Rail-to-Rail Gain Bandwidth Product: (typical) Supply Current: (t

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

Rail-to-Rail Gain Bandwidth Product: (typical) Supply Current: (t

Datasheet Thumbnail

Top Searches for this datasheet

MCP6271/1R/2/3/4/5
Rail-to-Rail
Gain Bandwidth Product: (typical) Supply Current: (typical) Supply Voltage: 2.0V 6.0V Rail-to-Rail Input/Output Extended Temperature Range: -40°C +125°C Available Single, Dual Quad Packages Parts with Chip Select (CS) Single (MCP6273) Dual (MCP6275)
Description
Microchip Technology Inc. MCP6271/1R/2/3/4/5 family operational amplifiers amps) provide wide bandwidth current. This family Gain Bandwidth Product (GBWP) Phase Margin. This family also operates from single supply voltage 2.0V, while drawing (typical) quiescent current. MCP6271/1R/2/3/4/5 supports rail-to-rail input output swing, with common mode input voltage range This family amps designed with Microchip's advanced CMOS process. MCP6275 Chip Select input (CS) dual amps 8-pin package manufactured cascading amps (the output connected non-inverting input input puts device power mode. MCP6271/1R/2/3/4/5 family operates over Extended Temperature Range -40°C +125°C, with power supply range 2.0V 6.0V.
Applications
Automotive Portable Equipment Photodiode Amplifier Analog Filters Notebooks PDAs Battery Powered Systems
Available Tools
SPICE Macro Models FilterLab® Software MindiCircuit Designer Simulator MAPS (Microchip Advanced Part Selector) Analog Demonstration Evaluation Boards Application Notes
Package Types
MCP6271 PDIP, SOIC, MSOP
VIN- VIN+ VOUT VOUT VIN+ VIN-
MCP6271 SOT-23-5
MCP6271R SOT-23-5
VOUT VIN+ VIN-
MCP6272 PDIP, SOIC, MSOP
VOUTA VINA- VINA+ VOUTB VINB- VINB+
MCP6273 PDIP, SOIC, MSOP
VIN- VIN+ VOUT
MCP6273 SOT-23-6
MCP6274 PDIP, SOIC, TSSOP
VOUTA
MCP6275 PDIP, SOIC, MSOP
VOUTD VOUTA/VINB+ VIND- VIND+ VINC+ VOUTC VINA- VINA+
VINA- VINB+ VINB- VOUTB
VOUTB VINB-
VOUT VIN+
VIN- VINA+
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability. Section 4.1.2 "Input Voltage Current Limits".
Absolute Maximum Ratings
.7.0V Current Input Pins Analog Inputs (VIN+ VIN-) 1.0V 1.0V other Inputs Outputs 0.3V 0.3V Difference Input Voltage |VDD VSS| Output Short Circuit Current .Continuous Current Output Supply Pins .±30 Storage Temperature.-65°C +150°C Junction Temperature (TJ) .+150°C Protection Pins (HBM/MM) kV/400V
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low. (Refer Figure Figure 1-3). Parameters Input Offset (Note Input Offset Voltage Input Offset Voltage (Extended Temperature) Input Offset Temperature Drift Power Supply Rejection Ratio Input Bias Current Impedance Input Bias Current Temperature Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode (Note Common Mode Input Voltage Range Common Mode Rejection Ratio Common Mode Rejection Ratio Open-Loop Gain Open-Loop Gain (Large Signal) Note VOUT 0.2V 0.2V, (Note VCMR VCMR CMRR CMRR 0.15 0.30 0.15 0.30 2.0V (Note 5.5V (Note -0.3V 2.5V, (Note -0.3V 5.3V, (Note ZDIFF ±1.0 ±1.0 1013||3
Units
Conditions
VOS/TA PSRR
-3.0 -5.0
±1.7
+3.0 +5.0
-40°C +125°C,
µV/°C -40°C +125°C, Note +85°C (Note +125°C (Note Note
||pF Note ||pF Note
MCP6275's (pins VOUTA/VINB+ VINB-) current MCP6275's VINB- specified only. This specification does apply MCP6275's VOUTA/VINB+ pin. MCP6275's VINB- common mode input voltage range (VCMR) CMRR measured MCP6275. MCP6275's VOUTA/VINB+ voltage range specified VOL. design characterization. Does apply MCP6275. parts with date codes November 2007 later have been screened ensure operation 6.0V. However, other minimum maximum specifications measured 2.0V 5.5V.
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low. (Refer Figure Figure 1-3). Parameters Output Maximum Output Voltage Swing Output Short Circuit Current Power Supply Supply Voltage Quiescent Current Amplifier Note VOL, 0.5V input overdrive (Note Units Conditions
MCP6275's (pins VOUTA/VINB+ VINB-) current MCP6275's VINB- specified only. This specification does apply MCP6275's VOUTA/VINB+ pin. MCP6275's VINB- common mode input voltage range (VCMR) CMRR measured MCP6275. MCP6275's VOUTA/VINB+ voltage range specified VOL. design characterization. Does apply MCP6275. parts with date codes November 2007 later have been screened ensure operation 6.0V. However, other minimum maximum specifications measured 2.0V 5.5V.
