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Rail-to-Rail Gain Bandwidth Product: (typical) Supply Current: Su


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MCP6291/1R/2/3/4/5
Rail-to-Rail
Gain Bandwidth Product: (typical) Supply Current: Supply Voltage: 2.4V 6.0V Rail-to-Rail Input/Output Extended Temperature Range: -40°C +125°C Available Single, Dual Quad Packages Single with (MCP6293) Dual with (MCP6295)
Description
Microchip Technology Inc. MCP6291/1R/2/3/4/5 family operational amplifiers amps) provide wide bandwidth current. This family Gain Bandwidth Product (GBWP) phase margin. This family also operates from single supply voltage 2.4V, while drawing (typical) quiescent current. addition, MCP6291/1R/2/3/4/5 supports rail-to-rail input output swing, with common mode input voltage range This family operational amplifiers designed with Microchip's advanced CMOS process. MCP6295 Chip Select (CS) input dual amps 8-pin package. This device manufactured cascading amps, with output being connected non-inverting input input puts device Low-power mode. MCP6291/1R/2/3/4/5 family operates over Extended Temperature Range -40°C +125°C. also power supply range 2.4V 6.0V.
Applications
Automotive Portable Equipment Photodiode Amplifier Analog Filters Notebooks PDAs Battery-Powered Systems
Design Aids
SPICE Macro Models FilterLab® Software MindiSimulation Tool MAPS (Microchip Advanced Part Selector) Analog Demonstration Evaluation Boards Application Notes
Package Types
MCP6291 PDIP, SOIC, MSOP
MCP6291 SOT-23-5
VOUT VIN+ VIN-
MCP6291R SOT-23-5
VOUT VIN+ VIN-
MCP6292 PDIP, SOIC, MSOP
VOUTA VINA VINA+
VOUT
VOUTB VINB_ VINB+
VIN+
MCP6293 PDIP, SOIC, MSOP
VIN_ VIN+ VOUT VOUT VIN+
MCP6293 SOT-23-6
VIN-
MCP6294 PDIP, SOIC, TSSOP
VOUTA VINA_ VINA+ VINB+ VINB_ VOUTB
VOUTD
MCP6295 PDIP, SOIC, MSOP
VOUTA/VINB+ VINA_ VINA+
VIND_
VIND+ VINC+ VOUTC
VOUTB
VINB
2007 Microchip Technology Inc.
DS21812E-page
MCP6291/1R/2/3/4/5
ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability. Section 4.1.2 "Input Voltage Current Limits".
Absolute Maximum Ratings
.7.0V Current Input Pins Analog Inputs (VIN+, VIN-) 1.0V 1.0V Other Inputs Outputs 0.3V 0.3V Difference Input Voltage |VDD VSS| Output Short Circuit Current .Continuous Current Output Supply Pins .±30 Storage Temperature.-65°C +150°C Maximum Junction Temperature (TJ) .+150°C Protection Pins (HBM; 400V
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.4V +5.5V, GND, VOUT VDD/2, VDD/2, VDD/2, tied (refer Figure Figure 1-3). Parameters Input Offset Input Offset Voltage Input Offset Voltage (Extended Temperature) Input Offset Temperature Drift Power Supply Rejection Ratio Input Bias Current Temperature Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode (Note Common Mode Input Range Common Mode Rejection Ratio Common Mode Rejection Ratio Open-Loop Gain Open-Loop Gain (Large Signal) Output Maximum Output Voltage Swing Output Short Circuit Current Power Supply Supply Voltage Quiescent Current Amplifier Note -40°C +125°C (Note VOL, 0.5V Input Overdrive VOUT 0.2V 0.2V, (Note VCMR CMRR CMRR -0.3V 2.5V, -0.3V 5.3V, VOS/TA PSRR ZDIFF -3.0 -5.0 ±1.7 ±1.0 ±1.0 1013||6 1013||3 +3.0 +5.0 µV/°C ||pF ||pF (Note -40°C +125°C, (Note -40°C +125°C, (Note (Note Note +85°C (Note +125°C (Note Note Note Note Units Conditions
Input Bias, Input Offset Current Impedance
MCP6295's (pins VOUTA/VINB+ VINB-) current MCP6295's VINB- specified only. This specification does apply MCP6295's VOUTA/VINB+ pin. MCP6295's VINB- common mode range (VCMR) MCP6295's VOUTA/VINB+ voltage range specified VOL. parts with date codes November 2007 later have been screened ensure operation 6.0V. However, other minimum maximum specifications measured 2.4V 5.5V.
