name=TX3 LEAKAGE, VOUT=12V
section1
Test.Number=8.005, Test.Name=TX3 LEAKAGE, VOUT=12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -106.616E-09 >4.0000
23.022E-09 319.108E-09 114.553E-09 73.723E-09 66.130E-09 335.723E-09
232.147E-09 296.086E-09 >4.0000 >4.0000 >4.0000
1.2635
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.000, Test.Name=RX
Section
2006, 11:32
Test.Number=10.000, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.200 1.250 1.218 24.507E-03 1.200 1.292 1.145 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.5829 1.250 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.000, Test.Name=RX
section1
Test.Number=10.000, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.200 1.300 1.297 17.408E-03 1.300 1.349 1.245 >4.0000 -5.7446
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.300 100.000E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.001, Test.Name=RX
Section
2006, 11:32
Test.Number=10.001, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1000.000E-03 1.050 1.038 21.509E-03 1.050 1.103 973.806E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.3283 1.050 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.001, Test.Name=RX
section1
Test.Number=10.001, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
850.000E-03 1000.000E-03 968.181E-03 32.640E-03 950.000E-03 1.066 870.263E-03 3.7601 -1.2512
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1000.000E-03 150.000E-03 3.7601
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.002, Test.Name=RX HYSTERESIS
Section
2006, 11:32
Test.Number=10.002, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
150.001E-03 250.000E-03 180.001E-03 38.507E-03 150.001E-03 295.520E-03 64.481E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.8541 250.000E-03 100.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.002, Test.Name=RX HYSTERESIS
section1
Test.Number=10.002, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
300.001E-03 350.001E-03 328.788E-03 25.095E-03 300.001E-03 404.072E-03 253.505E-03 -0.3214
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
350.001E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.003, Test.Name=RX
Section
2006, 11:32
Test.Number=10.003, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.250 1.300 1.260 20.342E-03 1.250 1.321 1.199 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.5801 1.300 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.003, Test.Name=RX
section1
Test.Number=10.003, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.150 1.300 1.286 31.307E-03 1.300 1.380 1.192 >4.0000 -2.9904
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.300 150.001E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.004, Test.Name=RX
Section
2006, 11:32
Test.Number=10.004, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
950.000E-03 1000.000E-03 970.000E-03 24.914E-03 950.000E-03 1.045 895.259E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.4301 1000.000E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.004, Test.Name=RX
section1
Test.Number=10.004, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
850.000E-03 1000.000E-03 962.121E-03 30.696E-03 950.000E-03 1.054 870.033E-03 3.9324 -1.0411
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1000.000E-03 150.000E-03 3.9324
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.005, Test.Name=RX HYSTERESIS
Section
2006, 11:32
Test.Number=10.005, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
250.000E-03 350.001E-03 290.000E-03 33.218E-03 250.000E-03 389.655E-03 190.346E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.2419 350.001E-03 100.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.005, Test.Name=RX HYSTERESIS
section1
Test.Number=10.005, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
250.000E-03 350.001E-03 324.243E-03 28.288E-03 300.001E-03 409.106E-03 239.380E-03 -0.4885
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
350.001E-03 100.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.006, Test.Name=RX
Section
2006, 11:32
Test.Number=10.006, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.300 1.300 1.300 1.300 1.300 1.300
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.300
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.006, Test.Name=RX
section1
Test.Number=10.006, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.200 1.350 1.300 21.651E-03 1.300 1.365 1.235 >4.0000 -2.4584
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.300 150.001E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.007, Test.Name=RX
Section
2006, 11:32
Test.Number=10.007, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
950.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.007, Test.Name=RX
section1
Test.Number=10.007, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
850.000E-03 1000.000E-03 966.666E-03 32.275E-03 950.000E-03 1.063 869.842E-03 3.7869 -1.1819
