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MCP6291/1R/2/3/4/5 mA10 2.4V 6.0V -40°C +125°C (MCP6293) (MC


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MCP6291/1R/2/3/4/5
mA10
2.4V 6.0V -40°C +125°C (MCP6293) (MCP6295)
MCP6291/1R/2/3/ (GBWP) 2.4V MCP6291/1R/2/3/4/5 CMOS MCP6295 (CS) MCP6291/1R/2/3/4/5 -40°C +125°C 2.4V 6.0V
PCPDA
SPICE FilterLab® Mindi MAPS
MCP6291 PDIP, SOIC, MSOP
MCP6291 SOT-23-5
VOUT VIN+ VIN-
MCP6291R SOT-23-5
VOUT VIN+ VIN-
VOUT
VOUTA VINA_ VINA+
MCP6292 PDIP, SOIC, MSOP
VOUTB VINB_ VINB+
VIN+
MCP6293 PDIP, SOIC, MSOP
VIN_ VIN+ VOUT VOUT VIN+
MCP6293 SOT-23-6
VIN-
VOUTA VINA_ VINA+ VINB+ VINB_ VOUTB
MCP6294 PDIP, SOIC, TSSOP
VOUTD
MCP6295 PDIP, SOIC, MSOP
VOUTA/VINB+ VINA
VIND_
VIND+ VINC+ VOUTC
VOUTB
VINB
VINA+
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
7.0V (VIN+VIN-) 1.0V 1.0V 0.3V 0.3V |VDD VSS| -65°C +150°C (TJ).+150°C (HBM; 400V 4.1.2
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.4V +5.5V, GND, VOUT VDD/2, VDD/2, VDD/2, tied (refer Figure Figure 1-3). Parameters Input Offset Input Offset Voltage Input Offset Voltage (Extended Temperature) Input Offset Temperature Drift Power Supply Rejection Ratio Input Bias Current Temperature Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode (Note Common Mode Input Range Common Mode Rejection Ratio Common Mode Rejection Ratio Open-Loop Gain Open-Loop Gain (Large Signal) Output Maximum Output Voltage Swing Output Short Circuit Current Power Supply Supply Voltage Quiescent Current Amplifier -40°C +125°C (Note VOL, 0.5V Input Overdrive VOUT 0.2V 0.2V, (Note VCMR CMRR CMRR -0.3V 2.5V, -0.3V 5.3V, VOS/TA PSRR ZDIFF -3.0 -5.0 ±1.7 ±1.0 ±1.0 1013||6 1013||3 +3.0 +5.0 µV/°C ||pF ||pF (Note -40°C +125°C, (Note -40°C +125°C, (Note (Note Note +85°C (Note +125°C (Note Note Note Note Units Conditions
Input Bias, Input Offset Current Impedance
MCP6295 VOUTA/VINB+ VINB-) MCP6295 VINB- MCP6295 VOUTA/VINB+ MCP6295 VINB- (VCMR) MCP6295 VOUTA/VINB+ 2007 6.0V 2.4V 5.5V
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied (refer Figure Figure 1-3). Parameters Response Gain Bandwidth Product Phase Margin Unity-Gain Slew Rate Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density µVP-P nV/Hz fA/Hz GBWP 10.0 V/µs Units Conditions
MCP6293/MCP6295 (CS)
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied (refer Figure Figure 1-3). Parameters Specifications Logic Threshold, Input Current, High Specifications Logic Threshold, High Input Current, High Current Amplifier Amplifier Output Leakage Dynamic Specifications Valid Amplifier Output, Turn-on Time High Amplifier Output High-Z Hysteresis VDD, V/V, VDD/2, VOUT VDD/2, 5.0V High VDD, V/V, VDD/2, VOUT VDD/2 ICSH -0.7 0.01 ICSL 0.01 Units Conditions
tOFF VHYST
0.01
(VIN) MCP6295 (VOUTB)
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
Electrical Characteristics: Unless otherwise indicated, +2.4V +5.5V GND. Parameters Temperature Ranges Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SOT-23 Thermal Resistance, 6L-SOT-23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-MSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W +125 +150 Note Units Conditions
(TJ) +150°C
VOUT Hi-Z -0.7 (typical) (typical) tOFF Hi-Z -0.7 (typical) (typical)
DCAC
VOUT VDD/2
-1.0 (typical) (typical)
MCP629X
1-1:
MCP6293 MCP6295 (CS)
1-2:
VOUT
VDD/2
MCP629X
1-3:
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
+25°CVDD +2.4V +5.5VVSS GNDVCM VDD/2VOUT VDD/2 VDD/2RL VLCL pFCS
Percentage Occurrences
Percentage Occurrences
Samples
Samples -40°C +125°C
-2.8
-2.4
-2.0
-1.6
-1.2
-0.8
-0.4
2600 2800
Input Offset Voltage (mV)
Input Offset Voltage Drift (µV/°C)
2-1:
2-4:
Percentage Occurrences
Percentage Occurrences
Samples 85°C
Samples +125°C
1000
1200
1400
1600
1800
2000
2200
2400
Input Bias Current (pA)
Input Bias Current (pA)
2-2:
+85°C
2-5:
+125°C
Input Offset Voltage (µV)
Input Offset Voltage (µV)
2.4V
-40°C +25°C +85°C +125°C
-0.5
5.5V -0.5
+125°C +85°C +25°C -40°C
Common Mode Input Voltage
Common Mode Input Voltage
2-3:
2.4V
2-6:
5.5V
2009 Microchip Technology Inc.
DS21812E_JP
3000
MCP6291/1R/2/3/4/5
+25°CVDD +2.4V +5.5VVSS GNDVCM VDD/2VOUT VDD/2 VDD/2RL VLCL pFCS
Representative Part 10,000
Input Offset Voltage (µV)
Input Bias, Offset Currents (pA)
5.5V
1,000
Input Bias Current Input Offset Current
5.5V 2.4V
Output Voltage
Ambient Temperature (°C)
2-7:
2-10:
CMRR PSRRPSRR+
CMRR, PSRR (dB)
PSRR, CMRR (dB)
CMRR PSRR
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
100k
Frequency (Hz)
Ambient Temperature (°C)
2-8:
CMRR PSRR
2-11:
CMRR PSRR
Input Bias, Offset Currents (pA)
+85°C 5.5V
Input Bias Current
Input Bias, Offset Currents (nA)
-0.5 -1.0
+125°C 5.5V Input Bias Current
Input Offset Current
Input Offset Current
Common Mode Input Voltage
Common Mode Input Voltage
2-9:
+85°C
2-12:
+125°C
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
+25°CVDD +2.4V +5.5VVSS GNDVCM VDD/2VOUT VDD/2 VDD/2RL VLCL pFCS
1000
+125°C +85°C +25°C -40°C
Ouput Voltage Headroom (mV)
Quiescent Current (mA/Amplifier)
0.01
Power Supply Voltage
Output Current Magnitude (mA)
2-13:
2-16:
GBWP, 5.5V GBWP, 2.4V
Open-Loop Phase
Phase
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07
-120 -150 -180 100k -210 100M
1.E+08
5.5V 2.4V
Frequency (Hz)
Ambient Temperature (°C)
2-14:
2-17:
Falling Edge, 5.5V 2.4V
Maximum Output Voltage Swing P-P)
Slew Rate (V/µs)
Rising Edge, 5.5V 2.4V
5.5V 2.4V
1.E+03
1.E+04
1.E+05
1.E+06
100k
1.E+07
Frequency (Hz)
Ambient Temperature (°C)
2-15:
2-18:
2009 Microchip Technology Inc.
DS21812E_JP
Phase Margin
Gain
Gain Bandwidth Product (MHz)
Open-Loop Gain (dB)
MCP6291/1R/2/3/4/5
+25°CVDD +2.4V +5.5VVSS GNDVCM VDD/2VOUT VDD/2 VDD/2RL VLCL pFCS
1,000
Input Noise Voltage Density (nV/
Input Noise Voltage Density (nV/
5.0V
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
100k
Frequency (Hz)
Common Mode Input Voltage
2-19:
2-22:
Ouptut Short Circuit Current (mA)
Channel-to-Channel Separation (dB)
+125°C +85°C +25°C -40°C
Power Supply Voltage
Frequency (kHz)
2-20:
2-23:
(MCP6292 MCP6294MCP6295
5.5V Hysteresis
Op-Amp shuts here Op-Amp turns here
2.4V
shuts turns
Quiescent Current (mA/Amplifier)
Quiescent Current (mA/Amplifier)
swept high
Hysteresis
swept high
swept high
swept high
Chip Select Voltage
Chip Select Voltage
2-21:
2.4V (CS) (MCP6293 MCP6295
2-24:
5.5V (CS) (MCP6293 MCP6295
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
+25°CVDD +2.4V +5.5VVSS GNDVCM VDD/2VOUT VDD/2 VDD/2RL VLCL pFCS
+1V/V 5.0V -1V/V 5.0V
Output Voltage
0.E+00 1.E-06 2.E-06 3.E-06 4.E-06 5.E-06 6.E-06 7.E-06 8.E-06 9.E-06 1.E-05
Output Voltage
0.E+00 1.E-06 2.E-06 3.E-06 4.E-06 5.E-06 6.E-06 7.E-06 8.E-06 9.E-06 1.E-05
Time µs/div)
Time µs/div)
2-25:
+1V/V
2-28:
-1V/V
Output Voltage mV/div)
Time (200 ns/div)
Output Voltage mV/div)
Time (200 ns/div)
2-26:
2-29:
Chip Select, Output Voltages
Voltage
Chip Select, Output Voltages
2.4V +1V/V
0.E+00 5.E-06 1.E-05 2.E-05 2.E-05 3.E-05 3.E-05 4.E-05 4.E-05
Voltage
5.5V +1V/V
VOUT
Output
VOUT
Output
Output High-Z
5.E-05 5.E-05
Output High-Z
0.E+00 5.E-06 1.E-05 2.E-05 2.E-05 3.E-05 3.E-05 4.E-05 4.E-05 5.E-05 5.E-05
Time µs/div)
Time µs/div)
2-27:
2.4V (CS) (MCP6293MCP6295)
2-30:
5.5V (CS) (MCP6293MCP6295
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
+25°CVDD +2.4V +5.5VVSS GNDVCM VDD/2VOUT VDD/2 VDD/2RL VLCL pFCS
1.E-02 1.E-03 100µ 1.E-04 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10 1.E-11 1.E-12
5.0V +2V/V
Input Current Magnitude
Input, Output Voltage
VOUT
+125°C +85°C +25°C -40°C
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 Input Voltage
Time ms/div)
2-31:
(VSS
2-32:
MCP6291/1R/2/3/4/5
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
3-1:
MCP6291 MCP6293 MCP6291R SOT-23-5 PDIP, SOIC, MSOP Symbol SOT-23-6 VOUT VIN- VIN+ Analog Output Inverting Input Non-inverting Input Positive Power Supply Negative Power Supply Chip Select Internal Connection Description
PDIP, SOIC, MSOP 1,5,8
3-2:
MCP6292
MCP6294 MCP6295 Symbol VOUTA VINA- VINA+ VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD VOUTA/VINB+ Analog Output Inverting Input Non-inverting Input Positive Power Supply Non-inverting Input Inverting Input Analog Output Analog Output Inverting Input Non-inverting Input Negative Power Supply Non-inverting Input Inverting Input Analog Output Analog Output A)/Non-inverting Input Chip Select Description
CMOS
CMOS
MCP6295 VOUTA/VINB+
(VDD) (VSS) 2.4V 6.0V
MCP6295 VOUTA/VINB+
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
MCP6291/1R/2/3/4/5 CMOS MCP6291/1R/2/3/4/5
MCP629X VOUT (minimum expected (minimum expected
4.1.1
MCP6291/1R/2/3/4/5 2-32
4.1.2
4-2:
(IB)
Bond
(VIN+ VIN-) (VCM) (VSS) 2-31
4.1.3
VIN+ Bond
Input Stage
Bond
Bond
MCP6291/1R/2/3/4/5 CMOS (VCM) 0.3V (VOS) 0.3V 0.3V 1.1V
4-1:
VIN- (1.0 (VIN+ VIN-) (VIN+ VIN-)
MCP6291/1R/2/3/4/5 VDD/2 5.5V 2-16
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
MCP629X
RISO MCP6293 MCP6295 (CS) High
(MCP6295)
MCP629X
RISO VOUT
4-3:
(RISO)
MCP6295 (CS) MCP629X
