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2008 Microchip Technology Inc. DS51524C Code protection cons


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PICDEMZ Demonstration User's Guide
2008 Microchip Technology Inc.
DS51524C
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip devices life support and/or safety applications entirely buyer's risk, buyer agrees defend, indemnify hold harmless Microchip from damages, claims, suits, expenses resulting from such use. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights.
Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt UNI/O registered trademarks Microchip Technology Incorporated U.S.A. other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock ZENA trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2008, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper.
Microchip received ISO/TS-16949:2002 certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona; Gresham, Oregon design centers California India. Company's quality system processes procedures PIC® MCUs dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified.
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PICDEMZ DEMONSTRATION USER'S GUIDE Table Contents
Preface Chapter Overview
Introduction PICDEMZ Demonstration Contents PICDEM Demonstration PICDEMZ Motherboard Wireless Daughter Boards PICDEMZ CD-ROM
Chapter Getting Started with PICDEMZ Demonstration
Introduction Microchip ZigBee-2006 Residential Stack Protocol Microchip MiWiProtocol Microchip MiWi Protocol
Appendix PICDEMZ Motherboard Schematics
PICDEM Motherboard Schematics PICDEM Motherboard Bill Materials
Appendix MRF24J40MA PICDEM Board
Introduction MRF24J40MA PICDEM Board Schematic Layout Bill Materials
Appendix PICDEMZ Card
Introduction PICDEMZ MRF24J40 Daughter Card Schematic Layout PICDEM MRF24J40 Daughter Card Bill Materials Antenna Details
Worldwide Sales Service
2008 Microchip Technology Inc.
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NOTES:
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2008 Microchip Technology Inc.
PICDEMZ DEMONSTRATION USER'S GUIDE Preface
NOTICE CUSTOMERS
documentation becomes dated, this manual exception. Microchip tools documentation constantly evolving meet customer needs, some actual dialogs and/or tool descriptions differ from those this document. Please refer site (www.microchip.com) obtain latest documentation available. Documents identified with "DS" number. This number located bottom each page, front page number. numbering convention number "DSXXXXXA", where "XXXXX" document number revision level document. most up-to-date information development tools, MPLAB® on-line help. Select Help menu, then Topics open list available on-line help files.
INTRODUCTION
This chapter contains general information that will useful know before using PICDEMZ Demonstration Kit. Items discussed include: Document Layout Conventions Used this Guide Warranty Registration Recommended Reading Microchip Site Development Systems Customer Change Notification Service Customer Support
DOCUMENT LAYOUT
This document describes PICDEM Demonstration development tool evaluate experiment with Microchip wireless solutions. manual layout follows: Chapter Overview Describes PICDEM Demonstration works. Chapter Getting Started with PICDEMZ Demonstration What need know start using PICDEM Demonstration Kit. Appendix PICDEMZ Motherboard Schematics Hardware information PICDEM demonstration board. Appendix MRF24J40MA PICDEM Board Hardware information MRF24J40MA PICDEM Board. Appendix PICDEMZ Card Hardware information PICDEM Card.
2008 Microchip Technology Inc.
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CONVENTIONS USED THIS GUIDE
Where applicable, this manual uses following documentation conventions: DOCUMENTATION CONVENTIONS
Description Arial font: Italic characters Initial caps Represents Referenced books Emphasized text window dialog menu selection field name window dialog menu path dialog button keyboard hexadecimal number where hexadecimal digit Sample source code Filenames File paths Keywords Command-line options values binary number variable argument Optional arguments Choice mutually exclusive arguments; selection Replaces repeated text Represents code supplied user Examples MPLAB® User's Guide only compiler. Output window Settings dialog select Enable Programmer "Save project before build" File>Save Click Click Power Press <Enter>, <F1> 0xFFFF, 0x007A
Quotes Underlined, italic text with right angle bracket Bold characters Text angle brackets 0xnnnn Courier font: Plain Courier
Italic Courier Square brackets Curly brackets pipe character: Ellipses.