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1000.000E-03 150.000E-03 3.7869
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.008, Test.Name=RX HYSTERESIS
Section
2006, 11:32
Test.Number=10.008, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
350.001E-03 350.001E-03 350.001E-03 350.001E-03 350.001E-03 350.001E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
350.001E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.008, Test.Name=RX HYSTERESIS
section1
Test.Number=10.008, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
300.001E-03 350.001E-03 333.334E-03 23.936E-03 300.001E-03 405.141E-03 261.527E-03 -0.7412
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
350.001E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.009, Test.Name=RX
Section
2006, 11:32
Test.Number=10.009, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.300 1.350 1.327 25.371E-03 1.300 1.403 1.251 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.1408 1.350 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.009, Test.Name=RX
section1
Test.Number=10.009, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.200 1.350 1.341 29.194E-03 1.350 1.428 1.253 >4.0000 -3.9862
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.350 150.001E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.010, Test.Name=RX
Section
2006, 11:32
Test.Number=10.010, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
950.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.010, Test.Name=RX
section1
Test.Number=10.010, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
850.000E-03 1000.000E-03 965.151E-03 31.832E-03 950.000E-03 1.061 869.656E-03 3.8238 -1.1228
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1000.000E-03 150.000E-03 3.8238
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.011, Test.Name=RX HYSTERESIS
Section
2006, 11:32
Test.Number=10.011, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
350.001E-03 400.001E-03 376.667E-03 25.371E-03 350.001E-03 452.780E-03 300.555E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.1408 400.001E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.011, Test.Name=RX HYSTERESIS
section1
Test.Number=10.011, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
350.000E-03 400.001E-03 375.758E-03 25.376E-03 350.001E-03 451.886E-03 299.630E-03 -0.0636
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
400.001E-03 50.001E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.012, Test.Name=RX
Section
2006, 11:32
Test.Number=10.012, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.300 1.350 1.302 9.129E-03 1.300 1.329 1.274 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
5.4772 1.300 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.012, Test.Name=RX
section1
Test.Number=10.012, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.200 1.350 1.318 32.640E-03 1.300 1.416 1.220 >4.0000 -1.2512
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.350 150.001E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.013, Test.Name=RX
Section
2006, 11:32
Test.Number=10.013, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
950.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.013, Test.Name=RX
section1
Test.Number=10.013, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
800.000E-03 1000.000E-03 965.151E-03 38.497E-03 950.000E-03 1.081 849.661E-03 3.1617 -2.3442
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1000.000E-03 200.000E-03 3.1617
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=10.014, Test.Name=RX HYSTERESIS
Section
2006, 11:32
Test.Number=10.014, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
350.001E-03 400.001E-03 351.667E-03 9.129E-03 350.001E-03 379.054E-03 324.281E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
5.4772 350.001E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=10.014, Test.Name=RX HYSTERESIS
section1
Test.Number=10.014, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
300.001E-03 400.001E-03 353.031E-03 21.431E-03 350.001E-03 417.323E-03 288.738E-03 0.3903
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
400.000E-03 100.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=12.000, Test.Name=INVALID VOL, IOUT=1.6MA
Section
2006, 11:32
Test.Number=12.000, Test.Name=INVALID VOL, IOUT=1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
246.882E-03 313.047E-03 254.700E-03 11.459E-03 250.237E-03 289.077E-03 220.322E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
4.8408 258.088E-03 66.164E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=12.000, Test.Name=INVALID VOL, IOUT=1.6MA
section1
Test.Number=12.000, Test.Name=INVALID VOL, IOUT=1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
252.887E-03 271.728E-03 263.765E-03 5.137E-03 260.746E-03 279.176E-03 248.353E-03 >4.0000 -0.2090
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