DS21812E-page
2007 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied (refer Figure Figure 1-3). Parameters Response Gain Bandwidth Product Phase Margin Unity-Gain Slew Rate Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density µVP-P nV/Hz fA/Hz GBWP 10.0 V/µs Units Conditions
MCP6293/MCP6295 CHIP SELECT (CS) SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied (refer Figure Figure 1-3). Parameters Specifications Logic Threshold, Input Current, High Specifications Logic Threshold, High Input Current, High Current Amplifier Amplifier Output Leakage Dynamic Specifications (Note Valid Amplifier Output, Turn-on Time High Amplifier Output High-Z Hysteresis Note VDD, V/V, VDD/2, VOUT VDD/2, 5.0V High VDD, V/V, VDD/2, VOUT VDD/2 ICSH -0.7 0.01 ICSL 0.01 Units Conditions
tOFF VHYST
0.01
input condition (VIN) specified applies both MCP6295. dynamic specification tested output (VOUTB).
2007 Microchip Technology Inc.
DS21812E-page
MCP6291/1R/2/3/4/5
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +2.4V +5.5V GND. Parameters Temperature Ranges Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SOT-23 Thermal Resistance, 6L-SOT-23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-MSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note: °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W +125 +150 Note Units Conditions
Junction Temperature (TJ) must exceed Absolute Maximum specification +150°C.
VOUT Hi-Z tOFF Hi-Z
Test Circuits
test circuits used tests shown Figure Figure 1-2. bypass capacitors laid according rules discussed Section "Supply Bypass". VOUT VDD/2
-0.7 (typical) (typical)
-1.0 (typical) (typical)
-0.7 (typical) (typical)
MCP629X
FIGURE 1-1: Timing Diagram Chip Select (CS) MCP6293 MCP6295.
FIGURE 1-2: Test Circuit Most Non-Inverting Gain Conditions.
VOUT
VDD/2
MCP629X
FIGURE 1-3: Test Circuit Most Inverting Gain Conditions.
DS21812E-page
2007 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
Note:
TYPICAL PERFORMANCE CURVES
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Note: Unless otherwise indicated, +25°C, +2.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
Percentage Occurrences
Percentage Occurrences
Samples
Samples -40°C +125°C
-2.8
-2.4
-2.0
-1.6
-1.2
-0.8
-0.4
2600 2800
Input Offset Voltage (mV)
Input Offset Voltage Drift (µV/°C)
FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4:
Input Offset Voltage Drift.
Percentage Occurrences
Percentage Occurrences
Samples 85°C
Samples +125°C
1000
1200
1400
1600
1800
2000
2200
2400
Input Bias Current (pA)
Input Bias Current (pA)
FIGURE 2-2:
Input Bias Current
FIGURE 2-5: +125
Input Bias Current
Input Offset Voltage (µV)
Input Offset Voltage (µV)
2.4V
-40°C +25°C +85°C +125°C
-0.5
5.5V -0.5
+125°C +85°C +25°C -40°C
Common Mode Input Voltage
Common Mode Input Voltage
FIGURE 2-3: Input Offset Voltage Common Mode Input Voltage 2.4V.
FIGURE 2-6: Input Offset Voltage Common Mode Input Voltage 5.5V.
2007 Microchip Technology Inc.
DS21812E-page
3000
MCP6291/1R/2/3/4/5
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, +25°C, +2.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
10,000
Input Offset Voltage (µV)
Input Bias, Offset Currents (pA)
Representative Part
5.5V
1,000
Input Bias Current Input Offset Current
5.5V 2.4V
Output Voltage
Ambient Temperature (°C)
FIGURE 2-7: Output Voltage.
Input Offset Voltage
FIGURE 2-10: Input Bias, Input Offset Currents Ambient Temperature.
CMRR, PSRR (dB)
CMRR PSRRPSRR+
PSRR, CMRR (dB)
CMRR PSRR
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
100k
Frequency (Hz)
Ambient Temperature (°C)
FIGURE 2-8: Frequency.
CMRR, PSRR
FIGURE 2-11: Temperature.
CMRR, PSRR Ambient
Input Bias, Offset Currents (pA)
+85°C 5.5V
Input Bias Current
Input Bias, Offset Currents (nA)
-0.5 -1.0
+125°C 5.5V Input Bias Current
Input Offset Current
Input Offset Current
Common Mode Input Voltage
Common Mode Input Voltage
FIGURE 2-9: Input Bias, Offset Currents Common Mode Input Voltage +85°C.
FIGURE 2-12: Input Bias, Offset Currents Common Mode Input Voltage +125°C.
