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nV/Hz ±500 ±250 VREF MCP6021 MCP6023 0.00053% 2.5V 5.5V -40°C +85°C -4


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MCP6021/1R/2/3/4
nV/Hz ±500 ±250 VREF MCP6021 MCP6023 0.00053% 2.5V 5.5V -40°C +85°C -40°C +125°C
Microchip MCP6021 MCP6021R MCP6022 MCP6023 MCP6024 nV/Hz 0.00053% THD+N MCP6023 MCP6021 MCP6021R SOT-23 MCP6021MCP6023 MCP6022 PDIPSOIC TSSOP MCP6021 MSOP MCP6024 PDIP SOIC TSSOP MCP6021/1R/2/3/4 2.5V 5.5V
MCP6021 SOT-23-5
VOUT VIN+ VIN-
MCP6022 PDIP SOIC, TSSOP
VOUTA VINA- VINA+ VOUTB VINB- VINB+
MCP6021R SOT-23-5
VOUT VIN+ VIN-
MCP6023 PDIP SOIC, TSSOP
VIN- VIN+ VOUT VREF
SPICE FilterLab® Mindi Microchip Microchip Advanced Part Selector MAPS
MCP6021 PDIP SOIC, MSOP, TSSOP
VIN- VIN+ VOUT VREF
MCP6024 PDIP SOIC, TSSOP
VOUTA VINA- VINA+ VINB+ VINB- VOUTB VOUTD VIND- VIND+ VINC+ VINC- VOUTC
MCP6021 VDD/2
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
.7.0V VIN+ VIN- VIN+ VIN- 1.0V 1.0V 0.3V 0.3V |VDD VSS| .±30 .-65°C +150°C +150°C HBM/MM. 200V 4.1.2
+25°C +2.5V +5.5V VDD/2 VOUT VDD/2 VDD/2
VCMR CMRR CMRR CMRR MCP6021 MCP6023 VREF VREF VDD/2 VREF VSS+15 VDD-20 0.5V 2.5V 5.5V VREF VREF/TA ±100 µV/°C -40°C +125°C VOUT VSS+0.3V VDD-0.3V VSS-0.3 VDD+0.3 -0.3V 5.3V 3.0V 5.3V -0.3V 3.0V VOS/TA PSRR ZDIFF -500 -250 -2.5 ±3.5 1013||6 1013||3 +500 +250 +2.5 5,000 5.0V 5.0V -40°C +125°C
µV/°C -40°C +125°C ||pF ||pF +85°C +125°C
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
+25°C +2.5V +5.5V VDD/2 VOUT VDD/2 VDD/2 0.2% kHz, kHz, V/V, kHz, kHz, kHz, +100 µVp-p nV/Hz fA/Hz THD+N THD+N THD+N THD+N THD+N 0.00053 0.00064 0.0014 0.0009 0.005 VOUT 0.25V 3.25V (1.75V 1.50VPK), 5.0V, VOUT 0.25V 3.25V (1.75V 1.50VPK), 5.0V, VOUT 4VP-P, 5.0V, VOUT 4VP-P, 5.0V, VOUT 4VP-P, 5.0V, GBWP tSETTLE V/µs VOUT mVp-p 1.35
MCP6023
+25°C +2.5V +5.5V VDD/2 VOUT VDD/2 VDD/2 tOFF VHYST 0.01 VSS, 0.2VDD VOUT 0.45VDD VSS, 0.8VDD VOUT 0.05VDD 5.0V ICSH IO(LEAK) 0.01 -0.05 0.01 ICSL -1.0 0.01
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
+2.5V +5.5V SOT-23 PDIP SOIC MSOP TSSOP PDIP SOIC TSSOP °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W +125 +125 +150