270.819E-03 18.841E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=12.001, Test.Name=INVALID VOH, IOUT=-1MA
Section
2006, 11:32
Test.Number=12.001, Test.Name=INVALID VOH, IOUT=-1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
2.562 2.607 2.587 10.440E-03 2.581 2.618 2.555
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.1198 2.601 44.859E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=12.001, Test.Name=INVALID VOH, IOUT=-1MA
section1
Test.Number=12.001, Test.Name=INVALID VOH, IOUT=-1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
2.526 2.599 2.578 13.018E-03 2.572 2.617 2.539 >4.0000 -1.9775
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.590 73.011E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.000, Test.Name=POS. THRESH
Section
2006, 11:32
Test.Number=13.000, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.350 1.400 1.352 9.129E-03 1.350 1.379 1.324
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
5.4772 1.350 49.999E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.000, Test.Name=POS. THRESH
section1
Test.Number=13.000, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.350 2.650 1.689 552.234E-03 1.350 3.346 32.693E-03 1.2546
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.650 1.300
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.001, Test.Name=POS. THRESH
Section
2006, 11:32
Test.Number=13.001, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
900.000E-03 950.000E-03 948.333E-03 9.129E-03 950.000E-03 975.719E-03 920.947E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-5.4772 950.000E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.001, Test.Name=POS. THRESH
section1
Test.Number=13.001, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
850.000E-03 1000.000E-03 987.879E-03 30.696E-03 1000.000E-03 1.080 895.791E-03 -3.2720
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1000.000E-03 150.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.002, Test.Name=POS. THRESH
Section
2006, 11:32
Test.Number=13.002, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.350 1.350 1.350 1.350 1.350 1.350
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.350
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.002, Test.Name=POS. THRESH
section1
Test.Number=13.002, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.350 2.650 1.698 546.792E-03 1.400 3.339 58.107E-03 1.2575
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.650 1.300
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.003, Test.Name=POS. THRESH
Section
2006, 11:32
Test.Number=13.003, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
950.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.003, Test.Name=POS. THRESH
section1
Test.Number=13.003, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
850.000E-03 1000.000E-03 984.848E-03 31.832E-03 1000.000E-03 1.080 889.353E-03 -2.7449
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1000.000E-03 150.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.004, Test.Name=POS. THRESH
Section
2006, 11:32
Test.Number=13.004, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.350 1.400 1.352 9.129E-03 1.350 1.379 1.324
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
5.4772 1.350 49.999E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.004, Test.Name=POS. THRESH
section1
Test.Number=13.004, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.350 2.650 1.698 546.792E-03 1.400 3.339 58.107E-03 1.2575
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.650 1.300
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.005, Test.Name=POS. THRESH
Section
2006, 11:32
Test.Number=13.005, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
950.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.005, Test.Name=POS. THRESH
section1
Test.Number=13.005, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
850.000E-03 1000.000E-03 992.424E-03 28.288E-03 1000.000E-03 1.077 907.561E-03 -4.4511
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1000.000E-03 150.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.006, Test.Name=POS. THRESH
Section
2006, 11:32
Test.Number=13.006, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.350 1.400 1.353 12.685E-03 1.350 1.391 1.315
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
3.6600 1.350 49.999E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.006, Test.Name=POS. THRESH
section1
Test.Number=13.006, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.350 2.650 1.697 547.714E-03 1.400 3.340 53.828E-03 1.2568
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.650 1.300
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.007, Test.Name=POS. THRESH
Section
2006, 11:32
Test.Number=13.007, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
950.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.007, Test.Name=POS. THRESH
section1
