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SP3223EB Family Products SP3220, SP3222, SP3223, SP3232 Products


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SP3223EB Family Products
SP3220, SP3222, SP3223, SP3232 Products
Prepared Velvet Doung Greg West Date: August 2006
SP3223EB Product Family Characterization Report
Table Contents
Section Introduction Characterization Procedure Data Summary Parameters Conclusions Data Histograms Page Appendix
Page 9/14/2006
SP3223EB Product Family Characterization Report
Introduction: This product family characterization done part qualification Sipex's fabrication site transfer from Sipex's Hillview Milpitas, contract foundry, Episil, Taiwan. This characterization report summarizes data SP3223EB product family characteristics contains distributions parameters. complete listing product numbers covered characterization report included "Conclusion" section this report. distributions Appendix arranged that Hillview Episil distributions given parameter adjacent. distribution given parameter shows different temperature data which Wafer Fab: Episil Location: Taiwan Process: Episil SC2- 1107 Assembly location: Carsem Characterization Procedure: Episil number(s): C1453 Hillview number(s): 96889c Temperatures: Ambient (25C), 85C, -40C Tester: Test Program: SP3223EC2U.AT
Page 9/14/2006
SP3223EB Product Family Characterization Report
Data Summary: Parameter Across Temperature Data Summary
Hillview Distribution Mean Hillview Distribution Variance Hillview (across temp) Episil Distribution Mean Episil Distribution Variance Episil (across temp)
Parameter
Units
5.000: AutoOnline Disabled 5.002: Shut Down 7.000: Voh, Load 7.001: Voh, Load 7.002: Vol, Load 7.003: Vol, Load 17.005: Skew 18.000: 18.001: 18.002: SR3K 18.003: SR3K
591.273
329.293 488.463
403.133 219.193
116.858 83.746
1.7025 >4.0000
200.641
5.354
35.981E-03
3.2797
5.356
36.769E-03
3.2265
5.357
36.388E-03
3.2673
5.357
36.735E-03
3.2439
-5.281
43.988E-03
2.1271
-5.273
49.513E-03
1.8353
-5.282
43.883E-03 49.578 .6970 1.348 .6813 3.098
2.1390 >4.0000 2.6326 >4.0000 1.6730
-5.274 409.666 20.899 21.285 16.142 16.194
49.517E-03 23.265 .9402 856.184 .6738 .9030
1.8422 3.2268 3.3931 >4.0000 >4.0000
342.726
18.377
19.353
13.951
14.449
Page 9/14/2006
SP3223EB Product Family Characterization Report
Conclusion: Characterization data over temperature range show datasheet parameters meet spec. Cpk's most parameters comparable between Hillview Episil although many show strong temperature dependence that tends produce lower Cpk's this analysis. performance SP3223EB parts fabricated Episil comparable current SP3223EB parts built from Hillview fab. This characterization report applies following SP3223EB family product part numbers:
SP3220BCA SP3220BCA-L SP3220BCT SP3220BCT-L SP3220BCY SP3220BCY-L SP3220BEA SP3220BEA-L SP3220BET SP3220BET-L SP3220BEY SP3220BEY-L SP3220CA SP3220CA-L SP3220CT SP3220CT-L SP3220CY SP3220CY-L SP3220EA SP3220EA-L SP3220EBCA SP3220EBCA-L SP3220EBCT SP3220EBCT-L SP3220EBCY SP3220EBCY-L SP3220EBEA SP3220EBEA-L SP3220EBET SP3220EBET-L SP3220EBEY SP3220EBEY-L SP3220ECA SP3220ECA-L SP3220ECT SP3220ECT-L SP3220ECY SP3220ECY-L SP3220EEA SP3220EEA-L SP3220EET SP3220EET-L SP3220EEY SP3220EEY-L SP3220ET SP3220ET-L SP3220EUCA SP3220EUCA-L SP3220EUCT SP3220EUCT-L SP3220EUCY SP3220EUCY-L SP3220EUEA SP3220EUEA-L SP3220EUET SP3220EUET-L SP3220EUEY SP3220EUEY-L SP3220EY SP3220EY-L SP3220UCA SP3220UCA-L SP3220UCT SP3220UCT-L SP3220UCY SP3220UCY-L SP3220UEA SP3220UEA-L SP3220UET SP3220UET-L SP3220UEY SP3220UEY-L SP3222BCA SP3222BCA-L SP3222BCP SP3222BCP-L SP3222BCT SP3222BCT-L SP3222BCY SP3222BCY-L SP3222BEA SP3222BEA-L SP3222BEP SP3222BEP-L SP3222BET SP3222BET-L SP3222BEY SP3222BEY-L SP3222CA SP3222CA-L SP3222CP SP3222CP-L SP3222CT SP3222CT-L SP3222CY SP3222CY-L SP3222EA SP3222EA-L SP3222EBCA SP3222EBCA-L SP3222EBCP SP3222EBCP-L SP3222EBCT SP3222EBCT-L SP3222EBCY SP3222EBCY-L SP3222EBEA SP3222EBEA-L SP3222EBEP SP3222EBEP-L SP3222EBET SP3222EBET-L SP3222EBEY SP3222EBEY-L SP3222ECA SP3222ECA-L SP3222ECP SP3222ECP-L SP3222ECT SP3222ECT-L SP3222ECY SP3222ECY-L SP3222EEA SP3222EEA-L SP3222EEP SP3222EEP-L SP3222EET SP3222EET-L SP3222EEY SP3222EEY-L SP3222EP SP3222EP-L SP3222ET SP3222ET-L SP3222EUCA SP3222EUCA-L SP3222EUCP SP3222EUCP-L SP3222EUCT SP3222EUCT-L SP3222EUCY SP3222EUCY-L SP3222EUEA SP3222EUEA-L SP3222EUEP SP3222EUEP-L SP3222EUET SP3222EUET-L SP3222EUEY SP3222EUEY-L SP3222EY SP3222EY-L SP3222SECY SP3222SECY-L SP3222UCA SP3222UCA-L SP3222UCP SP3222UCP-L SP3222UCT SP3222UCT-L SP3222UCY SP3222UCY-L SP3222UEA SP3222UEA-L SP3222UEP
Page 9/14/2006
SP3223EB Product Family Characterization Report
SP3222UEP-L SP3222UET SP3222UET-L SP3222UEY SP3222UEY-L SP3223BCA SP3223BCA-L SP3223BCP SP3223BCP-L SP3223BCY SP3223BCY-L SP3223BEA SP3223BEA-L SP3223BEP SP3223BEP-L SP3223BEY SP3223BEY-L SP3223CA SP3223CA-L SP3223CP SP3223CP-L SP3223CY SP3223CY-L SP3223EA SP3223EA-L SP3223EBCA SP3223EBCA-L SP3223EBCP SP3223EBCP-L SP3223EBCY SP3223EBCY-L SP3223EBEA SP3223EBEA-L SP3223EBEP SP3223EBEP-L SP3223EBEY SP3223EBEY-L SP3223ECA SP3223ECA-L SP3223ECP SP3223ECP-L SP3223ECY SP3223ECY-L SP3223EEA SP3223EEA-L
SP3223EEP SP3223EEP-L SP3223EEY SP3223EEY-L SP3223EHCA SP3223EHCA-L SP3223EHCP SP3223EHCP-L SP3223EHCY SP3223EHCY-L SP3223EHEA SP3223EHEA-L SP3223EHEP SP3223EHEP-L SP3223EHEY SP3223EHEY-L SP3223EP SP3223EP-L SP3223EUCA SP3223EUCA-L SP3223EUCP SP3223EUCP-L SP3223EUCY SP3223EUCY-L SP3223EUEA SP3223EUEA-L SP3223EUEP SP3223EUEP-L SP3223EUEY SP3223EUEY-L SP3223EY SP3223EY-L SP3223HCA-L SP3223HCP-L SP3223HCY-L SP3223HEA-L SP3223HEP-L SP3223HEY-L SP3223UCA SP3223UCA-L SP3223UCP SP3223UCP-L SP3223UCY SP3223UCY-L SP3223UEA
SP3223UEA-L SP3223UEP SP3223UEP-L SP3223UEY SP3223UEY-L SP3232BCA SP3232BCA-L SP3232BCN SP3232BCN-L SP3232BCP SP3232BCP-L SP3232BCT SP3232BCT-L SP3232BCY SP3232BCY-L SP3232BEA SP3232BEA-L SP3232BEN SP3232BEN-L SP3232BEP SP3232BEP-L SP3232BET SP3232BET-L SP3232BEY SP3232BEY-L SP3232CA SP3232CA-L SP3232CN SP3232CN-L SP3232CP SP3232CP-L SP3232CT SP3232CT-L SP3232CY SP3232CY-L SP3232EA SP3232EA-L SP3232EBCA SP3232EBCA-L SP3232EBCN SP3232EBCN-L SP3232EBCP SP3232EBCP-L SP3232EBCT SP3232EBCT-L
SP3232EBCY SP3232EBCY-L SP3232EBEA SP3232EBEA-L SP3232EBEN SP3232EBEN-L SP3232EBEP SP3232EBEP-L SP3232EBET SP3232EBET-L SP3232EBEY SP3232EBEY-L SP3232ECA SP3232ECA-L SP3232ECN SP3232ECN-L SP3232ECP SP3232ECP-L SP3232ECT SP3232ECT-L SP3232ECY SP3232ECY-L SP3232EEA SP3232EEA-L SP3232EEN SP3232EEN-L SP3232EEP SP3232EEP-L SP3232EET SP3232EET-L SP3232EEY SP3232EEY-L SP3232EHCA SP3232EHCA-L SP3232EHCP SP3232EHCP-L SP3232EHCT SP3232EHCT-L SP3232EHCY SP3232EHCY-L SP3232EHEA SP3232EHEA-L SP3232EHEP SP3232EHEP-L SP3232EHET
SP3232EHET-L SP3232EHEY SP3232EHEY-L SP3232EN SP3232EN-L SP3232EP SP3232EP-L SP3232ET SP3232ET-L SP3232EUCA SP3232EUCA-L SP3232EUCN SP3232EUCN-L SP3232EUCP SP3232EUCP-L SP3232EUCT SP3232EUCT-L SP3232EUCY SP3232EUCY-L SP3232EUEA SP3232EUEA-L SP3232EUEN SP3232EUEN-L SP3232EUEP SP3232EUEP-L SP3232EUET SP3232EUET-L SP3232EUEY SP3232EUEY-L SP3232EY SP3232EY-L SP3232HCA SP3232HCA-L SP3232HCP SP3232HCP-L SP3232HCT SP3232HCT-L SP3232HCY SP3232HCY-L SP3232HEA SP3232HEA-L SP3232HEP SP3232HEP-L SP3232HET SP3232HET-L
Page 9/14/2006
SP3223EB Product Family Characterization Report
SP3232HEY SP3232HEY-L SP3232UCA SP3232UCA-L SP3232UCN SP3232UCN-L SP3232UCP SP3232UCP-L SP3232UCT SP3232UCT-L SP3232UCY SP3232UCY-L SP3232UEA SP3232UEA-L SP3232UEN SP3232UEN-L SP3232UEP SP3232UEP-L SP3232UET SP3232UET-L SP3232UEY SP3232UEY-L