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low. (Refer Figure Figure 1-3).
Parameters Response Gain Bandwidth Product Phase Margin Slew Rate Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density
GBWP
Units V/µs µVP-P nV/Hz fA/Hz
Conditions
tOFF High-Z -0.7 (typical) (typical)
VOUT
High-Z -0.7 (typical)
(typical)
-170 (typical) (typical)
FIGURE 1-1: Timing Diagram Chip Select (CS) MCP6273 MCP6275.
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +2.0V +5.5V GND. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SOT-23 Thermal Resistance, 6L-SOT-23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-MSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note: °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W +125 +125 +150 Note Units Conditions
Junction Temperature (TJ) must exceed Absolute Maximum specification +150°C.
MCP6273/MCP6275 CHIP SELECT SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, VDD/2, tied low. Parameters Specifications Logic Threshold, Input Current, High Specifications Logic Threshold, High Input Current, High Current Amplifier Amplifier Output Leakage Dynamic Specifications (Note Valid Amplifier Output, Turn Time High Amplifier Output High-Z Hysteresis Note VDD, V/V, VDD/2, VOUT VDD/2, 5.0V High VDD, V/V, VDD/2, VOUT VDD/2 ICSH 0.8VDD -0.7 0.01 ICSL 0.01 0.2VDD Units Conditions
tOFF VHYST
0.01
input condition (VIN) specified applies both MCP6275. dynamic specification tested output (VOUTB).
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
Test Circuits
test circuits used tests shown Figure Figure 1-3. bypass capacitors laid according rules discussed Section "Supply Bypass". VOUT VDD/2
MCP627X
FIGURE 1-2: Test Circuit Most Non-Inverting Gain Conditions.
VOUT
VDD/2
MCP627X
FIGURE 1-3: Test Circuit Most Inverting Gain Conditions.
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
Note:
TYPICAL PERFORMANCE CURVES
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Note: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
Percentage Occurrences
-3.0 -2.4 -1.8 -1.2 -0.6 Input Offset Voltage (mV)
Percentage Occurrences
Samples
Samples -40°C +125°C
Input Offset Voltage Drift (µV/°C)
FIGURE 2-1:
Percentage Occurrences
Input Offset Voltage.
FIGURE 2-4:
Input Offset Voltage Drift.
Percentage Occurrences
Samples 85°C
Samples +125°C
Input Bias Current (pA)
Input Bias Current (nA)
FIGURE 2-2: +85°C.
Input Offset Voltage (µV) -100 -0.4 -0.2
Input Bias Current
FIGURE 2-5: +125°C.
Input Offset Voltage (µV)
Input Bias Current
2.0V
-100 -0.5
5.5V
+125°C
+125°C +85°C +25°C -40°C
+85°C +25°C -40°C
Common Mode Input Voltage
Common Mode Input Voltage
FIGURE 2-3: Input Offset Voltage Common Mode Input Voltage, with 2.0V.
FIGURE 2-6: Input Offset Voltage Common Mode Input Voltage, with 5.5V.
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
Note: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30 -0.35 -0.40 -0.45 -0.50
Typical lower (VCM VSS) limit
2.0V
5.5V
0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00
Common Mode Input Voltage Range Limit
Common Mode Input Voltage Range Limit
5.5V
2.0V
Typical upper (VCM VDD) limit Ambient Temperature (°C)
Ambient Temperature (°C)
FIGURE 2-7: Common Mode Input Voltage Range Lower Limit Temperature.
Input Offset Voltage (µV)
FIGURE 2-10: Common Mode Input Voltage Range Upper Limit Temperature.
-100 Output Voltage 2.0V 5.5V
Input Bias, Offset Currents (pA)
Representative Part
10,000 1,000 Ambient Temperature (°C) 5.5V
Input Bias Current
Input Offset Current
FIGURE 2-8: Output Voltage.
Input Offset Voltage
FIGURE 2-11: Input Bias, Input Offset Currents Temperature.
CMRR, PSRR (dB) 100k 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 Frequency (Hz) PSRR- PSRR+ CMRR PSRR, CMRR (dB)
Ambient Temperature (°C) PSRR (VCM VSS) CMRR
FIGURE 2-9: Frequency.
CMRR, PSRR
FIGURE 2-12: Temperature.
CMRR, PSRR
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
Note: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
Input Bias, Offset Currents (pA) Input Bias, Offset Currents (nA) Common Mode Input Voltage Input Offset Current 85°C 5.5V Input Bias Current
-0.5 -1.0 Common Mode Input Voltage 125°C 5.5V Input Offset Current Input Bias Current
FIGURE 2-13: Input Bias, Offset Currents Common Mode Input Voltage, with +85°C.
Quiescent Current (µA/amplifier) Power Supply Voltage +125°C +85°C +25°C -40°C
FIGURE 2-16: Input Bias, Offset Currents Common Mode Input Voltage, with +125°C.
