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2.3V 5.5V Micropower Bi-CMOS Amps Input Offset Voltage: ±150 (max


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MCP616/7/8/9
2.3V 5.5V Micropower Bi-CMOS Amps
Input Offset Voltage: ±150 (maximum) Noise: µVP-P (typical, Rail-to-Rail Output Input Offset Current: (typical) Quiescent Current: (maximum) Power Supply Voltage: 2.3V 5.5V Unity Gain Stable Chip Select (CS) Capability: MCP618 Industrial Temperature Range: -40°C +85°C Phase Reversal Available Single, Dual Quad Packages
Description
MCP616/7/8/9 family operational amplifiers amps) from Microchip Technology Inc. capable precision, low-power, single-supply operation. These amps unity-gain stable, have input offset voltage (±150 maximum), rail-to-rail output swing input offset current (0.3 typical). These features make this family amps well suited battery-powered applications. single MCP616, single MCP618 with Chip Select (CS) dual MCP617 available standard 8-lead PDIP, SOIC MSOP packages. quad MCP619 offered standard 14-lead PDIP, SOIC TSSOP packages. devices fully specified from -40°C +85°C, with power supplies from 2.3V 5.5V.
Typical Applications
Battery Power Instruments Weight Scales Strain Gauges Medical Instruments Test Equipment
Package Types
MCP616 PDIP, SOIC, MSOP VIN- VIN+ MCP617 PDIP, SOIC, MSOP VOUTB VINB- VINB+
Design Aids
SPICE Macro Models Microchip Advanced Part Selector (MAPS) MindiCircuit Designer Simulator Analog Demonstration Evaluation Boards Application Notes
VOUTA VINA- VOUT VINA+
MCP618 PDIP, SOIC, MSOP VIN- VIN+
MCP619 PDIP, SOIC, TSSOP VOUTD VIND- VIND+ VINC+ VINC- VOUTC
Input Offset Voltage
Percentage Occurrences -100 Samples 5.5V
VOUTA VINA- VOUT VINA+ VINB+ VINB- VOUTB
Input Offset Voltage (µV)
2008 Microchip Technology Inc.
DS21613C-page
MCP616/7/8/9
NOTES:
DS21613C-page
2008 Microchip Technology Inc.
MCP616/7/8/9
ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability. Section 4.1.2 "Input Voltage Current Limits".
Absolute Maximum Ratings
.7.0V Current Analog Input Pins (VIN+ VIN-).±2 Analog Inputs (VIN+ VIN-) 0.3V 0.3V other Inputs Outputs 0.3V 0.3V Difference Input Voltage |VDD VSS| Output Short Circuit Current Continuous Current Output Supply Pins .±30 Storage Temperature -65°C +150°C Maximum Junction Temperature (TJ). .+150°C Protection Pins (HBM; 400V
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, +2.3V +5.5V, GND, +25°C, VDD/2, VOUT VDD/2 VDD/2.
Parameters
Input Offset Input Offset Voltage Input Offset Drift with Temperature Power Supply Rejection Input Bias Current Impedance Input Bias Current Temperature Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode Common Mode Input Voltage Range Common Mode Rejection Ratio Open-Loop Gain Open-Loop Gain (large signal) Open-Loop Gain (large signal) Output Maximum Output Voltage Swing
VOS/TA PSRR ZDIFF VCMR CMRR
-150
±2.5 ±0.15 600||4 3||2
+150
Units
µV/°C
Conditions
-40°C +85°C
-40°C +85°C M||pF M||pF
5.0V, 0.0V 4.1V VDD/2, VOUT 0.05V 0.05V VDD/2, VOUT 0.1V 0.1V VDD/2, 0.5V input overdrive VDD/2, 0.5V input overdrive VDD/2, VDD/2, 2.3V 5.5V
VOL, VOL,
Linear Output Voltage Range
VOUT VOUT
Output Short Circuit Current Power Supply Supply Voltage Quiescent Current Amplifier