#define START autoexec.bat c:\mcc18\h _asm, _endasm, static -Opa+, -Opa0, `b00100, `b10 file.o, where file valid filename mcc18 [options] file [options] errorlevel {0|1} var_name var_name.] void main (void)
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Preface
WARRANTY REGISTRATION
Please complete enclosed Warranty Registration Card mail promptly. Sending Warranty Registration Card entitles users receive product updates. Interim software releases available Microchip site.
RECOMMENDED READING
This user's guide describes PICDEMZ Demonstration Kit. Other useful documents listed below. following Microchip documents available recommended supplemental reference resources. AN1232 "Microchip ZigBee-2006 Residential Stack Protocol" (DS01232) AN1066, "MiWiWireless Networking Protocol Stack" (DS01066) AN1204, "Microchip MiWi Wireless Protocol" (DS01204) AN1192, "MRF24J40 Radio Driver Utility Program" (DS01192) These application notes describe Microchip wireless solutions quickly build your application. illustrate usage Microchip Wireless Protocol Stack's working demo, applications provided their respective application notes. These demo applications used reference simply modified adapted your requirements.
MICROCHIP SITE
Microchip provides online support site www.microchip.com. This site used means make files information easily available customers. Accessible using your favorite Internet browser, site contains following information: Product Support Data sheets errata, application notes sample programs, design resources, user's guides hardware support documents, latest software releases archived software General Technical Support Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing Business Microchip Product selector ordering guides, latest Microchip press releases, listing seminars events, listings Microchip sales offices, distributors factory representatives
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DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip's customer notification service helps keep customers current Microchip products. Subscribers will receive e-mail notification whenever there changes, updates, revisions errata related specified product family development tool interest. register, access Microchip site www.microchip.com, click Customer Change Notification follow registration instructions. Development Systems product group categories are: Compilers latest information Microchip compilers other language tools. These include MPLAB MPLAB compilers; MPASMand MPLAB ASM30 assemblers; MPLINKand MPLAB LINK30 object linkers; MPLIBand MPLAB LIB30 object librarians. Emulators latest information Microchip in-circuit emulators.This includes MPLAB 2000 MPLAB 4000. In-Circuit Debuggers latest information Microchip in-circuit debugger, MPLAB MPLAB® latest information Microchip MPLAB IDE, Windows® Integrated Development Environment development systems tools. This list focused MPLAB IDE, MPLAB simulator, MPLAB Project Manager general editing debugging features. Programmers latest information Microchip programmers. These include MPLAB MATE device programmers PICSTART® Plus PICkit1 development programmers.
CUSTOMER SUPPORT
Users Microchip products receive assistance through several channels: Distributor Representative Local Sales Office Field Application Engineer (FAE) Technical Support
Customers should contact their distributor, representative field application engineer (FAE) support. Local sales offices also available help customers. listing sales offices locations included back this document. Technical support available through site http://support.microchip.com
DOCUMENT REVISION HISTORY
Revision (November 2008)
Extensive rewrite sections.
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PICDEMZ DEMONSTRATION USER'S GUIDE Chapter Overview
INTRODUCTION
This chapter introduces PICDEMZ Demonstration features. This chapter discusses: PICDEMZ Demonstration Contents PICDEM Demonstration PICDEMZ Motherboard Wireless Daughter Boards PICDEMZ CD-ROM
PICDEMZ DEMONSTRATION CONTENTS
PICDEM Demonstration (Part Number DM163027-5) contains following items: PICDEMZ Motherboards MRF24J40MA PICDEM Boards PICDEM CD-ROM ZENANetwork Analyzer Cable ZENA CD-ROM
These items ordered separately. Table lists individual part numbers. TABLE 1-1: PICDEMZ COMPONENT PART NUMBERS
Description PICDEMZ Motherboard MRF24J40MA PICDEM Board ZENANetwork Analyzer AC163027-1 AC163028 DM183023 Part Number
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FIGURE 1-1: PICDEMZ DEMONSTRATION
PICDEM DEMONSTRATION
PICDEM Demonstration allows developers evaluate develop with Microchip wireless solutions. provides motherboards MRF24J40MA daughter boards which used form simple node wireless network. More nodes added purchasing additional PICDEM Demonstration Kits individual components (see Table 1-1). PICDEM Demonstration comes preprogrammed with wireless demo program. Refer Chapter "Getting Started with PICDEMZ Demonstration Kit" learn operate preprogrammed demo program load other Microchip Wireless Protocols evaluation development. Additional wireless protocols downloaded from Microchip Wireless Design Center motherboard powered external power supply coaxial power connector (J1) portably battery (B1). Note: wall adapter battery included kit. wall adapter ordered from microchipDIRECT under part number AC162039.