DS21812E-page
2007 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, +25°C, +2.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
1000
+125°C +85°C +25°C -40°C
Ouput Voltage Headroom (mV)
Quiescent Current (mA/Amplifier)
0.01
Power Supply Voltage
Output Current Magnitude (mA)
FIGURE 2-13: Quiescent Current Power Supply Voltage.
FIGURE 2-16: Output Voltage Headroom Output Current Magnitude.
GBWP, 5.5V GBWP, 2.4V
Open-Loop Phase
Phase
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07
-120 -150 -180 100k -210 100M
1.E+08
5.5V 2.4V
Frequency (Hz)
Ambient Temperature (°C)
FIGURE 2-14: Frequency.
Open-Loop Gain, Phase
FIGURE 2-17: Gain Bandwidth Product, Phase Margin Ambient Temperature.
Falling Edge, 5.5V 2.4V
Maximum Output Voltage Swing P-P)
Slew Rate (V/µs)
Rising Edge, 5.5V 2.4V
5.5V 2.4V
1.E+03
1.E+04
1.E+05
1.E+06
1.E+07
100k
Frequency (Hz)
Ambient Temperature (°C)
FIGURE 2-15: Maximum Output Voltage Swing Frequency.
FIGURE 2-18: Temperature.
Slew Rate Ambient
2007 Microchip Technology Inc.
DS21812E-page
Phase Margin
Gain
Gain Bandwidth Product (MHz)
Open-Loop Gain (dB)
MCP6291/1R/2/3/4/5
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, +25°C, +2.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
1,000
Input Noise Voltage Density (nV/
Input Noise Voltage Density (nV/
5.0V
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
100k
Frequency (Hz)
Common Mode Input Voltage
FIGURE 2-19: Frequency.
Input Noise Voltage Density
FIGURE 2-22: Input Noise Voltage Density Common Mode Input Voltage kHz.
Ouptut Short Circuit Current (mA)
Channel-to-Channel Separation (dB)
+125°C +85°C +25°C -40°C
Power Supply Voltage
Frequency (kHz)
FIGURE 2-20: Output Short Circuit Current Power Supply Voltage.
FIGURE 2-23: Channel-to-Channel Separation Frequency (MCP6292, MCP6294 MCP6295 only).
Op-Amp shuts here Op-Amp turns here
2.4V
shuts turns
5.5V Hysteresis
Quiescent Current (mA/Amplifier)
Quiescent Current (mA/Amplifier)
swept high
Hysteresis
swept high
swept high
swept high
Chip Select Voltage
Chip Select Voltage
FIGURE 2-21: Quiescent Current Chip Select (CS) Voltage 2.4V (MCP6293 MCP6295 only).
FIGURE 2-24: Quiescent Current Chip Select (CS) Voltage 5.5V (MCP6293 MCP6295 only).
DS21812E-page
2007 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, +25°C, +2.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
+1V/V 5.0V
-1V/V 5.0V
Output Voltage
0.E+00 1.E-06 2.E-06 3.E-06 4.E-06 5.E-06 6.E-06 7.E-06 8.E-06 9.E-06 1.E-05
Output Voltage
0.E+00 1.E-06 2.E-06 3.E-06 4.E-06 5.E-06 6.E-06 7.E-06 8.E-06 9.E-06 1.E-05
Time µs/div)
Time µs/div)
FIGURE 2-25: Pulse Response.
Large-Signal Non-inverting
FIGURE 2-28: Response.
Large-Signal Inverting Pulse
+1V/V
-1V/V
Output Voltage mV/div)
Time (200 ns/div)
Output Voltage mV/div)
Time (200 ns/div)
FIGURE 2-26: Pulse Response.
Small-Signal Non-inverting
FIGURE 2-29: Response.
Small-Signal Inverting Pulse
Chip Select, Output Voltages
Voltage
Chip Select, Output Voltages
2.4V +1V/V
0.E+00 5.E-06 1.E-05 2.E-05 2.E-05 3.E-05 3.E-05 4.E-05 4.E-05
Voltage
5.5V +1V/V
VOUT
Output
VOUT
Output
Output High-Z
5.E-05 5.E-05
Output High-Z
0.E+00 5.E-06 1.E-05 2.E-05 2.E-05 3.E-05 3.E-05 4.E-05 4.E-05 5.E-05 5.E-05
Time µs/div)
Time µs/div)
FIGURE 2-27: Chip Select (CS) Amplifier Output Response Time 2.4V (MCP6293 MCP6295 only).