Page 9/14/2006
SP3223EB Product Family Characterization Report
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Page 9/14/2006
SP3223EB Product Family Characterization Report
Appendix Characterization Data Histograms
Page 9/14/2006
C1453hotHistogram: Test.Number=1.000, Test.Name=TI1 OPEN/SHORT
section
2006, 06:12
Test.Number=1.000, Test.Name=TI1 OPEN/SHORT
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-1.125 -1.109 -1.119 3.821E-03 -1.122 -1.108 -1.130
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.2877 -1.115 16.026E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=1.000, Test.Name=TI1 OPEN/SHORT
Section
Test.Number=1.000, Test.Name=TI1 OPEN/SHORT
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-1.174 -1.148 -1.164 7.225E-03 -1.171 -1.142 -1.186 0.4144
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.154 26.241E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=1.001, Test.Name=TI2 OPEN/SHORT
section
2006, 06:12
Test.Number=1.001, Test.Name=TI2 OPEN/SHORT
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-1.126 -1.112 -1.119 3.991E-03 -1.123 -1.107 -1.131
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.1633 -1.114 14.118E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=1.001, Test.Name=TI2 OPEN/SHORT
Section
Test.Number=1.001, Test.Name=TI2 OPEN/SHORT
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-1.175 -1.148 -1.165 7.306E-03 -1.172 -1.143 -1.187 0.4594
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.155 27.186E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=2.002, Test.Name=TX1 ROUT POWER VO=-2V
section
2006, 06:12
Test.Number=2.002, Test.Name=TX1 ROUT POWER VO=-2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
519.809E03 2.914E06 1.078E06 554.041E03 658.995E03 2.740E06 -584.170E03 0.6484
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.7257 1.739E06 2.394E06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=2.002, Test.Name=TX1 ROUT POWER VO=-2V
Section
Test.Number=2.002, Test.Name=TX1 ROUT POWER VO=-2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
633.659E03 48.290E06 6.433E06 9.260E06 1.506E06 34.212E06 -21.347E06 0.2316 3.2883
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
14.792E06 47.656E06 0.2316
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=2.003, Test.Name=TX2 ROUT POWER VO=-2V
section
2006, 06:12
Test.Number=2.003, Test.Name=TX2 ROUT POWER VO=-2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
576.931E03 3.146E06 1.085E06 577.145E03 719.168E03 2.817E06 -646.071E03 0.6267
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.2463 1.726E06 2.569E06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=2.003, Test.Name=TX2 ROUT POWER VO=-2V
Section
Test.Number=2.003, Test.Name=TX2 ROUT POWER VO=-2V
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
669.824E03 27.729E06 5.702E06 6.802E06 2.040E06 26.108E06 -14.704E06 0.2794 2.0794
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
18.192E06 27.059E06 0.2794
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=3.000, Test.Name=232 -1MA
section
2006, 06:12
Test.Number=3.000, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
2.550 2.570 2.562 5.720E-03 2.557 2.579 2.545 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.5921 2.569 19.324E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=3.000, Test.Name=232 -1MA
Section
Test.Number=3.000, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
2.460 2.602 2.583 31.164E-03 2.585 2.676 2.489 1.9555 -3.6189
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.599 142.027E-03 1.9555
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=3.001, Test.Name=232 -1MA
section
2006, 06:12
Test.Number=3.001, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
2.550 2.570 2.559 5.381E-03 2.553 2.575 2.542 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.0121 2.565 20.238E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=3.001, Test.Name=232 -1MA
Section
Test.Number=3.001, Test.Name=232 -1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
2.465 2.603 2.584 29.508E-03 2.586 2.673 2.496 2.0826 -3.5847
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.601 137.589E-03 2.0826
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=3.002, Test.Name=232 1.6MA
section
2006, 06:12
Test.Number=3.002, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
256.386E-03 266.626E-03 262.164E-03 2.206E-03 261.023E-03 268.782E-03 255.546E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.3346 265.242E-03 10.240E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=3.002, Test.Name=232 1.6MA
Section
Test.Number=3.002, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
237.341E-03 260.664E-03 254.629E-03 5.467E-03 252.988E-03 271.029E-03 238.229E-03 >4.0000 -1.8947
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
259.704E-03 23.323E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=3.003, Test.Name=232 1.6MA
section
2006, 06:12
Test.Number=3.003, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
259.854E-03 268.265E-03 264.176E-03 2.105E-03 262.726E-03 270.491E-03 257.862E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.0657 267.109E-03 8.411E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=3.003, Test.Name=232 1.6MA
Section
Test.Number=3.003, Test.Name=232 1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
239.796E-03 263.384E-03 257.425E-03 5.130E-03 256.328E-03 272.814E-03 242.036E-03 >4.0000 -2.2431
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
262.003E-03 23.588E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=4.000, Test.Name=232
section
2006, 06:12
Test.Number=4.000, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
4.453E03 4.619E03 4.560E03 43.963 4.526E03 4.691E03 4.428E03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.4881 4.610E03 166.414
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=4.000, Test.Name=232
Section
Test.Number=4.000, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
4.751E03 4.975E03 4.879E03 67.669 4.843E03 5.082E03 4.676E03 >4.0000 -0.4835
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
4.956E03 224.488 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=4.001, Test.Name=232
section
2006, 06:12
Test.Number=4.001, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev
4.479E03 4.635E03 4.563E03 44.081 4.519E03 4.695E03 4.431E03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.1396 4.619E03 155.402
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=4.001, Test.Name=232
Section
Test.Number=4.001, Test.Name=232
Statistics: (OHMS)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
4.754E03 4.987E03 4.883E03 63.776 4.840E03 5.074E03 4.691E03 >4.0000 -0.4526
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
4.954E03 233.348 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=5.000, Test.Name=ICC: AUTO-ONLINE DISABLED,DXIN=0V
section
2006, 06:12
Test.Number=5.000, Test.Name=ICC: AUTO-ONLINE DISABLED,DXIN=0V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
293.605E-06 781.483E-06 403.133E-06 116.858E-06 344.811E-06 753.706E-06 52.559E-06 1.7025
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.4798 538.528E-06 487.878E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=5.000, Test.Name=ICC: AUTO-ONLINE DISABLED
Section
Test.Number=5.000, Test.Name=ICC: AUTO-ONLINE DISABLED
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -396.605E-06
332.406E-06 1.723E-03 591.273E-06 329.293E-06 432.794E-06 1.579E-03
856.026E-06 1.390E-03
2.5239