150°C
VOUT Hi-Z tOFF Hi-Z
MCP6021 VOUT
VDD/2
1-1:
MCP6023
VDD/2 MCP6021 VOUT
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
+25°C +2.5V +5.5V VDD/2 VOUT VDD/2 VDD/2
Percentage Occurances
Percentage Occurances -500 -400 -300 -200 -100 I-Temp Parts 1192 Samples +25°C
I-Temp Parts
1192 Samples -40°C +85°C
Input Offset Voltage (µV)
Input Offset Voltage Drift (µV/°C)
Percentage Occurances E-Temp Parts Samples 5.0V +25°C
Percentage Occurances E-Temp Parts Samples -40°C +125°C
-160
-240
-200
-120
Input Offset Voltage (µV)
Input Offset Voltage Drift (µV/°C)
2.5V -100 -200 -300 -400 -500 -0.5
-100 -200 -300 -400 -500
Input Offset Voltage (µV)
-40°C +25°C +85°C +125°C
Input Offset Voltage (µV)
5.5V
-40°C +25°C +85°C +125°C
-0.5
Common Mode Input Voltage
Common Mode Input Voltage
2.5V
5.5V
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
+25°C +2.5V +5.5V VDD/2 VOUT VDD/2 VDD/2
Input Offset Voltage (µV) -100 -150 -200 -250 -300 Ambient Temperature (°C) 5.0V Input Offset Voltage (µV) -100 -150 -200 Output Voltage 2.5V 5.5V VDD/2
2-10
Input Noise Voltage Density (nV/Hz) 5.0V
1,000 Input Noise Voltage Density (nV/Hz)
-0.5
1.E+
.E+0
1.E+
.E+0
1.E+
.E+0
100k
Frequency (Hz)
Common Mode Input Voltage
CMRR, PSRR (dB)
1.E+02 1.E+03
2-11
PSRR, CMRR (dB)
PSRR+ PSRR-
PSRR (VCM CMRR
CMRR
1.E+04
1.E+05
1.E+06
Frequency (Hz)
100k
Ambient Temperature (°C)
CMRR PSRR-
2-12
CMRR PSRR-
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
+25°C +2.5V +5.5V VDD/2 VOUT VDD/2 VDD/2
Input Bias, Offset Currents (pA) Input Bias, Offset Currents (pA) 10,000 5.5V 1,000 10,000 1,000 Ambient Temperature (°C)
+125°C IOS, +125°C +85°C
5.5V
IOS, +85°C
Common Mode Input Voltage
2-13
Power Supply Voltage
2-16
5.5V 2.5V
Quiescent Current (mA/amplifier)
+125°C +85°C +25°C -40°C
Quiescent Current (mA/amplifier)
0.5V
Ambient Temperature (°C)
2-14
Output Short Circuit Current (mA)
2-17
Phase -105 -120 -135 -150 Gain -165 -180 -195 -210 100k 100M
1.E+04 1.E+05 1.E+06 1.E+07 1.E+08
Supply Voltage +125°C +85°C +25°C -40°C
Open-Loop Gain (dB)
1.E+00
1.E+01
1.E+02
1.E+03
Frequency (Hz)