2008 Microchip Technology Inc.
DS21613C-page
MCP616/7/8/9
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, +2.3V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2
Parameters
Response Gain Bandwidth Product Phase Margin Slew Rate Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density
GBWP
0.08
Units
V/µs µVP-P nV/Hz fA/Hz
Conditions
+1V/V
MCP618 CHIP SELECT (CS) ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, +2.3V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2
Parameters
Specifications Logic Threshold, Input Current, High Specifications Logic Threshold, High Input Current, High Current Amplifier Output Leakage Dynamic Specifications Amplifier Output Turn-on Time High Amplifier Output High-Z Hysteresis
Units
Conditions
ICSL ICSH IO(LEAK) tOFF VHYST
-1.0
0.01
0.01 -0.05
0.2VDD VOUT 0.9VDD/2, V/V, 0.8VDD VOUT 0.1VDD/2, V/V, 5.0V
VOUT High-Z (typical) (typical)
tOFF High-Z (typical) (typical) (typical)
FIGURE 1-1: Timing Diagram MCP618.
DS21613C-page
2008 Microchip Technology Inc.
MCP616/7/8/9
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, +2.3V +5.5V GND.
Parameters
Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 8L-MSOP Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note
89.3 149.5 95.3
+125 +150
Units
°C/W °C/W °C/W °C/W °C/W °C/W Note
Conditions
MCP616/7/8/9 operate over this extended temperature range, with reduced performance. case, Junction Temperature (TJ) must exceed Absolute Maximum specification +150°C.
Test Circuits
test circuits used tests shown Figure Figure 1-3. bypass capacitors laid according rules discussed Section "Supply Bypass". VOUT VDD/2
MCP61X
FIGURE 1-2: Test Circuit Most Non-Inverting Gain Conditions.
VOUT
VDD/2
MCP61X
FIGURE 1-3: Test Circuit Most Inverting Gain Conditions.
2008 Microchip Technology Inc.
DS21613C-page
MCP616/7/8/9
NOTES:
DS21613C-page
2008 Microchip Technology Inc.
MCP616/7/8/9
Note:
TYPICAL PERFORMANCE CURVES
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Note: Unless otherwise indicated, +2.3V +5.5V, GND, +25°C, VDD/2, VOUT VDD/2, VDD/2
Percentage Occurrences
Samples 5.5V
-100
Percentage Occurrences
Samples 5.5V -40°C +85°C
Input Offset Voltage (µV)
Input Offset Voltage Drift (µV/°C)
FIGURE 2-1: 5.5V.
Input Offset Voltage
FIGURE 2-4: 5.5V.
Percentage Occurrences
Input Offset Voltage Drift
Percentage Occurrences
Samples 2.3V
Samples 2.3V -40°C +85°C
-100
Offset Voltage (µV)
Input Offset Voltage Drift (µV/°C)
FIGURE 2-2: 2.3V.
Percentage Occurrences
Input Offset Voltage
FIGURE 2-5: 2.3V.
Input Offset Voltage Drift
Samples 5.5V
Percentage Occurrences
Samples 5.5V
-0.7
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
Input Bias Current (nA)
Input Offset Current (nA)
FIGURE 2-3: 5.5V.
Input Bias Current
FIGURE 2-6: 5.5V.
Input Offset Current
2008 Microchip Technology Inc.
DS21613C-page
MCP616/7/8/9
Note: Unless otherwise indicated, +2.3V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2
Input Offset Voltage (µV) 2.3V -100 -150 Ambient Temperature (°C) 5.5V Representative Part Input Bias Current (nA) Ambient Temperature (°C) Input Offset Current (nA)
5.5V
FIGURE 2-7: Input Offset Voltage Ambient Temperature.
FIGURE 2-10: Input Bias, Offset Currents Ambient Temperature.
CMRR, PSRR (dB)
Quiescent Current (µA/Amplifier)
5.5V
CMRR PSRR
2.3V
Ambient Temperature (°C)
Ambient Temperature (°C)
FIGURE 2-8: Quiescent Current Ambient Temperature.
Output Voltage Headroom (mV) Ambient Temperature (°C) 2.3V
FIGURE 2-11: Temperature.
