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±150 1.8V 5.5V (CS) MCP6033 -40°C +125°C MCP6031/2/3/4 1.8V (0.9


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MCP6031/2/3/4
±150 1.8V 5.5V (CS) MCP6033 -40°C +125°C
MCP6031/2/3/4 1.8V (0.9 (±150 MCP6031/2/3/4 MCP6031/2/3/4 (MCP6031) (CS) (MCP6033) (MCP6032) (MCP6034) MCP6031/2/3/4 CMOS 1.8V 5.5V
SPICE FilterLab® Mindi MAPS
MCP6031 SOIC MSOP
VIN- VIN+ VOUT
MCP6032 SOIC MSOP
VOUTA VINA- VINA+ VOUTB VINB5 VINB+
VOUT 1.8V 5.5V MCP6031 -(10
MCP6033 SOIC MSOP
VIN- VIN+ VOUT
MCP6034 SOIC TSSOP
VOUTA VINA- VINA+ VINB+ VINB- VOUTB VOUTD VIND12 VIND+ VINC+ VINC8 VOUTC
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
7.0V (VIN+VIN-). (VIN+VIN-) .VSS 1.0V 1.0V .VSS 0.3V 0.3V |VDD VSS| .±30 -65°C +150°C (TJ).+150°C (HBM; kV400V
4.1.2
+25°CVDD +1.8V +5.5VVSS VDD/2VOUT VDD/2VL VDD/2
-150 0.2V VOUT (VDD 0.2V) ±3.0 ±1.0 2000 ±1.0
+150 5000
3.0VVCM VDD/3
VOS/TA PSRR VCMR CMRR ZDIFF
µV/°C -40°C +125°C 3.0VVCM VDD/3 ||pF ||pF -0.3V 2.1V 1.8V -0.3V 5.8V 5.5V 2.75V 5.8V 5.5V -0.3V 2.75V 5.5V +85°C +125°C
DS22041A_JP
2007 Microchip Technology Inc.
MCP6031/2/3/4
+25°CVDD +1.8V +5.5VVSS VDD/2VOUT VDD/2VL VDD/2
1.35 0VCM 5.5V 0.5V 1.8V 5.5V
+25°CVDD +1.8 +5.5VVSS GNDVCM VDD/2 VOUT VDD/2VL VDD/2CL
µVp-p fA/Hz nV/Hz GBWP V/ms
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
MCP6033 (CS)
+1.8V +5.5VVSS GNDTA +25°CVCM VDD/2 VOUT VDD/2VL VDD/2CL
High High High High High-Z 0.2VDDVOUT 0.9VDD/2 V/VVIN VDD/2 0.8VDDVOUT 0.1VDD/2 V/VVIN VDD/2 ICSH IO(LEAK) 0.8VDD -400 ICSL 0.2VDD
tOFF
VHYST
0.3VDD
VOUT High-Z
tOFF High-Z
-0.9
-400
-400
1-1:
MCP6033
DS22041A_JP
2007 Microchip Technology Inc.
MCP6031/2/3/4
+1.8V +5.5V
8L-SOIC 8L-MSOP 14L-SOIC 14L-TSSOP °C/W °C/W °C/W °C/W +125 +150
(TJ) +150°C
DCAC
MCP603X VOUT
1-2:
MCP603X VOUT
1-3:
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
+25°CVDD +1.8V +5.5VVSS GNDVCM VDD/2VOUT VDD/2 VDD/2RL
(µV) -150 -120 (µV)
1424 3.0V VDD/3
-100 -200 -300 -400 -0.5
3.0V -40°C +25°C +85°C +125°C
2-1:
3.0V VDD/3
2-4:
3.0V
-40°C +25°C +85°C +125°C
(µV/) (µV)
1080 3.0V VDD/3 -40°C+125°C
-100 -200 -300 -400 -0.4
1.8V
-0.2
2-2:
3.0VVCM VDD/3
2-5:
1.8V
(µV) -100 -200 -300 -400
5.5V
(µV)
-40°C +25°C +85°C +125°C
-100 -150 -200 -250
3.0V
5.5V
1.8V
-0.5
2-3:
5.5V
2-6:
DS22041A_JP
2007 Microchip Technology Inc.
MCP6031/2/3/4
+25°CVDD +1.8V +5.5VVSS GNDVCM VDD/2VOUT VDD/2 VDD/2RL
1,000 (nV/Hz)
PSRR, CMRR (dB)
CMRR (VDD 1.8V, -0.3V 2.1V)
CMRR (VDD 5.5V, -0.3V 5.8V)
PSRR (VDD 1.8V 5.5V, VSS)
1E-1
1E+0
1E+1
1E+2
1E+3
1E+4
100k 1E+5
(Hz)
(°C)
2-7:
2-10:
(pA)
(nV/Hz)
-0.5
5.5V
10000 1000
5.5V
2-8:
2-11:
PSRR-
10000 (pA)
5.5V
CMRRPSRR (dB)
PSRR+ CMRR
1000
+125°C
+85°C
5.5V
(Hz)
1000
2-9:
2-12:
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
+25°CVDD +1.8V +5.5VVSS GNDVCM VDD/2VOUT VDD/2 VDD/2RL
(V/V)
5.5V 5.5V
5.5V
(µA/)
-120 -150 -180 -210 100k (Hz)
1.8V 1.8V
0.001 0.01 0.01
2-13:
2-16:
+125°C +85°C +25°C -40°C
(A/)
(dB)
0.2V VOUT 0.2V
2-14:
2-17:
+125°C +85°C +25°C -40°C
5.5V 0.00 0.05
(A/)
(dB)
1.8V
0.10
0.15
0.20
0.25
2-15:
VOUT VOUT
2-18:
DS22041A_JP
2007 Microchip Technology Inc.
MCP6031/2/3/4
+25°CVDD +1.8V +5.5VVSS GNDVCM VDD/2VOUT VDD/2 VDD/2RL
(dB)
(kHz)
1.8V
1,000 (Hz)
10,000
(°C)
2-19:
(MCP6032/4
2-22:
(mA)
-40°C +25°C +85°C +125°C
(dB)
5.5V
2-20:
-0.5
2-23:
5.5V
(VP-P)
3.0V 1.8V
(kHz)
5.5V
1000 10000
(°C)
(Hz)
2-24:
2-21:
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
+25°CVDD +1.8V +5.5VVSS GNDVCM VDD/2VOUT VDD/2 VDD/2RL
1000 VOH, (mV) mV/div)
-1V8V 1.8V
5.5V 5.5V
5.5V
100µ
(100 µs/Div)
2-25:
2-28:
(mV)
5.5V
mV/div)
5.5V
(°C)
(100 µs/Div)
2-29:
2-26:
5.5V 1.8V
(V/ms)
5.5V
5.5V 1.8V
(0.5 ms/div)
(°C)
2-30:
2-27:
DS22041A_JP
2007 Microchip Technology Inc.
MCP6031/2/3/4
+25°CVDD +1.8V +5.5VVSS GNDVCM VDD/2VOUT VDD/2 VDD/2RL
5.5V
High
5.5V
High
High-Z
(0.5 ms/div)
2-31:
VOUT
2-34:
(CS) (MCP6033 )VDD 5.5V
3.0V
-1.0 ms/div)
5.0V
High-Z High High
2-32:
MCP6031/2/3/4
2-35:
(CS) (MCP6033 )VDD 3.0V
-1.0 -2.0 -3.0 -4.0 -5.0 -6.0 -7.0 -8.0
1.8V
5.5V kVSS High-Z
High-Z
High
High
High-Z
ms/div)
2-33:
(CS) (MCP6033
2-36:
(CS) (MCP6033 )VDD 1.8V
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
+25°CVDD +1.8V +5.5VVSS GNDVCM VDD/2VOUT VDD/2 VDD/2RL
100000 100k
10000 1000 1000 100k 10000 100000
1.00E-02 1.00E-03 100µ 1.00E-04 1.00E-05 1.00E-06 100n 1.00E-07 1.00E-08 1.00E-09 100p 1.00E-10 1.00E-11 1.00E-12
-IIN
+125°C +85°C +25°C -40°C
(Hz)
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1
2-37:
2-38:
(VSS
DS22041A_JP
2007 Microchip Technology Inc.
MCP6031/2/3/4
3-1:
MCP6031
MCP6032 MCP6033 MCP6034
VOUTVOUTA VIN-VINA- VIN+VINA+ VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD
(VSS VDD)
(VDD) (VSS) 1.8V 5.5V 0.01
CMOS
(CS)
MCP6033 CMOS
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
MCP603X
MCP6031/2/3/4 CMOS
4.1.1
MCP6031/2/3/4 2-32
4.1.2
4-2:
(IB)
(VIN+ VIN-) (VCM) (VSS)
4.1.3
VIN+
VIN-
MCP6031/2/3/4 (VCM) 0.3V 0.3V
4-1:
VIN+ VIN- (VIN+ VIN-) (VIN+ VIN-)
DS22041A_JP
2007 Microchip Technology Inc.
MCP6031/2/3/4
MCP603X RISO VOUT
MCP6031/2/3/4 VDD/2 5.5V 2-25 2-26
4-3: (RISO)
MCP6031/2/3/4 (CS) 2.5V (0.9 15.9 (1/2fC) Vp-p (1.77 Vrms)
RISO (CL/ GN)GN V/V)
1000000
RISO
100k 100000
10000
4-1:
PSupply (VDD VSS) VL(p-p) (5V)(0.9 5.0Vp-p 100Hz
1000 100p 100n 1.E-11 1.E-10 1.E-09 1.E-08 1.E-07 1.E-06 CL/GN
4-4:
RISO
RISO RISO SPICE MCP6031/2/3/4
RISO
MCP6033 (CS)
MCP6033 (CS)
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
VIN- VIN+
VDD) 0.01
4-6:
(MCP6034)
MCP6034 MCP6034
4-5:
(VIN+) (VIN-) (VIN+) VDD/2 (VIN-)
(PCB) 1012 MCP6031/2/3/4 +25°C (±1.0
DS22041A_JP
2007 Microchip Technology Inc.
MCP6031/2/3/4
4.9.1
4.9.2
MCP6031/2/3/4 0.3V (0.9 (IDD)
VOUT 1.8V 5.5V MCP6031
VREF
MCP6031
VREF
MCP6541
VOUT
4-8:
-(10
4-7:
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
MCP6031/2/3/4
SPICE
MCP6031/2/3/4 SPICE www.microchip.com model
www.microchip.com/analogtools SOIC8EV: SOIC/MSOP/TSSOP/DIP SOIC14EV: SOIC/TSSOP/DIP
FilterLab®
FilterLab® www.microchip.com/ filterlab FilterLab SPICE
www.microchip.com/appnotes AN003: DS00003 AN722: DS00722 AN723: DS00723 AN884: DS00884 AN990: DS00990 DS21825
Mindi
Mindi www.microchip.com/mindi Mindi
MAPS
MAPS MAPS www.microchip.com/ maps
DS22041A_JP
2007 Microchip Technology Inc.
MCP6031/2/3/4
MSOP XXXXXX YWWNNN 6031E 711256
SOIC (150 mil) XXXXXXXX XXXXYYWW
MCP6033E SN^^0711
XX.X
(Sn) JEDEC JEDEC(
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
SOIC (150 mil) (MCP6034)
XXXXXXXXXX XXXXXXXXXX YYWWNNN
MCP6034 E/SL^^ 0711256
TSSOP (MCP6034)
XXXXXX YYWW
6034EST 0711
XX.X
(Sn) JEDEC JEDEC(
DS22041A_JP
2007 Microchip Technology Inc.
MCP6031/2/3/4
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Note: most current package drawings, please Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness
MILLIMETERS 0.65 0.75 0.00 0.85 4.90 3.00 3.00 0.40 0.08 0.60 0.95 0.23 0.80 1.10 0.95 0.15
Lead Width 0.22 0.40 Notes: visual index feature vary, must located within hatched area. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-111B
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
8-Lead Plastic Small Outline (SN) Narrow, 3.90 Body [SOIC]
Note: most current package drawings, please Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom 0.17 0.31 0.25 0.40 1.25 0.10
MILLIMETERS 1.27 6.00 3.90 4.90 1.04 0.25 0.51 0.50 1.27 1.75 0.25
Notes: visual index feature vary, must located within hatched area. Significant Characteristic. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-057B