2-15
2-18
2009 Microchip Technology Inc.
DS21685D_CN
Open-Loop Phase
MCP6021/1R/2/3/4
+25°C +2.5V +5.5V VDD/2 VOUT VDD/2 VDD/2
Open-Loop Gain (dB) Open-Loop Gain (dB) 5.5V 2.5V
1.E+02
1.E+03 1.E+04 1.E+05
5.5V
2.5V
100k
Load Resistance
Ambient Temperature (°C)
2-19
2-22
Gain Bandwidth Product (MHz) VDD/2 Common Mode Input Voltage 5.0V Phase Margin, Gain Bandwidth Product
Phase Margin, Phase Margin,
Open-Loop Gain (dB)
5.5V 0.00 2.5V
0.05
0.10
0.15
0.20
0.25
0.30
Output Voltage Headroom (V);
2-20
2-23
Gain Bandwidth Product (MHz)
GBWP, 5.5V GBWP, 2.5V 2.5V 5.5V
Gain Bandwidth Product Phase Margin, 5.0V VDD/2 Output Voltage
Gain Bandwidth Product (MHz)
Phase Margin,
Ambient Temperature (°C)
2-21
2-24
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
+25°C +2.5V +5.5V VDD/2 VOUT VDD/2 VDD/2
Falling, 5.5V Rising, 5.5V Maximum Output Voltage Swing (VP-P) 5.5V 2.5V
Slew Rate (V/µs)
Falling, 2.5V Rising, 2.5V
1.E+04
Ambient Temperature (°C)
100k Frequency (Hz)
1.E+05
1.E+06
1.E+07
2-25
2-28
0.1000%
0.1000%
BWMeas 5.0V THD+N +100
+100
THD+N
0.0100%
0.0100%
0.0010% 0.0001% Output Voltage (VP-P)
0.0010%
BWMeas 5.0V
0.0001% Output Voltage (VP-P)
2-26
Input, Output Voltage Time µs/div) VOUT 5.0V
2-29
Channel Channel Separation (dB)
1.E+03 1.E+04 1.E+05 1.E+06
100k Frequency (Hz)
MCP6021/1R/2/3/4 2-27
2-30 MCP6022 MCP6024
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
+25°C +2.5V +5.5V VDD/2 VOUT VDD/2 VDD/2
1,000 Output Voltage Headroom; VDD-VOH VOL-VSS (mV) Output Voltage Headroom VDD-VOH VOL-VSS (mV)
0.01
Output Current Magnitude (mA)
Ambient Temperature (°C)
2-31
6.E-02
2-34
6.E-02
5.E-02
Output Voltage mV/div)
5.E-02
Output Voltage mV/div)
4.E-02
4.E-02
3.E-02
3.E-02
2.E-02
2.E-02
1.E-02
1.E-02
0.E+00
0.E+00
-1.E-02
-1.E-02
-2.E-02
-2.E-02
-3.E-02
-3.E-02
-4.E-02
-4.E-02
-5.E-02 -5.E-02
-6.E-02 -6.E-02 0.E+00 2.E-07 4.E-07 6.E-07 8.E-07 1.E-06 1.E-06 1.E-06 2.E-06 2.E-06 2.E-06 0.E+00 2.E-07 4.E-07 6.E-07 8.E-07 1.E-06 1.E-06 1.E-06 2.E-06 2.E-06 2.E-06
Time (200 ns/div)
Time (200 ns/div)
2-32
Output Voltage
0.E+00 5.E-07 1.E-06
2-35
Output Voltage
0.E+00
5.E-07
1.E-06
2.E-06
2.E-06
3.E-06
3.E-06
4.E-06
4.E-06
5.E-06
5.E-06
2.E-06
2.E-06
3.E-06
3.E-06
4.E-06
4.E-06
5.E-06
5.E-06
Time (500 ns/div)
Time (500 ns/div)
2-33
2-36
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
+25°C +2.5V +5.5V VDD/2 VOUT VDD/2 VDD/2
Power Supply Voltage
VREF Accuracy; VREF-VDD/2 (mV)
VREF Accuracy; VREF VDD/2 (mV)
Representative Part
5.5V 2.5V
Ambient Temperature (°C)
2-37 VREF MCP6021 MCP6023
Quiescent Current (mA/amplifier) Chip Select Voltage 2.5V 1.25V swept high swept high Hysteresis turns here shuts here
2-40 VREF MCP6021 MCP6023
Quiescent Current (mA/amplifier) Chip Select Voltage Hysteresis swept high 5.5V 2.75V swept high turns here shuts here
2-38 MCP6023 2.5V
-0.5 5.0V
2-41 MCP6023 5.5V
Chip Select Voltage, Output Voltage
Voltage
VOUT
Output
Output High-Z
Output
0.0E+00
5.0E-06
1.0E-05
1.5E-05
2.0E-05
2.5E-05
3.0E-05
3.5E-05
Time µs/div)
2-39 MCP6023
2-42
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
MCP6021 PDIP SOIC MSOP TSSOP
MCP6021R MCP6022 MCP6023 MCP6024 SOT-23-5 PDIP SOIC TSSOP PDIP SOIC TSSOP PDIP SOIC TSSOP SOT-23-5
VOUT VOUTA VIN- VINA- VIN+ VINA+ VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD VREF
MCP6021 TSSOP MCP6021R SOT-23
CMOS
CMOS
VREF MCP6021 MCP6023
2.5V 6.0V
SOT-23
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