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=5.002, Test.Name=ICC: AUTO-ONLINE,DXIN=VCC
section
2006, 06:12
Test.Number=5.002, Test.Name=ICC: AUTO-ONLINE,DXIN=VCC
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
6.605E-09 301.690E-09 219.193E-09 83.746E-09 219.289E-09 470.432E-09 -32.046E-09 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.6812 287.156E-09 295.085E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=5.001, Test.Name=ICC: AUTO-ONLINE
Section
Test.Number=5.001, Test.Name=ICC: AUTO-ONLINE
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.923E-09 2.817E-06 200.641E-09 488.463E-09 21.637E-09 1.666E-06 -1.265E-06 5.1158
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
200.000E-09 2.815E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=5.004, Test.Name=ICC: SHUT DOWN,DXIN=OV
section
2006, 06:12
Test.Number=5.004, Test.Name=ICC: SHUT DOWN,DXIN=OV
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
2.076E-09 168.949E-09 45.061E-09 43.573E-09 16.044E-09 175.781E-09 -85.658E-09 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.6004 121.571E-09 166.873E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=5.002, Test.Name=ICC: SHUT DOWN
Section
Test.Number=5.002, Test.Name=ICC: SHUT DOWN
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
2.769E-09 2.833E-06 223.458E-09 487.852E-09 39.762E-09 1.687E-06 -1.240E-06 5.0938
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
216.490E-09 2.830E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=6.000, Test.Name=232
section
2006, 06:12
Test.Number=6.000, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-14.151E-03 -13.455E-03 -13.691E-03 179.350E-06 -13.796E-03 -13.153E-03 -14.229E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.8181 -13.480E-03 696.156E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=6.000, Test.Name=232
Section
Test.Number=6.000, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-14.177E-03 -13.188E-03 -13.772E-03 290.699E-06 -14.068E-03 -12.900E-03 -14.644E-03 >4.0000 0.2339
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-13.433E-03 989.374E-06 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=6.001, Test.Name=232
section
2006, 06:12
Test.Number=6.001, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-16.059E-06 13.709E-06 -1.969E-06 8.733E-06 -10.403E-06 24.231E-06 -28.168E-06 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.0358 8.350E-06 29.768E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=6.001, Test.Name=232
Section
Test.Number=6.001, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-14.164E-03 -13.180E-03 -13.805E-03 278.864E-06 -14.016E-03 -12.968E-03 -14.641E-03 >4.0000 0.5005
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-13.401E-03 984.505E-06 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=6.002, Test.Name=232
section
2006, 06:12
Test.Number=6.002, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
15.907E-03 16.220E-03 16.062E-03 75.891E-06 16.005E-03 16.289E-03 15.834E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.3052 16.177E-03 312.220E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=6.002, Test.Name=232
Section
Test.Number=6.002, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
15.337E-03 16.420E-03 15.948E-03 236.349E-06 15.801E-03 16.657E-03 15.239E-03 >4.0000 -0.6261
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
16.186E-03 1.084E-03 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=6.003, Test.Name=232
section
2006, 06:12
Test.Number=6.003, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-16.059E-06 9.838E-06 -1.780E-06 5.611E-06 -3.854E-06 15.052E-06 -18.613E-06 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.5152 4.629E-06 25.898E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=6.003, Test.Name=232
Section
Test.Number=6.003, Test.Name=232
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
15.347E-03 16.410E-03 15.970E-03 242.266E-06 15.808E-03 16.697E-03 15.244E-03 >4.0000 -0.8201
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
16.193E-03 1.062E-03 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=6.004, Test.Name=232 +12V
section
2006, 06:12
Test.Number=6.004, Test.Name=232 +12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
33.390E-03 34.954E-03 34.268E-03 372.914E-06 34.092E-03 35.387E-03 33.150E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.1774 34.763E-03 1.564E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=6.004, Test.Name=232 +12V
Section
Test.Number=6.004, Test.Name=232 +12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
29.400E-03 32.388E-03 31.261E-03 626.009E-06 30.871E-03 33.139E-03 29.383E-03 >4.0000 -0.4485
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
32.027E-03 2.988E-03 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=6.005, Test.Name=232 +12V
section
2006, 06:12
Test.Number=6.005, Test.Name=232 +12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-13.677E-06 34.108E-03 2.271E-03 8.653E-03 -4.747E-06 28.230E-03 -23.687E-03 2.2239
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
3.6600 3.885E-06 34.121E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=6.005, Test.Name=232 +12V
Section
Test.Number=6.005, Test.Name=232 +12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
30.477E-03 32.166E-03 31.256E-03 465.944E-06 30.931E-03 32.654E-03 29.859E-03 >4.0000 0.3153
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
31.888E-03 1.689E-03 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=6.006, Test.Name=232 +12V
section
2006, 06:12
Test.Number=6.006, Test.Name=232 +12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-29.150E-06 1.639E-03 94.513E-06 377.567E-06 -9.212E-06 1.227E-03 -1.038E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
3.7385 9.987E-06 1.669E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=6.006, Test.Name=232 +12V
Section
Test.Number=6.006, Test.Name=232 +12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -176.610E-06 >4.0000
-32.829E-06 360.499E-06 12.869E-06 63.160E-06 -3.226E-06 202.348E-06
12.602E-06 393.329E-06 >4.0000 >4.0000 >4.0000
5.5235
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=6.007, Test.Name=232 +12V
section
2006, 06:12
Test.Number=6.007, Test.Name=232 +12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-25.281E-06 6.862E-06 -9.698E-06 8.774E-06 -16.952E-06 16.624E-06 -36.020E-06 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.0858 2.694E-06 32.143E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=6.007, Test.Name=232 +12V
Section
Test.Number=6.007, Test.Name=232 +12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-125.172E-06 72.243E-06 -1.939E-06 27.844E-06 -7.370E-06 81.593E-06 -85.471E-06 >4.0000 -2.2197
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
18.385E-06 197.415E-06 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=6.008, Test.Name=232 -12V
section
2006, 06:12
Test.Number=6.008, Test.Name=232 -12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-16.677E-03 -15.881E-03 -16.225E-03 201.405E-06 -16.341E-03 -15.621E-03 -16.829E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.2617 -15.941E-03 795.651E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=6.008, Test.Name=232 -12V
Section
Test.Number=6.008, Test.Name=232 -12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-17.246E-03 -15.048E-03 -16.563E-03 381.378E-06 -16.792E-03 -15.419E-03 -17.707E-03 >4.0000 1.7784
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-16.216E-03 2.199E-03 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=6.009, Test.Name=232 -12V
