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MHz, Low-Power Available SC-70-5 SOT-23-5 packages Gain Bandwidth
Top Searches for this datasheetMCP6001/1R/1U/2/4 MHz, Low-Power Available SC-70-5 SOT-23-5 packages Gain Bandwidth Product: (typical) Rail-to-Rail Input/Output Supply Voltage: 1.8V 6.0V Supply Current: (typical) Phase Margin: (typical) Temperature Range: Industrial: -40°C +85°C Extended: -40°C +125°C Available Single, Dual Quad Packages Description Microchip Technology Inc. MCP6001/2/4 family operational amplifiers amps) specifically designed general-purpose applications. This family Gain Bandwidth Product (GBWP) phase margin (typical). also maintains phase margin (typical) with capacitive load. This family operates from single supply voltage 1.8V, while drawing (typical) quiescent current. Additionally, MCP6001/2/4 supports rail-to-rail input output swing, with common mode input voltage range This family amps designed with Microchip's advanced CMOS process. MCP6001/2/4 family available industrial extended temperature ranges, with power supply range 1.8V 6.0V. Applications Automotive Portable Equipment Photodiode Amplifier Analog Filters Notebooks PDAs Battery-Powered Systems Package Types MCP6001 SC-70-5, SOT-23-5 VOUT VIN+ MCP6002 PDIP, SOIC, MSOP VOUTA VINA- VIN- VINA+ VOUTB Design Aids SPICE Macro Models FilterLab® Software MindiCircuit Designer Simulator Microchip Advanced Part Selector (MAPS) Analog Demonstration Evaluation Boards Application Notes VINB- VINB+ MCP6001R SOT-23-5 VOUT Typical Application MCP6001 Gain VOUT MCP6004 PDIP, SOIC, TSSOP VOUTA VOUTD VIND- VIND+ VINC+ VINC- VOUTC VINA- VINA+ VIN+ VIN- MCP6001U SOT-23-5 VIN+ VINB+ VINB- VOUTB VREF VIN- VOUT Non-Inverting Amplifier 2008 Microchip Technology Inc. DS21733H-page MCP6001/1R/1U/2/4 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability. Section 4.1.2 "Input Voltage Current Limits". Absolute Maximum Ratings .7.0V Current Analog Input Pins (VIN+, VIN-) Analog Inputs (VIN+, VIN-) 1.0V 1.0V Other Inputs Outputs 0.3V 0.3V Difference Input Voltage |VDD VSS| Output Short Circuit Current .Continuous Current Output Supply Pins .±30 Storage Temperature.-65°C +150°C Maximum Junction Temperature (TJ) .+150°C Protection Pins (HBM; 200V ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, +25°C, +1.8V +5.5V, GND, VDD/2, VDD/2, VOUT VDD/2 (refer Figure Figure 1-2). Parameters Input Offset Input Offset Voltage Input Offset Drift with Temperature Power Supply Rejection Ratio Input Bias Current Impedance Input Bias Current: Industrial Temperature Extended Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode Common Mode Input Range Common Mode Rejection Ratio Open-Loop Gain Open-Loop Gain (Large Signal) Output Maximum Output Voltage Swing Output Short Circuit Current Power Supply Supply Voltage Quiescent Current Amplifier Note Note 5.5V, VOL, 5.5V, 0.5V Input Overdrive 1.8V 5.5V VOUT 0.3V 0.3V, VCMR CMRR -0.3V 5.3V, ZDIFF ±1.0 1100 ±1.0 1013||6 1013||3 ||pF ||pF +85°C +125°C VOS/TA PSRR -4.5 ±2.0 +4.5 µV/°C (Note -40°C +125°C, Units Conditions MCP6001/1R/1U/2/4 parts with date codes prior December 2004 (week code were tested minimum/ maximum limits. parts with date codes November 2007 later have been screened ensure operation 6.0V. However, other minimum maximum specifications measured 1.8V 5.5V. DS21733H-page 2008 Microchip Technology Inc. MCP6001/1R/1U/2/4 ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, +25°C, +1.8 5.5V, GND, VDD/2, VDD/2, VOUT VDD/2, (refer Figure Figure 1-2). Parameters Response Gain Bandwidth Product Phase Margin Slew Rate Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density µVp-p nV/Hz fA/Hz GBWP V/µs Units Conditions TEMPERATURE SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, +1.8V +5.5V GND. Parameters Temperature Ranges Industrial Temperature Range Extended Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SC70 Thermal Resistance, 5L-SOT-23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC (150 mil) Thermal