Rail-to-Rail Input/Output Amps Quiescent Current: nA/amplifier (t
|
|
|
Top Searches for this datasheet
MCP6041/2/3/4
Rail-to-Rail Input/Output Amps
Quiescent Current: nA/amplifier (typical) Rail-to-Rail Input/Output Gain Bandwidth Product: (typical) Wide Supply Voltage Range: 1.4V 6.0V Unity Gain Stable Available Single, Dual, Quad Chip Select (CS) with MCP6043 Available 5-lead 6-lead SOT-23 Packages Temperature Ranges: Industrial: -40°C +85°C Extended: -40°C +125°C
Description
MCP6041/2/3/4 family operational amplifiers amps) from Microchip Technology Inc. operate with single supply voltage 1.4V, while drawing less than (maximum) quiescent current amplifier. These devices also designed support rail-to-rail input output operation. This combination features supports battery-powered portable applications. MCP6041/2/3/4 amplifiers have gain-bandwidth product (typical) unity gain stable. These specifications make these amps appropriate frequency applications, such battery current monitoring sensor conditioning. MCP6041/2/3/4 family operational amplifiers offered single (MCP6041), single with Chip Select (CS) (MCP6043), dual (MCP6042), quad (MCP6044) configurations. MCP6041 device available 5-lead SOT-23 package, MCP6043 device available 6-lead SOT-23 package.
Applications
Toll Booth Tags Wearable Products Temperature Measurement Battery Powered
Design Aids
SPICE Macro Models FilterLab® Software MindiCircuit Designer Simulator MAPS (Microchip Advanced Part Selector) Analog Demonstration Evaluation Boards Application Notes
Package Types
MCP6041 PDIP, SOIC, MSOP
VIN- VIN+ VOUT
MCP6043 PDIP, SOIC, MSOP
VIN- VIN+ VOUT
Related Devices
MCP6141/2/3/4: Stable Amps
MCP6041 SOT-23-5
VOUT VIN- VIN+
MCP6043 SOT-23-6
VOUT VIN+ VIN-
Typical Application
1.4V 6.0V MCP604X High Side Battery Current Sensor VOUT
MCP6042 PDIP, SOIC, MSOP
VOUTA VINA- VINA+
MCP6044 PDIP, SOIC, TSSOP
VOUTA VOUTD VIND- VIND+ VINC+ VINC- VOUTC
VOUTB VINA- VINB- VINA+ VINB+ VINB+ VINB- VOUTB
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability. Section "Rail-to-Rail Input"
Absolute Maximum Ratings
.7.0V Current Input Pins Analog Inputs (VIN+, VIN-) 1.0V 1.0V Other Inputs Outputs 0.3V 0.3V Difference Input voltage |VDD VSS| Output Short Circuit Current .continuous Current Output Supply Pins .±30 Storage Temperature.-65°C +150°C Junction Temperature. +150°C protection pins (HBM; 200V
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, +1.4V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2, (refer Figure Figure 1-3).
Parameters
Input Offset Input Offset Voltage Drift with Temperature
VOS/TA VOS/TA
VSS-0.3
1200 1013||6 1013||6
5000 VDD+0.3
Units
µV/°C µV/°C ||pF ||pF
Conditions
VSS, -40°C +85°C VSS, +85°C +125°C
Power Supply Rejection Input Bias Current Impedance Input Bias Current Industrial Temperature Extended Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode Common-Mode Input Range Common-Mode Rejection Ratio
PSRR ZDIFF VCMR CMRR CMRR CMRR
+85° +125°
-0.3V 5.3V 2.5V 5.3V -0.3V 2.5V VOUT 0.1V VDD-0.1V 0.5V input overdrive 1.4V 5.5V (Note
Open-Loop Gain Open-Loop Gain (large signal) Output Maximum Output Voltage Swing Linear Region Output Voltage Swing Output Short Circuit Current Power Supply Supply Voltage Quiescent Current Amplifier Note VOL, VOVR
parts with date codes November 2007 later have been screened ensure operation 6.0V. However, other minimum maximum specifications measured 1.4V and/or 5.5V.