section
2006, 06:12
Test.Number=6.009, Test.Name=232 -12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-16.372E-03 9.589E-06 -1.095E-03 4.134E-03 -21.372E-06 11.305E-03 -13.496E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-3.6601 1.254E-06 16.382E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=6.009, Test.Name=232 -12V
Section
Test.Number=6.009, Test.Name=232 -12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-20.686E-03 -16.155E-03 -16.821E-03 860.183E-06 -16.860E-03 -14.240E-03 -19.401E-03 >4.0000 -3.5673
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-16.279E-03 4.532E-03 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=6.010, Test.Name=232 -12V
section
2006, 06:12
Test.Number=6.010, Test.Name=232 -12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -661.025E-06 NOutsideSpec
-548.538E-06 -294.332E-06 -482.198E-06 59.609E-06 -509.543E-06 -303.372E-06
2.3460 -407.145E-06 254.205E-06
>4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=6.010, Test.Name=232 -12V
Section
Test.Number=6.010, Test.Name=232 -12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -742.469E-06 >4.0000
-626.311E-06 -319.399E-06 -550.539E-06 63.977E-06 -581.926E-06 -358.609E-06
-500.239E-06 306.913E-06 >4.0000 >4.0000 >4.0000
2.3666
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=6.011, Test.Name=232 -12V
section
2006, 06:12
Test.Number=6.011, Test.Name=232 -12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -242.020E-06 NOutsideSpec
-408.332E-06 7.803E-06 -21.162E-06 73.619E-06 -17.502E-06 199.696E-06
-5.3600 3.635E-06 416.135E-06
>4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=6.011, Test.Name=232 -12V
Section
Test.Number=6.011, Test.Name=232 -12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-15.818E-03 -323.543E-06 -1.058E-03 2.659E-03 -611.964E-06 6.918E-03 -9.034E-03 >4.0000 -5.6849
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-516.817E-06 15.494E-03 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=7.000, Test.Name=232 VOH, LOAD
section
2006, 06:12
Test.Number=7.000, Test.Name=232 VOH, LOAD
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
5.231 5.248 5.239 4.153E-03 5.235 5.251 5.226 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.4675 5.245 17.661E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=7.000, Test.Name=232 VOH, LOAD
Section
Test.Number=7.000, Test.Name=232 VOH, LOAD
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
5.184 5.252 5.233 15.830E-03 5.223 5.281 5.186 >4.0000 -1.2556
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
5.248 68.151E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=7.001, Test.Name=232 VOH, LOAD
section
2006, 06:12
Test.Number=7.001, Test.Name=232 VOH, LOAD
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
5.234 5.251 5.241 4.108E-03 5.238 5.254 5.229 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.4001 5.247 17.248E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=7.001, Test.Name=232 VOH, LOAD
Section
Test.Number=7.001, Test.Name=232 VOH, LOAD
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
5.185 5.260 5.235 16.261E-03 5.224 5.284 5.186 >4.0000 -1.2083
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
5.251 75.254E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=7.002, Test.Name=232 VOL, LOAD
section
2006, 06:12
Test.Number=7.002, Test.Name=232 VOL, LOAD
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-5.243 -5.207 -5.229 7.844E-03 -5.236 -5.206 -5.253 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.9997 -5.220 36.400E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=7.002, Test.Name=232 VOL, LOAD
Section
Test.Number=7.002, Test.Name=232 VOL, LOAD
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-5.246 -5.155 -5.211 19.196E-03 -5.224 -5.154 -5.269 3.6700 1.2070
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-5.192 90.457E-03 3.6700
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=7.003, Test.Name=232 VOL, LOAD
section
2006, 06:12
Test.Number=7.003, Test.Name=232 VOL, LOAD
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-5.246 -5.209 -5.232 7.752E-03 -5.238 -5.209 -5.255 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.0123 -5.223 36.554E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=7.003, Test.Name=232 VOL, LOAD
Section
Test.Number=7.003, Test.Name=232 VOL, LOAD
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-5.246 -5.156 -5.212 19.275E-03 -5.224 -5.154 -5.270 3.6674 1.2448
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-5.193 90.211E-03 3.6674
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=8.000, Test.Name=TX1 LEAKAGE, VOUT=-12V
section
2006, 06:12
Test.Number=8.000, Test.Name=TX1 LEAKAGE, VOUT=-12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-2.123E-06 -270.282E-09 -895.080E-09 492.242E-09 -1.220E-06 581.648E-09 -2.372E-06 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.0648 -390.628E-09 1.853E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=8.000, Test.Name=TX1 LEAKAGE, VOUT=-12V
Section
Test.Number=8.000, Test.Name=TX1 LEAKAGE, VOUT=-12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -353.889E-09 >4.0000
-344.450E-09 -161.297E-09 -216.588E-09 45.767E-09 -228.700E-09 -79.287E-09
-165.791E-09 183.153E-09 >4.0000 >4.0000 >4.0000
-1.2496
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=8.001, Test.Name=TX2 LEAKAGE, VOUT=-12V
section
2006, 06:12
Test.Number=8.001, Test.Name=TX2 LEAKAGE, VOUT=-12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-1.430E-06 -267.043E-09 -445.026E-09 221.441E-09 -466.586E-09 219.298E-09 -1.109E-06 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-3.2815 -280.691E-09 1.163E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=8.001, Test.Name=TX2 LEAKAGE, VOUT=-12V
Section
Test.Number=8.001, Test.Name=TX2 LEAKAGE, VOUT=-12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -346.774E-09 >4.0000
-315.828E-09 -110.945E-09 -209.925E-09 45.616E-09 -228.844E-09 -73.077E-09
-168.722E-09 204.883E-09 >4.0000 >4.0000 >4.0000
-0.6650
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=8.002, Test.Name=TX1 LEAKAGE, VOUT=12V
section
2006, 06:12
Test.Number=8.002, Test.Name=TX1 LEAKAGE, VOUT=12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
33.870E-09 279.072E-09 181.515E-09 51.360E-09 157.894E-09 335.596E-09 27.435E-09 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.6589 237.535E-09 245.202E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=8.002, Test.Name=TX1 LEAKAGE, VOUT=12V
Section
Test.Number=8.002, Test.Name=TX1 LEAKAGE, VOUT=12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -759.851E-09 >4.0000
68.104E-09 1.556E-06 364.356E-09 374.736E-09 152.600E-09 1.489E-06
962.224E-09 1.488E-06 >4.0000 >4.0000 >4.0000
1.7440
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=8.003, Test.Name=TX2 LEAKAGE, VOUT=12V
section
2006, 06:12
Test.Number=8.003, Test.Name=TX2 LEAKAGE, VOUT=12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
27.780E-09 436.880E-09 129.616E-09 71.344E-09 97.010E-09 343.648E-09 -84.415E-09 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.8414 185.047E-09 409.100E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=8.003, Test.Name=TX2 LEAKAGE, VOUT=12V
Section
Test.Number=8.003, Test.Name=TX2 LEAKAGE, VOUT=12V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -897.818E-09 >4.0000
39.581E-09 1.808E-06 317.240E-09 405.019E-09 110.202E-09 1.532E-06
873.826E-09 1.768E-06 >4.0000 >4.0000 >4.0000