Output Voltage Headroom (mV) 2.3V 5.5V
CMRR, PSRR Ambient
5.5V
Ambient Temperature (°C)
FIGURE 2-9: Maximum Output Voltage Swing Ambient Temperature
FIGURE 2-12: Maximum Output Voltage Swing Ambient Temperature
DS21613C-page
2008 Microchip Technology Inc.
MCP616/7/8/9
Note: Unless otherwise indicated, +2.3V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2
Gain Bandwidth Product (kHz) ISC+ Ambient Temperature (°C) ISC- 2.3V 5.5V
Output Short Circuit Current (mA)
GBWP
Ambient Temperature (°C)
FIGURE 2-13: Output Short Circuit Current Ambient Temperature.
0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00
FIGURE 2-16: Gain Bandwidth Product, Phase Margin Ambient Temperature.
-100
Low-to-High Transition
High-to-Low Transition
Input Offset Voltage (µV)
5.5V
Slew Rate (V/µs)
+85°C +25°C -40°C
5.0V Ambient Temperature (°C)
-0.5
Common Mode Input Voltage
FIGURE 2-14: Temperature.
Slew Rate Ambient
FIGURE 2-17: Input Offset Voltage Common Mode Input Voltage.
+85°C +25°C -40°C
5.5V
0.30 0.25 0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30
Input Offset Current (nA)
Input Offset Voltage
5.5V 2.3V
Input Bias Current (nA)
Output Voltage
Common Mode Input Voltage
FIGURE 2-15: Input Bias, Offset Currents Common Mode Input Voltage.
FIGURE 2-18: Output Voltage.
Input Offset Voltage
2008 Microchip Technology Inc.
DS21613C-page
Phase Margin
MCP616/7/8/9
Note: Unless otherwise indicated, +2.3V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2
Output Voltage Headroom (mV)
Quiescent Current (µA/Amplifier) Power Supply Voltage +85°C +25°C -40°C
1,000 2.3V
5.5V
0.01
100µ Output Current Magnitude
FIGURE 2-19: Quiescent Current Power Supply Voltage.
Open-Loop Gain (dB) Load Resistance 100k 2.3V 5.5V
FIGURE 2-22: Output Voltage Headroom Output Current Magnitude.
Open-Loop Gain (dB)
Power Supply Voltage
FIGURE 2-20: Load Resistance.
Open-Loop Gain
FIGURE 2-23: Open-Loop Gain Power Supply Voltage.
Channel-to-Channel Seperation (dB) 1.E+02 1.E+03 1.E+04 Frequency (Hz) 100k 1.E+05
GBWP
100k Load Resistance
1,000
Referred Input
Gain Bandwidth Product (kHz)
Phase Margin
FIGURE 2-21: Gain-Bandwidth Product, Phase Margin Load Resistance.
FIGURE 2-24: Channel-to-Channel Separation Frequency (MCP617 MCP619 only).
DS21613C-page
2008 Microchip Technology Inc.
MCP616/7/8/9
Note: Unless otherwise indicated, +2.3V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2
Open-Loop Gain (dB) Gain Phase Open-Loop Phase -120 -150 -180 -210 CMRR, PSRR (dB) PSRR+ CMRR PSRR80 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Frequency (Hz)
-240 0.01 1.E+ 1.E- 1.E- 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 100k 1.E+ Frequency (Hz)
1.E+04
FIGURE 2-25: Frequency.
10,000 Input Noise Voltage Density (nV/Hz)
Open-Loop Gain, Phase
FIGURE 2-28: Frequency.
Maximum Output Voltage Swing (VP-P)
CMRR, PSRR
10,000 Input Noise Current Density (fA/Hz)
5.5V 2.3V
1,000
1,000
1.E- 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 Frequency (Hz)
1.E+02
1.E+03 1.E+04 Frequency (Hz)
100k 1.E+05
FIGURE 2-26: Input Noise Voltage, Current Densities Frequency.
Gain
FIGURE 2-29: Maximum Output Voltage Swing Frequency.