1000 Ouput Voltage Headroom (mV)
0.01
Output Current Magnitude (mA)
FIGURE 2-14: Supply Voltage.
Open-Loop Gain (dB) 1.E+00 1.E+01 1.E+02 Phase
Quiescent Current
FIGURE 2-17: Output Voltage Headroom Output Current Magnitude.
Gain Bandwidth Product (MHz) Open-Loop Phase Ambient Temperature (°C) 5.5V 2.0V GBWP, 5.5V 2.0V Phase Margin
Gain -120 -150 -180 -210 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 100k 100M Frequency (Hz) 1.E+08 1.E-01
FIGURE 2-15: Frequency.
Open-Loop Gain, Phase
FIGURE 2-18: Gain Bandwidth Product, Phase Margin Temperature.
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
Note: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
Maximum Output Voltage Swing 5.5V 2.0V
Slew Rate (V/µs) Ambient Temperature (°C) Rising Edge 2.0V Falling Edge 5.5V
1.E+03 1.E+04 1.E+05 1.E+06 100k Frequency (Hz) 1.E+07
FIGURE 2-19: Maximum Output Voltage Swing Frequency.
1,000 Input Noise Voltage Density (nV/
FIGURE 2-22:
Slew Rate Temperature.
Input Noise Voltage Density (nV/ -0.5 Common Mode Input Voltage
5.0V
100k 1.E- 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ Frequency (Hz)
FIGURE 2-20: Frequency.
Ouptut Short-Circuit Current (mA)
Input Noise Voltage Density
FIGURE 2-23: Input Noise Voltage Density Common Mode Input Voltage, with kHz.
Channel-to-Channel Separation (dB)
Power Supply Voltage +125°C +85°C +25°C -40°C
Frequency (kHz)
FIGURE 2-21: Output Short Circuit Current Supply Voltage.
FIGURE 2-24: Channel-to-Channel Separation Frequency (MCP6272 MCP6274).
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
Note: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
2.0V Quiescent Current (µA/amplifier) turns Hysteresis Chip Select Voltage swept High-to-Low swept Low-to-High turns Quiescent Current (µA/amplifier)
5.5V
Hysteresis swept Low-to-High swept High-to-Low turns On/Off
Chip Select Voltage
FIGURE 2-25: Quiescent Current Chip Select (CS) Voltage, with 2.0V (MCP6273 MCP6275 only).
Output Voltage Time µs/div) 5.0V
FIGURE 2-28: Quiescent Current Chip Select (CS) Voltage, with 5.5V (MCP6273 MCP6275 only).
Output Voltage Time µs/div) 5.0V
FIGURE 2-26: Pulse Response.
Large Signal Non-inverting
FIGURE 2-29: Response.
Large Signal Inverting Pulse
Output Voltage mV/div) Output Voltage mV/div)
Time µs/div)
Time µs/div)
FIGURE 2-27: Pulse Response.
Small Signal Non-inverting
FIGURE 2-30: Response.
Small Signal Inverting Pulse
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
Note: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
Chip Select, Output Voltages Output VOUT Time µs/div)
Chip Select, Output Voltages
2.0V
Output High-Z
5.5V
VOUT
Output High-Z Time µs/div)
Output
FIGURE 2-31: Chip Select (CS) Amplifier Output Response Time, with 2.0V (MCP6273 MCP6275 only).
1.E-02 1.E-03 1.E-04 100µ 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10 1.E-11 1.E-12
FIGURE 2-33: Chip Select (CS) Amplifier Output Response Time, with 5,5V (MCP6273 MCP6275 only).
Input, Output Voltage Time ms/div) VOUT 5.0V
Input Current Magnitude
+125°C +85°C +25°C -40°C
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 Input Voltage
FIGURE 2-32: Voltage.
Input Current Input
FIGURE 2-34: MCP6271/1R/2/3/4/5 Show Phase Reversal.
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
DESCRIPTIONS
Descriptions pins listed Table (single amps) Table (dual quad amps).
TABLE 3-1:
FUNCTION TABLE SINGLE AMPS
MCP6271R SOT-23-5 MCP6273 PDIP, SOIC, MSOP Symbol SOT-23-6 VIN- VIN+ VOUT Inverting Input Non-inverting Input Negative Power Supply Analog Output Positive Power Supply Chip Select Internal Connection Description
MCP6271 PDIP, SOIC, MSOP 1,5,8 SOT-23-5
TABLE 3-2:
MCP6272
FUNCTION TABLE DUAL QUAD AMPS
MCP6274 MCP6275 Symbol VOUTA VINA- VINA+ VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD VOUTA VINB+ Analog Output Inverting Input Non-inverting Input Positive Power Supply Non-inverting Input Inverting Input Analog Output Analog Output Inverting Input Non-inverting Input Negative Power Supply Non-inverting Input Inverting Input Analog Output Analog Output A)/Non-inverting Input Chip Select Description
Analog Outputs
Chip Select Digital Input
output pins impedance voltage sources.