VOUTA/VINB+ VINB- VINA- VINA+ MCP6295 VOUTB
RISO (CL/GN) V/V)
Recommended
4-5:
1,000 10,000 Normalized Load Capacitance; CL/GN (pF)
10136
4-4:
RISO
RISO RISO MCP6291/1R/2/3/4/5 SPICE
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
VDD) (0.01 (PCB) 1012 MCP6291/1R/2/3/ 25°C
VIN- VIN+
(MCP6294)
MCP6294 VREF MCP6294
Guard Ring
4-7:
4-6:
(VIN+) VDD/2 (VIN-) (VIN+) (VIN-)
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
4.9.1
4.9.3
MCP6291/1R/2/3/4/5
VOUT
MCP6295 MCP6295
MCP6291 VDD/2
4.9.3.1
4-8:
4.9.2
MCP6295 VOUTB Load
VOUT
VOUT
4-10:
light
MCP6291 VDD/2
4-9:
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
4.9.3.2 4.9.3.4
4-11
VOSA VOSB
4-13 1/(2R1C1)
VOUT
MCP6295
4-13: 4.9.3.5
MCP6295
VOUT
4-11: 4.9.3.3
4-14
MCP6295 VOUT
4-12 (CMRR) 0.1%)
VIN2 MCP6295 VOUT
VIN1
4-14:
4-12:
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
4.9.3.6 4.9.3.8
4-15 FilterLab® C3R6R7
VOUT
4-17
MCP6295
VREF MCP6295
4-15:
VOUT
4.9.3.7
4-16 FilterLab® C3R5R6
4-17:
VOUT
MCP6295
4-16:
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
MCP6291/1R/2/3/4/5
SPICE
MCP6291/1R/2/3/4/5 SPICE www.microchip.com
www.microchip.com/analogtools SOIC8EV: SOIC/MSOP/TSSOP/ SOIC14EV: SOIC/TSSOP/DIP
FilterLab®
FilterLab® www.microchip.com/ filterlab FilterLab SPICE
www.microchip.com/appnotes ADN003: DS21821 AN722: DS00722 AN723: DS00723 AN884: DS00884 AN990: DS00990 DS21825
Mindi
Mindi www.microchip.com/mindi Mindi
MAPS
MAPS MAPS www.microchip.com/maps
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
5-Lead SOT-23 (MCP6291 MCP6291R) Example:
Device
Code CJNN EVNN
XXNN
MCP6291 MCP6291R
CJ25
Example:
5-Lead SOT-23
6-Lead SOT-23 (MCP6283)
Device
Code CMNN
XXNN
8-Lead MSOP XXXXXX YWWNNN
MCP6293
6-Lead SOT-23
CM25
Example: 6291E 436256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Example: MCP6291 E/P256 0436 MCP6291 E/P^^256 0743
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW
Example: MCP6291 E/SN0436 MCP6291E SN^^0743
XX.X
(Sn) JEDEC JEDEC(
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
14-Lead PDIP (300 mil) (MCP6294) XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN Example:
MCP6294-E/P 0436256
MCP6294 E/P^^ 0743256
14-Lead SOIC (150 mil) (MCP6294)
Example:
XXXXXXXXXX XXXXXXXXXX YYWWNNN
MCP6294ESL 0436256
MCP6294 E/SL^^ 0436256
14-Lead TSSOP (MCP6294)
Example:
XXXXXX YYWW
6294EST 0436
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
(OT) [SOT-23]
Microchip Packaging Specification
Units Dimension Limits Number Pins Lead Pitch Outside Lead Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness Lead Width 0.90 0.89 0.00 2.20 1.30 2.70 0.10 0.35 0.08 0.20
MILLIMETERS 0.95 1.90 1.45 1.30 0.15 3.20 1.80 3.10 0.60 0.80 0.26 0.51
0.127 ASME Y14.5M BSC:
Microchip Technology Drawing C04-091B
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
(CH) [SOT-23]
Microchip Packaging Specification
LASER MARK
Units Dimension Limits Number Pins Pitch Outside Lead Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness Lead Width 0.90 0.89 0.00 2.20 1.30 2.70 0.10 0.35 0.08 0.20 MILLIMETERS 0.95 1.90
1.45 1.30 0.15 3.20 1.80 3.10 0.60 0.80 0.26 0.51
0.127 ASME Y14.5M BSC:
Microchip Technology Drawing C04-028B
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
(MS) [MSOP]
Microchip Packaging Specification
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness Lead Width
MILLIMETERS 0.65 0.75 0.00 0.85 4.90 3.00 3.00 0.40 0.08 0.22 0.60 0.95 0.23 0.40 0.80 1.10 0.95 0.15
0.15 ASME Y14.5M BSC: REF:
Microchip Technology Drawing C04-111B
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
[PDIP]
Microchip Packaging Specification
NOTE
Units Dimension Limits Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing .115 .015 .290 .240 .348 .115 .008 .040 .014
INCHES .100 .130 .310 .250 .365 .130 .010 .060 .018 .210 .195 .325 .280 .400 .150 .015 .070 .022 .430
0.010" (0.254 ASME Y14.5M BSC:
Microchip Technology Drawing C04-018B
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
(SN) 3.90 [SOIC]
Microchip Packaging Specification
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom 0.17 0.31 0.25 0.40 1.25 0.10
MILLIMETERS 1.27 6.00 3.90 4.90 1.04 0.25 0.51 0.50 1.27 1.75 0.25
0.15 ASME Y14.5M BSC: REF:
Microchip Technology Drawing C04-057B
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
(SN) 3.90 [SOIC]
Microchip Packaging Specification
ASME Y14.5M BSC:
Microchip Technology Drawing C04-2057A
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
[PDIP]
Microchip Packaging Specification
NOTE
Units Dimension Limits Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing .115 .015 .290 .240 .735 .115 .008 .045 .014 INCHES .100 .130 .310 .250 .750 .130 .010 .060 .018 .210 .195 .325 .280 .775 .150 .015 .070 .022 .430
0.010" (0.254 ASME Y14.5M BSC:
Microchip Technology Drawing C04-005B
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
(SL) 3.90 [SOIC]
Microchip Packaging Specification
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom 0.17 0.31 0.25 0.40 1.25 0.10
MILLIMETERS 1.27 6.00 3.90 8.65 1.04 0.25 0.51 0.50 1.27 1.75 0.25
0.15 ASME Y14.5M BSC: REF:
Microchip Technology Drawing C04-065B
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
(ST) [TSSOP]
Microchip Packaging Specification
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Footprint Foot Angle Lead Thickness Lead Width
MILLIMETERS 0.65 0.80 0.05 4.30 4.90 0.45 0.09 0.19 1.00 6.40 4.40 5.00 0.60 1.00 0.20 0.30 4.50 5.10 0.75 1.20 1.05 0.15
0.15 ASME Y14.5M BSC: REF:
Microchip Technology Drawing C04-087B
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
(2007
(VDD) 2-31 2-32 4.1.1 4.1.2 4.1.3
(2004
MCP6291 MCP6291R SOT-23-5 MCP6293 SOT-23-6 (4.9 SOT-23-5 SOT-23-6 (6.0
(2004
(2003
(2003
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
DS21812E_JP
2009 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
PART Device
Package
SOIC MCP6291-E/MS: MSOP MCP6291-E/P: PDIP MCP6291T-E/OT: SOT-23 MCP6291RT-E/OT: SOT-23 SOIC MCP6292-E/MS: MSOP MCP6292-E/P: PDIP MCP6292T-E/SN: SOIC SOIC MCP6293-E/MS: MSOP MCP6293-E/P: PDIP MCP6293T-E/CH: SOT-23 MCP6294-E/P: MCP6294T-E/SL: MCP6294-E/SL: MCP6294-E/ST: MCP6295-E/SN: PDIP SOIC SOIC 14TSSOP MCP6293-E/SN: MCP6292-E/SN: MCP6291-E/SN:
Temperature Range
Device:
MCP6291: MCP6291T: MCP6291RT: MCP6292: MCP6292T: MCP6293: MCP6293T: MCP6294: MCP6294T: MCP6295: MCP6295T:
Single Single (Tape Reel) (SOIC, MSOP, SOT-23-5) Single (Tape Reel) (SOT-23-5) Dual Dual (Tape Reel) (SOIC, MSOP) Single with Chip Select Single with Chip Select (Tape Reel) (SOIC, MSOP, SOT-23-6) Quad Quad (Tape Reel) (SOIC, TSSOP) Dual with Chip Select Dual with Chip Select (Tape Reel) (SOIC, MSOP)
Temperature Range: Package:
-40° +125°
Plastic Small Outline Transistor (SOT-23), 5-lead (MCP6291, MCP6291R) Plastic Small Outline Transistor (SOT-23), 6-lead (MCP6293) Plastic MSOP, 8-lead Plastic (300 body), 8-lead, 14-lead Plastic SOIC, (3.90 body), 8-lead Plastic SOIC (3.90 body), 14-lead Plastic TSSOP (4.4 body), 14-lead