MCP602X MCP6021/1R/2/3/4 Microchip CMOS
4.1.1
MCP6021/1R/2/3/4 2-42
4.1.2
VIN+ VIN- 2-42
VIN+
VIN-
4.1.3
MCP6021/1R/2/3/4 CMOS 0.3V 0.3V
VIN+ VIN- VIN+ VIN- VIN+ VIN-
2-31 2-34
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
RISO MCP602X VOUT
RISO VOUT
RISO
Maximum
RISO CL/GN
1,000 Recommended RISO
1.E+05 100k
1.E+04
1.E+03
1.E+02
Noise Gain; (V/V)
1,000 10,000 Normalized Capacitance; CL/GN (pF)
RISO
MCP6023
RISO RISO MCP6021/1R/2/3/4 SPICE
MCP6023
2-35 2-36
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
MCP6021 MCP6023
SOT-23 MCP6021 MCP6023 VREF MCP6021 MCP6023 VREF VREF VREF MCP6021 VOUT
VREF
VREF MCP6021 MCP6023
VREF
0.01
VREF MCP6021 MCP6023
MCP6024 4-10 MCP6024 VREF MCP6024
VOUT VREF
VREF MCP6021 MCP6023
VREF
4-10
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
Printed Circuit Board 1012 MCP6021/1R/2/3/4 +25°C 4-11 VIN- VIN+
4.11
4.11.1
4-12 ksps
4-11
8.45 14.7 33.2 MCP602X
VIN- VIN+ 4-11 VIN+ VDD/2 VIN-
4-12
4.10
Electro-Magnetic Compatibility
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
4.11.2
4-13 MCP6021 MCP6021 VDD/2
4-13
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
Microchip MCP6021/1R/2/3/4 Microchip Microchip www.microchip.com/analogtools MCP6XXX MCP6XXX MCP6XXX MCP6XXX SOIC/MSOP/TSSOP/DIP P/NSOIC8EV SOIC/TSSOP/DIP P/NSOIC14EV
SPICE
Microchip www.microchip.com MCP6021/1R/2/3/4 SPICE SPICE
FilterLab®
MicrochipFilterLab® Microchip www.microchip.com/filterlab FilterLab SPICE
Microchip Microchip www.microchip. com/appnotes ADN003"Select Right Operational Amplifier your Filtering Circuits" DS21821 AN722 DS00722A_CN AN723: DS00723A_CN AN884 DS00884A_CN AN990 DS00990A_CN AN1177"Op Precision Design: Errors" DS01177 AN1228"Op Precision Design: Random Noise" DS01228 "Signal Chain Design Guide" DS21825
Mindi
Microchip Mindi Microchip www.microchip.com/mindi Mindi
Microchip MAPS
MAPS Microchip Microchip www.microchip.com/maps MAPS Microchip Microchip
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
SOT-23 MCP6021/MCP6021R
EYNN EZNN
XXNN
MCP6021 MCP6021R
EY25
SOT-23
PDIP XXXXXXXX XXXXXNNN YYWW
MCP6021 I/P256 0903 MCP6021 E/P^^256 0903
SOIC XXXXXXXX XXXXYYWW
MCP6021 I/SN0903 MCP6021E SN^^0903
MSOP XXXXXX YWWNNN
6021E 903256
TSSOP
XXXX YYWW
XX.X
6021 E903
"01" Matte JEDEC JEDEC
Microchip
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
PDIP MCP6024
XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
MCP6024-I/P XXXXXXXXXXXXXX 0903256
MCP6024 E/P^^ 0903256
SOIC MCP6024
XXXXXXXXXX XXXXXXXXXX YYWWNNN
MCP6024ISL XXXXXXXXXX 0903256
MCP6024 E/SL^^ 0903256
TSSOP MCP6024
XXXXXX YYWW
6024E 0903
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
[SOT-23]
Note: most current package drawings, please Microchip Packaging Specification located Microchip
Units Dimension Limits Number Pins Lead Pitch Outside Lead Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness 0.90 0.89 0.00 2.20 1.30 2.70 0.10 0.35 0.08 MILLIMETERS 0.95 1.90 1.45 1.30 0.15 3.20 1.80 3.10 0.60 0.80 0.26
Lead Width 0.20 0.51 Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.127 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-091B
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
P-300mil [PDIP]
Note: most current package drawings, please Microchip Packaging Specification located Microchip
NOTE
Units Dimension Limits Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing .115 .015 .290 .240 .348 .115 .008 .040 .014
INCHES .100 .130 .310 .250 .365 .130 .010 .060 .018 .210 .195 .325 .280 .400 .150 .015 .070 .022