This CMOS, Schmitt triggered input that places part into power mode operation.
Analog Inputs Power Supply Pins
positive power supply (VDD) 2.0V 6.0V higher than negative power supply (VSS). normal operation, other pins voltages between VDD. Typically, these parts used single (positive) supply configuration. this case, connected ground connected supply. will need bypass capacitors.
non-inverting inverting inputs high impedance CMOS inputs with bias currents.
MCP6275's VOUTA/VINB+
MCP6275 only, output connected directly non-inverting input this VOUTA/VINB+ pin. This connection makes possible provide duals 8-pin packages.
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
APPLICATION INFORMATION
MCP6271/1R/2/3/4/5 family amps manufactured using Microchip's state CMOS process, specifically designed cost, power general purpose applications. supply voltage, quiescent current wide bandwidth make MCP6271/1R/2/3/4/5 ideal battery powered applications. dump currents onto VDD. When implemented shown, resistors also limit current through (minimum expected (minimum expected MCP627X VOUT
4.1.1
Rail-to-Rail Inputs
PHASE REVERSAL
input devices designed exhibit phase inversion when input pins exceed supply voltages. Figure 2-34 shows input voltage exceeding both supplies with phase inversion.
4.1.2
INPUT VOLTAGE CURRENT LIMITS
protection inputs depicted shown Figure 4-1. This structure chosen protect input transistors, minimize input bias current (IB). input diodes clamp inputs when they more than diode drop below VSS. They also clamp voltages that above VDD; their breakdown voltage high enough allow normal operation, enough bypass quick events within specified limits.
FIGURE 4-2: Inputs.
Protecting Analog
also possible connect diodes left resistor this case, currents through diodes need limited some other mechanism. resistors then serve in-rush current limiters; current into input pins (VIN+ VIN-) should very small. significant amount current flow inputs (through diodes) when common mode voltage (VCM) below ground (VSS); Figure 2-32. Applications that high impedance need limit usable voltage range.
Bond
VIN+ Bond
Input Stage
Bond
4.1.3
NORMAL OPERATIONS
Bond
FIGURE 4-1: Structures.
Simplified Analog Input
order prevent damage and/or improper operation these amplifiers, circuit must limit currents (and voltages) input pins (see Absolute Maximum Ratings beginning Section "Electrical Characteristics"). Figure shows recommended approach protecting these inputs. internal diodes prevent input pins (VIN+ VIN-) from going below ground, resistors limit possible current drawn input pins. Diodes prevent input pins (VIN+ VIN-) from going above VDD,
input stage MCP6271/1R/2/3/4/5 amps uses differential CMOS input stages parallel. operates common mode input voltage (VCM other high VCM. With this topology, input operates with 0.3V past either supply rail (see Figure Figure 2-10). input offset voltage (VOS) measured 0.3V 0.3V ensure proper operation. transition between input stage occurs when 1.1V (see Figure Figure 26). best distortion gain linearity, with noninverting gains, avoid this region operation.
Rail-to-Rail Output
output voltage range MCP6271/1R/2/3/4/5 amps (minimum) (maximum) when connected VDD/2 5.5V. Refer Figure 2-17 more information.
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
Capacitive Loads MCP6273/5 Chip Select
Driving large capacitive loads cause stability problems voltage feedback amps. load capacitance increases, feedback loop's phase margin decreases closed-loop bandwidth reduced. This produces gain peaking frequency response, with overshoot ringing step response. unity gain buffer most sensitive capacitive loads, though gains show same general behavior. When driving large capacitive loads with these amps (e.g., when +1), small series resistor output (RISO Figure 4-3) improves feedback loop's phase margin (stability) making output load resistive higher frequencies. bandwidth will generally lower than bandwidth with capacitive load. MCP6273 MCP6275 single dual amps with Chip Select (CS), respectively. When pulled high, supply current drops (typical) flows through VSS. When this happens, amplifier output into high impedance state. pulling low, amplifier enabled. internal (typical) pulldown resistor connected VSS, will left floating. Figure shows output voltage supply current response pulse.
Cascaded Dual Amps (MCP6275)
MCP627X
RISO VOUT
MCP6275 dual with Chip Select (CS). Chip Select input available what would non-inverting input standard dual (pin This available because output connects non-inverting input shown Figure 4-5. Chip Select input, which connected microcontroller line, puts device power mode. Refer Section "MCP6273/5 Chip Select (CS)".
VOUTA/VINB+ VINA- VINA+ MCP6275 VINB-
FIGURE 4-3: Output Resistor, RISO stabilizes large capacitive loads.
Figure gives recommended RISO values different capacitive loads gains. x-axis normalized load capacitance (CL/GN), where circuit's noise gain. non-inverting gains, Signal Gain equal. inverting gains, 1+|Signal Gain| (e.g., gives V/V).
1,000 Recommended RISO
VOUTB
FIGURE 4-5:
Cascaded Gain Amplifier.
