0.3V 0.3V VOUT 1.6V 5.5V SOT-23-5 SC-70-5* MCP6548 -40°C +85°C -40°C +
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MCP6546/6R/6U/7/8/9
0.3V 0.3V VOUT 1.6V 5.5V SOT-23-5 SC-70-5* MCP6548 -40°C +85°C -40°C +125°C
Microchip MCP6546/6R/6U/7/8/9 MCP6546 MCP6546R MCP6546U MCP6548 MCP6547 MCP6549 MCP6546/6R/6U/7/8/9 1.6V Microchip MCP6541/2/3/4 TTL/CMOS SC-70-5 MCP6546U SOT-23-5
CMOS/TTL MCP6541/2/3/4
MCP6546 PDIP, SOIC, MSOP VIN- VIN+ VIN+ MCP6546R SOT-23-5 MCP6547 PDIP, SOIC, MSOP MCP6549 PDIP, SOIC, TSSOP OUTA OUTD VIND- VIND+ VINC+ OUTC
OUTA VINA- VINA+ VIN-
OUTB VINA- VINB- VINA+ VINB+ VINB+ VINB- OUTB
MCP6546 SOT-23-5, SC-70-5 VIN+ VIN-
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.7.0V +10.5V VIN+ VIN- 1.0V 1.0V -0.3V +0.3V |VDD VSS| -65°C +150°C +150°C HBM;MM.2 kV;200V MCP6546U HBM;MM. 200V
4.1.2
+1.6V +5.5VVSS GNDTA 25°CVIN+ VDD/2VIN 2.74 VCMR CMRR CMRR CMRR PSRR VOS/TA VHYST ZDIFF -7.0 ±1.5 -0.035 1200 1013||4 1013||2 +7.0 5000 µV/°C µV/°C -0.3V 5.3V 2.5V 5.3V -0.3V 2.5V -40°C +125°C -40°C +125°C IOUT
µV/°C2 -40°C +125°C ||pF ||pF +85°C +125°C
VHYST VHYST (TA) VHYST -25°C) 25°C)2TC2 SC-70-5 2004
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+1.6V +5.5VVSS GNDTA 25°CVIN+ VDD/2VIN 2.74 COUT -100 ±1.5 1.6V 5.5V IOUT 1.6V 5.5V
VHYST VHYST (TA) VHYST -25°C) 25°C)2TC2 SC-70-5 2004
+1.6V +5.5V 25°C VIN+ VDD/2 2.74 tPHL tPLH tPDS fMAX fMAX -1.0 µVP-P 1.6V 5.5V
tPLH tPDS tPLH tPHL
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ICSL ICSH IO(LEAK) tOFF VCS_HYST
VOUT VSS+10V 0.2VDD VOUT VDD/2 0.8VDD VOUT VDD/2
tOFF Hi-Z
VIN- VIN+ VDD/2 tPLH VOUT tPHL
VOUT
Hi-Z
-0.6
MCP6548
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MCP6546/6R/6U/7/8/9 +150°C
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Percentage Occurrences Input Offset Voltage (mV) Percentage Occurrences Input Hysteresis Voltage (mV)
1200 Samples
1200 Samples
Percentage Occurrences
Percentage Occurrences
1200 Samples -40°C +125°C
Samples -40°C +125°C
5.5V
1.6V
-0.020
Input Offset Voltage Drift (µV/°C)
Input Hysteresis Voltage Linear Temp. Co.; (µV/°C)
Percentage Occurrences Samples -40°C +125°C 5.5V 1.6V
Inverting Input, Output Voltage
5.5V VOUT
-0.060
-0.056
-0.052
-0.048
-0.044
-0.040
-0.036
-0.032
-0.028
-0.024
Time ms/div)