.430 Notes: visual index feature vary, must located with hatched area. Significant Characteristic. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-018B
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
3.90 [SOIC]
Note: most current package drawings, please Microchip Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom 0.17 0.31 0.25 0.40 1.25 0.10
MILLIMETERS 1.27 6.00 3.90 4.90 1.04 0.25 0.51 0.50 1.27 1.75 0.25
Notes: visual index feature vary, must located within hatched area. Significant Characteristic. Dimensions JEDEC MS-012 mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. include C04-057 Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-057B
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
3.90 %RG\ >62,&@ /HDG 3ODVWLF 6PDOO 2XWOLQH 1DUURZ [SOIC]
1RWH
0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH Microchip
KWWS PLFURFKLS SDFNDJLQJ
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
[MSOP]
Note: most current package drawings, please Microchip Packaging Specification located Microchip
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness
MILLIMETERS 0.65 0.75 0.00 0.85 4.90 3.00 3.00 0.40 0.08 0.60 0.95 0.23 0.80 1.10 0.95 0.15
Lead Width 0.22 0.40 Notes: visual index feature vary, must located within hatched area. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-111B
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
P-300 [PDIP]
Note: most current package drawings, please Microchip Packaging Specification located Microchip
NOTE
Units Dimension Limits Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing .115 .015 .290 .240 .735 .115 .008 .045 .014 INCHES .100 .130 .310 .250 .750 .130 .010 .060 .018 .210 .195 .325 .280 .775 .150 .015 .070 .022
.430 Notes: visual index feature vary, must located with hatched area. Significant Characteristic. Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" side. Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-005B
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
3.90 [SOIC]
Note:
Microchip
most current package drawings, please Microchip Packaging Specification located
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom 0.17 0.31 0.25 0.40 1.25 0.10
MILLIMETERS 1.27 6.00 3.90 8.65 1.04 0.25 0.51 0.50 1.27 1.75 0.25
Notes: visual index feature vary, must located within hatched area. Significant Characteristic. JEDEC include Dimensions notMS-012 mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. C04-065 Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-065B
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
3.90 [SOIC]
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWS PLFURFKLS SDFNDJLQJ Microchip
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
ST-4.4 [TSSOP]
Note: most current package drawings, please Microchip Packaging Specification located Microchip
NOTE
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Footprint Foot Angle Lead Thickness
MILLIMETERS 0.65 0.80 0.05 4.30 4.90 0.45 0.09 1.00 6.40 4.40 5.00 0.60 1.00 0.20 4.50 5.10 0.75 1.20 1.05 0.15
Lead Width 0.19 0.30 Notes: visual index feature vary, must located within hatched area. JEDEC MO-153 Dimensions include mold flash protrusions. Mold flash protrusions shall exceed 0.15 side. C04-087 Dimensioning tolerancing ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, information purposes only. Microchip Technology Drawing C04-087B