FIGURE 2-30: Chip Select (CS) Amplifier Output Response Time 5.5V (MCP6293 MCP6295 only).
2007 Microchip Technology Inc.
DS21812E-page
MCP6291/1R/2/3/4/5
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, +25°C, +2.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
1.E-02 1.E-03 100µ 1.E-04 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10 1.E-11 1.E-12
Input Current Magnitude
Input, Output Voltage
5.0V +2V/V
VOUT
+125°C +85°C +25°C -40°C
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 Input Voltage
Time ms/div)
FIGURE 2-31: Measured Input Current Input Voltage (below VSS).
FIGURE 2-32: MCP6291/1R/2/3/4/5 Show Phase Reversal.
DS21812E-page
2007 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
DESCRIPTIONS
FUNCTION TABLE SINGLE AMPS
MCP6293 MCP6291R SOT-23-5 PDIP, SOIC, MSOP Symbol SOT-23-6 VOUT VIN- VIN+ Analog Output Inverting Input Non-inverting Input Positive Power Supply Negative Power Supply Chip Select Internal Connection Description
Descriptions pins listed Table (single amps) Table (dual quad amps).
TABLE 3-1:
MCP6291 PDIP, SOIC, MSOP 1,5,8
TABLE 3-2:
MCP6292
FUNCTION TABLE DUAL QUAD AMPS
MCP6294 MCP6295 Symbol VOUTA VINA- VINA+ VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD VOUTA/VINB+ Analog Output Inverting Input Non-inverting Input Positive Power Supply Non-inverting Input Inverting Input Analog Output Analog Output Inverting Input Non-inverting Input Negative Power Supply Non-inverting Input Inverting Input Analog Output Analog Output A)/Non-inverting Input Chip Select Description
Analog Outputs Analog Inputs
Chip Select Digital Input
output pins low-impedance voltage sources.
This CMOS, Schmitt-triggered input that places part into power mode operation.
Power Supply Pins
non-inverting inverting inputs highimpedance CMOS inputs with bias currents.
MCP6295's VOUTA/VINB+
positive power supply (VDD) 2.4V 6.0V higher than negative power supply (VSS). normal operation, other pins between VDD. Typically, these parts used single (positive) supply configuration. this case, connected ground connected supply. will need bypass capacitors
MCP6295 only, output connected directly non-inverting input this VOUTA/VINB+ pin. This connection makes possible provide Chip Select duals 8-pin packages.
2007 Microchip Technology Inc.
DS21812E-page
MCP6291/1R/2/3/4/5
APPLICATION INFORMATION
MCP6291/1R/2/3/4/5 family amps manufactured using Microchip's state CMOS process, specifically designed low-cost, low-power general purpose applications. supply voltage, quiescent current wide bandwidth makes MCP6291/1R/2/3/4/5 ideal battery-powered applications. VDD, dump currents onto VDD. When implemented shown, resistors also limit current through (minimum expected (minimum expected MCP629X VOUT
4.1.1
Rail-to-Rail Inputs
PHASE REVERSAL
MCP6291/1R/2/3/4/5 designed prevent phase reversal when input pins exceed supply voltages. Figure 2-32 shows input voltage exceeding supply voltage without phase reversal.
4.1.2
INPUT VOLTAGE CURRENT LIMITS
protection inputs depicted shown Figure 4-1. This structure chosen protect input transistors, minimize input bias current (IB). input diodes clamp inputs when they more than diode drop below VSS. They also clamp voltages that above VDD; their breakdown voltage high enough allow normal operation, enough bypass quick events within specified limits.
FIGURE 4-2: Inputs.
Protecting Analog
also possible connect diodes left resistor this case, currents through diodes need limited some other mechanism. resistors then serve in-rush current limiters; current into input pins (VIN+ VIN-) should very small. significant amount current flow inputs when common mode voltage (VCM) below ground (VSS); Figure 2-31. Applications that high impedance need limit usable voltage range.
Bond
4.1.3
VIN+ Bond Input Stage Bond VIN-
NORMAL OPERATION
Bond
input stage MCP6291/1R/2/3/4/5 amps differential CMOS input stages parallel. operates common mode input voltage (VCM), while other operates high VCM. WIth this topology, device operates with 0.3V past either supply rail. input offset voltage (VOS) measured 0.3V 0.3V ensure proper operation. transition between input stages occurs when 1.1V. best distortion gain linearity, with non-inverting gains, avoid this region operation.
FIGURE 4-1: Structures.