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, +1.4V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2, (refer Figure Figure 1-3).
Parameters
Response Gain Bandwidth Product Slew Rate Phase Margin Noise Input Voltage Noise Input Voltage Noise Density Input Current Noise Density
GBWP
Units
V/ms µVP-P
Conditions
nV/Hz fA/Hz
MCP6043 CHIP SELECT (CS) ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, +1.4V +5.5V, GND, 25°C, VDD/2, VOUT VDD/2, VDD/2, (refer Figure Figure 1-3).
Parameters
Specifications Logic Threshold, Input Current, High Specifications Logic Threshold, High Input Current, High Input High, Current Amplifier Output Leakage, High Dynamic Specifications Amplifier Output Turn-on Time High Amplifier Output High-Z Hysteresis
Units
Conditions
ICSL
VSS+0.3
ICSH IOLEAK
VDD-0.3
tOFF VHYST
+1V/V, 0.3V VOUT 0.9VDD/2 +1V/V, VDD-0.3V VOUT 0.1VDD/2 5.0V
tOFF High-Z -0.6 (typical)
VOUT
High-Z
(typical)
(typical)
(typical)
FIGURE 1-1: Chip Select (CS) Timing Diagram (MCP6043 only).
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
TEMPERATURE CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, +1.4V +5.5V, GND.
Parameters
Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SOT-23 Thermal Resistance, 6L-SOT-23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-MSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note
+125 +125 +150
Units
°C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W
Conditions
Industrial Temperature parts Extended Temperature parts (Note
MCP6041/2/3/4 family Industrial Temperature amps operates over this extended range, with reduced performance. case, internal Junction Temperature (TJ) must exceed Absolute Maximum specification +150°C.
Test Circuits
test circuits used tests shown Figure Figure 1-3. bypass capacitors laid according rules discussed Section "Supply Bypass". VOUT VDD/2
MCP604X
FIGURE 1-2: Test Circuit Most Non-Inverting Gain Conditions.
VOUT
VDD/2
MCP604X
FIGURE 1-3: Test Circuit Most Inverting Gain Conditions.
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
Note:
TYPICAL PERFORMANCE CURVES
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Note: Unless otherwise indicated, +25°C, +1.4V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2,
Percentage Occurrences
1124 Samples 1.4V 5.5V
Percentage Occurrences
Samples Representative +85°C +125°C 1.4V
Input Offset Voltage (mV)
Input Offset Voltage Drift (µV/°C)
FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4: Input Offset Voltage Drift with +85°C +125°C 1.4V.
Samples Representative +85°C +125°C 5.5V
Percentage Occurrences
Input Offset Voltage Drift (µV/°C)
Percentage Occurrences
1124 Samples -40°C +85°C 1.4V
FIGURE 2-2: Input Offset Voltage Drift with -40°C +85°C.
2000 Input Offset Voltage (µV) 1500 1000 -500 -1000 -1500 -2000 -0.4 -0.2 Common Mode Input Voltage
+125°C +85°C +25°C -40°C 1.4V Representative Part
Input Offset Voltage Drift (µV/°C)
FIGURE 2-5: Input Offset Voltage Drift with +25°C +125°C 5.5V.
2000 Input Offset Voltage (µV) 1500 1000 -500 -1000 -1500 -2000 -0.5 Common Mode Input Voltage
+125°C +85°C +25°C -40°C 5.5V Representative Part
FIGURE 2-3: Input Offset Voltage Common Mode Input Voltage with 1.4V.
FIGURE 2-6: Input Offset Voltage Common Mode Input Voltage with 5.5V.
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
Note: Unless otherwise indicated, +25°C, +1.4V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2,
Input Offset Voltage (µV)
5.5V 1.4V
Input, Output Voltages Time ms/div)
5.0V VOUT
Output Voltage
FIGURE 2-7: Output Voltage.