1,000 10,000 Normalized Load Capacitance; (pF)
output loaded input impedance which typically 10136 specified specification table (Refer Section "Capacitive Loads" further details regarding capacitive loads). common mode input range these amps specified data sheet However, since output limited from rails with load), non-inverting input range limited common mode input range
FIGURE 4-4: Recommended RISO Values Capacitive Loads.
After selecting RISO your circuit, double check resulting frequency response peaking step response overshoot. Modify RISO's value until response reasonable. Bench evaluation simulations with MCP6271/1R/2/3/4/5 SPICE macro model helpful.
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
Unused Amplifiers
VIN- VIN+ unused quad package (MCP6274) should configured shown Figure 4-6. These circuits prevent output from toggling causing crosstalk. Circuit produce voltage within output voltage range (VOH, VOL). buffers this voltage, which used elsewhere circuit. Circuit uses minimum number components operates comparator. MCP6274 VREF MCP6274
Guard Ring
FIGURE 4-7: Inverting Gain.
Example Guard Ring Layout
FIGURE 4-6:
Unused Amps.
Supply Bypass
With this family operational amplifiers, power supply (VDD single supply) should have local bypass capacitor (i.e., 0.01 within good, high frequency performance. also needs bulk capacitor (i.e., larger) within provide large, slow currents. This bulk capacitor shared with nearby analog parts.
Inverting Gain Transimpedance Amplifiers (convert current voltage, such photo detectors): Connect guard ring non-inverting input (VIN+). This biases guard ring same reference voltage (e.g., VDD/2 ground). Connect inverting (VIN-) input with wire that does touch surface. Non-inverting Gain Unity Gain Buffer: Connect non-inverting (VIN+) input with wire that does touch surface. Connect guard ring inverting input (VIN-). This biases guard ring common mode input voltage.
Surface Leakage
applications where input bias current critical, Printed Circuit Board (PCB) surface leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current flow. This greater than MCP6271/1R/2/3/4/5 family's bias current 25°C typical). easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. example this type layout illustrated Figure 4-7.
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
4.9.1
Application Circuits
ACTIVE FULL-WAVE RECTIFIER
4.9.2
LOSSY NON-INVERTING INTEGRATOR
MCP6271/1R/2/3/4/5 family amplifiers used applications such Active Full-Wave Rectifier Absolute Value circuit, shown Figure 4-8. amplifier feedback loops this active voltage rectifier circuit eliminate diode drop problem that exists passive voltage rectifier. This circuit behaves follower (the output follows input) long input signal more positive than reference voltage. input signal more negative than reference voltage, however, circuit behaves inverting amplifier. Therefore, output voltage will always above reference voltage, regardless input signal. VOUT MCP6272 VREF Output
non-inverting integrator shown Figure easy build. saves over typical Miller integrator plus inverting amplifier configuration. phase accuracy this integrator depends matching input feedback resistor-capacitor time constants. makes this lossy integrator finite gain DC), makes this integrator stable itself. MCP6271 VOUT
FIGURE 4-9:
Non-Inverting Integrator.
MCP6272 Input
VREF
VREF
VREF
time
time
FIGURE 4-8:
Active Full-wave Rectifier.
design equations give gain from VOUT, produce rail-to-rail outputs.
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
4.9.3 CASCADED APPLICATIONS
MCP6275 provides flexibility power mode dual amps 8-pin package. MCP6275 eliminates added cost space battery powered application using single amps with Chip Select (CS) lines 10-pin device with line both amps. Since amps internally cascaded, this device cannot used circuits that require active passive elements between amps. However, there several applications where this configuration with line becomes suitable. circuits below show possible applications this device.
MCP6275
VOUT
FIGURE 4-11: Configuration. 4.9.3.3
Cascaded Gain Circuit
4.9.3.1
Load Isolation
Difference Amplifier
With cascaded configuration, used isolate load from applications where driving capacitive resistive loads feedback loop (such integrator filter circuit) have sufficient source current drive load. this case, used buffer.
Figure 4-12 shows configured difference amplifier with Chip Select. this configuration, recommended that well matched resistors (e.g., 0.1%) used increase Common Mode Rejection Ratio (CMRR). used provide additional gain isolate load from difference amplifier. VIN2
MCP6275 Load
VOUTB VIN1 MCP6275
VOUT
FIGURE 4-10: Buffer. 4.9.3.2
Isolating Load with
FIGURE 4-12: 4.9.3.4
Difference Amplifier Circuit.
Cascaded Gain
Inverting Integrator with Active Compensation Chip Select
Figure 4-11 shows cascaded gain circuit configuration with Chip Select. amps configured non-inverting amplifier configuration. this configuration, important note that input offset voltage amplified gain shown below: Where: VOSA VOSB gain gain input offset voltage input offset voltage
Figure 4-13 uses active compensator compensate non-ideal characteristics introduced higher frequencies. This circuit uses unity gain buffer isolate integration capacitor from drives capacitor with impedance source. Since both amps matched very well, they provide high quality integrator. MCP6275 VOUT
Therefore, recommended that most gain with with relatively small gain (e.g., unity gain buffer).
FIGURE 4-13: Compensation.