Simplified Analog Input
order prevent damage and/or improper operation these amps, circuit they must limit currents voltages VIN+ VIN- pins (see Absolute Maximum Ratings beginning Section "Electrical Characteristics"). Figure shows recommended approach protecting these inputs. internal diodes prevent input pins (VIN+ VIN-) from going below ground, resistors limit possible current drawn input pins. Diodes prevent input pins (VIN+ VIN-) from going above
Rail-to-Rail Output
output voltage range MCP6291/1R/2/3/4/5 (min.) (maximum) when connected VDD/2 5.5V. Refer Figure 2-16 more information.
DS21812E-page
2007 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
Capacitive Loads MCP629X Chip Select
Driving large capacitive loads cause stability problems voltage feedback amps. load capacitance increases, feedback loop's phase margin decreases closed-loop bandwidth reduced. This produces gain peaking frequency response, with overshoot ringing step response. unity-gain buffer most sensitive capacitive loads, though gains show same general behavior. When driving large capacitive loads with these amps (e.g., when +1), small series resistor output (RISO Figure 4-3) improves feedback loop's phase margin (stability) making output load resistive higher frequencies. bandwidth will generally lower than bandwidth with capacitive load. MCP6293 MCP6295 single dual amps with Chip Select (CS), respectively. When pulled high, supply current drops (typical) flows through VSS. When this happens, amplifier output into high-impedance state. pulling low, amplifier enabled. internal (typical) pull-down resistor connected VSS, will left floating. Figure shows output voltage supply current response pulse.
Cascaded Dual Amps (MCP6295)
MCP629X
RISO VOUT
MCP6295 dual with Chip Select (CS). Chip Select input available what would non-inverting input standard dual (pin This available because output connects non-inverting input shown Figure 4-5. Chip Select input, which connected microcontroller line, puts device Low-power mode. Refer Section "MCP629X Chip Select". VOUTA/VINB+ VINB-
FIGURE 4-3: Output Resistor, RISO stabilizes large capacitive loads.
Figure gives recommended RISO values different capacitive loads gains. x-axis normalized load capacitance (CL/GN), where circuit's noise gain. non-inverting gains, Signal Gain equal. inverting gains, 1+|Signal Gain| (e.g., gives V/V).
Recommended
VINA- VINA+ MCP6295
VOUTB
FIGURE 4-5:
Cascaded Gain Amplifier.
1,000 10,000 Normalized Load Capacitance; CL/GN (pF)
output loaded input impedance which typically 1013||6 specified specification table (Refer Section "Capacitive Loads" further details regarding capacitive loads). common mode input range these amps specified data sheet However, since output limited from rails with load), non-inverting input range limited common mode input range
FIGURE 4-4: Recommended RISO Values Capacitive Loads.
After selecting RISO your circuit, double-check resulting frequency response peaking step response overshoot. Modify RISO's value until response reasonable. Bench evaluation simulations with MCP6291/1R/2/3/4/5 SPICE macro model helpful.
2007 Microchip Technology Inc.
DS21812E-page
MCP6291/1R/2/3/4/5
Supply Bypass Surface Leakage
With this family operational amplifiers, power supply (VDD single supply) should have local bypass capacitor (i.e., 0.01 within good high-frequency performance. also needs bulk capacitor (i.e., larger) within provide large, slow currents. This bulk capacitor shared with nearby analog parts. applications where input bias current critical, Printed Circuit Board (PCB) surface-leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current flow, which greater than MCP6291/1R/2/3/4/5 family's bias current 25°C typical). easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. example this type layout shown Figure 4-7. VIN- VIN+
Unused Amps
unused quad package (MCP6294) should configured shown Figure 4-6. These circuits prevent output from toggling causing crosstalk. Circuits sets minimum noise gain. resistor divider produces desired reference voltage within output voltage range amp; buffers that reference voltage. Circuit uses minimum number components operates comparator, draw more current. MCP6294 VREF MCP6294
Guard Ring
FIGURE 4-7: Inverting Gain.
Example Guard Ring Layout
FIGURE 4-6:
Unused Amps.
Inverting Gain Transimpedance Amplifiers (convert current voltage, such photo detectors): Connect guard ring non-inverting input (VIN+). This biases guard ring same reference voltage (e.g., VDD/2 ground). Connect inverting (VIN-) input with wire that does touch surface. Non-inverting Gain Unity-Gain Buffer: Connect non-inverting (VIN+) input with wire that does touch surface. Connect guard ring inverting input (VIN-). This biases guard ring common mode input voltage.