comes with ZENANetwork Analyzer that graphically displays wireless network traffic following IEEE 802.15.4specification band. ZENA Network Analyzer supports IEEE 802.15.4, ZigBeeand MiWiprotocols. software analyze complete network traffic graphically display decoded packets. also display graphical representation network topology messages they flow through network. This information then saved and/or exported further analysis. Refer User's Guide (DS51606) more information operation ZENA Network Analyzer.
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Overview
PICDEMZ MOTHERBOARD
PICDEM Motherboard contains many features enable evaluation development wireless solutions. Figure shows motherboard with MRF24J40MA Module Daughter Board plugged Below description call outs figure. motherboard schematic, layout bill materials available Appendix Microcontroller 40-pin Sockets: sockets allow variety 40-pin package PIC® microcontrollers. 40-pin socket (U4) contains PIC18LF4620 microcontroller clocked crystal (Y1). 28-pin socket unpopulated located under 40-pin package. 28-pin connector, carefully remove 40-pin microcontroller. Temperature Sensor: motherboard contains Microchip TC77 thermal sensor with interface. TC77 shares with wireless daughter card plugged into connector LEDs: driven microcontroller ports RA1, respectively. Push Button Switches: connected microcontroller ports RB4, respectively. There external pull-up resistors motherboard. Therefore, internal pull-up PORTB feature must enabled. MCLR Push Button Switch: Connected MCLR microcontroller. ICSPJack: 6-pin RJ-11 jack used connect microcontroller programmer such MPLAB in-circuit debugger MPLAB REAL ICEin-circuit emulator. RS-232 Connector: Allows motherboard connect serial port interactive control debugging. microcontroller USART interfaces RS-232 connector RS-232 level shifter (U5). Wireless Daughter Card Connector: Connector 12-pin connector that supplies 3.3V power, 4-wire SPI, reset, wake interrupt connections microcontroller. pinout shown Figure 1-3. 12-pin connector Samtec LST-106-07-F-D. Prototyping Area: Provided breadboard additional circuitry development. Connections +3.3V, ground microcontroller signals provided. Power: motherboard powered external power supply coaxial power connector (J1) portably battery (B1). on-board voltage regulator (U2) LP2981, micropower ultra low-dropout regulator SOT-23 package. maximum input voltage LP2981 16V. motherboard protected from accidental reverse power connection diode When using battery, switches power off. When powering external power supply, will disconnect battery from circuit power circuit continuously (switch only switches battery off, external power source).
CAUTION
exceed combined current rating circuitry voltage regulator will overheat possibly fail.
Note:
wall adapter ordered from microchipDIRECT under part number AC162039.
Measure Current: Jumper used measure current draw circuitry motherboard past voltage regulator (U2). measure current, trace bottom side insert ampmeter. also install value resistor into position measure voltage across determine current.
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TABLE 1-2:
Jumper
JUMPERS
Purpose connect disconnect RS-232 level shifter from microcontroller USART. pins connected traces. enable disable pins connected traces. enable disable pins connected traces. measure current draw circuitry past voltage regulator
FIGURE 1-2:
PICDEMZ MOTHERBOARD
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Overview
FIGURE 1-3: CONNECTOR PINOUT
Microcontroller MISO WAKE Signal MOSI RESET +3.3V Signal Microcontroller
(Top view Motherboard)
WIRELESS DAUGHTER BOARDS
PICDEM Motherboard designed interface with variety wireless daughter boards connector Connector 12-pin connector that supplies 3.3V power, 4-wire SPI, reset, wake interrupt connections microcontroller. pinout shown Figure 1-3. 12-pin connector Samtec LST-106-07-F-D.