2008 Microchip Technology Inc.
Integrator Circuit with Active
DS21810F-page
MCP6271/1R/2/3/4/5
4.9.3.5 Second Order with Extra Pole-Zero Pair 4.9.3.7 Capacitorless Second Order Low-Pass filter with Chip Select
Figure 4-14 second order multiple feedback lowpass filter with Chip Select. FilterLab® software from Microchip Technology Inc. determine values second order filter. used pole-zero pair using low-pass filter shown Figure 4-16 does require external capacitors uses only three external resistors; amp's GBWP sets corner frequency. used circuit gain. used avoid gain peaking frequency response, needs (lower values need selected R3). Note that amplifier bandwidth varies greatly over temperature process. This configuration, however, provides cost solution applications with high bandwidth requirements. MCP6275 VREF MCP6275 VOUT
VOUT
FIGURE 4-14: Second Order Multiple Feedback Low-Pass Filter with Extra PoleZero Pair. 4.9.3.6 Second Order Sallen-Key with Extra Pole-Zero Pair
FIGURE 4-16: Capacitorless Second Order Low-Pass Filter with Chip Select.
Figure 4-15 second order Sallen-Key low-pass filter with Chip Select. Filterlab® software from Microchip determine values second order filter. used pole-zero pair using VOUT
MCP6275
FIGURE 4-15: Second Order Sallen-Key Low-Pass Filter with Extra Pole-Zero Pair Chip Select.
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
DESIGN TOOLS
Microchip provides basic design tools needed MCP6271/1R/2/3/4/5 family amps.
Analog Demonstration Evaluation Boards
SPICE Macro Model
latest SPICE macro model MCP6271/1R/2/ 3/4/5 amps available Microchip site www.microchip.com. This model intended initial design tool that works well amp's linear region operation over temperature range. model file information capabilities. Bench testing very important part design cannot replaced with simulations. Also, simulation results using this macro model need validated comparing them data sheet specifications characteristic curves.
Microchip offers broad spectrum Analog Demonstration Evaluation Boards that designed help achieve faster time market. complete listing these boards their corresponding user's guides technical information, visit Microchip site www.microchip.com/ analogtools. boards that especially useful are: SOIC8EV: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board SOIC14EV: 14-Pin SOIC/TSSOP/DIP Evaluation Board
Application Notes
FilterLab® Software
Microchip's FilterLab® software innovative software tool that simplifies analog active filter (using amps) design. Available cost from Microchip site www.microchip.com/filterlab, FilterLab design tool provides full schematic diagrams filter circuit with component values. also outputs filter circuit SPICE format, which used with macro model simulate actual filter performance.
following Microchip Application Notes available Microchip site www.microchip. com/ appnotes recommended supplemental reference resources. ADN003: "Select Right Operational Amplifier your Filtering Circuits", DS21821 AN722: "Operational Amplifier Topologies Specifications", DS00722 AN723: "Operational Amplifier Specifications Applications", DS00723 AN884: "Driving Capacitive Loads With Amps", DS00884 AN990: "Analog Sensor Conditioning Circuits Overview", DS00990 These application notes others listed design guide: "Signal Chain Design Guide", DS21825
MindiCircuit Designer Simulator
Microchip's MindiCircuit Designer Simulator aids design various circuits useful active filter, amplifier power-management applications. free online circuit designer simulator available from Microchip site www.microchip.com/mindi. This interactive circuit designer simulator enables designers quickly generate circuit diagrams, simulate circuits. Circuits developed using Mindi Circuit Designer Simulator downloaded personal computer workstation.
MAPS (Microchip Advanced Part Selector)
MAPS software tool that helps semiconductor professionals efficiently identify Microchip devices that particular design requirement. Available cost from Microchip site www.microchip.com/ maps, MAPS overall selection tool Microchip's product portfolio that includes Analog, Memory, MCUs DSCs. Using this tool define filter sort features parametric search devices export side-by-side technical comparison reports. Helpful links also provided Data sheets, Purchase, Sampling Microchip parts.
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
PACKAGING INFORMATION
Package Marking Information
5-Lead SOT-23 (MCP6271 MCP6271R) Example:
Device
Code CGNN ETNN
XXNN
MCP6271 MCP6271R
CG25
Note: Applies 5-Lead SOT-23
6-Lead SOT-23 (MCP6273)
Example:
XXNN
CK25
8-Lead MSOP XXXXXX YWWNNN
Example: 6271E 644256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW MCP6271 E/P256 0437
Example: MCP6271 E/P^^256 0644
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW MCP6271 E/SN0437
Example: MCP6271E SN^^0644
Legend: XX.X
Note:
Customer-specific information Year code (last digit calendar year) Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code Pb-free JEDEC designator Matte (Sn) This package Pb-free. Pb-free JEDEC designator found outer packaging this package.
event full Microchip part number cannot marked line, will carried over next line, thus limiting number available characters customer-specific information.