DS21812E-page
2007 Microchip Technology Inc.
MCP6291/1R/2/3/4/5
4.9.1
Application Circuits
MULTIPLE FEEDBACK LOW-PASS FILTER
4.9.3
CASCADED APPLICATIONS
MCP6291/1R/2/3/4/5 used active-filter applications. Figure shows inverting, third-order, multiple feedback low-pass filter that used anti-aliasing filter.
VOUT
MCP6295 provides flexibility Low-power mode dual amps 8-pin package. MCP6295 eliminates added cost space battery-powered applications using single amps with Chip Select lines 10-pin device with Chip Select line both amps. Since amps internally cascaded, this device cannot used circuits that require active passive elements between amps. However, there several applications where this configuration with Chip Select line becomes suitable. circuits below show possible applications this device.
4.9.3.1
MCP6291 VDD/2
Load Isolation
FIGURE 4-8: Pass Filter.
Multiple Feedback Low-
With cascaded configuration, used isolate load from applications where driving capacitive resistance loads feedback loop (such integrator circuit filter circuit), have sufficient source current drive load. this case, used buffer.
This filter, others, designed using Microchip's Filter design software. Refer Section "Design Aids"
4.9.2
PHOTODIODE AMPLIFIER
MCP6295
VOUTB Load
Figure shows photodiode biased photovoltaic mode high precision. resistor converts diode current voltage VOUT. capacitor used limit bandwidth stabilize circuit against diode's capacitance always needed).
FIGURE 4-10: Buffer.
Isolating Load with
VOUT
light
MCP6291 VDD/2
FIGURE 4-9:
Photodiode Amplifier.
2007 Microchip Technology Inc.
DS21812E-page
MCP6291/1R/2/3/4/5
4.9.3.2 Cascaded Gain 4.9.3.4 Buffered Non-inverting Integrator
Figure 4-11 shows cascaded gain circuit configuration with Chip Select. amps configured non-inverting amplifier configuration. this configuration, important note that input offset voltage amplified gain shown below: Where: VOSA VOSB gain gain input offset voltage input offset voltage
VOUT
Figure 4-13 shows lossy non-inverting integrator that buffered Chip Select input. configured non-inverting integrator. this configuration, matching impedance each input recommended. used provide feedback loop frequencies 1/(2R1C1) makes this lossy integrator finite gain DC). used isolate load from integrator.
MCP6295
Therefore, recommended most gain with with relatively small gain (e.g., unity-gain buffer).
FIGURE 4-13: Buffered Non-inverting Integrator with Chip Select. 4.9.3.5 Inverting Integrator with Active Compensation Chip Select
MCP6295
VOUT
FIGURE 4-11: Configuration. 4.9.3.3
Cascaded Gain Circuit
Figure 4-14 uses active compensator compensate non-ideal characteristics introduced higher frequencies. This circuit uses unity-gain buffer isolate integration capacitor from drives capacitor with low-impedance source. Since both amps matched very well, they provide high quality integrator.
Difference Amplifier
Figure 4-12 shows difference amplifier with Chip Select. this configuration, recommended well-matched resistors (e.g., 0.1%) increase Common Mode Rejection Ratio (CMRR). used additional gain unity-gain buffer isolate load from difference amplifier. VIN2 MCP6295 VOUT
MCP6295 VOUT
VIN1
FIGURE 4-14: Compensation.
Integrator Circuit with Active
FIGURE 4-12:
Difference Amplifier Circuit.
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4.9.3.6 Second-Order Low-Pass Filter with Extra Pole-Zero Pair 4.9.3.8 Capacitorless Second-Order Low-Pass filter with Chip Select
Figure 4-15 second-order multiple feedback lowpass filter with Chip Select. FilterLab® software from Microchip determine values second-order filter. used pole-zero pair using
VOUT
low-pass filter shown Figure 4-17 does require external capacitors uses only three external resistors; amp's GBWP sets corner frequency. used circuit gain used avoid gain peaking frequency response, needs (lower values need selected R3). Note that amplifier bandwidth varies greatly over temperature process. However, this configuration provides cost solution applications with high bandwidth requirements.
MCP6295
FIGURE 4-15: Second-Order Multiple Feedback Low-Pass Filter with Extra PoleZero Pair. 4.9.3.7 Second-Order Sallen-Key Low-Pass Filter with Extra Pole-Zero Pair
VREF MCP6295
VOUT
Figure 4-16 second-order, Sallen-Key low-pass filter with Chip Select. FilterLab® software from Microchip determine values second-order filter. used pole-zero pair using
FIGURE 4-17: Capacitorless Second-Order Low-Pass Filter with Chip Select.