2.3021
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=9.000, Test.Name=TIN ILEAK
section
2006, 06:23
Test.Number=9.000, Test.Name=TIN ILEAK
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-62.294E-09 24.517E-09 -16.966E-09 24.426E-09 -40.997E-09 56.313E-09 -90.244E-09 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.4536 10.920E-09 86.811E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=9.000, Test.Name=TIN ILEAK
Section
Test.Number=9.000, Test.Name=TIN ILEAK
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-51.581E-09 37.384E-09 -5.152E-09 21.583E-09 -18.506E-09 59.598E-09 -69.903E-09 >4.0000 -0.3690
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
16.214E-09 88.965E-09 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=9.001, Test.Name=TIN ILEAK
section
2006, 06:24
Test.Number=9.001, Test.Name=TIN ILEAK
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -156.594E-09 NOutsideSpec
-241.959E-09 17.442E-09 -20.523E-09 45.357E-09 -27.879E-09 115.549E-09
-4.2309 8.304E-09 259.400E-09
>4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=9.001, Test.Name=TIN ILEAK
Section
Test.Number=9.001, Test.Name=TIN ILEAK
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-39.970E-09 36.139E-09 -3.027E-09 18.921E-09 -14.955E-09 53.736E-09 -59.790E-09 >4.0000 -0.5957
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
16.214E-09 76.109E-09 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=9.002, Test.Name=FORCEON ILEAK
section
2006, 06:25
Test.Number=9.002, Test.Name=FORCEON ILEAK
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-45.567E-09 6.166E-09 -7.354E-09 11.165E-09 -10.857E-09 26.140E-09 -40.847E-09 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.7430 2.997E-09 51.733E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=9.002, Test.Name=FORCEON ILEAK
Section
Test.Number=9.002, Test.Name=FORCEON ILEAK
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-35.540E-09 14.455E-09 4.464E-09 10.735E-09 3.870E-09 36.670E-09 -27.742E-09 >4.0000 -2.3149
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
11.817E-09 49.995E-09 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=9.003, Test.Name=FORCEOFF ILEAK
section
2006, 06:26
Test.Number=9.003, Test.Name=FORCEOFF ILEAK
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-28.616E-09 4.398E-09 -8.506E-09 10.070E-09 -14.763E-09 21.705E-09 -38.716E-09 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.7760 1.745E-09 33.014E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=9.003, Test.Name=FORCEOFF ILEAK
Section
Test.Number=9.003, Test.Name=FORCEOFF ILEAK
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-25.687E-09 15.335E-09 -444.431E-12 12.188E-09 -7.008E-09 36.119E-09 -37.008E-09 >4.0000 -0.9600
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
11.524E-09 41.022E-09 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=9.004, Test.Name=^EN ILEAK
section
2006, 06:27
Test.Number=9.004, Test.Name=^EN ILEAK
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-46.229E-09 2.409E-09 -10.464E-09 13.482E-09 -15.573E-09 29.984E-09 -50.911E-09 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.5286 123.995E-12 48.638E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=9.004, Test.Name=^EN ILEAK
Section
Test.Number=9.004, Test.Name=^EN ILEAK
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-35.540E-09 12.624E-09 1.353E-09 12.347E-09 -2.612E-09 38.395E-09 -35.689E-09 >4.0000 -1.6887
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
10.172E-09 48.163E-09 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=10.000, Test.Name=RX
section
2006, 06:12
Test.Number=10.000, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.250 1.350 1.313 29.165E-03 1.300 1.401 1.226 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.0861 1.350 100.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=10.000, Test.Name=RX
Section
Test.Number=10.000, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.050 1.350 1.265 69.017E-03 1.200 1.472 1.058 2.2466 -1.0416
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.350 300.000E-03 2.8979 2.2466 3.5491
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=10.001, Test.Name=RX
section
2006, 06:12
Test.Number=10.001, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
900.000E-03 1.100 968.333E-03 49.971E-03 950.000E-03 1.118 818.419E-03 1.1229
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.6158 1.050 200.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=10.001, Test.Name=RX
Section
Test.Number=10.001, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
850.000E-03 1.100 990.909E-03 61.814E-03 950.000E-03 1.176 805.466E-03 1.0295 0.3675
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.100 250.000E-03 3.2355 1.0295 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=10.002, Test.Name=RX HYSTERESIS
section
2006, 06:12
Test.Number=10.002, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
150.001E-03 450.001E-03 345.001E-03 60.672E-03 350.001E-03 527.015E-03 162.986E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.5335 400.001E-03 300.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=10.002, Test.Name=RX HYSTERESIS
Section
Test.Number=10.002, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
100.000E-03 400.001E-03 274.243E-03 81.126E-03 250.000E-03 517.621E-03 30.865E-03 -0.3917
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
350.001E-03 300.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=10.003, Test.Name=RX
section
2006, 06:12
Test.Number=10.003, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.150 1.350 1.262 56.756E-03 1.250 1.432 1.091 2.7114
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.1127 1.350 200.001E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=10.003, Test.Name=RX
Section
Test.Number=10.003, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.150 1.350 1.282 78.877E-03 1.200 1.518 1.045 2.0361 -0.4706
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.350 200.001E-03 2.5356 2.0361 3.0350
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=10.004, Test.Name=RX
section
2006, 06:12
Test.Number=10.004, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
950.000E-03 1.100 1.047 29.165E-03 1.050 1.134 959.172E-03 2.8192
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-1.1203 1.075 150.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=10.004, Test.Name=RX
Section
Test.Number=10.004, Test.Name=RX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
950.000E-03 1.100 984.848E-03 52.268E-03 950.000E-03 1.142 828.043E-03 1.1788 1.0107
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.050 150.000E-03 3.8264 1.1788 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=10.005, Test.Name=RX HYSTERESIS
section
2006, 06:12
Test.Number=10.005, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
50.000E-03 350.001E-03 215.001E-03 75.601E-03 200.001E-03 441.804E-03 -11.803E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.1013 325.001E-03 300.001E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=10.005, Test.Name=RX HYSTERESIS
Section
Test.Number=10.005, Test.Name=RX HYSTERESIS
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
50.000E-03 400.001E-03 296.970E-03 116.552E-03 200.000E-03 646.626E-03 -52.685E-03 -0.6471
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
400.001E-03 350.001E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=11.000, Test.Name=RX,I LEAKAGE, VOUT=0V
section
2006, 06:12