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP6274) XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN Example:
MCP6274-E/P 0437256
MCP6274 E/P^^ 0644256
14-Lead SOIC (150 mil) (MCP6274)
Example:
XXXXXXXXXX XXXXXXXXXX YYWWNNN
MCP6274ESL 0437256
MCP6274 E/SL^^ 0644256
14-Lead TSSOP (MCP6274)
Example:
XXXXXX YYWW
6274EST 0437
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
/HDG 3ODVWLF 6PDOO 2XWOLQH 7UDQVLVWRU >627@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV /HDG 3LWFK 2XWVLGH /HDG 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV 0,//,0(7(56
/HDG :LGWK 1RWHV 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
/HDG 3ODVWLF 6PDOO 2XWOLQH 7UDQVLVWRU >627@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
LASER MARK
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 2XWVLGH /HDG 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV 0,//,0(7(56
/HDG :LGWK 1RWHV 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
/HDG 3ODVWLF 0LFUR 6PDOO 2XWOLQH 3DFNDJH >0623@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
NOTE
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV
0,//,0(7(56
/HDG :LGWK 1RWHV YLVXDO LQGH[ IHDWXUH YDU\ PXVW ORFDWHG ZLWKLQ KDWFKHG DUHD 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 5HIHUHQFH 'LPHQVLRQ XVXDOO\ ZLWKRXW WROHUDQFH LQIRUPDWLRQ SXUSRVHV RQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
/HDG 3ODVWLF 'XDO ,Q/LQH %RG\ >3',3@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
NOTE
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 6HDWLQJ 3ODQH 0ROGHG 3DFNDJH 7KLFNQHVV %DVH 6HDWLQJ 3ODQH 6KRXOGHU 6KRXOGHU :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK 6HDWLQJ 3ODQH /HDG 7KLFNQHVV 8SSHU /HDG :LGWK /RZHU /HDG :LGWK 2YHUDOO 6SDFLQJ
,1&+(6
1RWHV YLVXDO LQGH[ IHDWXUH YDU\ PXVW ORFDWHG ZLWK KDWFKHG DUHD 6LJQLILFDQW &KDUDFWHULVWLF 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
/HDG 3ODVWLF 6PDOO 2XWOLQH 1DUURZ %RG\ >62,&@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
NOTE
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK &KDPIHU RSWLRQDO )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV /HDG :LGWK 0ROG 'UDIW $QJOH 0ROG 'UDIW $QJOH %RWWRP
0,//,0(7(56
1RWHV YLVXDO LQGH[ IHDWXUH YDU\ PXVW ORFDWHG ZLWKLQ KDWFKHG DUHD 6LJQLILFDQW &KDUDFWHULVWLF 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 5HIHUHQFH 'LPHQVLRQ XVXDOO\ ZLWKRXW WROHUDQFH LQIRUPDWLRQ SXUSRVHV RQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
/HDG 3ODVWLF 6PDOO 2XWOLQH 1DUURZ %RG\ >62,&@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
/HDG 3ODVWLF 'XDO ,Q/LQH %RG\ >3',3@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
NOTE
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 6HDWLQJ 3ODQH 0ROGHG 3DFNDJH 7KLFNQHVV %DVH 6HDWLQJ 3ODQH 6KRXOGHU 6KRXOGHU :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK 6HDWLQJ 3ODQH /HDG 7KLFNQHVV 8SSHU /HDG :LGWK /RZHU /HDG :LGWK 2YHUDOO 6SDFLQJ ,1&+(6
1RWHV YLVXDO LQGH[ IHDWXUH YDU\ PXVW ORFDWHG ZLWK KDWFKHG DUHD 6LJQLILFDQW &KDUDFWHULVWLF 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
/HDG 3ODVWLF 6PDOO 2XWOLQH 1DUURZ %RG\ >62,&@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
NOTE
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK &KDPIHU RSWLRQDO )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV /HDG :LGWK 0ROG 'UDIW $QJOH 0ROG 'UDIW $QJOH %RWWRP
0,//,0(7(56
1RWHV YLVXDO LQGH[ IHDWXUH YDU\ PXVW ORFDWHG ZLWKLQ KDWFKHG DUHD 6LJQLILFDQW &KDUDFWHULVWLF 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 5HIHUHQFH 'LPHQVLRQ XVXDOO\ ZLWKRXW WROHUDQFH LQIRUPDWLRQ SXUSRVHV RQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
/HDG 3ODVWLF 7KLQ 6KULQN 6PDOO 2XWOLQH %RG\ >76623@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
NOTE
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 0ROGHG 3DFNDJH /HQJWK )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV
0,//,0(7(56
/HDG :LGWK 1RWHV YLVXDO LQGH[ IHDWXUH YDU\ PXVW ORFDWHG ZLWKLQ KDWFKHG DUHD 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 5HIHUHQFH 'LPHQVLRQ XVXDOO\ ZLWKRXW WROHUDQFH LQIRUPDWLRQ SXUSRVHV RQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
APPENDIX REVISION HISTORY
Revision (June 2004)
Undocumented Changes
Revision (March 2008)
following list modifications: Increased maximum operating VDD. Updated Section "Design Tools" Various cleanups thoughout document. Updated package outline drawings Section "Packaging Information"
Revision (October 2003)
Undocumented Changes
Revision (June 2003)
Original data sheet release.