VOUT
MCP6295
FIGURE 4-16: Second-Order Sallen-Key Low-Pass Filter with Extra Pole-Zero Pair Chip Select.
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DESIGN AIDS
Microchip provides basic design tools needed MCP6291/1R/2/3/4/5 family amps.
Analog Demonstration Evaluation Boards
SPICE Macro Model
latest SPICE macro model MCP6291/1R/2/ 3/4/5 amps available Microchip site www.microchip.com. This model intended initial design tool that works well amp's linear region operation over temperature range. model file information capabilities. Bench testing very important part design cannot replaced with simulations. Also, simulation results using this macro model need validated comparing them data sheet specifications characteristic curves.
Microchip offers broad spectrum Analog Demonstration Evaluation Boards that designed help achieve faster time market. complete listing these boards their corresponding user's guides technical information, visit Microchip site www.microchip.com/analogtools. boards that especially useful are: SOIC8EV: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board SOIC14EV: 14-Pin SOIC/TSSOP/DIP Evaluation Board
Application Notes
FilterLab® Software
Microchip's FilterLab® software innovative software tool that simplifies analog active filter (using amps) design. Available cost from Microchip site www.microchip.com/filterlab, FilterLab design tool provides full schematic diagrams filter circuit with component values. also outputs filter circuit SPICE format, which used with macro model simulate actual filter performance.
following Microchip Application Notes available Microchip site www.microchip. com/ appnotes recommended supplemental reference resources. ADN003: "Select Right Operational Amplifier your Filtering Circuits", DS21821 AN722: "Operational Amplifier Topologies Specifications", DS00722 AN723: "Operational Amplifier Specifications Applications", DS00723 AN884: "Driving Capacitive Loads With Amps", DS00884 AN990: "Analog Sensor Conditioning Circuits Overview", DS00990 These application notes others listed design guide: "Signal Chain Design Guide", DS21825
MindiSimulator Tool
Microchip's Mindisimulator tool aids design various circuits useful active filter, amplifier power-management applications. free online simulation tool available from Microchip site www.microchip.com/mindi. This interactive simulator enables designers quickly generate circuit diagrams, simulate circuits. Circuits developed using Mindi simulation tool downloaded personal computer workstation.
MAPS (Microchip Advanced Part Selector)
MAPS software tool that helps semiconductor professionals efficiently identify Microchip devices that particular design requirement. Available cost from Microchip site www.microchip.com/ maps, MAPS overall selection tool Microchip's product portfolio that includes Analog, Memory, MCUs DSCs. Using this tool define filter sort features parametric search devices export side-by-side technical comparison reports. Helpful links also provided Data sheets, Purchase, Sampling Microchip parts.
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MCP6291/1R/2/3/4/5
PACKAGING INFORMATION
Package Marking Information
5-Lead SOT-23 (MCP6291 MCP6291R) Example:
Device
Code CJNN EVNN
XXNN
MCP6291 MCP6291R
CJ25
Note: Applies 5-Lead SOT-23
6-Lead SOT-23 (MCP6283)
Example:
Device
Code CMNN
XXNN
MCP6293
Note: Applies 6-Lead SOT-23
CM25
8-Lead MSOP XXXXXX YWWNNN
Example: 6291E 436256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Example: MCP6291 E/P256 0436 MCP6291 E/P^^256 0743
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW
Example: MCP6291 E/SN0436 MCP6291E SN^^0743
Legend: XX.X Note:
Customer-specific information Year code (last digit calendar year) Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code Pb-free JEDEC designator Matte (Sn) This package Pb-free. Pb-free JEDEC designator found outer packaging this package.
event full Microchip part number cannot marked line, will carried over next line, thus limiting number available characters customer-specific information.
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MCP6291/1R/2/3/4/5
Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP6294) XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN Example:
MCP6294-E/P 0436256
MCP6294 E/P^^ 0743256
14-Lead SOIC (150 mil) (MCP6294)
Example:
XXXXXXXXXX XXXXXXXXXX YYWWNNN
MCP6294ESL 0436256
MCP6294 E/SL^^ 0436256
14-Lead TSSOP (MCP6294)
Example:
XXXXXX YYWW
6294EST 0436
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MCP6291/1R/2/3/4/5
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MCP6291/1R/2/3/4/5
NOTES:
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MCP6291/1R/2/3/4/5
APPENDIX REVISION HISTORY
Revision (November 2007)
following list modifications: Updated notes Section "Electrical Characteristics". Increased absolute maximum voltage range input pins. Increased maximum operating supply voltage (VDD). Added Test Circuits. Added Figure 2-31 Figure 2-32. Added Section 4.1.1 "Phase Reversal", Section 4.1.2 "Input Voltage Current Limits", Section 4.1.3 "Normal Operation". Added Section "Unused Amps". Updated Section "Design Aids". Corrected Package Markings. Updated Package Outline Drawing.