Test.Number=11.000, Test.Name=RX,I LEAKAGE, VOUT=0V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-34.463E-09 -1.964E-09 -16.626E-09 9.334E-09 -23.090E-09 11.375E-09 -44.626E-09 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.2141 -4.580E-09 32.499E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=11.000, Test.Name=RX,I LEAKAGE, VOUT=0V
Section
Test.Number=11.000, Test.Name=RX,I LEAKAGE, VOUT=0V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-46.234E-09 10.097E-09 -13.592E-09 13.335E-09 -19.912E-09 26.412E-09 -53.596E-09 >4.0000 -0.6832
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
599.154E-12 56.330E-09 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=11.001, Test.Name=RX,I LEAKAGE, VOUT=0V
section
2006, 06:12
Test.Number=11.001, Test.Name=RX,I LEAKAGE, VOUT=0V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-27.266E-09 -73.066E-12 -12.907E-09 7.432E-09 -19.160E-09 9.389E-09 -35.203E-09 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.2893 -3.389E-09 27.193E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=11.001, Test.Name=RX,I LEAKAGE, VOUT=0V
Section
Test.Number=11.001, Test.Name=RX,I LEAKAGE, VOUT=0V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
-51.019E-09 7.607E-09 -8.539E-09 12.782E-09 -16.310E-09 29.805E-09 -46.884E-09 >4.0000 -1.4361
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
4.250E-09 58.626E-09 >4.0000 >4.0000 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=11.002, Test.Name=RX,I LEAKAGE, VOUT=VCC
section
2006, 06:12
Test.Number=11.002, Test.Name=RX,I LEAKAGE, VOUT=VCC
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-26.209E-09 3.169E-09 -11.177E-09 7.736E-09 -17.145E-09 12.032E-09 -34.386E-09 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.4938 -3.008E-09 29.379E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=11.002, Test.Name=RX,I LEAKAGE, VOUT=3.3V
Section
Test.Number=11.002, Test.Name=RX,I LEAKAGE, VOUT=3.3V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
54.243E-09 3.952E-06 1.310E-06 1.048E-06 721.027E-09 4.455E-06 -1.836E-06 1.3087
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
3.227E-06 3.898E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=11.003, Test.Name=RX,I LEAKAGE, VOUT=VCC
section
2006, 06:12
Test.Number=11.003, Test.Name=RX,I LEAKAGE, VOUT=VCC
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
-26.455E-09 4.029E-09 -13.651E-09 7.756E-09 -19.823E-09 9.618E-09 -36.921E-09 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.2948 -2.984E-09 30.484E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=11.003, Test.Name=RX,I LEAKAGE, VOUT=3.3V
Section
Test.Number=11.003, Test.Name=RX,I LEAKAGE, VOUT=3.3V
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
49.995E-09 3.753E-06 1.327E-06 1.025E-06 698.637E-09 4.401E-06 -1.747E-06 1.1979
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
3.090E-06 3.703E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=12.000, Test.Name=INVALID VOL, IOUT=1.6MA
section
2006, 06:12
Test.Number=12.000, Test.Name=INVALID VOL, IOUT=1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
261.519E-03 273.258E-03 266.945E-03 2.947E-03 264.454E-03 275.786E-03 258.104E-03 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.0557 270.875E-03 11.739E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=12.000, Test.Name=INVALID VOL, IOUT=1.6MA
Section
Test.Number=12.000, Test.Name=INVALID VOL, IOUT=1.6MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
238.225E-03 263.712E-03 256.349E-03 5.408E-03 254.661E-03 272.574E-03 240.124E-03 >4.0000 -1.6763
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
262.028E-03 25.487E-03 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=12.001, Test.Name=INVALID VOH, IOUT=-1MA
section
2006, 06:12
Test.Number=12.001, Test.Name=INVALID VOH, IOUT=-1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
2.543 2.569 2.558 5.944E-03 2.554 2.576 2.540 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.2205 2.566 26.260E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=12.001, Test.Name=INVALID VOH, IOUT=-1MA
Section
Test.Number=12.001, Test.Name=INVALID VOH, IOUT=-1MA
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
2.460 2.604 2.583 31.320E-03 2.584 2.677 2.489 1.9427 -3.5694
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
2.600 144.241E-03 1.9427
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=13.000, Test.Name=POS. THRESH
section
2006, 06:12
Test.Number=13.000, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.350 1.400 1.358 18.952E-03 1.350 1.415 1.301
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.8844 1.400 49.999E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=13.000, Test.Name=POS. THRESH
Section
Test.Number=13.000, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.250 1.350 1.347 17.408E-03 1.350 1.399 1.295 -5.7446
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.350 100.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=13.001, Test.Name=POS. THRESH
section
2006, 06:12
Test.Number=13.001, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
900.000E-03 950.000E-03 933.333E-03 23.973E-03 900.000E-03 1.005 861.414E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.7449 950.000E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=13.001, Test.Name=POS. THRESH
Section
Test.Number=13.001, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
750.000E-03 1.050 946.970E-03 39.409E-03 950.000E-03 1.065 828.744E-03 -3.5587
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
950.000E-03 300.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=13.002, Test.Name=POS. THRESH
section
2006, 06:12
Test.Number=13.002, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.350 1.400 1.363 22.488E-03 1.350 1.431 1.296
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.1117 1.400 49.999E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=13.002, Test.Name=POS. THRESH
Section
Test.Number=13.002, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.350 1.350 1.350 1.350 1.350 1.350
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.350
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=13.003, Test.Name=POS. THRESH
section
2006, 06:12
Test.Number=13.003, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
900.000E-03 950.000E-03 930.000E-03 24.914E-03 900.000E-03 1.005 855.259E-03
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.4301 950.000E-03 50.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=13.003, Test.Name=POS. THRESH
Section
Test.Number=13.003, Test.Name=POS. THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03 950.000E-03
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
950.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=13.004, Test.Name=REC THRESH
section
2006, 06:12
Test.Number=13.004, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -352.051E-03 NOutsideSpec
-300.000E-03 -150.000E-03 -230.000E-03 40.684E-03 -250.000E-03 -107.949E-03
0.7571 -150.000E-03 150.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=13.004, Test.Name=REC THRESH
Section
Test.Number=13.004, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -454.914E-03
-400.000E-03 -200.000E-03 -343.939E-03 36.992E-03 -350.000E-03 -232.965E-03
-300.000E-03 200.000E-03
2.2650
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=13.005, Test.Name=REC THRESH ==)DX
section
2006, 06:12
Test.Number=13.005, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -341.599E-03 NOutsideSpec
-300.000E-03 -100.000E-03 -206.666E-03 44.978E-03 -250.000E-03 -71.734E-03