Resistance, 8L-MSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note: °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W +125 +125 +150 Note Units Conditions industrial temperature devices operate over this extended temperature range, with reduced performance. case, internal Junction Temperature (TJ) must exceed Absolute Maximum specification +150°C. Test Circuits VDD/2 VOUT VOUT test circuits used tests shown Figure Figure 1-2. bypass capacitors laid according rules discussed Section "Supply Bypass". MCP600X MCP600X FIGURE 1-2: Test Circuit Most Inverting Gain Conditions. VDD/2 FIGURE 1-1: Test Circuit Most Non-Inverting Gain Conditions. 2008 Microchip Technology Inc. DS21733H-page MCP6001/1R/1U/2/4 Note: TYPICAL PERFORMANCE CURVES graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range. Note: Unless otherwise indicated, +25°C, +1.8V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, Input Offset Voltage (µV) -100 -200 -300 -400 -500 -600 -700 -0.4 -0.2 Input Offset Voltage (mV) Common Mode Input Voltage -40°C +25°C +85°C +125°C Percentage Occurrences 64,695 Samples 1.8V FIGURE 2-1: Input Offset Voltage. FIGURE 2-4: Input Offset Voltage Common Mode Input Voltage 1.8V. Input Offset Voltage (µV) Percentage Occurrences 2453 Samples -40°C +125°C 5.5V -100 -200 -300 -400 -500 -600 -700 -0.5 Common Mode Input Voltage -40°C +25°C +85°C +125°C Input Offset Voltage Drift; (µV/°C) FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-5: Input Offset Voltage Common Mode Input Voltage 5.5V. Input Offset Voltage (µV) -100 -150 -200 Output Voltage 1.8V 5.5V Percentage Occurrences 0.00 0.01 0.02 0.03 -0.02 -0.01 2453 Samples -40°C +125°C 0.04 0.05 0.06 Input Offset Quadratic Temp. Co.; (µV/°C FIGURE 2-3: Temp. Input Offset Quadratic 0.07 FIGURE 2-6: Output Voltage. Input Offset Voltage DS21733H-page 2008 Microchip Technology Inc. MCP6001/1R/1U/2/4 Note: Unless otherwise indicated, +25°C, +1.8V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, Percentage Occurrences Input Bias Current (pA) PSRR, CMRR (dB) 1.E+01 1.E+02 1.E+03 1.E+04 Frequency (Hz) 100k 1.E+05 CMRR PSRR+ PSRR- 1230 Samples 5.5V +85°C FIGURE 2-7: Input Bias Current +85°C. FIGURE 2-10: Frequency. Open-Loop Gain (dB) PSRR, CMRR Percentage Occurrences Phase Gain -120 -150 -180 1050 1200 1350 1500 Input Bias Current (pA) 1.E- 1.E+ 1.E+ -210 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 100k 1.E+ Frequency (Hz) FIGURE 2-8: +125°C. PSRR, CMRR (dB) Input Bias Current FIGURE 2-11: Frequency. 1,000 Input Noise Voltage Density (nV/Hz) Open-Loop Gain, Phase 5.0V PSRR (VCM VSS) Ambient Temperature (°C) CMRR (VCM -0.3V +5.3V) 100k 1.E-01 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 Frequency (Hz) FIGURE 2-9: Temperature. CMRR, PSRR Ambient FIGURE 2-12: Frequency. Input Noise Voltage Density 2008 Microchip Technology Inc. DS21733H-page Open-Loop Phase Samples 5.5V +125°C MCP6001/1R/1U/2/4 Note: Unless otherwise indicated, +25°C, +1.8V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, 0.08 Output Voltage mV/div) 0.06 Short Circuit Current Magnitude (mA) -40°C +25°C +85°C +125°C 0.04 0.02 0.00 -0.02 -0.04 -0.06 Power Supply Voltage -0.08 0.E+00 1.E-06 2.E-06 3.E-06 4.E-06 5.E-06 6.E-06 7.E-06 8.E-06 9.E-06 1.E-05 Time µs/div) FIGURE 2-13: Output Short Circuit Current Power Supply Voltage. 1,000 Output Voltage Headroom (mV) FIGURE 2-16: Pulse Response. Small-Signal, Non-Inverting 5.0V 1.E-05 100µ 1.E-04 1.E-03 Output Current Magnitude 1.E-02 Output Voltage 0.E+00 1.E-05 2.E-05 3.E-05 4.E-05 5.E-05 6.E-05 7.E-05 8.E-05 9.E-05 1.E-04 Time µs/div) FIGURE 2-14: Output Voltage Headroom Output Current Magnitude. Quiescent Current amplifier (mA) Power Supply Voltage +125°C +85°C +25°C -40°C FIGURE 2-17: Pulse Response. Large-Signal, Non-Inverting 0.5V 5.5V Falling Edge Slew Rate (V/µs) 1.8V Rising Edge Ambient Temperature (°C) FIGURE 2-15: Quiescent Current Power Supply Voltage. FIGURE 2-18: Temperature. Slew Rate Ambient DS21733H-page 2008 Microchip Technology Inc. MCP6001/1R/1U/2/4 Note: Unless otherwise indicated, +25°C, +1.8V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, 5.5V Input, Output Voltages 0.E+00 1.E-05 2.E-05 3.E-05 Output Voltage Swing VOUT 5.0V 1.8V 1.E+03 100k 1.E+04 1.E+05 Frequency (Hz) 1.E+06 4.E-05 5.E-05 6.E-05 7.E-05 8.E-05 9.E-05 1.E-04 Time µs/div) FIGURE 2-19: Frequency. 