Revision (December 2006)
following list modifications: Updated specifications (Section "Electrical Characteristics"): Clarified Absolute Maximum Analog Input Voltage Current specifications. Clarified VCMR, VOL, VOH, specifications. Corrected typical Eni. Added plots Common Mode Input Range behavior temperature supply voltage (Section "Typical Performance Curves"). Added applications writeup unused amps corrected description floating behavior (Section "Application Information"). Updated package information (Section "Packaging Information"): Corrected package markings. Added disclaimer package outline drawings.
Revision (December 2004)
following list modifications: Added SOT-23-5 packages MCP6271 MCP6271R single amps. Added SOT-23-6 packages MCP6273 single amp. Added Section "Pin Descriptions". Corrected application circuits (Section "Application Circuits"). Added SOT-23-5 SOT-23-6 packages corrected package marking information (Section "Packaging Information"). Added Appendix Revision History.
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
NOTES:
DS21810F-page
2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device
Package
Examples:
MCP6271-E/SN: MCP6271-E/MS: MCP6271-E/P: MCP6271T-E/OT: Extended Temperature, SOIC package. Extended Temperature, MSOP package. Extended Temperature, PDIP package. Tape Reel, Extended Temperature, SOT-23 package.
Temperature Range
Device:
MCP6271: MCP6271T:
MCP6271RT: MCP6272: MCP6272T: MCP6273: MCP6273T:
MCP6274: MCP6274T: MCP6275: MCP6275T:
Single Single (Tape Reel) (SOIC, MSOP, SOT-23-5) Single (Tape Reel) (SOT-23-5) Dual Dual (Tape Reel) (SOIC, MSOP) Single with Chip Select Single with Chip Select (Tape Reel) (SOIC, MSOP, SOT-23-6) Quad Quad (Tape Reel) (SOIC, TSSOP) Dual with Chip Select Dual with Chip Select (Tape Reel) (SOIC, MSOP)
MCP6271RT-E/OT: Tape Reel, Extended Temperature, SOT-23 package. MCP6272-E/SN: MCP6272-E/MS: MCP6272-E/P: MCP6272T-E/SN: Extended Temperature, SOIC package. Extended Temperature, MSOP package. Extended Temperature, PDIP package. Tape Reel, Extended Temperature, SOIC package.
Temperature Range: -40°C +125°C Package: Plastic Small Outline Transistor (SOT-23), 5-lead (MCP6271, MCP6271R) Plastic Small Outline Transistor (SOT-23), 6-lead (MCP6273) Plastic MSOP, 8-lead Plastic (300 Body), 8-lead, 14-lead Plastic SOIC, (150 Body), 8-lead Plastic SOIC (150 Body), 14-lead Plastic TSSOP (4.4 Body), 14-lead
MCP6273-E/SN:
Extended Temperature, SOIC package. MCP6273-E/MS: Extended Temperature, MSOP package. MCP6273-E/P: Extended Temperature, PDIP package. MCP6273T-E/CH: Extended Temperature, SOT-23 package. Extended Temperature, 14LD PDIP package. Tape Reel, Extended Temperature, 14LD SOIC package. Extended Temperature, 14LD SOIC package. Extended Temperature, 14LD TSSOP package. Extended Temperature, SOIC package. Extended Temperature, MSOP package. Extended Temperature, PDIP package. Tape Reel, Extended Temperature, SOIC package.
MCP6274-E/P: MCP6274T-E/SL:
MCP6274-E/SL: MCP6274-E/ST:
MCP6275-E/SN: MCP6275-E/MS: MCP6275-E/P: MCP6275T-E/SN:
2008 Microchip Technology Inc.
DS21810F-page
MCP6271/1R/2/3/4/5
NOTES:
DS21810F-page
2008 Microchip Technology Inc.
Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip devices life support and/or safety applications entirely buyer's risk, buyer agrees defend, indemnify hold harmless Microchip from damages, claims, suits, expenses resulting from such use. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights.
Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, MATE, rfPIC SmartShunt registered trademarks Microchip Technology Incorporated U.S.A. other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, UNI/O, WiperLock ZENA trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2008, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper.
Microchip received ISO/TS-16949:2002 certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona; Gresham, Oregon design centers California India. Company's quality system processes procedures PIC® MCUs dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified.
2008 Microchip Technology Inc.
DS21810F-page
WORLDWIDE SALES SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Address: www.microchip.com Atlanta Duluth, Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, Tel: 765-864-8360 Fax: 765-864-8387 Angeles Mission Viejo, Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 China Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049
ASIA/PACIFIC
India Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934 Malaysia Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Hsin Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
01/02/08
DS21810F-page
2008 Microchip Technology Inc.

Rail-to-Rail Gain Bandwidth Product: (typical) Supply Current: (t

Top Searches for this datasheet

Other recent searches