PICDEMZ CD-ROM
PICDEM CD-ROM contains documentation motherboard, wireless daughter boards, data sheets, application notes wireless protocol software. Check Microchip site latest revisions
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Chapter Getting Started with PICDEMZ Demonstration
INTRODUCTION
PICDEM Demonstration used with variety Microchip software protocol stacks used develop proprietary protocol stacks. Microchip software protocol stacks available free download, including source code, from Microchip website: PICDEM Demonstration assumes that user familiar with Microchip microcontrollers development tools such MPLAB IDE. There wealth getting started information Microchip website http://www.microchip.com/. Select Design>Getting Started links more information about microcontrollers development tools. Topics covered this chapter include: Microchip ZigBee-2006 Residential Stack Protocol Microchip MiWiProtocol Microchip MiWi Protocol
MICROCHIP ZIGBEE-2006 RESIDENTIAL STACK PROTOCOL
ZigBee protocol wireless network protocol specifically designed data rate, low-cost wireless sensors control networks. based IEEE 802.15.4 global standard ensuring interoperability reliable communication. ZigBee protocol supports star, cluster mesh wireless network topologies making well suited short range low-power applications. Microchip ZigBee-2006 protocol certified PIC18 PIC24 families Microchip microcontrollers MRF24J40 Transceiver. software stack available PICDEM CD-ROM. Check Microchip site latest revision Once software stack installed, source code documentation available C:\Microchip Solutions\ZigBee2006Res\ PICDEM Demonstration preprogrammed with ZigBee protocol demo program. Please refer "Getting Started: Running ZigBee-2006 Demo" document located directory: C:\Microchip Solutions\ZigBee2006Res\ Complete documentation available application note AN1232, "Microchip ZigBee-2006 Residential Stack Protocol" (DS01232).
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MICROCHIP MiWiPROTOCOL
MiWi Wireless Networking Protocol simple protocol designed data rate, short distance, low-cost networks. application layer IEEE 802.15.4 layers. MiWi protocol provides easy-to-use alternative wireless communication. particular, targets smaller applications that have relatively small network sizes with hops between nodes. MiWi protocol runs variety Microchip microcontrollers PIC18, PIC24 PIC32 families MRF24J40 Transceiver. software stack available PICDEM CD-ROM. Check Microchip site latest revision Once software stack installed, source code documentation available C:\Microchip Solutions\MiWi\ load MiWi Protocol demonstration program, please refer "Getting Started: Running MiWidemo" document located above directory. Complete documentation available application note AN1066, "MiWiWireless Networking Protocol Stack" (DS01066).
MICROCHIP MiWi PROTOCOL
MiWi Peer-to-Peer (P2P) protocol application layer IEEE 802.15.4 layers that supports peer-to-peer star topologies. routing mechanism, wireless communication coverage defined radio range. Application note AN1204, "Microchip MiWi Wireless Protocol" describes MiWi protocol. details supported features implement them. Simple application level data structures programming interfaces also described. MiWi protocol runs variety Microchip microcontrollers PIC18, PIC24 PIC32 families MRF24J40 Transceiver. software stack available PICDEM CD-ROM. Check Microchip site latest revision Once software stack installed, source code documentation available C:\Microchip Solutions\P2P\ load MiWi Protocol demonstration program, please refer "Getting Started: Running MiWiP2P demo" document located above directory. Complete documentation available application note AN1204, "Microchip MiWi Wireless Protocol" (DS01204).