1.E-02 1.E-03 100µ 1.E-04 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10 1.E-11 1.E-12 Output Voltage Swing FIGURE 2-21: Phase Reversal. MCP6001/2/4 Show Input Current Magnitude +125°C +85°C +25°C -40°C -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 Input Voltage FIGURE 2-20: Measured Input Current Input Voltage (below VSS). 2008 Microchip Technology Inc. DS21733H-page MCP6001/1R/1U/2/4 DESCRIPTIONS Descriptions pins listed Table 3-1. TABLE 3-1: MCP6001 SC-70-5, SOT-23-5 FUNCTION TABLE MCP6001R MCP6001U SOT-23-5 SOT-23-5 MCP6002 MSOP, PDIP, SOIC MCP6004 PDIP, SOIC, TSSOP Symbol Description VOUT, VOUTA Analog Output VIN-, VINA- Inverting Input VIN+, VINA+ Non-inverting Input VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD Positive Power Supply Non-inverting Input Inverting Input Analog Output Analog Output Inverting Input Non-inverting Input Negative Power Supply Non-inverting Input Inverting Input Analog Output Analog Outputs Power Supply Pins output pins low-impedance voltage sources. Analog Inputs non-inverting inverting inputs highimpedance CMOS inputs with bias currents. positive power supply (VDD) 1.8V 6.0V higher than negative power supply (VSS). normal operation, other pins voltages between VDD. Typically, these parts used single (positive) supply configuration. this case, connected ground connected supply. will need bypass capacitors. DS21733H-page 2008 Microchip Technology Inc. MCP6001/1R/1U/2/4 APPLICATION INFORMATION MCP6001/2/4 family amps manufactured using Microchip's state-of-the-art CMOS process specifically designed low-cost, low-power general-purpose applications. supply voltage, quiescent current wide bandwidth makes MCP6001/2/4 ideal battery-powered applications. This device high phase margin, which makes stable larger capacitive load applications. VDD, dump currents onto VDD. When implemented shown, resistors also limit current through (minimum expected (minimum expected MCP600X 4.1.1 Rail-to-Rail Inputs PHASE REVERSAL MCP6001/1R/1U/2/4 designed prevent phase reversal when input pins exceed supply voltages. Figure 2-21 shows input voltage exceeding supply voltage without phase reversal. 4.1.2 INPUT VOLTAGE CURRENT LIMITS protection inputs depicted shown Figure 4-1. This structure chosen protect input transistors, minimize input bias current (IB). input diodes clamp inputs when they more than diode drop below VSS. They also clamp voltages that above VDD; their breakdown voltage high enough allow normal operation, enough bypass quick events within specified limits. Bond FIGURE 4-2: Inputs. Protecting Analog also possible connect diodes left resistors this case, current through diodes needs limited some other mechanism. resistors then serve in-rush current limiters; current into input pins (VIN+ VIN-) should very small. significant amount current flow inputs when common mode voltage (VCM) below ground (VSS); Figure 2-20. Applications that high impedance need limit usable voltage range. VIN+ Bond Input Stage Bond VIN- 4.1.3 NORMAL OPERATION Bond input stage MCP6001/1R/1U/2/4 amps differential CMOS input stages parallel. operates common mode input voltage (VCM), while other operates high VCM. WIth this topology, device operates with 0.3V above 0.3V below VSS. transition between input stages occurs when 1.1V. best distortion gain linearity, with non-inverting gains, avoid this region operation. FIGURE 4-1: Structures. Simplified Analog Input order prevent damage and/or improper operation these amps, circuit they must limit currents voltages VIN+ VIN- pins (see Absolute Maximum Ratings beginning Section "Electrical Characteristics"). Figure shows recommended approach protecting these inputs. internal diodes prevent input pins (VIN+ VIN-) from going below ground, resistors limit possible current drawn input pins. Diodes prevent input pins (VIN+ VIN-) from going above Rail-to-Rail Output output voltage range MCP6001/2/4 amps (minimum) (maximum) when connected VDD/2 5.5V. Refer Figure 2-14 more information. 