-0.0275 -150.000E-03 200.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=13.005, Test.Name=REC THRESH ==)DX
Section
Test.Number=13.005, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -379.375E-03
-350.000E-03 -200.000E-03 -289.394E-03 29.994E-03 -300.000E-03 -199.413E-03
-250.000E-03 150.000E-03
1.7502
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=13.006, Test.Name=REC THRESH
section
2006, 06:12
Test.Number=13.006, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -331.741E-03 NOutsideSpec
-300.000E-03 -200.000E-03 -248.333E-03 27.803E-03 -250.000E-03 -164.925E-03
0.0220 -200.000E-03 100.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=13.006, Test.Name=REC THRESH
Section
Test.Number=13.006, Test.Name=REC THRESH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -423.790E-03
-400.000E-03 -250.000E-03 -345.455E-03 26.112E-03 -350.000E-03 -267.120E-03
-300.000E-03 150.000E-03
1.5404
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=13.007, Test.Name=REC THRESH ==)DX
section
2006, 06:12
Test.Number=13.007, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range -338.596E-03 NOutsideSpec
-300.000E-03 -150.000E-03 -230.000E-03 36.199E-03 -250.000E-03 -121.404E-03
-0.2103 -200.000E-03 150.000E-03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=13.007, Test.Name=REC THRESH ==)DX
Section
Test.Number=13.007, Test.Name=REC THRESH ==)DX
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec -366.631E-03
-350.000E-03 -250.000E-03 -293.939E-03 24.231E-03 -300.000E-03 -221.247E-03
-250.000E-03 100.000E-03
0.3532
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=14.000, Test.Name=TWU
section
2006, 06:12
Test.Number=14.000, Test.Name=TWU
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.340E-06 2.610E-06 1.512E-06 274.737E-09 1.400E-06 2.337E-06 688.120E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
3.4223 1.550E-06 1.270E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=14.000, Test.Name=TWU
Section
Test.Number=14.000, Test.Name=TWU
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.090E-06 30.000E-06 4.722E-06 9.469E-06 1.220E-06 33.128E-06 -23.684E-06 2.4324
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
29.680E-06 28.910E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=15.000, Test.Name=TINVH
section
2006, 06:12
Test.Number=15.000, Test.Name=TINVH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
2.290E-06 6.910E-06 5.617E-06 1.668E-06 3.670E-06 10.621E-06 612.592E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.8258 6.885E-06 4.620E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=15.000, Test.Name=TINVH
Section
Test.Number=15.000, Test.Name=TINVH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.770E-06 10.260E-06 4.098E-06 2.176E-06 1.890E-06 10.626E-06 -2.431E-06 1.1515
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
6.440E-06 8.490E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=15.001, Test.Name=TINVL
section
2006, 06:12
Test.Number=15.001, Test.Name=TINVL
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
73.190E-06 80.070E-06 77.421E-06 1.573E-06 76.460E-06 82.141E-06 72.702E-06
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.4582 79.700E-06 6.880E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=15.001, Test.Name=TINVL
Section
Test.Number=15.001, Test.Name=TINVL
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
73.890E-06 94.810E-06 80.218E-06 3.766E-06 78.960E-06 91.515E-06 68.921E-06 2.6361
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
81.830E-06 20.920E-06
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=16.000, Test.Name=RX1 TPHL, CL=150PF
section
2006, 06:13
Test.Number=16.000, Test.Name=RX1 TPHL, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
424.117E-09 455.668E-09 440.016E-09 6.930E-09 436.180E-09 460.807E-09 419.225E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.3001 448.244E-09 31.551E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=16.000, Test.Name=RX1 TPHL, CL=150PF
Section
Test.Number=16.000, Test.Name=RX1 TPHL, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
415.029E-09 585.842E-09 436.922E-09 29.195E-09 424.363E-09 524.507E-09 349.337E-09 4.4446
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
443.031E-09 170.812E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=16.001, Test.Name=RX2 TPHL, CL=150PF
section
2006, 06:13
Test.Number=16.001, Test.Name=RX2 TPHL, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
446.388E-09 477.939E-09 458.080E-09 6.856E-09 453.812E-09 478.650E-09 437.511E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.5864 465.411E-09 31.551E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=16.001, Test.Name=RX2 TPHL, CL=150PF
Section
Test.Number=16.001, Test.Name=RX2 TPHL, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
425.297E-09 510.236E-09 450.499E-09 17.489E-09 440.231E-09 502.965E-09 398.032E-09 1.8363
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
462.633E-09 84.939E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=16.002, Test.Name=RX1 TPLH, CL=150PF
section
2006, 06:13
Test.Number=16.002, Test.Name=RX1 TPLH, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
237.595E-09 252.443E-09 244.215E-09 3.453E-09 243.163E-09 254.573E-09 233.857E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.0899 248.267E-09 14.847E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=16.002, Test.Name=RX1 TPLH, CL=150PF
Section
Test.Number=16.002, Test.Name=RX1 TPLH, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
243.284E-09 270.353E-09 257.030E-09 5.504E-09 253.551E-09 273.541E-09 240.519E-09 -0.0669
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
263.819E-09 27.069E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=16.003, Test.Name=RX1 SKEW
section
2006, 06:13
Test.Number=16.003, Test.Name=RX1 SKEW
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
178.170E-09 206.009E-09 195.801E-09 6.317E-09 191.161E-09 214.753E-09 176.849E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.3429 205.081E-09 27.839E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=16.003, Test.Name=RX1 SKEW
Section
Test.Number=16.003, Test.Name=RX1 SKEW
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
158.678E-09 322.023E-09 179.892E-09 28.572E-09 168.945E-09 265.608E-09 94.175E-09 4.2710
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
188.547E-09 163.345E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=16.004, Test.Name=RX2 TPLH+TPHL
section
2006, 06:13
Test.Number=16.004, Test.Name=RX2 TPLH+TPHL
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
670.064E-09 708.110E-09 684.231E-09 8.944E-09 678.415E-09 711.062E-09 657.399E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.6710 693.727E-09 38.047E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=16.004, Test.Name=RX2 TPLH+TPHL
Section
Test.Number=16.004, Test.Name=RX2 TPLH+TPHL
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
664.847E-09 849.660E-09 693.952E-09 30.804E-09 680.715E-09 786.365E-09 601.539E-09 4.2327
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
705.917E-09 184.813E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=16.005, Test.Name=RX2 TPLH, CL=150PF
section
2006, 06:13
Test.Number=16.005, Test.Name=RX2 TPLH, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
245.019E-09 263.578E-09 252.845E-09 4.112E-09 249.659E-09 265.180E-09 240.510E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.3934 258.475E-09 18.559E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=16.005, Test.Name=RX2 TPLH, CL=150PF