Gain Output Voltage mV/div)
Output Voltage mV/div)
Time µs/div)
Time µs/div)
FIGURE 2-27: Pulse Response.
Small-Signal, Non-Inverting
FIGURE 2-30: Pulse Response.
Small-Signal, Inverting
2008 Microchip Technology Inc.
DS21613C-page
MCP616/7/8/9
Note: Unless otherwise indicated, +2.3V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2
Time µs/div) Gain 5.0V Output Voltage Time µs/div)
Gain 5.0V
Output Voltage
FIGURE 2-31: Pulse Response.
Output Voltage Output High-Z
Large-Signal, Non-Inverting
FIGURE 2-34: Pulse Response.
Internal Switch Output
Large-Signal, Inverting
Chip Select Voltage
5.0V Gain VOUT Output Output High-Z Time s/div)
5.0V Hysteresis Output
swept High-to-Low
swept Low-to-High
Output High-Z
Chip Select Voltage
FIGURE 2-32: Chip Select (CS) Amplifier Output Response Time (MCP618 only).
Input, Output Voltages Time (100 µs/div) VOUT
FIGURE 2-35: Chip Select (CS) Internal Hysteresis (MCP618 only).
1.E-02 1.E-03 1.E-04 100µ 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10 1.E-11 1.E-12
Input Current Magnitude
Gain 5.0V
+125°C +85°C +25°C -40°C
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 Input Voltage
FIGURE 2-33: MCP616/7/8/9 Show Phase Reversal.
FIGURE 2-36: Measured Input Current Input Voltage (below VSS).
DS21613C-page
2008 Microchip Technology Inc.
MCP616/7/8/9
DESCRIPTIONS
Descriptions pins listed Table 3-1.
TABLE 3-1:
MCP616
FUNCTION TABLE
MCP617 MCP618 MCP619 PDIP, SOIC, TSSOP Symbol Description
MSOP, MSOP, MSOP, PDIP, SOIC PDIP, SOIC PDIP, SOIC
VOUT, VOUTA VIN-, VINA- VIN+, VINA+ VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD
Output Inverting Input Non-inverting Input Positive Power Supply Non-inverting Input Inverting Input Output Output Inverting Input Non-inverting Input Negative Power Supply Non-inverting Input Inverting Input Output Chip Select Internal Connection
Analog Outputs
Power Supply Pins (VDD, VSS)
output pins low-impedance voltage sources.
Analog Inputs
non-inverting inverting inputs highimpedance inputs with bias currents.
positive power supply (VDD) 2.3V 5.5V higher than negative power supply (VSS). normal operation, other pins voltages between VDD. Typically, these parts used single-supply (positive) supply configuration. this case, connected ground connected supply. will need bypass capacitors.
Chip Select Digital Input (CS)
This CMOS, Schmitt-triggered input that places MCP618 into low-power mode operation.
2008 Microchip Technology Inc.
DS21613C-page
MCP616/7/8/9
NOTES:
DS21613C-page
2008 Microchip Technology Inc.
MCP616/7/8/9
APPLICATIONS INFORMATION
(minimum expected (minimum expected MCP61X MCP616/7/8/9 family amps manufactured using Microchip's state-of-the-art CMOS process, which includes transistors. These amps unity-gain stable suitable wide range general purpose applications.
4.1.1
Rail-to-Rail Inputs
PHASE REVERSAL
MCP616/7/8/9 designed prevent phase reversal when input pins exceed supply voltages. Figure 2-36 shows input voltage exceeding supply voltage without phase reversal.
4.1.2
INPUT VOLTAGE CURRENT LIMITS
protection inputs depicted shown Figure 4-1. This structure chosen protect input transistors, minimize input bias current (IB). input diodes clamp inputs when they more than diode drop below VSS. They also clamp voltages that above VDD; their breakdown voltage high enough allow normal operation, enough bypass quick events within specified limits. Bond
FIGURE 4-2: Inputs.