2008 Microchip Technology Inc. DS21733H-page MCP6001/1R/1U/2/4 Capacitive Loads Supply Bypass Driving large capacitive loads cause stability problems voltage feedback amps. load capacitance increases, feedback loop's phase margin decreases closed-loop bandwidth reduced. This produces gain peaking frequency response, with overshoot ringing step response. While unity-gain buffer most sensitive capacitive loads, gains show same general behavior. When driving large capacitive loads with these amps (e.g., when +1), small series resistor output (RISO Figure 4-3) improves feedback loop's phase margin (stability) making output load resistive higher frequencies. bandwidth will generally lower than bandwidth with capacitance load. With this family operational amplifiers, power supply (VDD single-supply) should have local bypass capacitor (i.e., 0.01 within good high-frequency performance. also needs bulk capacitor (i.e., larger) within provide large, slow currents. This bulk capacitor shared with nearby analog parts. Unused Amps MCP600X RISO VOUT unused quad package (MCP6004) should configured shown Figure 4-5. These circuits prevent output from toggling causing crosstalk. Circuits sets minimum noise gain. resistor divider produces desired reference voltage within output voltage range amp; buffers that reference voltage. Circuit uses minimum number components operates comparator, draw more current. MCP6004 VREF MCP6004 FIGURE 4-3: Output resistor, RISO stabilizes large capacitive loads. Figure gives recommended RISO values different capacitive loads gains. x-axis normalized load capacitance (CL/GN), where circuit's noise gain. non-inverting gains, Signal Gain equal. inverting gains, 1+|Signal Gain| (e.g., gives V/V). 1000 Recommended RISO FIGURE 4-5: 5.0V Unused Amps. Surface Leakage 100p 1.E-11 1.E-10 1.E-09 1.E-08 Normalized Load Capacitance; CL/GN applications where input bias current critical, Printed Circuit Board (PCB) surface leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current flow; which greater than MCP6001/1R/1U/2/4 family's bias current 25°C (typically pA). easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. example this type layout shown Figure 4-6. FIGURE 4-4: Recommended RISO values Capacitive Loads. After selecting RISO your circuit, double-check resulting frequency response peaking step response overshoot. Modify RISO's value until response reasonable. Bench evaluation simulations with MCP6001/1R/1U/2/4 SPICE macro model very helpful. DS21733H-page 2008 Microchip Technology Inc. MCP6001/1R/1U/2/4 VINVIN+ VIN1 MCP6002 MCP6001 MCP6002 VOUT Guard Ring VIN2 FIGURE 4-6: Inverting Gain. Example Guard Ring Layout VREF Non-inverting Gain Unity-Gain Buffer: Connect non-inverting (VIN+) input with wire that does touch surface. Connect guard ring inverting input (VIN-). This biases guard ring common mode input voltage. Inverting Gain Transimpedance Gain Amplifiers (convert current voltage, such photo detectors): Connect guard ring non-inverting input (VIN+). This biases guard ring same reference voltage (e.g., VDD/2 ground). Connect inverting (VIN-) input with wire that does touch surface. FIGURE 4-7: Instrumentation Amplifier with Unity-Gain Buffer Inputs. 4.7.2 ACTIVE LOW-PASS FILTER MCP6001/2/4 amp's input bias current makes possible designer larger resistors smaller capacitors active low-pass filter applications. However, resistance increases, noise generated also increases. Parasitic capacitances large value resistors could also modify frequency response. These trade-offs need considered when selecting circuit elements. Usually, bandwidth 100X filter cutoff frequency higher) good performance. possible have bandwidth higher than cutoff frequency, thus having design that more sensitive component tolerances. Figure shows second-order Butterworth filter with cutoff frequency gain V/V; bandwidth only higher than cutoff frequency. component values were selected using Microchip's FilterLab® software. 