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Application Note AN:017 RoHS-Compliant Through-Hole Chip Soldering Recommendations
Ankur Patel, Associate Product Line Engineer
Introduction Contents
Introduction Wave Soldering Hand Soldering Pin/Lead Protrusion Board Cleaning Page RoHS compliant, through-hole full size Chips intended wave soldering assembly. information contained this document defines processing conditions required mounting full size Chip using wave soldering hand soldering. Failure follow recommendations provided result visual functional failure module. addition soldering procedures, common soldering defects will discussed direction will provided detecting, handling preventing these defects. surface mount Chip reflow soldering guidelines, please AN:009 Note: Solder related soldering equipment and/or emit noxious gases. Industry standard health safety procedures must followed when soldering Chips.
Solder Joint Inspection Procedure Potential Defects Removal Disclaimer Reference
Wave Soldering
Storage full size through-hole Chip qualified withstand equivalent level pre-condition using 3-zone wave soldering oven. recommended oven temperature profile available upon request. indicates that product unlimited life conditions 30°C according JEDEC-STD-020C components. Pick Place Chip should placed such that each lead rests appropriate hole without damage, distension, bending. appropriate hole spacing recommended data sheet should maintained avoid improper seating Chip leads within PCB. models Chips recommended spacings available persons equipment contact with Chips should have proper protection avoid damaging units during mounting process. Fluxing Fluxes available no-clean water washable varieties. Alpha 2202 recommended wave soldering through-hole Chips. Ultra-sonic spray recommended method applying flux wave soldering process. Flux should applied underside board (solder side). Precise control flux quantities required. little flux will cause poor joints, while much flux cause cosmetic other problems. Preheating preheating procedure must carefully selected ensure that temperature time cycles used degrade product. Recommended board preheat lead free temperature profile: Zone Zone Zone Zone Upper Lower Lower Lower 400°F 400°F 375°F 725°F (convection zone) closest wave (convection zone) closest wave (middle convection zone) zone) farthest from wave
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Application Note AN:017
Wave Soldering No-clean water washable 96.5 solder should used wave-soldering Chips. Other types solder (including leaded solders) used module safely wave soldered without exceeding maximum case temperature, noted Chip data sheet. with process, control process variables will have direct effect quality final product. following guidelines provided wave soldering full size through-hole Chips.
Table General Guidelines Machine Settings
Operating Parameter Amount Flux Applied side Preheat Temperature Bottom side Preheat Temperature Recommended Preheat Profile Maximum Ramp Rate Topside Temperature avoid component damage) Conveyor (wave) Angle Conveyor (wave) Speed Contact Time Solder (Dwell Time) Solder (wave) Temperature: Lead Free Alloys (99.3 96.5 96.5
Typical 1200 using Spray method Straight ramp desired side temperature seconds Maximum
Recommended Ultra Sonic Spray Method 400°F Zone 400°F, Zone 375°F, Zone 725°F
2.75 feet minute seconds
2.75 feet minute seconds
510°F (255 265°C)
510°F
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Application Note AN:017
Hand Soldering
Before soldering, make sure that clean. pins Chip optimized provide resistance electrical connection. final mounting scheme Chip should designed minimize potential mechanical stress pins solder joints. maximum clamp pressure through-hole Chip lbs. additional force required, please contact Applications Engineering. time required create good solder connection will vary depending several parameters such thickness, copper trace area, copper trace thickness, soldering iron power, temperature, type solder, size etc. following typical guidelines apply hand soldering through-hole Chips. size: recommended diameter temperature: 850°F Soldering time: seconds Type solder: clean, 96.5 Type flux: None
Soldering multiple pins same potential simultaneously acceptable. Care should taken short pins different potentials. Wire soldered directly Chip leads. However, wires soldered Chip should have appropriate strain relief insure that stress applied lead frame. Chip itself should mechanically secured appropriately that will move application stress solder connection. Caution should taken cause solder bridging shorts. Direct wire soldering Chip leads recommended production applications should only used initial prototyping exercises when available.