Protecting Analog
also possible connect diodes left resistors this case, current through diodes needs limited some other mechanism. resistors then serve in-rush current limiters; current into input pins (VIN+ VIN-) should very small. significant amount current flow inputs when common mode voltage (VCM) below ground (VSS). (See Figure 2-36.) Applications that high impedance need limit usable voltage range.
4.1.3
VIN+ Bond Input Stage Bond VIN-
NORMAL OPERATION
Bond
inputs MCP616/7/8/9 amps connect differential input stage. common mode input voltage range (VCMR) includes ground single-supply systems (VSS), does include VDD. This means that amplifier input behaves linearly long common mode input voltage (VCM) kept within specified VCMR limits (VSS VDD-0.9V +25°C).
FIGURE 4-1: Structures.
Simplified Analog Input
Offsets
order prevent damage and/or improper operation these amps, circuit they must limit currents voltages VIN+ VIN- pins (see "Absolute Maximum Ratings beginning Section "Electrical Characteristics"). Figure shows recommended approach protecting these inputs. internal diodes prevent input pins (VIN+ VIN-) from going below ground, resistors limit possible current drawn input pins. Diodes prevent input pins (VIN+ VIN-) from going above VDD, dump currents onto VDD. When implemented shown, resistors also limit current through
MCP616/7/8/9 family amps have input differential pair that gives good performance. They have very input offset voltage (±150 maximum) +25°C, with typical bias current (sourced inputs). There must path ground power supply) from both inputs, will bias properly. resistances seen inputs (R1||R2 R4||R5 Figure 4-3) need equal less than minimize total offset.
2008 Microchip Technology Inc.
DS21613C-page
MCP616/7/8/9
EQUATION 4-1:
MCP61X VOUT VOOS [VOS ((R1 ||R2) REQ) ((R1 ||R2 VOUT VOOS Where: amp's noise gain (from non-inverting input output) circuit's output offset voltage amp's input offset voltage amp's input bias current amp's input offset current amp's coommon mode input voltage
FIGURE 4-3: Example Circuit Calculating Offset.
calculate bias point offset, convert circuit equivalent: Replace capacitors with open circuits Replace inductors with short circuits Replace voltage sources with short circuits Replace current sources with open circuits Convert sources resistances into their Thevenin equivalent form
VOOS
equivalent circuit Figure shown Figure 4-4. MCP61X VOUT
worst-case specs source values determine worst-case output voltage range offset your design. Make sure common mode input voltage range output voltage range exceeded.
Rail-to-Rail Output
FIGURE 4-4:
Equivalent Circuit.
There specifications that describe output swing capability MCP616/7/8/9 family amps. first specification (Maximum Output Voltage Swing) defines absolute maximum swing that achieved under specified load conditions. instance, output voltage swings within negative rail with load tied VDD/2. Figure 2-33 shows output voltage limited when input goes beyond linear region operation. second specification that describes output swing capability these amplifiers Linear Output Voltage Range. This specification defines maximum output swing that achieved while amplifier still operates linear region. verify linear operation this range, large-signal Open-Loop Gain (AOL) measured points inside supply rails. measurement must meet specified conditions specification table.
calculate nominal bias point with offset:
DS21613C-page
2008 Microchip Technology Inc.
MCP616/7/8/9
Capacitive Loads MCP618 Chip Select (CS)
Driving large capacitive loads cause stability problems voltage feedback amps. load capacitance increases, feedback loop's phase margin decreases closed-loop bandwidth reduced. This produces gain peaking frequency response, with overshoot ringing step response. unity-gain buffer most sensitive capacitive loads, though gains show same general behavior. When driving large capacitive loads with these amps (e.g., when +1), small series resistor output (RISO Figure 4-5) improves feedback loop's phase margin (stability) making output load resistive higher frequencies. bandwidth will generally lower than bandwidth with capacitive load. MCP618 single with Chip Select (CS). When pulled high, supply current drops (typical) flows through VSS. When this happens, amplifier output into high-impedance state. pulling low, amplifier enabled. internal (typical) pull-down resistor connected VSS, will pins left floating. Figure shows output voltage supply current response pulse.