4.7.1 Application Circuits UNITY-GAIN BUFFER rail-to-rail input output capability MCP6001/2/4 ideal unity-gain buffer applications. quiescent current wide bandwidth makes device suitable buffer configuration instrumentation amplifier circuit, shown Figure 4-7. 14.3 53.6 MCP6002 VOUT FIGURE 4-8: Pass Filter. Active Second-Order Low- 2008 Microchip Technology Inc. DS21733H-page MCP6001/1R/1U/2/4 4.7.3 PEAK DETECTOR EQUATION 4-1: 25mA -0.1F 250mV This voltage rate change less than MCP6001/2/4 slew rate V/µs. When input voltage swings below voltage across becomes reversebiased. This opens feedback loop rails amplifier. When input voltage increases, amplifier recovers slew rate. Based rate voltage change shown above equation, takes extended period time charge capacitor. capacitors need selected that circuit limited amplifier slew rate. Therefore, capacitors should less than stabilizing resistor (RISO) needs properly selected. (Refer Section "Capacitive Loads"). MCP6001/2/4 high input impedance, rail-to-rail input/output input bias current, which makes this device suitable peak detector applications. Figure shows peak detector circuit with clear sample switches. peak-detection cycle uses clock (CLK), shown Figure 4-9. rising edge CLK, Sample Switch closes begin sampling. peak voltage stored sampled sample time defined tSAMP. sample time (falling edge Sample Signal), Clear Signal goes high closes Clear Switch. When Clear Switch closes, discharges through time defined tCLEAR. clear time (falling edge Clear Signal), begins store peak value time defined tDETECT. order define tSAMP tCLEAR, necessary determine capacitor charging discharging period. capacitor charging time limited amplifier source current, while discharging time defined using R1C1). tDETECT time that input signal sampled dependent input voltage change frequency. output current limit, size storage capacitors (both C2), could create slewing limitations input voltage (VIN) increases. Current through capacitor dependent size capacitor rate voltage change. From this relationship, rate voltage change slew rate determined. example, with short circuit current load capacitor then: MCP6002 RISO MCP6002 RISO MCP6001 Sample Switch Clear Switch Sample Signal tCLEAR tSAMP VOUT Clear Signal tDETECT FIGURE 4-9: Peak Detector with Clear Sample CMOS Analog Switches. DS21733H-page 2008 Microchip Technology Inc. MCP6001/1R/1U/2/4 DESIGN AIDS Microchip provides basic design tools needed MCP6001/1R/1U/2/4 family amps. Analog Demonstration Evaluation Boards SPICE Macro Model latest SPICE macro model MCP6001/1R/ 1U/2/4 amps available Microchip site www.microchip.com. This model intended initial design tool that works well amp's linear region operation over temperature range. model file information capabilities. Bench testing very important part design cannot replaced with simulations. Also, simulation results using this macro model need validated comparing them data sheet specifications characteristic curves. Microchip offers broad spectrum Analog Demonstration Evaluation Boards that designed help achieve faster time market. complete listing these boards their corresponding user's guides technical information, visit Microchip site www.microchip.com/analogtools. boards that especially useful are: SOIC8EV: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board SOIC14EV: 14-Pin SOIC/TSSOP/DIP Evaluation Board Application Notes FilterLab® Software Microchip's FilterLab® software innovative software tool that simplifies analog active filter (using amps) design. Available cost from Microchip site www.microchip.com/filterlab, FilterLab design tool provides full schematic diagrams