www.ti.com. SCES381I JANUARY 2002 REVISED OCTOBER 2009 DUAL SCHMI

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SN74LVC2G17
www.ti.com. SCES381I JANUARY 2002 REVISED OCTOBER 2009
DUAL SCHMITT-TRIGGER BUFFER
FEATURES
Typical VOHV (Output Undershoot) 25°C Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds JESD Class Protection Exceeds JESD 2000-V Human-Body Model (A114-A) 1000-V Charged-Device Model (C101)
PACKAGE (BOTTOM VIEW)
Available Texas Instruments NanoFreePackage Supports Operation Inputs Accept Voltages Power Consumption, 10-µA ±24-mA Output Drive Typical VOLP (Output Ground Bounce) <0.8 25°C
PACKAGE (TOP VIEW)
PACKAGE (TOP VIEW)
mechanical drawings dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual Schmitt-trigger buffer designed 1.65-V 5.5-V operation. SN74LVC2G17 contains buffers performs Boolean function device functions independent buffers, because Schmitt action, have different input threshold levels positive-going (VT+) negative-going (VT-) signals. NanoFreepackage technology major breakthrough packaging concepts, using package. This device fully specified partial-power-down applications using Ioff. Ioff circuitry disables outputs, preventing damaging current backflow through device when powered down.
Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet. NanoFree trademark Texas Instruments.
Copyright 2002-2009, Texas Instruments Incorporated
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters.
SN74LVC2G17
SCES381I JANUARY 2002 REVISED OCTOBER 2009. www.ti.com
ORDERING INFORMATION
PACKAGE NanoFree- WCSP (DSBGA) 0.23-mm Large Bump (Pb-free) -40°C 85°C (SOT-23) (SC-70) Reel 3000 Reel 3000 Reel Reel 3000 Reel ORDERABLE PART NUMBER SN74LVC2G17YZPR SN74LVC2G17DBVR SN74LVC2G17DBVT SN74LVC2G17DCKR SN74LVC2G17DCKT TOP-SIDE MARKING _C7_ C17_
most current package ordering information, Package Option Addendum this document, site www.ti.com. Package drawings, thermal data, symbolization available www.ti.com/packaging. DBV/DCK: actual top-side marking additional character that designates wafer fab/assembly site. YZP: actual top-side marking three preceding characters denote year, month, sequence code, following character designate wafer fab/assembly site. identifier indicates solder-bump composition SnPb, Pb-free).
FUNCTION TABLE (EACH INVERTER)
INPUT OUTPUT
LOGIC DIAGRAM (POSITIVE LOGIC)
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Supply voltage range Input voltage range
±100
UNIT °C/W
-0.5 -0.5 -0.5 -0.5
Voltage range applied output high-impedance power-off state Voltage range applied output high state Input clamp current Output clamp current Continuous output current Continuous current through package
Tstg
Package thermal impedance
package package
Junction temperature under bias Storage temperature range
Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. input negative-voltage output voltage ratings exceeded input output current ratings observed. value provided recommended operating conditions table. package thermal impedance calculated accordance with JESD 51-7.
Submit Documentation Feedback Product Folder Link(s): SN74LVC2G17
Copyright 2002-2009, Texas Instruments Incorporated
SN74LVC2G17
www.ti.com. SCES381I JANUARY 2002 REVISED OCTOBER 2009
Recommended Operating Conditions
Supply voltage Input voltage Output voltage 1.65 High-level output current 1.65 Low-level output current Operating free-air temperature Operating 1.65 UNIT
unused inputs device must held ensure proper device operation. Refer application report, Implications Slow Floating CMOS Inputs, literature number SCBA004.