Supply Bypass
With this family operational amplifiers, power supply (VDD single supply) should have local bypass capacitor (i.e., 0.01 within good high-frequency performance. bulk capacitor (i.e., larger) within provide large, slow currents. This bulk capacitor required shared with other analog parts.
RISO MCP61X VOUT
Unused Amps
FIGURE 4-5: Output Resistor, RISO stabilizes large capacitive loads.
Figure gives recommended RISO values different capacitive loads gains. x-axis normalized load capacitance (CL/GN), where circuit's noise gain. non-inverting gains, Signal Gain equal. inverting gains, 1+|Signal Gain| (e.g., gives V/V).
10,000 Recommended RISO
unused quad package (MCP619) should configured shown Figure 4-7. These circuits prevent output from toggling causing crosstalk. Circuits sets minimum noise gain. resistor divider produces desired reference voltage within output voltage range amp; buffers that reference voltage. Circuit uses minimum number components operates comparator, draw more current.
MCP619 VREF
MCP619
1,000
100p 1.E-11 1.E-10 1.E-09 1.E-08 Normalized Load Capacitance; L/GN
FIGURE 4-6: Recommended RISO Values Capacitive Loads.
After selecting RISO your circuit, double-check resulting frequency response peaking step response overshoot. Modify RISO's value until response reasonable. Bench evaluation simulations with MCP616/7/8/9 SPICE macro model helpful.
FIGURE 4-7:
Unused Amps.
2008 Microchip Technology Inc.
DS21613C-page
MCP616/7/8/9
Surface Leakage
4.9.1
Application Circuits
HIGH GAIN PRE-AMPLIFIER
applications where input bias current critical, Printed Circuit Board (PCB) surface leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current flow, which greater than MCP616/7/8/9 family's bias current 25°C typical). easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. example shown below Figure 4-8. Guard Ring VIN- VIN+
MCP616/7/8/9 amps well suited amplifying small signals produced low-impedance sources/sensors. offset voltage, offset current noise well this role. Figure shows typical pre-amplifier connected lowimpedance source RS). VDD/2 11.0 MCP616 VOUT
FIGURE 4-9:
High Gain Pre-amplifier.
FIGURE 4-8: Inverting Gain.
Example Guard Ring Layout
Non-inverting Gain Unity Gain Buffer: Connect non-inverting (VIN+) input with wire that does touch surface. Connect guard ring inverting input (VIN-). This biases guard ring common mode input voltage. Inverting Gain Transimpedance gain (convert current voltage, such photo detectors) amplifiers: Connect guard ring non-inverting input (VIN+). This biases guard ring same reference voltage (e.g., VDD/2 ground). Connect inverting (VIN-) input with wire that does touch surface.
best noise offset performance, source resistance needs less than resistances inputs equal minimize offset voltage caused input bias currents (Section Offsets"). this circuit, gain V/V, which will give typical bandwidth kHz.
4.9.2
INSTRUMENTATION AMPLIFIER
two-op instrumentation amplifier shown Figure 4-10 serves function taking difference input voltages, level-shifting gaining output. This configuration best suited higher gains (i.e., gain V/V). reference voltage (VREF) typically mid-supply (VDD/2) single-supply environment.
VOUT
VREF VOUT
MCP617
MCP617
FIGURE 4-10: Two-Op Instrumentation Amplifier.
specifications that make MCP616/7/8/9 family appropriate this application circuit input bias current, offset voltage high commonmode rejection.
DS21613C-page
2008 Microchip Technology Inc.
MCP616/7/8/9
4.9.3 THREE INSTRUMENTATION AMPLIFIER 4.9.4 PRECISION GAIN WITH GOOD LOAD ISOLATION
classic, three-op instrumentation amplifier illustrated Figure 4-11. two-input amps provide differential signal gain common mode gain output difference amplifier, which converts input signal from differential single-ended output; rejects common mode signals input. gain this circuit simply adjusted with resistor (RG). reference voltage (VREF) typically referenced mid-supply (VDD/2) singlesupply applications.