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PICDEMZ DEMONSTRATION USER'S GUIDE Appendix PICDEMZ Motherboard Schematics
PICDEM MOTHERBOARD SCHEMATICS
PICDEM motherboard schematics shown here. daughter card schematics found appendices that follow. Topic included this appendix are: PICDEM Motherboard Schematics PICDEM Motherboard Bill Materials
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FIGURE A-1: PICDEMZ MOTHERBOARD
INVALID FORCEON FORCEOFF
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PICDEMZ Motherboard Schematics
FIGURE A-2: PICDEMZ MOTHERBOARD ASSEMBLY
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FIGURE A-3: PICDEMZ MOTHERBOARD LAYER
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PICDEMZ Motherboard Schematics
FIGURE A-4: PICDEMZ MOTHERBOARD LAYER
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PICDEM MOTHERBOARD BILL MATERIALS
PICDEMZ MOTHERBOARD BILL MATERIALS (BOM)
Description Diode Schottky MELF Conn Batt Male Horz Snap-on Conn Batt Horz Snap-on Conn Vert Snap-on C10, C11, C12, C13, JP2, JP3, 28-pin Socket PIC® Load 1/8W 0805 1/8W 0805 4.7K 1/8W 0805 1.0M 1/8W 0805 Conn Jack 50AU Switch Tact 230GF Switch Slide SPDT Sensor Thermal 3.3V SOT235 Test Point Multi-Purpose Test Point Multi-Purpose Yageo America Yageo America Yageo America Yageo America AMP/Tyco Omron Electronics E-Switch, Inc. Microchip Keystone Electronics Keystone Electronics 9C08052A3300JLHFT 9C08052A4700JLHFT 9C08052A4701JLHFT 9C08052A1004JLHFT 520470-3 B3S-1002 EG1271 TC77-3.3MCTTR 5011 5010 Thin 565NM Diff 0805 Micropower SOT23-5 Lumex Opto Maxim Mill-Max Microchip 40-pin Socket (needs have internal ribs) Mill-Max SML-LXT0805GW-TR MAX3221CAE 110-99-328-41-001 110-99-640-41-001 PIC18LF4620-I/P National Semiconductor LP2981AIM5-3.3 .100" Socket/Terminal Samtec LST-106-07-F-D 100V Monolith Cerm Ceramic 0805 Vendor Diodes Inc. Keystone Electronics Keystone Electronics Keystone Electronics Panasonic Panasonic Vendor 1N5817M-13 ECU-S2A220JCA ECJ-2VB1C104K
TABLE A-1:
Reference
Capacitor Tant Capacitor Tant Crystal 4.000 HC-49/US Conn Powerjack Mini PCMT
Kemet Kemet Inc. Switchcraft Inc.
T491B225K025AS T491B335K016AS ECS-40-20-4 RAPC712
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PICDEMZ DEMONSTRATION USER'S GUIDE Appendix MRF24J40MA PICDEM Board
INTRODUCTION
This appendix describes MRF24J40MA Board. Topics covered this appendix include: MRF24J40MA PICDEM Board Schematic Layout Bill Materials
MRF24J40MA PICDEM BOARD
MRF24J40MA PICDEM 2.4GHz Board (AC163028) shown Figure B-1. features MRF24J40MA transceiver module. MRF24J40MA fully FCC, ETSI certified module. designed plug into PICDEM Motherboard, application, using 12-pin connector. 12-pin connector available from Samtec LST-106-07-F-D. more information about MRF24J40 module, refer "MRF24J40 IEEE 802.15.4 Transceiver Data Sheet" (DS39776) "MRF24J40MA IEEE 802.15.4 Transceiver Module Data Sheet" (DS70329) Features PICDEM MRF24J40 Board include: MRF24J40MA Transceiver Module (U1): IEEE 802.15.4 compliant transceiver module. Daughter Card Connector (P1): Connector 12-pin connector used connect PICDEM Motherboard application with mating connector. supplies 3.3V power, 4-wire SPI, reset, wake interrupt connections MRF24J40MA. pinout shown Figure B-2. 12-pin connector Samtec LST-106-07-F-D.