Input Hysteresis Voltage Quadratic Temp. Co.; (µV/°C
MCP6546/6R/6U/7/8/9
DS21714F_CN
2009 Microchip Technology Inc.
-0.016
VIN-
MCP6546/6R/6U/7/8/9
+1.6V +5.5V +25°C VIN+ VDD/2 2.74
-0.2 -0.4 -0.6 -0.8 -1.0
Input Hysteresis Voltage (mV)
Input Offset Voltage (mV)
1.6V
1.6V
5.5V
5.5V
Ambient Temperature (°C)
Ambient Temperature (°C)
Input Offset Voltage (mV) -0.5 -1.0 -1.5 -2.0
2-10
Input Hysteresis Voltage (mV)
1.6V
1.6V
+125°C +85°C
+125°C
+125°C +85°C +25°C -40°C
+125°C
+25°C -40°C
Common Mode Input Voltage
Common Mode Input Voltage
1.6V
Input Offset Voltage (mV) -0.5 -1.0 -1.5 -2.0 Common Mode Input Voltage +85°C +125°C
2-11 1.6V
Input Hysteresis Voltage (mV)
5.5V -40°C +25°C
5.5V
+125°C +85°C +25°C -40°C
Common Mode Input Voltage
5.5V
2-12 5.5V
2009 Microchip Technology Inc.
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MCP6546/6R/6U/7/8/9
+1.6V +5.5V +25°C VIN+ VDD/2 2.74
Input Bias, Offset Currents CMRR, PSRR (dB) Ambient Temperature (°C) PSRR, VIN+ VSS, 1.6V 5.5V 10000 +125°C 1000 100p IOS, +125°C IOS, +85°C +85°C
Input Referred
5.5V
CMRR, VIN+ -0.3 5.3V, 5.0V
100f Common Mode Input Voltage
2-13
CMRR PSRR-
2-16
Quiescent Current Comparator (µA) +125°C +85°C +25°C -40°C Power Supply Voltage
Input Bias, Offset Currents (pA)
1000
5.5V
Ambient Temperature (°C)
2-14
Quiescent Current Comparator (µA)
2-17
does include pull-up resistor current Quiescent Current Comparator (µA) 1.6V
does include pull-up resistor current 5.5V
Sweep VIN+, VIN- VDD/2 Sweep VIN-, VIN+ VDD/2 Common Mode Input Voltage
Sweep VIN+, VIN- VDD/2 Sweep VIN-, VIN+ VDD/2 Common Mode Input Voltage
2-15
1.6V
2-18
5.5V
DS21714F_CN
2009 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
+1.6V +5.5V +25°C VIN+ VDD/2 2.74
Supply Current Comparator (µA) Supply Current Comparator (µA)
2.1V 2.6V 3.6V 4.6V 5.6V
spike near 1.3V
5.6V 4.6V 3.6V 2.6V
1.6V 10.5V
1.6V
1.6V 2.1V
Pull-Up Voltage,
Pull-up Supply Voltage Difference,
2-19
Supply Current Comparator (µA)
2-22
Output Short Circuit Current Magnitude (mA)
-40°C +25°C +85°C +125°C
Overdrive VDD/2 does include pull-up resistor current
5.5V 1.6V Toggle Frequency (kHz)
Power Supply Voltage
2-20
Output Voltage Headroom
2-23
Output Voltage Headroom
5.5V
1.6V
VOL-VSS: +125°C +85°C +25°C -40°C
VSS: +125°C +85°C +25°C -40°C Output Current (mA)
Output Current (mA)
2-21
1.6V
2-24
5.5V
2009 Microchip Technology Inc.
DS21714F_CN
MCP6546/6R/6U/7/8/9
+1.6V +5.5V +25°C VIN+ VDD/2 2.74
Percentage Occurrences
Percentage Occurrences
Samples Overdrive VDD/2
Samples Overdrive VDD/2 1.6V 5.5V
1.6V
5.5V
High-to-Low Propagation Delay (µs)
Low-to-High Propagation Delay (µs)
2-25
2-28
Percentage Occurrences
5.5V
Propagation Delay (µs)
Samples Overdrive VDD/2 1.6V
Overdrive VDD/2 tPHL 5.5V
tPLH
1.6V
-2.0
-1.6
-1.2
-0.8
-0.4
Propagation Delay Skew (µs)
Ambient Temperature (°C)
2-26
2-29
Propagation Delay (µs) tPHL
VDD/2
VDD/2
Propagation Delay (µs)
5.5V tPHL
Overdrive
Overdrive
tPLH
1.6V Input Overdrive (mV)
tPLH 1000
Power Supply Voltage
2-27
2-30
DS21714F_CN
2009 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
+1.6V +5.5V +25°C VIN+ VDD/2 2.74
Propagation Delay (µs)
Common Mode Input Voltage tPLH tPHL
Propagation Delay (µs)
1.6V Overdrive
5.5V Overdrive tPHL tPLH
Common Mode Input Voltage
2-31
Propagation Delay (µs)
1.6V
2-34
5.5V
VIN- Overdrive VDD/2 VIN+ 5.5V tPLH
Propagation Delay (µs)
Overdrive VDD/2
tPLH
5.5V 1.6V
tPHL
1.6V
tPHL
Pull-up Resistor, (k:)
Load Capacitance (nF)
2-32
Propagation Delay (µs)
2-35
1.E+04
Output Leakage Current
VIN- Overdrive VDD/2 VIN+ 5.5V tPHL
+125°C
1.E+03 100p 1.E+02 1.E+01 1.E+00 1.E-01 100f Output Voltage +85°C VIN+ VDD/2 VIN- +25°C