VOUT
Figure 4-12, MCP616 amp, provide high gain input signal (VIN). MCP616's offset voltage makes this accurate circuit. MCP606 configured unity-gain buffer. isolates MCP616's output from load, increasing high gain stage's precision. Since MCP606 higher output current, amplifiers housed separate packages, there minimal change MCP616's offset voltage loading effect.
VOUT
MCP616 MCP606 VOUT
MCP617 MCP616 VREF VOUT
FIGURE 4-12: Load Isolation.
Precision Gain with Good
MCP617
FIGURE 4-11: Three-Op Instrumentation Amplifier.
2008 Microchip Technology Inc.
DS21613C-page
MCP616/7/8/9
NOTES:
DS21613C-page
2008 Microchip Technology Inc.
MCP616/7/8/9
DESIGN AIDS
Microchip provides basic design tools needed MCP616/7/8/9 family amps.
Analog Demonstration Evaluation Boards
SPICE Macro Model
latest SPICE macro model MCP616/7/8/9 amps available Microchip site www.microchip.com. This model intended initial design tool that works well amp's linear region operation over temperature range. model file information capabilities. Bench testing very important part design cannot replaced with simulations. Also, simulation results using this macro model need validated comparing them data sheet specifications characteristic curves.
Microchip offers broad spectrum Analog Demonstration Evaluation Boards that designed help achieve faster time market. complete listing these boards their corresponding user's guides technical information, visit Microchip site www.microchip.com/ analogtools. boards that especially useful are: SOIC8EV: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board SOIC14EV: 14-Pin SOIC/TSSOP/DIP Evaluation Board
Application Notes
MindiCircuit Designer Simulator
Microchip's MindiCircuit Designer Simulator aids design various circuits useful active filter, amplifier power-management applications. free online circuit designer simulator available from Microchip site www.microchip.com/mindi. This interactive circuit designer simulator enables designers quickly generate circuit diagrams, simulate circuits. Circuits developed using Mindi Circuit Designer Simulator downloaded personal computer workstation.
following Microchip Application Notes available Microchip site www.microchip. com/ appnotes recommended supplemental reference resources. ADN003: "Select Right Operational Amplifier your Filtering Circuits", DS21821 AN722: "Operational Amplifier Topologies Specifications", DS00722 AN723: "Operational Amplifier Specifications Applications", DS00723 AN884: "Driving Capacitive Loads With Amps", DS00884 AN990: "Analog Sensor Conditioning Circuits Overview", DS00990 These application notes others listed design guide: "Signal Chain Design Guide", DS21825
Microchip Advanced Part Selector (MAPS)
MAPS software tool that helps semiconductor professionals efficiently identify Microchip devices that particular design requirement. Available cost from Microchip website www.microchip.com/ maps, MAPS overall selection tool Microchip's product portfolio that includes Analog, Memory, MCUs DSCs. Using this tool define filter sort features parametric search devices export side-by-side technical comparasion reports. Helpful links also provided Datasheets, Purchase, Sampling Microchip parts.
2008 Microchip Technology Inc.
DS21613C-page
MCP616/7/8/9
NOTES:
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2008 Microchip Technology Inc.
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PACKAGING INFORMATION
Package Marking Information
8-Lead MSOP XXXXXX YWWNNN Example: 616I 812256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Examples: MCP616 I/P256 0812 MCP616 0812
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW
Examples: MCP616 I/SN0812 MCP616I SN^^ 0812
Legend: XX.X
Customer-specific information Year code (last digit calendar year) Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code Pb-free JEDEC designator Matte (Sn) This package Pb-free. Pb-free JEDEC designator found outer packaging this package.
Note:
event full Microchip part number cannot marked line, will carried over next line, thus limiting number available characters customer-specific information.