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FIGURE B-1: MRF24J40MA PICDEMZ BOARD
SCHEMATIC
schematic MRF24J40MA module available MRF24J40MA Data Sheet (DS70329). Figure shows schematic daughter board with MRF24J40MA module mounted FIGURE B-2: MRF24J40MA PICDEMZ BOARD SCHEMATIC
MRF24J40MA
RESET WAKE
CLKOUT
LAYOUT
Figure through Figure show layout daughter board without MRF24J40MA module mounted
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MRF24J40MA PICDEM Board
FIGURE B-3: SILKSCREEN
FIGURE B-4:
COPPER
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FIGURE B-5: BOTTOM COPPER
FIGURE B-6:
BOTTOM SILKSCREEN
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MRF24J40MA PICDEM Board
BILL MATERIALS
TABLE B-1:
BILL MATERIALS
Value MRF24J40MA 16V, X7R, 10%, 0603 LST-106-07-F-D Description IEEE 802.15.4Transceiver Module Capacitor, Ceramic Samtec Connector Header with Locking Socket
Reference Designator
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PICDEMZ DEMONSTRATION USER'S GUIDE Appendix PICDEMZ Card
INTRODUCTION
This appendix describes PICDEM MRF24J40 Daughter Card. Topics discussed this chapter are: PICDEMZ MRF24J40 Daughter Card Schematic Layout PICDEM MRF24J40 Daughter Card Bill Materials Antenna Details
PICDEMZ MRF24J40 DAUGHTER CARD
PICDEM MRF24J40 Daughter Card (AC163027-4) shown Figure C-1. features MRF24J40 transceiver passive circuitry, antenna, optional connector footprint. designed plug into PICDEM Motherboard, application, using 12-pin connector Explorer Development Board using side edge connector. PICDEM MRF24J40 Daughter Card good platform evaluate inverted F-type antenna. optional connector populated evaluate external antenna options connect test equipment measurement. PICDEM MRF24J40 Daughter Card used reference design. Gerber files available download Microchip website PICDEM CD-ROM. More information about MRF24J40 refer "MRF24J40 IEEE 802.15.4 Transceiver Data Sheet" (DS39776) Features PICDEM MRF24J40 Daughter Card include: MRF24J40 Transceiver (U1): IEEE 802.15.4 compliant transceiver 40-pin package. Daughter Card Connector (J2): Connector 12-pin connector used connect PICDEM Motherboard application with mating connector. supplies 3.3V power, 4-wire SPI, reset, wake interrupt connections MRF24J40. pinout shown Figure C-2. 12-pin connector Samtec LST-106-07-F-D. Edge Connector (J3): Connector 30-pin connector used connect Explorer Development Board. supplies 3.3V power, 4-wire SPI, reset, wake interrupt connections MRF24J40. pinout shown Figure C-2. Antenna: inverted F-type antenna. Optional Connector (P5): footprint populated with connector connecting external antenna test equipment. antenna connected default. enable connector disable antenna, removed capacitor move position
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Note: MRF24J40 defaults state when high (the MRF24J40 selected). MRF24J40 Daughter Card share bus, tri-state buffer placed signal provide high-impedance signal bus. Refer "MRF24J40 Data Sheet" (DS39776) more information. PICDEMZ MRF24J40 DAUGHTER CARD
FIGURE C-1:
SCHEMATIC
PICDEM MRF24J40 Daughter Card schematic shown Figure C-2.
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FIGURE C-2:
PICDEM MRF24J40 DAUGHTER CARD SCHEMATIC
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LAYOUT
PICDEM MRF24J40 Daughter Card fabricated four layer PCB. material with signal traces copper. Figure through Figure show individual layers from bottom. Figure C-10 shows layer stack following guidelines intended users high-frequency layout design. printed circuit board comprised four basic layers: signal layout, ground, power line routing ground (see Figure C-3). guidelines will explain requirements these layers. FIGURE C-3: FOUR BASIC COPPER LAYERS
Signal Layout, Thickness mils Dielectric 4.5, Thickness mils
Ground, Thickness mils
Dielectric 4.5, Thickness mils
Power Line Routing, Thickness mils Dielectric 4.5, Thickness mils Ground, Thickness mils Note: Care should taken with ground lines prevent breakage.
important keep original thickness since change will affect antenna performance (see total thickness dielectric) microstrip lines characteristic impedance. first layer width characteristic impedance microstrip line mils. Avoid having microstrip lines longer than since that line might very close quarter wave length working frequency board which start behaving antenna. Except antenna layout, avoid sharp corners since they antenna. Round corners will eliminate possible future problems. Digital lines definition prone very noisy when handling periodic waveforms fast clock/switching rates. Avoid laying signal close digital lines. filled ground patch underneath transceiver mandatory. power supply must distributed each star topology low-ESR capacitors must placed each proper decoupling noise. Thorough decoupling each power beneficial reducing in-band transceiver noise, particularly when this noise degrades performance. Usually, value caps (27-47 combined with large value caps (100 will cover large spectrum frequency. Passive components (inductors) must high-frequency category (Self-Resonant Frequency) should least times higher than operating frequency.