1.6V
tPLH
Pull-up Voltage
2-33
2-36 VDD- MCP6548
2009 Microchip Technology Inc.
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MCP6546/6R/6U/7/8/9
+1.6V +5.5V +25°C VIN+ VDD/2 2.74
1.E-03
Supply Current Comparator
1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 1.E-10 100p High-to-Low Hysteresis Low-to-High
Supply Current Comparator
1.E-04 100µ
Comparator Turns
1.E-03 Comparator Shuts 100µ 1.E-04 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10
Comparator Turns
Comparator Shuts
Hysteresis Low-to-High High-to-Low
1.6V 1.E-11
5.5V 1.E-11 Chip Select (CS) Voltage
Chip Select (CS) Voltage
2-37 -VDD 1.6V MCP6548
Supply Current (µA)
2-40 -VDD 5.5V MCP6548
Output Voltage, Chip Select Voltage
VOUT 1.6V Start-up -1.6 -3.2 -4.9 -6.5 -8.1 Time ms/div)
Output Voltage, Chip Select Voltage (V),
VOUT
Supply Current Comparator (µA)
Start-up
5.5V Charging output capacitance
Charging output capacitance
Time (0.5 ms/div)
2-38 -VDD 1.6V MCP6548
-0.5 5.5V
2-41 -VDD 5.5V MCP6548
1.E-02 1.E-03 100µ 1.E-04 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10 1.E-11 1.E-12
Chip Select, Output Voltage
VOUT
Input Current Magnitude
Time (ms)
+125°C +85°C +25°C -40°C
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 Input Voltage
2-39
MCP6548
2-42
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MCP6546/6R/6U/7/8/9
MCP6546 PDIP SOIC MSOP
MCP6546R MCP6546U MCP6547 MCP6548 MCP6546 SOT-23-5 SC-70-5 MCP6549
OUTA VIN+ VINA+ VINB+ VINB OUTB OUTC VINC VINC+ VIND+ VIND OUTD
VINA
CMOS
1.6V 5.5V 0.01
CMOS
CMOS
2009 Microchip Technology Inc.
DS21714F_CN
MCP6546/6R/6U/7/8/9
MCP6546/6R/6U/7/8/9 Microchip CMOS
4.1.1
MCP6G0X
VOUT
MCP6546/6R/6U/7/8/9 CMOS
4.1.2
VIN+ VIN- 2-42
VIN+
VIN-
4.1.3
CMOS 0.3V 0.3V 0.3V 0.3V MCP6546/6R/6U/7/8/9 µVp-p
VIN+ VIN- VIN+ VIN- VIN+ VIN-
DS21714F_CN
2009 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
4.4.1
5.0V VIN- VOUT Input Voltage mV/div)
MCP654X
Output Voltage
Hysteresis
VOUT
Time (100 ms/div)