2008 Microchip Technology Inc.
DS21613C-page
MCP616/7/8/9
Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP619) Examples:
XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
MCP619-I/P XXXXXXXXXXXXXX 0812256
MCP619 I/P^^ 0812256
14-Lead SOIC (150 mil) (MCP619)
Examples:
XXXXXXXXXX XXXXXXXXXX YYWWNNN
MCP619ISL XXXXXXXXXX 0812256
MCP619 I/SL 0812256
14-Lead TSSOP (MCP619)
Example:
XXXXXXXX YYWW
619IST 0812
DS21613C-page
2008 Microchip Technology Inc.
MCP616/7/8/9
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DS21613C-page
2008 Microchip Technology Inc.
MCP616/7/8/9
APPENDIX REVISION HISTORY
Revision (October 2008)
following list modifications: Added Section "Test Circuits". Added Figure 2-36. Added Section 4.1.1 "Phase Reversal", Section 4.1.2 "Input Voltage Current Limits", Section 4.1.3 "Normal Operation". Updated Figure 4-7. Updated Section "Design Aids". Updated Section "Packaging Information"
Revision (April 2005)
following list modifications: Clarified specifications found Section "Electrical Characteristics". Updated Section "Typical Performance Curves" added input noise current density plot. Added Section "Pin Descriptions". Updated Section "Applications Information". Updated SPICE macro model added information FilterLab software, Section "Design Aids". Corrected package marking information (Section "Packaging Information"). Added Appendix "Revision History".
Revision (April 2001)
Original Release this Document.
2008 Microchip Technology Inc.
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NOTES:
DS21613C-page
2008 Microchip Technology Inc.
MCP616/7/8/9
PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device Temperature Range Package Examples:
Device: MCP616: MCP616T: MCP617: MCP617T: MCP618: MCP618T: MCP619: MCP619T: Single Operational Amplifier Single Operational Amplifier (Tape Reel SOIC, MSOP) Dual Operational Amplifier Dual Operational Amplifier (Tape Reel SOIC MSOP) Single Operational Amplifier w/Chip Select (CS) Single Operational Amplifier w/Chip Select (CS) (Tape Reel SOIC MSOP) Quad Operational Amplifier Quad Operational Amplifier (Tape Reel SOIC TSSOP)
MCP616-I/P: MCP616-I/SN: MCP616T-I/MS:
Industrial Temperature, lead PDIP. Industrial Temperature, lead SOIC. Tape Reel, Industrial Temperature, lead MSOP. Industrial Temperature, lead MSOP. Tape Reel, Industrial Temperature, lead MSOP. Industrial Temperature, lead PDIP. Industrial Temperature, lead SOIC. Tape Reel, Industrial Temperature, lead SOIC. Industrial Temperature, lead PDIP. Tape Reel, Industrial Temperature, lead SOIC. Tape Reel, Industrial Temperature, lead TSSOP. Industrial Temperature, lead PDIP.
MCP617-I/MS: MCP617T-I/MS:
MCP617-I/P:
Temperature Range: Package:
-40°C +85°C
Plastic MSOP, 8-lead Plastic (300 Body), 8-lead, 14-lead Plastic SOIC (3.90 body), 8-lead Plastic SOIC (3.90 Body), 14-lead (MCP619) Plastic TSSOP (4.4mm Body), 14-lead (MCP619)
MCP618-I/SN: MCP618T-I/SN:
MCP618-I/P:
MCP619T-I/SL:
MCP619T-I/ST:
MCP619-I/P:
2008 Microchip Technology Inc.
DS21613C-page
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NOTES:
DS21613C-page
2008 Microchip Technology Inc.
Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip devices life support and/or safety applications entirely buyer's risk, buyer agrees defend, indemnify hold harmless Microchip from damages, claims, suits, expenses resulting from such use. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights.
Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt UNI/O registered trademarks Microchip Technology Incorporated U.S.A. other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock ZENA trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2008, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper.
Microchip received ISO/TS-16949:2002 certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona; Gresham, Oregon design centers California India. Company's quality system processes procedures PIC® MCUs dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified.
2008 Microchip Technology Inc.
DS21613C-page
WORLDWIDE SALES SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Address: www.microchip.com Atlanta Duluth, Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, Tel: 765-864-8360 Fax: 765-864-8387 Angeles Mission Viejo, Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 China Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049
ASIA/PACIFIC
India Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934 Malaysia Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Hsin Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
01/02/08
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2008 Microchip Technology Inc.

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