SOIC MCP6295-E/MS: MSOP MCP6295-E/P: PDIP MCP6295T-E/SN: SOIC
2009 Microchip Technology Inc.
DS21812E_JP
MCP6291/1R/2/3/4/5
DS21812E_JP
2009 Microchip Technology Inc.
Microchip Microchip dsPIC KEELOQKEELOQ MPLABPICPICmicro PICSTARTrfPICUNI/O Microchip Technology Incorporated FilterLabHampshireHI-TECH CLinear Active ThermistorMXDEVMXLABSEEVALThe Embedded Control Solutions Company Microchip Technology Incorporated Analog-for-the-Digital AgeApplication Maestro Serial ProgrammingICSPICEPIC MindiMiWiMPASMMPLAB Certified MPLIB MPLINKmTouchnanoWatt XLPOmniscient Code PICDEM.netPICtailPIC32 Real ICErfLAB Select ModeTotal EnduranceTSHARCWiperLock ZENA Microchip Technology Incorporated SQTP Microchip Technology Incorporated 2009, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved.
Chandler Tempe Gresham ISO/TS-16949:2002 PIC® dsPIC® DSCKEELOQ® EEPROM 9001:2000
2009 Microchip Technology Inc.
DS21812E_JP
2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 http://support.microchip.com www.microchip.com
Suites 3707-14, 37th Floor Tower Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431
Tel: 91-80-3090-4444 Fax: 91-80-3090-4080
Tel: 43-7242-2244-39 Fax: 43-7242-2244-393
Tel: 91-11-4160-8631 Fax: 91-11-4160-8632
Tel: 45-4450-2828 Fax: 45-4485-2829
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Tel: 91-20-2566-1512 Fax: 91-20-2566-1513
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Duluth, Tel: 678-957-9614 Fax: 678-957-1455
Tel: 86-10-8528-2100 Fax: 86-10-8528-2104
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Tel: 49-89-627-144-0 Fax: 49-89-627-144-44
Westborough, Tel: 774-760-0087 Fax: 774-760-0088
Tel: 86-28-8665-5511 Fax: 86-28-8665-7889
Tel: 82-53-744-4301 Fax: 82-53-744-4302
Tel: 39-0331-742611 Fax: 39-0331-466781
Itasca, Tel: 630-285-0071 Fax: 630-285-0075
Tel: 852-2401-1200 Fax: 852-2401-3431
Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934
Tel: 31-416-690399 Fax: 31-416-690340
Independence, Tel: 216-447-0464 Fax: 216-447-0643
Tel: 86-25-8473-2460 Fax: 86-25-8473-2470
Tel: 60-3-6201-9857 Fax: 60-3-6201-9859
Tel: 34-91-708-08-90 Fax: 34-91-708-08-91
Tel: 86-532-8502-7355 Fax: 86-532-8502-7205
Tel: 60-4-227-8870 Fax: 60-4-227-4068
Tel: 44-118-921-5869 Fax: 44-118-921-5820
Addison, Tel: 972-818-7423 Fax: 972-818-2924
Tel: 86-21-5407-5533 Fax: 86-21-5407-5066
Tel: 63-2-634-9065 Fax: 63-2-634-9069
Farmington Hills, Tel: 248-538-2250 Fax: 248-538-2260
Tel: 86-24-2334-2829 Fax: 86-24-2334-2393
Tel: 65-6334-8870 Fax: 65-6334-8850
Kokomo, Tel: 765-864-8360 Fax: 765-864-8387
Tel: 86-755-8203-2660 Fax: 86-755-8203-1760
Tel: 886-3-6578-300 Fax: 886-3-6578-370
Tel: 86-27-5980-5300 Fax: 86-27-5980-5118
Mission Viejo, Tel: 949-462-9523 Fax: 949-462-9608
Tel: 886-7-536-4818 Fax: 886-7-536-4803
Tel: 86-592-2388138 Fax: 86-592-2388130
Tel: 886-2-2500-6610 Fax: 886-2-2508-0102
Santa Clara, Tel: 408-961-6444 Fax: 408-961-6445
Tel: 86-29-8833-7252 Fax: 86-29-8833-7256
Tel: 66-2-694-1351 Fax: 66-2-694-1350
Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
Tel: 86-756-3210040 Fax: 86-756-3210049
03/26/09
DS21812E_JP
2009 Microchip Technology Inc.

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