MCP6546/6R/6U/7/8/9
VOUT VTLH VTHL
2-15 2-18 2-37 2-41
MCP6548
MCP6548
VTLH VTHL
Thevenin MCP654X VOUT
VHYST
2009 Microchip Technology Inc.
DS21714F_CN
MCP6546/6R/6U/7/8/9
2-27 2-30
VTLH VTHL 2-21 2-24
Printed Circuit Board 10125V MCP6546/6R/6U/7/8/9 25°C VINVIN+
VDD+0.3V
VIN+ VDD/2 VIN-
VDD2 0.01
DS21714F_CN
2009 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
4.10
4.10.1
MCP6549 2-15 2-18 MCP6549
MCP6041 VREF MCP6041
VREF
MCP6546
VOUT
4.10.2
4-10 VOUT
MCP6547
MCP6547
4-10
2009 Microchip Technology Inc.
DS21714F_CN
MCP6546/6R/6U/7/8/9
SC-70MCP6546
ACNN
XXNN
MCP6546
AC25
AC25
2005 "ACN" SC-70-5
SOT-23 MCP6546 MCP6546R MCP6546U
ACNN AHNN GWNN GXNN AWNN
XXNN
MCP6546 MCP6546R MCP6546U
AC25
SOT-23
PDIP300 XXXXXXXX XXXXXNNN YYWW SOIC150 XXXXXXXX XXXXYYWW MCP6546 I/SN0729 MCP6546 I/P256 0729
MCP6546 I/P^^256 0729
MCP6546I SN^^0729
MSOP XXXXXX YWWNNN
6546I 729256
XX.X
"01" Matte JEDEC JEDEC
Microchip
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2009 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
PDIP300 MCP6549
XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
MCP6549-I/P XXXXXXXXXXXXXX 0729256
MCP6549-E/P 0729256
MCP6549 I/P^^ 0729256
SOIC MCP6549
XXXXXXXXXX XXXXXXXXXX YYWWNNN
MCP6549ISL XXXXXXXXXX 0729256
MCP6549 E/SL^^ 0729256
TSSOPMCP6549
XXXXXXXX YYWW
MCP6549I 0729
2009 Microchip Technology Inc.
DS21714F_CN
MCP6546/6R/6U/7/8/9
[SC-70]
Note:
Microchip
most current package drawings, please Microchip Packaging Specification located
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Lead Width 0.80 0.80 0.00 1.80 1.15 1.80 0.10 0.08 0.15 MILLIMETERS 0.65 2.10 1.25 2.00 0.20 1.10 1.00 0.10 2.40 1.35 2.25 0.46 0.26 0.40
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.127 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-061B
DS21714F_CN
2009 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
[SOT-23]
Note: most current package drawings, please Microchip Packaging Specification located Microchip
Units Dimension Limits Number Pins Lead Pitch Outside Lead Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness 0.90 0.89 0.00 2.20 1.30 2.70 0.10 0.35 0.08 MILLIMETERS 0.95 1.90 1.45 1.30 0.15 3.20 1.80 3.10 0.60 0.80 0.26
Lead Width 0.20 0.51 Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.127 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-091B
2009 Microchip Technology Inc.
DS21714F_CN
MCP6546/6R/6U/7/8/9
P-300mil [PDIP]
Note: most current package drawings, please Microchip Packaging Specification located Microchip
NOTE
Units Dimension Limits Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing .115 .015 .290 .240 .348 .115 .008 .040 .014
INCHES .100 .130 .310 .250 .365 .130 .010 .060 .018 .210 .195 .325 .280 .400 .150 .015 .070 .022
.430 Notes: visual index feature vary, must located with hatched area. Significant Characteristic. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-018B
DS21714F_CN
2009 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
3.90 [SOIC]
Note: most current package drawings, please Microchip Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom 0.17 0.31 0.25 0.40 1.25 0.10
MILLIMETERS 1.27 6.00 3.90 4.90 1.04 0.25 0.51 0.50 1.27 1.75 0.25
Notes: visual index feature vary, must located within hatched area. Significant Characteristic. Dimensions JEDEC MS-012 mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. include C04-057 Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-057B
2009 Microchip Technology Inc.
DS21714F_CN
MCP6546/6R/6U/7/8/9
[MSOP]
Note: most current package drawings, please Microchip Packaging Specification located Microchip
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness
MILLIMETERS 0.65 0.75 0.00 0.85 4.90 3.00 3.00 0.40 0.08 0.60 0.95 0.23 0.80 1.10 0.95 0.15
Lead Width 0.22 0.40 Notes: visual index feature vary, must located within hatched area. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-111B
DS21714F_CN
2009 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
P-300 [PDIP]
Note: most current package drawings, please Microchip Packaging Specification located Microchip
NOTE
Units Dimension Limits Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing .115 .015 .290 .240 .735 .115 .008 .045 .014 INCHES .100 .130 .310 .250 .750 .130 .010 .060 .018 .210 .195 .325 .280 .775 .150 .015 .070 .022
.430 Notes: visual index feature vary, must located with hatched area. Significant Characteristic. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-005B