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/1R/2/3/4
2003
2009
6.0V 5.5V Mindi 0.9V 0.5V ,0.2% Mindi
2001
2006
MCP6021 MCP6021R SOT-23 MSOP MCP6021 MCP6022 THD+N THD+N
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/1R/2/3/4
DS21685D_CN
2009 Microchip Technology Inc.
MCP6021/2/3/4
MCP6021 MCP6021T SOT-23 SOIC TSSOP MSOP MCP6021R MCP6021RT SOT-23 MCP6022 MCP6022T SOIC TSSOP MCP6023 MCP6023T SOIC TSSOP MCP6024 MCP6024T SOIC TSSOP -40°C +85°C -40°C +125°C MCP6021T-E/OT SOT-23 MCP6021-E/P PDIP MCP6021-E/SN SOIC MCP6021RT-E/OT SOT-23 MCP6022-I/P PDIP MCP6022-E/P PDIP MCP6022T-E/ST TSSOP
MCP6023-I/P
PDIP MCP6023-E/P PDIP MCP6023-E/SN SOIC
SOT-23 MCP6021 MCP6021R MSOP MCP6021 SOIC 150mil SOIC TSSOP MCP6021 MCP6022 MCP6023 TSSOP
MCP6024-I/SL SOIC MCP6024-E/SL SOIC MCP6024T-E/ST TSSOP
2009 Microchip Technology Inc.
DS21685D_CN
MCP6021/2/3/4
DS21685D_CN
2009 Microchip Technology Inc.
Microchip Microchip Microchip Microchip Microchip Microchip Microchip Microchip Microchip
Microchip Microchip Digital Millennium Copyright
Microchip Microchip Technology Inc. Microchip Technology Inc. Microchip Microchip Microchip Microchip Microchip
Microchip Microchip dsPIC KEELOQ KEELOQ MPLAB PICmicro PICSTART rfPIC UNI/O Microchip Technology Inc. FilterLab Hampshire HI-TECH Linear Active ThermistorMXDEVMXLABSEEVAL Embedded Control Solutions Company Microchip Technology Inc. Analog-for-the-Digital Application Maestro CodeGuard dsPICDEM dsPICDEM.net dsPICworks dsSPEAK ECAN ECONOMONITOR FanSense HI-TIDE In-Circuit Serial Programming ICSP ICEPIC Mindi MiWi MPASM MPLAB Certified MPLIB MPLINK mTouch nanoWatt Omniscient Code Generation PICC PICC-18 PICkit PICDEM PICDEM.net PICtail PIC32 REAL rfLAB Select Mode Total Endurance TSHARC WiperLock ZENA Microchip Technology Inc. SQTP Microchip Technology Inc. 2009, Microchip Technology Inc.
Microchip Chandler Tempe Gresham ISO/TS-16949:2002 PIC® dsPIC® KEELOQ® EEPROM ISO/TS16949:2002 Microchip 9001:2000
2009 Microchip Technology Inc.
DS21685D_CN
Corporate Office 2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 1-480-792-7200 Fax: 1-480-792-7277 http://support.microchip.com www.microchip.com Atlanta Duluth, Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, Tel: 1-774-760-0087 Fax: 1-774-760-0088 Chicago Itasca, Tel: 1-630-285-0071 Fax: 1-630-285-0075 Cleveland Independence, Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, Tel: 1-972-818-7423 Fax: 1-972-818-2924 Detroit Farmington Hills, Tel: 1-248-538-2250 Fax: 1-248-538-2260 Kokomo Kokomo, Tel: 1-765-864-8360 Fax: 1-765-864-8387 Angeles Mission Viejo, Tel: 1-949-462-9523 Fax: 1-949-462-9608 Santa Clara Santa Clara, Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 1-905-673-0699 Fax: 1-905-673-6509
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Australia Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 India Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4080 India Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934 Malaysia Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Thailand Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
Austria Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark-Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/26/09
DS21685D_CN
2009 Microchip Technology Inc.

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