DS22041A_JP
2007 Microchip Technology Inc.
MCP6031/2/3/4
14-Lead Plastic Small Outline (SL) Narrow, 3.90 Body [SOIC]
Note: most current package drawings, please Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom 0.17 0.31 0.25 0.40 1.25 0.10
MILLIMETERS 1.27 6.00 3.90 8.65 1.04 0.25 0.51 0.50 1.27 1.75 0.25
Notes: visual index feature vary, must located within hatched area. Significant Characteristic. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-065B
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
14-Lead Plastic Thin Shrink Small Outline (ST) Body [TSSOP]
Note: most current package drawings, please Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Footprint Foot Angle Lead Thickness
MILLIMETERS 0.65 0.80 0.05 4.30 4.90 0.45 0.09 1.00 6.40 4.40 5.00 0.60 1.00 0.20 4.50 5.10 0.75 1.20 1.05 0.15
Lead Width 0.19 0.30 Notes: visual index feature vary, must located within hatched area. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-087B
DS22041A_JP
2007 Microchip Technology Inc.
MCP6031/2/3/4
(2007
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
DS22041A_JP
2007 Microchip Technology Inc.
MCP6031/2/3/4
MCP6031: MCP6031T: MCP6032: MCP6032T: MCP6033: MCP6033T: MCP6034: MCP6034T:
SOIC MCP6031T-E/SN: SOIC MCP6031-E/MS: MSOP MCP6031T-E/MS: MSOP SOIC MCP6032T-E/SN: SOIC MCP6032-E/MS: MSOP MCP6032T-E/MS: MSOP SOIC MCP6033T-E/SN: SOIC MCP6033-E/MS: MSOP MCP6033T-E/MS: MSOP SOIC MCP6034T-E/SL: SOIC MCP6034-E/ST: TSSOP MCP6034T-E/ST: TSSOP MCP6034-E/SL: MCP6033-E/SN: MCP6032-E/SN:
MCP6031-E/SN:
-40°C +125°C MSOP8 SOIC(150mil SOIC(150mil TSSOP(4.4mm
2007 Microchip Technology Inc.
DS22041A_JP
MCP6031/2/3/4
DS22041A_JP
2007 Microchip Technology Inc.
Microchip Microchip Accuron dsPICKEELOQKEELOQ microIDMPLAB PICPICmicroPICSTARTPRO MATErfPIC SmartShunt Microchip Technology Incorporated AmpLabFilterLabLinear Active ThermistorMigratable Embedded Control Solutions Company Microchip Technology Incorporated Analog-for-the-Digital AgeApplication Maestro dsSPEAKECANECONOMONITORFanSense FlexROMfuzzyLABIn-Circuit Serial Programming ICSPICEPICMindiMiWiMPASMMPLAB Certified MPLIBMPLINKPICkitPICDEM PowerMatePowerToolReal ICErfLABSelect Mode Smart SerialSmartTelTotal EnduranceUNI/O WiperLockZENA Microchip Technology Incorporated SQTP Microchip Technology Incorporated 2007, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved.
Chandler Tempe Gresham ISO/TS-16949:2002 PIC® dsPIC® DSCKEELOQ® EEPROM 9001:2000
2007 Microchip Technology Inc.
DS22041A_JP
2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 http://support.microchip.com www.microchip.com
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Santa Clara, Tel: 408-961-6444 Fax: 408-961-6445
Tel: 886-2-2500-6610 Fax: 886-2-2508-0102
Tel: 86-27-5980-5300 Fax: 86-27-5980-5118
Tel: 66-2-694-1351 Fax: 66-2-694-1350
Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
Tel: 86-29-8833-7252 Fax: 86-29-8833-7256
06/25/07
DS22041A_JP
2007 Microchip Technology Inc.

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