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Application Note AN:017
Pin/Lead Protrusion
Pin/Lead protrusion guidelines, defined IPC-A-610D, necessary enable good solder connection. Minimum criteria require lead discernible solder, while maximum criteria require enough clearance avoid danger shorting between leads. Figures Table show length maximum minimum criteria.
Figure Length leads considered without clinch (left) with clinch (right).
Figure Maximum (left image) minimum criteria (right image).
Figure Example acceptable protrusion soldered lead.
Table Maximum minimum recommended lead protrusion lengths
Class
Class
Class
visible solder joint (see Figure danger shorts [0.0984 [0.0591
Class General electronic products defined IPC-A-610 Class Dedicated service electronic products defined IPC-A-610D Class High performance electronic products defined IPC-A-610D
Board Cleaning
water-soluble solder used, board water washed using deionized water. No-clean solders require cleaning will leave residues board surface. this concern, cleaning performed using isopropyl alcohol.
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Application Note AN:017
Solder Joint Inspection Procedure
magnifying glass optical microscope magnification should used look solder shorts, solder voiding. Electrical inspection should conducted verify shorting that visible. Figures illustrate good solder joints with views from both bottom sides PCB.
Figure Good joint-board bottom side
Figure Good joints-board bottom side
Figure Good joints-board side
vicorpower.com
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Application Note AN:017
Figure Good joints board side
Potential Defects
Some common defects soldering through-hole Chips described below, illustrated figures Solder voiding caused outgassing substances from solder. prevent this, correct soldering profile should selected enough preheat should provided. Non-wetting caused improper chemical characteristics between solder surface metallization. Surface plating should compatible with solder order eliminate non-wetting defects. Fillet lifting defect which solder joints lifts from pad. Fillet lifting been associated with contamination which leads difference solder solidification rate interface. Bismuth Lead with lead-free solders should avoided order avoid fillet lifting. Shrink hole tearing defect related appearance tearing soldered joints. According standard this defect acceptable provided shrink hole does contact lead, land barrel wall. Solder balling related presence solder balls after soldering operation. Adjusting reflow profile allowing enough time soldering avoid this. Insufficient solder related solder filling through-hole during soldering process. Less than solder fill acceptable according Solder bridging related solder improperly connecting more adjacent pads leads that come into contact form conductive path during wave soldering process. Solder bridging between joints same potential acceptable should expected.
Figure Solder voiding
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Application Note AN:017
Figure wetting
Figure Fillet lifting
Figure Shrink hole/Hot tear
Figure Insufficient solder
Figure Solder balling
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Application Note AN:017
Figure Solder bridging
Removal
Through-hole Chip components removed from using vacuum method: Preheat assembly component required. Heat each individual joint time rapid, controllable fashion achieve complete solder reflow. Avoid thermal mechanical damage component, board, adjacent components their joints. exceed 150°C side (case) Chip. Apply vacuum during lead movement cool joint free lead. Through-hole Chips also removed using solder fountain method: Reflow joints solder fountain. Remove component either immediately replace with components clear through-holes component replacement later.
vicorpower.com
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Rev.
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Application Note AN:017
Disclaimer
This document provides general guidelines, which have proven yield excellent results. However, depending upon equipment, components circuit boards, optimal settings different. order optimize soldering process, recommended that soldering process experimentation performed, optimizing most important soldering process variables (amount flux applied, topside preheat temperature, bottom side preheat temperature, recommended preheat profile, maximum ramp rate topside temperature, conveyor angle, conveyor speed, contact time solder, solder temperature board orientation.) Mechanical samples Chips available enable optimization soldering process. Please ordering details. Please contact Applications Engineering further assistance inquiries regarding soldering through-hole Chip components covered this document.
Reference
Further information obtained from following sites documents: IPC-A-610 Revision Acceptability Electronic Assemblies http://www.ipc.org http://www.jedec.org
Information furnished Vicor believed accurate reliable. However, responsibility assumed Vicor use. Vicor components designed used applications, such life support systems, wherein failure malfunction could result injury death. sales subject Vicor's Terms Conditions Sale, which available upon request. Specifications subject change without notice.
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2/2008
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