Test.Number=13.007, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
850.000E-03 1000.000E-03 987.879E-03 30.696E-03 1000.000E-03 1.080 895.791E-03 -3.2720
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1000.000E-03 150.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.008, Test.Name=POS. THRESH
Section
2006, 11:32
Test.Number=13.008, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.350 1.350 1.350 1.350 1.350 1.350
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.350
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.008, Test.Name=POS. THRESH
section1
Test.Number=13.008, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.350 2.650 1.695 548.629E-03 1.400 3.341 49.566E-03 1.2562
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.650 1.300
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.009, Test.Name=POS. THRESH
Section
2006, 11:32
Test.Number=13.009, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
950.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.009, Test.Name=POS. THRESH
section1
Test.Number=13.009, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
850.000E-03 1000.000E-03 984.848E-03 31.832E-03 1000.000E-03 1.080 889.353E-03 -2.7449
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1000.000E-03 150.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.010, Test.Name=REC THRESH
Section
2006, 11:32
Test.Number=13.010, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -348.524E-03 NOutsideSpec
-300.000E-03 -250.000E-03 -291.667E-03 18.952E-03 -300.000E-03 -234.809E-03
1.8844 -250.000E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.010, Test.Name=REC THRESH
section1
Test.Number=13.010, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-2.300 -300.000E-03 -800.000E-03 861.956E-03 -350.000E-03 1.786 -3.386 -1.2578
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-300.000E-03 2.000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.011, Test.Name=REC THRESH ==)DX
Section
2006, 11:32
Test.Number=13.011, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -358.528E-03 NOutsideSpec
-350.000E-03 -300.000E-03 -306.666E-03 17.287E-03 -300.000E-03 -254.805E-03
-2.2725 -300.000E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.011, Test.Name=REC THRESH ==)DX
section1
Test.Number=13.011, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -414.230E-03
-400.000E-03 -250.000E-03 -345.454E-03 22.925E-03 -350.000E-03 -276.678E-03
-350.000E-03 150.000E-03
2.4643
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.012, Test.Name=REC THRESH
Section
2006, 11:32
Test.Number=13.012, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -354.914E-03 NOutsideSpec
-300.000E-03 -250.000E-03 -285.000E-03 23.305E-03 -300.000E-03 -215.086E-03
0.9195 -250.000E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.012, Test.Name=REC THRESH
section1
Test.Number=13.012, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-2.300 -300.000E-03 -796.970E-03 863.671E-03 -350.000E-03 1.794 -3.388 -1.2580
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-300.000E-03 2.000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.013, Test.Name=REC THRESH ==)DX
Section
2006, 11:32
Test.Number=13.013, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -350.769E-03 NOutsideSpec
-350.000E-03 -300.000E-03 -305.000E-03 15.256E-03 -300.000E-03 -259.230E-03
-2.8091 -300.000E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.013, Test.Name=REC THRESH ==)DX
section1
Test.Number=13.013, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -430.284E-03
-350.000E-03 -200.000E-03 -336.363E-03 31.307E-03 -350.000E-03 -242.443E-03
-300.000E-03 150.000E-03
2.9904
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.014, Test.Name=REC THRESH
Section
2006, 11:32
Test.Number=13.014, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -372.243E-03 NOutsideSpec
-300.000E-03 -200.000E-03 -278.333E-03 31.303E-03 -300.000E-03 -184.424E-03
1.1717 -250.000E-03 100.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.014, Test.Name=REC THRESH
section1
Test.Number=13.014, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-2.300 -300.000E-03 -801.515E-03 861.184E-03 -400.000E-03 1.782 -3.385 -1.2570
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-300.000E-03 2.000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.015, Test.Name=REC THRESH ==)DX
Section
2006, 11:32
Test.Number=13.015, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -375.186E-03 NOutsideSpec
-350.000E-03 -250.000E-03 -301.666E-03 24.507E-03 -300.000E-03 -228.147E-03
-0.0948 -275.000E-03 100.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.015, Test.Name=REC THRESH ==)DX
section1
Test.Number=13.015, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -411.262E-03
-400.000E-03 -250.000E-03 -346.969E-03 21.431E-03 -350.000E-03 -282.677E-03
-350.000E-03 150.000E-03
2.9251
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.016, Test.Name=REC THRESH