Copyright 2002-2009, Texas Instruments Incorporated
Submit Documentation Feedback Product Folder Link(s): SN74LVC2G17
SN74LVC2G17
SCES381I JANUARY 2002 REVISED OCTOBER 2009. www.ti.com
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS 1.65 Positive-going input threshold voltage 1.65 Negative-going input threshold voltage 1.65 Hysteresis (VT+ VT-) -100 Ioff input GND, input typical values 25°C. Other inputs 1.65 1.65 1.65 1.65 1.65 0.45 0.55 0.55 UNIT
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure
PARAMETER FROM (INPUT) (OUTPUT) 0.15 UNIT
Submit Documentation Feedback Product Folder Link(s): SN74LVC2G17
Copyright 2002-2009, Texas Instruments Incorporated
SN74LVC2G17
www.ti.com. SCES381I JANUARY 2002 REVISED OCTOBER 2009
Operating Characteristics
25°C
PARAMETER Power dissipation capacitance TEST CONDITIONS UNIT
Copyright 2002-2009, Texas Instruments Incorporated
Submit Documentation Feedback Product Folder Link(s): SN74LVC2G17
SN74LVC2G17
SCES381I JANUARY 2002 REVISED OCTOBER 2009. www.ti.com
PARAMETER MEASUREMENT INFORMATION
VLOAD From Output Under Test (see Note Open TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD
LOAD CIRCUIT INPUTS 0.15 tr/tf VCC/2 VCC/2 VCC/2 VLOAD 0.15 0.15 Timing Input Input VOLTAGE WAVEFORMS PULSE DURATION Input tPLH Output tPHL tPHL tPLH Output VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING NONINVERTING OUTPUTS Output Waveform (see Note Output Waveform VLOAD (see Note tPZH VOLTAGE WAVEFORMS SETUP HOLD TIMES tPZL tPLZ VLOAD/2 tPHZ VOLTAGE WAVEFORMS ENABLE DISABLE TIMES LOW- HIGH-LEVEL ENABLING Data Input
Output Control
NOTES: includes probe capacitance. Waveform output with internal conditions such that output low, except when disabled output control. Waveform output with internal conditions such that output high, except when disabled output control. input pulses supplied generators having following characteristics: MHz, outputs measured time, with transition measurement. tPLZ tPHZ same tdis. tPZL tPZH same ten. tPLH tPHL same tpd. parameters waveforms applicable devices.
Figure Load Circuit Voltage Waveforms
Submit Documentation Feedback Product Folder Link(s): SN74LVC2G17
Copyright 2002-2009, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com 23-Sep-2009
PACKAGING INFORMATION
Orderable Device SN74LVC2G17DBVR SN74LVC2G17DBVRE4 SN74LVC2G17DBVRG4 SN74LVC2G17DBVT SN74LVC2G17DBVTE4 SN74LVC2G17DBVTG4 SN74LVC2G17DCKR SN74LVC2G17DCKRE4 SN74LVC2G17DCKRG4 SN74LVC2G17DCKT SN74LVC2G17DCKTE4 SN74LVC2G17DCKTG4 SN74LVC2G17YZPR
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SC70 SC70 SC70 SC70 SC70 SC70 DSBGA
Package Drawing
Pins Package Plan 3000 Green (RoHS Sb/Br) 3000 Green (RoHS Sb/Br) 3000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
Lead/Ball Finish NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU SNAGCU
Peak Temp Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
3000 Green (RoHS Sb/Br) 3000 Green (RoHS Sb/Br) 3000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
3000 Green (RoHS Sb/Br)
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com 23-Sep-2009
incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis. OTHER QUALIFIED VERSIONS SN74LVC2G17 Automotive: SN74LVC2G17-Q1 Enhanced Product: SN74LVC2G17-EP NOTE: Qualified Version Definitions: Q100 high-reliability AutomotiveProduct -devices qualified Aerospace andautomotive applications targeting zero defects Supports Defense, Medical Applications Enhanced
Addendum-Page
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Oct-2009
TAPE REEL INFORMATION
*All dimensions nominal
Device
Package Package Pins Type Drawing SOT-23 SC70 SC70 SC70 DSBGA
Reel Reel Diameter Width (mm) (mm) (mm) 178.0 178.0 180.0 180.0 178.0 3.23 2.24 2.24 1.02
(mm) 3.17 2.34 2.34 1.52
(mm) 1.37 1.22 1.22 0.63
(mm)
Pin1 (mm) Quadrant
SN74LVC2G17DBVR SN74LVC2G17DCKR SN74LVC2G17DCKR SN74LVC2G17DCKT SN74LVC2G17YZPR
3000 3000 3000 3000
Pack Materials-Page
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Oct-2009
*All dimensions nominal
Device SN74LVC2G17DBVR SN74LVC2G17DCKR SN74LVC2G17DCKR SN74LVC2G17DCKT SN74LVC2G17YZPR
Package Type SOT-23 SC70 SC70 SC70 DSBGA
Package Drawing
Pins
3000 3000 3000 3000
Length (mm) 180.0 180.0 205.0 205.0 220.0
Width (mm) 180.0 180.0 200.0 200.0 220.0
Height (mm) 18.0 18.0 33.0 33.0 35.0
Pack Materials-Page
IMPORTANT NOTICE
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