filter circuit with component values. also outputs filter circuit SPICE format, which used with macro model simulate actual filter performance. following Microchip Application Notes available Microchip site www.microchip. com/ appnotes recommended supplemental reference resources. ADN003: "Select Right Operational Amplifier your Filtering Circuits", DS21821 AN722: "Operational Amplifier Topologies Specifications", DS00722 AN723: "Operational Amplifier Specifications Applications", DS00723 AN884: "Driving Capacitive Loads With Amps", DS00884 AN990: "Analog Sensor Conditioning Circuits Overview", DS00990 These application notes others listed design guide: "Signal Chain Design Guide", DS21825 MindiCircuit Designer Simulator Microchip's MindiCircuit Designer Simulator aids design various circuits useful active filter, amplifier power-management applications. free online circuit designer simulator available from Microchip site www.microchip.com/mindi. This interactive circuit designer simulator enables designers quickly generate circuit diagrams, simulate circuits. Circuits developed using Mindi Circuit Designer Simulator downloaded personal computer workstation. Microchip Advanced Part Selector (MAPS) MAPS software tool that helps semiconductor professionals efficiently identify Microchip devices that particular design requirement. Available cost from Microchip site www.microchip.com/ maps, MAPS overall selection tool Microchip's product portfolio that includes Analog, Memory, MCUs DSCs. Using this tool define filter sort features parametric search devices export side-by-side technical comparison reports. Helpful links also provided Data sheets, Purchase, Sampling Microchip parts. 2008 Microchip Technology Inc. DS21733H-page MCP6001/1R/1U/2/4 PACKAGING INFORMATION Package Marking Information 5-Lead SC-70 (MCP6001) Example: (I-Temp) (Front) (Back) Device MCP6001 I-Temp Code E-Temp Code (Front) (Back) Note: Applies 5-Lead SC-70. XXNN Device MCP6001 I-Temp Code AANN E-Temp Code CDNN AA74 Note: Applies 5-Lead SC-70. 5-Lead SOT-23 (MCP6001/1R/1U) Example: (E-Temp) I-Temp Code AANN ADNN AFNN E-Temp Code CDNN CENN CFNN Device MCP6001 MCP6001R MCP6001U XXNN CD25 Note: Applies 5-Lead SOT-23. 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Example: MCP6002 I/P256 0432 MCP6002 I/P^^256 0746 Legend: XX.X Customer-specific information Year code (last digit calendar year) Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code Pb-free JEDEC designator Matte (Sn) This package Pb-free. Pb-free JEDEC designator found outer packaging this package. Note: event full Microchip part number cannot marked line, will carried over next line, thus limiting number available characters customer-specific information. DS21733H-page 2008 Microchip Technology Inc. MCP6001/1R/1U/2/4 Package Marking Information (Continued) 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW Example: MCP6002 I/SN0432 MCP6002 I/SN^^0746 8-Lead MSOP XXXXXX YWWNNN Example: 6002I 432256 14-Lead PDIP (300 mil) (MCP6004) Example: XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN MCP6004-I/P 0432256 MCP6004 E/P^^ 0746256 14-Lead SOIC (150 mil) (MCP6004) Example: XXXXXXXXXX XXXXXXXXXX YYWWNNN MCP6004ISL 0432256 MCP6004 E/SL^^ 0746256 14-Lead TSSOP (MCP6004) Example: XXXXXX YYWW 6004ST 0432 6004STE 0432 2008 Microchip Technology Inc. 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DS21733H-page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page 2008 Microchip Technology Inc. MCP6001/1R/1U/2/4 APPENDIX REVISION HISTORY Revision (May 2003) Undocumented changes. Revision (May 2008) following list modifications: Design Aids: Name change Mindi Simulation Tool. Package Types: Correct device labeling error. Section "Electrical Characteristics", Electrical Specifications: Changed "Maximum Output Voltage Swing" condition from 0.9V Input Overdrive 0.5V Input Overdrive. Section "Electrical Characteristics", Electrical Specifications: Changed Phase Margin condition from V/V. Section "Design