Section
2006, 11:32
Test.Number=13.016, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -425.270E-03 NOutsideSpec
-300.000E-03 -50.000E-03 -280.000E-03 48.423E-03 -300.000E-03 -134.730E-03
3.9632 -250.000E-03 250.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.016, Test.Name=REC THRESH
section1
Test.Number=13.016, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-2.300 -300.000E-03 -800.000E-03 862.228E-03 -450.000E-03 1.787 -3.387 -1.2556
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-300.000E-03 2.000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.017, Test.Name=REC THRESH ==)DX
Section
2006, 11:32
Test.Number=13.017, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -445.264E-03 NOutsideSpec
-350.000E-03 -100.000E-03 -308.333E-03 45.644E-03 -350.000E-03 -171.402E-03
3.2647 -300.000E-03 250.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.017, Test.Name=REC THRESH ==)DX
section1
Test.Number=13.017, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -421.519E-03
-400.000E-03 -250.000E-03 -351.515E-03 23.335E-03 -350.000E-03 -281.511E-03
-350.000E-03 150.000E-03
1.8440
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.018, Test.Name=REC THRESH
Section
2006, 11:32
Test.Number=13.018, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -345.195E-03 NOutsideSpec
-300.000E-03 -250.000E-03 -293.333E-03 17.287E-03 -300.000E-03 -241.471E-03
2.2725 -250.000E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.018, Test.Name=REC THRESH
section1
Test.Number=13.018, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-2.300 -300.000E-03 -795.454E-03 864.523E-03 -350.000E-03 1.798 -3.389 -1.2582
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-300.000E-03 2.000
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=13.019, Test.Name=REC THRESH ==)DX
Section
2006, 11:32
Test.Number=13.019, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -376.194E-03 NOutsideSpec
-350.000E-03 -300.000E-03 -311.666E-03 21.509E-03 -300.000E-03 -247.139E-03
-1.3283 -300.000E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=13.019, Test.Name=REC THRESH ==)DX
section1
Test.Number=13.019, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -441.856E-03
-400.000E-03 -200.000E-03 -350.000E-03 30.619E-03 -350.000E-03 -258.144E-03
-350.000E-03 200.000E-03
3.4767
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=14.000, Test.Name=TWU
Section
2006, 11:32
Test.Number=14.000, Test.Name=TWU
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.130E-06 20.740E-06 3.155E-06 5.901E-06 1.160E-06 20.857E-06 -14.547E-06
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.8059 11.225E-06 19.610E-06
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=14.000, Test.Name=TWU
section1
Test.Number=14.000, Test.Name=TWU
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.070E-06 2.622E-03 98.867E-06 454.132E-06 1.990E-06 1.461E-03 -1.264E-03 5.6969
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
99.450E-06 2.621E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=15.000, Test.Name=TINVH
Section
2006, 11:32
Test.Number=15.000, Test.Name=TINVH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
430.000E-09 2.884E-03 96.608E-06 526.420E-06 450.000E-09 1.676E-03 -1.483E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
5.4772 480.000E-09 2.883E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=15.000, Test.Name=TINVH
section1
Test.Number=15.000, Test.Name=TINVH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
460.000E-09 539.999E-09 482.424E-09 14.584E-09 470.000E-09 526.175E-09 438.672E-09 1.8021
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
489.999E-09 80.000E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=15.001, Test.Name=TINVL
Section
2006, 11:32
Test.Number=15.001, Test.Name=TINVL
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
59.010E-06 3.113E-03 162.570E-06 557.297E-06 60.300E-06 1.834E-03 -1.509E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
5.4772 62.475E-06 3.054E-03
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=15.001, Test.Name=TINVL
section1
Test.Number=15.001, Test.Name=TINVL
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
60.000E-06 65.790E-06 63.231E-06 1.446E-06 61.900E-06 67.567E-06 58.894E-06 -0.4051
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
64.940E-06 5.790E-06
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=16.000, Test.Name=RX1 TPLH, CL=150PF
Section
2006, 11:32
Test.Number=16.000, Test.Name=RX1 TPLH, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
450.141E-09 485.941E-09 467.398E-09 7.420E-09 463.910E-09 489.658E-09 445.138E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.4036 473.549E-09 35.800E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=16.000, Test.Name=RX1 TPLH, CL=150PF
section1
Test.Number=16.000, Test.Name=RX1 TPLH, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