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PICDEMZ Card
FIGURE C-4: SILKSCREEN
FIGURE C-5:
COPPER LAYER
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FIGURE C-6: GROUND PLANE LAYER
FIGURE C-7:
POWER PLANE LAYER
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PICDEMZ Card
FIGURE C-8: BOTTOM COPPER LAYER
FIGURE C-9:
BOTTOM SILKSCREEN
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FIGURE C-10: STACKUP
Copper Ground Plane Power Plane Bottom Copper
Total
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PICDEMZ Card
PICDEM MRF24J40 DAUGHTER CARD BILL MATERIALS
MRF24J40 DAUGHTER CARD BILL MATERIALS(1)
Reference Description C23, C37, C38, C21, C19, C44, C55, C52, Value Description Vendor Vendor T491B225K025AT
TABLE C-1:
Quantity
Component Name CAP3528 CAP0402 CAP0402 CAP0402 CAP0402 CAP0402
F_Tant Capacitor TANT, Kemet 25V, 10%, CAP, Ceramic, 50V, NP0, 0402 CAP, Ceramic, 50V, C0G, 0402 CAP, Ceramic, 50V, 0402, CAP, Ceramic, 50V, C0G, 0402 CAP, Ceramic, 10000 16V, X7R, 0402 CAP, Ceramic, 10V, X7R, 10%, 0402 CAP, Ceramic, 50V, C0G, 0402 CAP, Ceramic, 10V, Y5V, 0603 Crystal, 20.000 MHz, FUND, MRF24J40, Single Chip Transceiver Inductor Multilayer, 0402 Inductor Multilayer, 0402 Inductor Multilayer, 0402 RES, 1/16W, 0402, RES, 1/16W, 0402, .100" Socket/Terminal
Yageo America 0402CG508C9B200 Murata Electronics Panasonic Corporation Kemet GRM1555C1H200JZ01D ECJ-0EC1H270J C1005C0G1H470J C0402C103K4RACTU
CAP0402 CAP0402 CAP0603 CRYSTAL_ABM8 MRF24J40_I/ML IND0402 IND0402 IND0402 RES0402 RES0402 HDR6X2
C39, R20,
Kemet Corporation Taiyo Yuden Abracon Corporation Microchip Corporation Corporation Corporation Panasonic
C0402C104K8PACTU C1005C0G1H181J LMK107F225ZA-T ABM8-20.000MHZ-B2-T MRF24J40-I/ML MLK1005S4N7S MLK1005S5N6D MLK1005S10NJ ERJ-2GE0R00X
Yageo America RC0402JR-0710KL Samtec LST-106-07-F-D
Note
placed: C41, C42,
2008 Microchip Technology Inc.
DS51524C-page
PICDEM Demonstration User's Guide
ANTENNA DETAILS
IMPEDANCE ANTENNA
FIGURE C-11:
FIGURE C-12:
IMPEDANCE ANTENNA SMITH CHART
DS51524C-page
2008 Microchip Technology Inc.
PICDEMZ Card
FIGURE C-13: IMPEDANCE ANTENNA WITH VOLTAGE STANDING WAVE RATIO
most critical part maintaining proper impedance adhering specified dimensions printed circuit board antenna (see Figure C-14). antenna dimensions, altered, will change specified impedance. example, variance will shift impedance 5-10 MHz. Note: This part been simulated using HFSSsimulator Ansoft Corporation.
FIGURE C-14:
PRINTED CIRCUIT BOARD ANTENNA DIMENSIONS(1)
22.0
0.85 3.37
3.82 1.54
0.72
Note
Dimensions tolerance 0.05
Figure C-15 Figure C-16 illustrate simulation results this antenna. Note simulation results very close measurements.
2008 Microchip Technology Inc.
DS51524C-page
PICDEM Demonstration User's Guide
FIGURE C-15: SIMULATED ANTENNA IMPEDANCE, PLOT
DS51524C-page
2008 Microchip Technology Inc.
PICDEMZ Card
FIGURE C-16: SIMULATED ANTENNA IMPEDANCE, SMITH PLOT
2008 Microchip Technology Inc.
DS51524C-page
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01/02/08
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2008 Microchip Technology Inc.

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