Section
Test.Number=16.005, Test.Name=RX2 TPLH, CL=150PF
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
249.818E-09 272.219E-09 263.055E-09 4.841E-09 261.018E-09 277.579E-09 248.531E-09 -0.4839
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
269.419E-09 22.402E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=16.006, Test.Name=RX2 SKEW
section
2006, 06:13
Test.Number=16.006, Test.Name=RX2 SKEW
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
189.305E-09 224.568E-09 205.235E-09 7.376E-09 201.369E-09 227.363E-09 183.108E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.2698 212.504E-09 35.263E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=16.006, Test.Name=RX2 SKEW
Section
Test.Number=16.006, Test.Name=RX2 SKEW
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
163.345E-09 256.685E-09 187.444E-09 19.426E-09 179.213E-09 245.722E-09 129.165E-09 2.4725
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
198.814E-09 93.340E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=16.007, Test.Name=RX2 TPLH+TPHL
section
2006, 06:13
Test.Number=16.007, Test.Name=RX2 TPLH+TPHL
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
691.407E-09 731.310E-09 710.925E-09 8.569E-09 704.398E-09 736.633E-09 685.217E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.3206 721.566E-09 39.903E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=16.007, Test.Name=RX2 TPLH+TPHL
Section
Test.Number=16.007, Test.Name=RX2 TPLH+TPHL
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
687.249E-09 763.788E-09 713.554E-09 16.769E-09 699.383E-09 763.862E-09 663.245E-09 0.9271
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
726.452E-09 76.539E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=17.000, Test.Name=T1 TPHL
section
2006, 06:13
Test.Number=17.000, Test.Name=T1 TPHL
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.080E-06 1.140E-06 1.111E-06 15.298E-09 1.100E-06 1.157E-06 1.065E-06
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.0662 1.130E-06 59.999E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=17.000, Test.Name=T1 TPHL
Section
Test.Number=17.000, Test.Name=T1 TPHL
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.120E-06 1.250E-06 1.148E-06 25.864E-09 1.130E-06 1.225E-06 1.070E-06 2.7075
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.160E-06 130.000E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=17.001, Test.Name=T2 TPLH
section
2006, 06:13
Test.Number=17.001, Test.Name=T2 TPLH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.080E-06 1.160E-06 1.115E-06 23.744E-09 1.100E-06 1.186E-06 1.044E-06
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.4140 1.150E-06 80.000E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=17.001, Test.Name=T2 TPLH
Section
Test.Number=17.001, Test.Name=T2 TPLH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.010E-06 1.180E-06 1.132E-06 27.045E-09 1.130E-06 1.214E-06 1.051E-06 -2.7255
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.150E-06 170.000E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=17.002, Test.Name=T1 TPLH
section
2006, 06:13
Test.Number=17.002, Test.Name=T1 TPLH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.750E-06 1.870E-06 1.788E-06 25.822E-09 1.770E-06 1.865E-06 1.710E-06
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.1131 1.820E-06 120.000E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=17.002, Test.Name=T1 TPLH
Section
Test.Number=17.002, Test.Name=T1 TPLH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.580E-06 1.950E-06 1.654E-06 60.876E-09 1.620E-06 1.837E-06 1.471E-06 3.7409
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.700E-06 370.000E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=17.003, Test.Name=T1 SKEW
section
2006, 06:13
Test.Number=17.003, Test.Name=T1 SKEW
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
630.000E-09 749.999E-09 676.999E-09 27.436E-09 659.999E-09 759.309E-09 594.690E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.5944 715.000E-09 120.000E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=17.003, Test.Name=T1 SKEW
Section
Test.Number=17.003, Test.Name=T1 SKEW
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
329.999E-09 729.999E-09 506.363E-09 56.724E-09 479.999E-09 676.535E-09 336.191E-09 1.0722
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
550.000E-09 399.999E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=17.004, Test.Name=T2 TPLH
section
2006, 06:13
Test.Number=17.004, Test.Name=T2 TPLH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
1.720E-06 1.880E-06 1.773E-06 42.030E-09 1.750E-06 1.899E-06 1.647E-06
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.1838 1.845E-06 159.999E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=17.004, Test.Name=T2 TPLH
Section
Test.Number=17.004, Test.Name=T2 TPLH
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
1.580E-06 2.070E-06 1.649E-06 84.259E-09 1.620E-06 1.902E-06 1.397E-06 4.1692
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
1.680E-06 490.000E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=17.005, Test.Name=T2 SKEW
section
2006, 06:13
Test.Number=17.005, Test.Name=T2 SKEW
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev
589.999E-09 739.999E-09 657.999E-09 36.427E-09 630.000E-09 767.279E-09 548.720E-09
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.4473 715.000E-09 150.000E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=17.005, Test.Name=T2 SKEW
Section
Test.Number=17.005, Test.Name=T2 SKEW
Statistics:
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
439.999E-09 1.060E-06 516.969E-09 103.365E-09 489.999E-09 827.064E-09 206.875E-09 4.8023
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
549.999E-09 620.001E-09
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=18.000, Test.Name=DX
section
2006, 06:13
Test.Number=18.000, Test.Name=DX
Statistics: (V/US)
Mean StdDev Mean+3*StdD Mean3*StdDev
10.345E06 11.111E06 10.738E06 229.176E03 10.526E06 11.426E06 10.051E06 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
0.3802 11.111E06 766.283E03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=18.000, Test.Name=DX
Section
Test.Number=18.000, Test.Name=DX
Statistics: (V/US)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
9.091E06 10.909E06 10.405E06 339.655E03 10.345E06 11.424E06 9.386E06 >4.0000 -2.2397
StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
10.714E06 1.818E06 >4.0000
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
96889ch:
MS1318
SP232
hot85oC
HillView
11-JUN2003
SP3223EC2 U.AT
Conditions
temp
Data: Data
Report generated
C1453hotHistogram: Test.Number=18.001, Test.Name=DX
section
2006, 06:13
Test.Number=18.001, Test.Name=DX
Statistics: (V/US)
Mean StdDev Mean+3*StdD Mean3*StdDev
10.170E06 11.111E06 10.720E06 250.025E03 10.526E06 11.470E06 9.970E06 >4.0000
Skew StatHigh StatLow NWithinSpec NOutsideSpec Range NOutsideSpec
-0.1937 11.111E06 941.620E03
Attributes
Lot: Wafers Maskset Device Device Operatio Foundry Process Date Tested Tester Test Program Sequence Retest
C14L53:
MS1107D SP3223E
hot85oC
Episil
2umCmo 22-FEBs 2006
SP3223EC2 U.AT
Data: Data
Report generated
85oCHistogram: Test.Number=18.001, Test.Name=DX
Section
Test.Number=18.001, Test.Name=DX
Statistics: (V/US)
Mean StdDev Mean+3*StdD Mean3*StdDev Skew StatHigh
10.170E06 14.634E06 10.711E06 735.438E03 10.345E06 12.917E06 8.505E06 >4.0000 5.0060
StatLow NWithin

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