440.548E-09 523.861E-09 468.007E-09 14.582E-09 462.079E-09 511.754E-09 424.260E-09 1.5102
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
482.673E-09 83.313E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=16.001, Test.Name=RX2 TPLH, CL=150PF
Section
2006, 11:32
Test.Number=16.001, Test.Name=RX2 TPLH, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
482.269E-09 507.054E-09 492.979E-09 6.361E-09 486.859E-09 512.063E-09 473.895E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.0504 500.169E-09 24.785E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=16.001, Test.Name=RX2 TPLH, CL=150PF
section1
Test.Number=16.001, Test.Name=RX2 TPLH, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
463.015E-09 563.178E-09 495.948E-09 16.771E-09 491.098E-09 546.261E-09 445.636E-09 1.6660
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
508.884E-09 100.163E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=16.002, Test.Name=RX3 TPLH,CL=150PF
Section
2006, 11:32
Test.Number=16.002, Test.Name=RX3 TPLH,CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
433.617E-09 455.648E-09 445.826E-09 5.603E-09 441.879E-09 462.634E-09 429.018E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.0071 454.271E-09 22.031E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=16.002, Test.Name=RX3 TPLH,CL=150PF
section1
Test.Number=16.002, Test.Name=RX3 TPLH,CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
409.657E-09 507.012E-09 442.222E-09 15.999E-09 435.868E-09 490.219E-09 394.225E-09 1.7196
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
454.590E-09 97.354E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=16.003, Test.Name=RX4 TPLH,CL=150PF
Section
2006, 11:32
Test.Number=16.003, Test.Name=RX4 TPLH,CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
431.781E-09 451.059E-09 440.839E-09 5.346E-09 437.289E-09 456.876E-09 424.801E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.3961 449.682E-09 19.277E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=16.003, Test.Name=RX4 TPLH,CL=150PF
section1
Test.Number=16.003, Test.Name=RX4 TPLH,CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
414.338E-09 510.756E-09 441.825E-09 17.357E-09 433.060E-09 493.896E-09 389.754E-09 1.8901
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
457.398E-09 96.418E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=16.004, Test.Name=RX5 TPLH, CL=150PF
Section
2006, 11:32
Test.Number=16.004, Test.Name=RX5 TPLH, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
422.602E-09 450.141E-09 436.402E-09 7.250E-09 432.699E-09 458.152E-09 414.652E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.1584 447.846E-09 27.539E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=16.004, Test.Name=RX5 TPLH, CL=150PF
section1
Test.Number=16.004, Test.Name=RX5 TPLH, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
412.465E-09 515.436E-09 438.478E-09 17.275E-09 430.251E-09 490.302E-09 386.653E-09 2.6818
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
451.782E-09 102.971E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=16.005, Test.Name=232 TPHL, CL=150PF
Section
2006, 11:32
Test.Number=16.005, Test.Name=232 TPHL, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
239.010E-09 251.861E-09 244.456E-09 2.831E-09 242.682E-09 252.950E-09 235.963E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.3163 248.189E-09 12.851E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=16.005, Test.Name=232 TPHL, CL=150PF
section1
Test.Number=16.005, Test.Name=232 TPHL, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
242.095E-09 265.498E-09 255.201E-09 5.655E-09 252.392E-09 272.167E-09 238.234E-09 -0.7829
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
260.817E-09 23.403E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
96890:
MS1324A SP3243E
Char
Hillview
09-JUL2003
SP3243ECH
Conditions
Temp
Data: Data
Report generated
3V,85oCHistogram: Test.Number=16.006, Test.Name=232 SKEW
Section
2006, 11:32
Test.Number=16.006, Test.Name=232 SKEW
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
211.131E-09 237.752E-09 222.942E-09 6.054E-09 219.392E-09 241.105E-09 204.779E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.4462 228.113E-09 26.621E-09
Attributes
Lot: Wafers Maskset Device Device Operation Foundry Process Date Tested Tester Test Program Sequence Retest
C30P44: MS1105G SP3243E
85oC3Vch Episil
2umcmos 20-MAR2006
SP3243ECH
Data: Data
Report generated
85oCHistogram: Test.Number=16.006, Test.Name=232 SKEW
section1
Test.Number=16.006, Test.Name=232 SKEW
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
197.517E-09 258.364E-09 212.807E-09 10.626E-09 206.878E-09 244.685E-09 180.929E-09 2.5056
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
221.856E-09 60.847E-09
Attributes
Lot: Wafers Maskset Device Device Operati
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