AIDS": Name change Mindi Simulation Tool. Revision (December 2002) Undocumented changes. Revision (October 2002) Undocumented changes. Revision (June 2002) Original data sheet release. Revision (November 2007) following list modifications: Updated notes Section "Electrical Characteristics". Increased Absolute Maximum Voltage range input pins. Increased maximum operating supply voltage (VDD). Added test circuits. Added Figure Figure 2-20. Added Section 4.1.1 "Phase Reversal", Section 4.1.2 "Input Voltage Current Limits", Section 4.1.2 "Input Voltage Current Limits" Section "Unused Amps". Updated Section "Design AIDS", Updated Section "Packaging Information" Updated Package Outline Drawings. Revision (March 2005) following list modifications: Updated Section "Packaging Information" include packaging examples. Revision (December 2004) following list modifications: specification reduced ±4.5 from ±7.0 parts starting with date code YYWW 0449 Corrected package markings Section "Packaging Information". Added Appendix Revision History. 2008 Microchip Technology Inc. DS21733H-page MCP6001/1R/1U/2/4 NOTES: DS21733H-page 2008 Microchip Technology Inc. MCP6001/1R/1U/2/4 PRODUCT IDENTIFICATION SYSTEM order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device Temperature Range Package Examples: Tape Reel, Industrial Temperature, SC-70 package MCP6001T-I/OT: Tape Reel, Industrial Temperature, SOT-23 package. MCP6001RT-I/OT: Tape Reel, Industrial Temperature, SOT-23 package. MCP6001UT-E/OT: Tape Reel, Extended Temperature, SOT-23 package. MCP6002-I/MS: MCP6002-I/P: MCP6002-E/P: Package: Plastic Package (SC-70), 5-lead (MCP6001 only) Plastic Small Outline Transistor (SOT-23), 5-lead (MCP6001, MCP6001R, MCP6001U) Plastic MSOP, 8-lead Plastic (300 body), 8-lead, 14-lead Plastic SOIC, (3.99 body), 8-lead Plastic SOIC (3.99 body), 14-lead Plastic TSSOP (4.4mm body), 14-lead MCP6001T-I/LT: Device: MCP6001T: MCP6001RT: MCP6001UT: MCP6002: MCP6002T: MCP6004: MCP6004T: Single (Tape Reel) (SC-70, SOT-23) Single (Tape Reel) (SOT-23) Single (Tape Reel) (SOT-23) Dual Dual (Tape Reel) (SOIC, MSOP) Quad Quad (Tape Reel) (SOIC, MSOP) Temperature Range: -40°C +85°C -40°C +125°C MCP6002-I/SN: MCP6002T-I/MS: Industrial Temperature, MSOP package. Industrial Temperature, PDIP package. Extended Temperature, PDIP package. Industrial Temperature, SOIC package. Tape Reel, Industrial Temperature, MSOP package. Industrial Temperature, 14LD PDIP package. Industrial Temperature, 14LD SOIC package. Extended Temperature, 14LD SOIC package. Industrial Temperature, 14LD TSSOP package. Tape Reel, Industrial Temperature, 14LD SOIC package. Tape Reel, Industrial Temperature, 14LD TSSOP package. MCP6004-I/P: MCP6004-I/SL: MCP6004-E/SL: MCP6004-I/ST: MCP6004T-I/SL: MCP6004T-I/ST: 2008 Microchip Technology Inc. DS21733H-page MCP6001/1R/1U/2/4 NOTES: DS21733H-page 2008 Microchip Technology Inc. Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable." Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act. Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip devices life support and/or safety applications entirely buyer's risk, buyer agrees defend, indemnify hold harmless Microchip from damages, claims, suits, expenses resulting from such use. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights. Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, MATE, rfPIC SmartShunt registered trademarks Microchip Technology Incorporated U.S.A. other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, UNI/O, WiperLock ZENA trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2008, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper. Microchip received ISO/TS-16949:2002 certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona; Gresham, Oregon design centers California India. Company's quality system processes procedures PIC® MCUs dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified. 2008 Microchip Technology Inc. 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