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www.ti.com SLAS657 2009 16-BIT, 1-MSPS, UNIPOLAR SINGLE ENDED WIT


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ADS8255
www.ti.com SLAS657 2009
16-BIT, 1-MSPS, UNIPOLAR SINGLE ENDED WITH ON-CHIP DRIVER (OPA) 8-CHANNEL DIFFERENTIAL MULTIPLEXER
FEATURES
1.0-MHz Sample Rate, Zero Latency Full Speed 16-Bit Resolution Supports Unipolar Single Ended Input Range: Built-In Eight Channel, Single Ended Multiplexer; with Channel Count Selection Auto/Manual Mode On-Board Single Ended Input, Differential Output Driver (OPA) Buffered Reference Output Level Shift Bipolar ±4-V Input with External Resistance Divider Reference/2 Output Offset External Signal Conditioner 16-/8-Bit Parallel Interface SNR: 95.4dB 2-kHz THD: -118dB 2-kHz Power Dissipation: 331.25 MSPS Internal Reference Internal Reference Buffer 64-Pin Package
APPLICATIONS
Medical Imaging/CT Scanners Automated Test Equipment High-Speed Data Acquisition Systems High-Speed Closed-Loop Systems
DESCRIPTION
ADS8255 high-performance analog system-on-chip (SoC) device with 16-bit, 1-MSPS converter, internal reference, on-chip driver (OPA), 8-channel single ended multiplexer. channel count multiplexer auto/manual scan modes device user selectable. driver designed leverage very high noise performance differential optimum power usage levels. ADS8255 outputs buffered reference signal level shifting ±4-V bipolar signal with external resistance divider. Vref/2 output signal available offset signal conditioning circuit. device also includes 16-/8-bit parallel interface. ADS8255 available 64-pin package characterized from -40°C 85°C.
HIGH-SPEED CONVERTER FAMILY
TYPE/SPEED 18-Bit Pseudo-Diff Single Ended ADS8380 ADS8382 18-Bit Pseudo-Bipolar, Fully Diff ADS8482 ADS8327 16-Bit Pseudo-Diff ADS8328 ADS8319 ADS8318 16-Bit Pseudo-Bipolar, Fully Diff ADS8254 14-Bit Pseudo-Diff 12-Bit Pseudo-Diff ADS7886 ADS8406 ADS7890 ADS7883 ADS8413 ADS7891 ADS7881 ADS8372 ADS8472 ADS8402 ADS8412 ADS8422 ADS8370 ADS8371 ADS8471 ADS8255 ADS8401 ADS8405 ADS8411 ADS8410 ADS8285 ADS8284 ADS8484 ADS8383 ~600 ADS8381 ADS8481 1.25 4MHz
Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet.
PRODUCT PREVIEW information concerns products formative design phase development. Characteristic data other specifications design goals. Texas Instruments reserves right change discontinue these products without notice.
Copyright 2009, Texas Instruments Incorporated
PRODUCT PREVIEW
PACKAGE OPTION ADDENDUM
www.ti.com 15-May-2009
PACKAGING INFORMATION
Orderable Device ADS8255IBRGCR ADS8255IBRGCT ADS8255IRGCR ADS8255IRGCT
Status PREVIEW PREVIEW PREVIEW PREVIEW
Package Type VQFN VQFN VQFN VQFN
Package Drawing
Pins Package Plan 2000 2000
Lead/Ball Finish Call Call Call Call
Peak Temp Call Call Call Call
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
IMPORTANT NOTICE
Texas Instruments Incorporated subsidiaries (TI) reserve right make corrections, modifications, enhancements, improvements, other changes products services time discontinue product service without notice. Customers should obtain latest relevant information before placing orders should verify that such information current complete. products sold subject TI's terms conditions sale supplied time order acknowledgment. warrants performance hardware products specifications applicable time sale accordance with TI's standard warranty. Testing other quality control techniques used extent deems necessary support this warranty. Except where mandated government requirements, testing parameters each product necessarily performed. assumes liability applications assistance customer product design. Customers responsible their products applications using components. minimize risks associated with customer products applications, customers should provide adequate design operating safeguards. does warrant represent that license, either express implied, granted under patent right, copyright, mask work right, other intellectual property right relating combination, machine, process which products services used. Information published regarding third-party products services does constitute license from such products services warranty endorsement thereof. such information require license from third party under patents other intellectual property third party, license from under patents other intellectual property Reproduction information data books data sheets permissible only reproduction without alteration accompanied associated warranties, conditions, limitations, notices. Reproduction this information with alteration unfair deceptive business practice. responsible liable such altered documentation. Information third parties subject additional restrictions. Resale products services with statements different from beyond parameters stated that product service voids express implied warranties associated product service unfair deceptive business practice. responsible liable such statements. products authorized safety-critical applications (such life support) where failure product would reasonably expected cause severe personal injury death, unless officers parties have executed agreement specifically governing such use. Buyers represent that they have necessary expertise safety regulatory ramifications their applications, acknowledge agree that they solely responsible legal, regulatory safety-related requirements concerning their products products such safety-critical applications, notwithstanding applications-related information support that provided Further, Buyers must fully indemnify representatives against damages arising products such safety-critical applications. products neither designed intended military/aerospace applications environments unless products specifically designated military-grade "enhanced plastic." Only products designated military-grade meet military specifications. Buyers acknowledge agree that such products which designated military-grade solely Buyer's risk, that they solely responsible compliance with legal regulatory requirements connection with such use. products neither designed intended automotive applications environments unless specific products designated compliant with ISO/TS 16949 requirements. Buyers acknowledge agree that, they non-designated products automotive applications, will responsible failure meet such requirements. Following URLs where obtain information other Texas Instruments products application solutions: Products Amplifiers Data Converters DLP® Products Clocks Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF ZigBee® Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office 655303, Dallas, Texas 75265 Copyright 2009, Texas Instruments Incorporated

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