2009 Microchip Technology Inc.
DS21714F_CN
MCP6546/6R/6U/7/8/9
3.90 [SOIC]
Note:
Microchip
most current package drawings, please Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom 0.17 0.31 0.25 0.40 1.25 0.10
MILLIMETERS 1.27 6.00 3.90 8.65 1.04 0.25 0.51 0.50 1.27 1.75 0.25
Notes: visual index feature vary, must located within hatched area. Significant Characteristic. JEDEC include Dimensions notMS-012 mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. C04-065 Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-065B
DS21714F_CN
2009 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
ST-4.4 [TSSOP]
Note: most current package drawings, please Microchip Packaging Specification located Microchip
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Footprint Foot Angle Lead Thickness
MILLIMETERS 0.65 0.80 0.05 4.30 4.90 0.45 0.09 1.00 6.40 4.40 5.00 0.60 1.00 0.20 4.50 5.10 0.75 1.20 1.05 0.15
Lead Width 0.19 0.30 Notes: visual index feature vary, must located within hatched area. JEDEC MO-153 Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. C04-087 Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-087B
2009 Microchip Technology Inc.
DS21714F_CN
MCP6546/6R/6U/7/8/9
DS21714F_CN
2009 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
2007
MCP6546U SOT-23-5
2006
SOT-23-5 MCP6546U
2006
200412 1.6V VHYST
2003 2002 2002
2009 Microchip Technology Inc.
DS21714F_CN
MCP6546/6R/6U/7/8/9
DS21714F_CN
2009 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
MCP6546T-I/LT SC-70 MCP6546T-I/OT SOT-23 MCP6546-E/P PDIP MCP6546RT-I/OT SOT23 MCP6546-E/SN SOIC MCP6546UT-E/OT SOT23 MCP6547-I/MS MSOP MCP6547T-I/MS MSOP MCP6547-I/P PDIP MCP6547-E/SN SOIC SOIC MCP6548T-I/SN SOIC MCP6548-I/P PDIP MCP6548-E/SN SOIC MCP6549T-I/SL SOIC MCP6549T-E/SL SOIC MCP6549-I/P PDIP MCP6549-E/ST TSSOP MCP6548-I/SN
MCP6546 MCP6546T SC-70 SOT-23 SOIC MSOP MCP6546RT SOT-23 MCP6546UT SOT-23-5 MCP6547 MCP6547T SOIC MSOP MCP6548 MCP6548T SOIC MSOP MCP6549 MCP6549T SOIC TSSOP -40°C +85°C -40°C +125°C SC-70-5 SC-70 SOT-23 MSOP SOIC SOIC MCP6549 TSSOP MCP6549
2009 Microchip Technology Inc.
DS21714F_CN
MCP6546/6R/6U/7/8/9
DS21714F_CN
2009 Microchip Technology Inc.
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Microchip Microchip dsPIC KEELOQ KEELOQ MPLAB PICmicro PICSTART rfPIC UNI/O Microchip Technology Inc. FilterLab Hampshire HI-TECH Linear Active ThermistorMXDEVMXLABSEEVAL Embedded Control Solutions Company Microchip Technology Inc. Analog-for-the-Digital Application Maestro CodeGuard dsPICDEM dsPICDEM.net dsPICworks dsSPEAK ECAN ECONOMONITOR FanSense HI-TIDE In-Circuit Serial Programming ICSP ICEPIC Mindi MiWi MPASM MPLAB Certified MPLIB MPLINK mTouch nanoWatt Omniscient Code Generation PICC PICC-18 PICkit PICDEM PICDEM.net PICtail PIC32 REAL rfLAB Select Mode Total Endurance TSHARC WiperLock ZENA Microchip Technology Inc. SQTP Microchip Technology Inc. 2009, Microchip Technology Inc.
Microchip Chandler Tempe Gresham ISO/TS-16949:2002 PIC® dsPIC® KEELOQ® EEPROM ISO/TS16949:2002 Microchip 9001:2000
2009 Microchip Technology Inc.
DS21714F_CN
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03/26/09
DS21714F_CN
2009 Microchip Technology Inc.
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