Revision (December 2004)
following list modifications: Added SOT-23-5 packages MCP6291 MCP6291R single amps. Added SOT-23-6 package MCP6293 single amp. Added Section "Pin Descriptions". Corrected application circuits (Section "Application Circuits"). Added SOT-23-5 SOT-23-6 packages corrected package marking information (Section "Packaging Information"). Added Appendix Revision History.
Revision (June 2004)
Undocumented changes.
Revision (October 2003)
Undocumented changes.
Revision (June 2003)
Original data sheet release.
2007 Microchip Technology Inc.
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NOTES:
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MCP6291/1R/2/3/4/5
PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device
Package
Examples:
Extended Temperature, lead SOIC package. MCP6291-E/MS: Extended Temperature, lead MSOP package. MCP6291-E/P: Extended Temperature, lead PDIP package. MCP6291T-E/OT: Tape Reel, Extended Temperature, lead SOT-23 package. MCP6291RT-E/OT: Tape Reel, Extended Temperature, lead SOT-23 package. Extended Temperature, lead SOIC package. MCP6292-E/MS: Extended Temperature, lead MSOP package. MCP6292-E/P: Extended Temperature, lead PDIP package. MCP6292T-E/SN: Tape Reel, Extended Temperature, lead SOIC package. Extended Temperature, lead SOIC package. MCP6293-E/MS: Extended Temperature, lead MSOP package. MCP6293-E/P: Extended Temperature, lead PDIP package. MCP6293T-E/CH: Tape Reel, Extended Temperature, lead SOT-23 package. MCP6294-E/P: MCP6294T-E/SL: Extended Temperature, lead PDIP package. Tape Reel, Extended Temperature, lead SOIC package. Extended Temperature, lead SOIC package. Extended Temperature, lead TSSOP package. MCP6293-E/SN: MCP6292-E/SN: MCP6291-E/SN:
Temperature Range
Device:
MCP6291: MCP6291T:
MCP6291RT: MCP6292: MCP6292T: MCP6293: MCP6293T:
MCP6294: MCP6294T: MCP6295: MCP6295T:
Single Single (Tape Reel) (SOIC, MSOP, SOT-23-5) Single (Tape Reel) (SOT-23-5) Dual Dual (Tape Reel) (SOIC, MSOP) Single with Chip Select Single with Chip Select (Tape Reel) (SOIC, MSOP, SOT-23-6) Quad Quad (Tape Reel) (SOIC, TSSOP) Dual with Chip Select Dual with Chip Select (Tape Reel) (SOIC, MSOP)
Temperature Range:
-40° +125°
Package:
Plastic Small Outline Transistor (SOT-23), 5-lead (MCP6291, MCP6291R) Plastic Small Outline Transistor (SOT-23), 6-lead (MCP6293) Plastic MSOP, 8-lead Plastic (300 body), 8-lead, 14-lead Plastic SOIC, (3.90 body), 8-lead Plastic SOIC (3.90 body), 14-lead Plastic TSSOP (4.4 body), 14-lead
MCP6294-E/SL: MCP6294-E/ST: MCP6295-E/SN:
Extended Temperature, lead SOIC package. MCP6295-E/MS: Extended Temperature, lead MSOP package. MCP6295-E/P: Extended Temperature, lead PDIP package. MCP6295T-E/SN: Tape Reel, Extended Temperature, lead SOIC package.
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NOTES:
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Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip devices life support and/or safety applications entirely buyer's risk, buyer agrees defend, indemnify hold harmless Microchip from damages, claims, suits, expenses resulting from such use. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights.
Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, MATE, rfPIC SmartShunt registered trademarks Microchip Technology Incorporated U.S.A. other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock ZENA trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2007, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper.
Microchip received ISO/TS-16949:2002 certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona; Gresham, Oregon design centers California India. Company's quality system processes procedures PIC® MCUs dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified.
2007 Microchip Technology Inc.
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WORLDWIDE SALES SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Address: www.microchip.com Atlanta Duluth, Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, Tel: 765-864-8360 Fax: 765-864-8387 Angeles Mission Viejo, Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 China Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256
ASIA/PACIFIC
India Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934 Malaysia Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Hsin Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
10/05/07
DS21812E-page
2007 Microchip Technology Inc.

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