1000 Input Noise Voltage Density (nV/
Input Offset Voltage
FIGURE 2-10: MCP6041/2/3/4 family shows phase reversal.
Input Noise Voltage Density (nV/ -0.5
5.0V
Frequency (Hz)
1000
Common Mode Input Voltage
FIGURE 2-8: Frequency.
CMRR, PSRR (dB)
Input Noise Voltage Density
FIGURE 2-11: Input Noise Voltage Density Common Mode Input Voltage.
PSRR, CMRR (dB)
CMRR (VDD 5.0V, -0.3V +5.3V) PSRR (VCM VSS)
Referred Input
PSRR- PSRR+ CMRR
Frequency (Hz)
1000
Ambient Temperature (°C)
FIGURE 2-9: Frequency.
CMRR, PSRR
FIGURE 2-12: Temperature.
CMRR, PSRR Ambient
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
Note: Unless otherwise indicated, +25°C, +1.4V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2,
Input Bias Offset Currents (pA)
5.5V
Input Bias Offset Currents (pA)
10000 1000
10000
5.5V
1000
+125°C
Common Mode Input Voltage
+85°C
Ambient Temperature (°C)
FIGURE 2-13: Input Bias, Offset Currents Ambient Temperature.
Open-Loop Gain (dB) Phase Gain
FIGURE 2-16: Input Bias, Offset Currents Common Mode Input Voltage.
Open-Loop Gain (dB)
-120 -150 -180
Open-Loop Phase
VOUT 0.1V 0.1V 1.4V 5.5V
-210 0.001 0.01 1.E- 1.E+ 1.E+ 1.E+ 1.E+ 100k 1.E+ 1.E+ 1.E- 1.E- Frequency (Hz)
1.E+02
1.E+03 1.E+04 Load Resistance
100k 1.E+05
FIGURE 2-14: Frequency.
Open-Loop Gain (dB)
Open-Loop Gain, Phase
FIGURE 2-17: Load Resistance.
Open-Loop Gain (dB)
Open-Loop Gain
Power Supply Voltage
5.0V VOUT 0.1V 0.1V
5.5V
0.00
1.4V
0.05 0.10 0.15 0.20 Output Voltage Headroom;
0.25
FIGURE 2-15: Open-Loop Gain Power Supply Voltage.
FIGURE 2-18: Open-Loop Gain Output Voltage Headroom.
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
Note: Unless otherwise indicated, +25°C, +1.4V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2,
Gain Bandwidth Product (kHz) Channel Channel Separation (dB)
Input Referred
1.E+02
-0.5
GBWP
5.0V
1.E+03 Frequency (Hz)
1.E+04
Common Mode Input Voltage
FIGURE 2-19: Channel-to-Channel Separation Frequency (MCP6042 MCP6044 only).
Gain Bandwidth Product (kHz) Ambient Temperature (°C)
1.4V GBWP
FIGURE 2-22: Gain Bandwidth Product, Phase Margin Common Mode Input Voltage.
Gain Bandwidth Product (kHz) Phase Margin
Ambient Temperature (°C)
5.5V GBWP
Phase Margin
FIGURE 2-20: Gain Bandwidth Product, Phase Margin Ambient Temperature with 1.4V.
Quiescent Current (µA/Amplifier) Power Supply Voltage
+125°C +85°C +25°C -40°C
FIGURE 2-23: Gain Bandwidth Product, Phase Margin Ambient Temperature with 5.5V.
Output Short Circuit Current Magnitude (mA) Power Supply Voltage
-40°C +25°C +85°C +125°C
FIGURE 2-21: Quiescent Current Power Supply Voltage.
FIGURE 2-24: Output Short Circuit Current Power Supply Voltage.
DS21669C-page
2008 Microchip Technology Inc.
Phase Margin
MCP6041/2/3/4
Note: Unless otherwise indicated, +25°C, +1.4V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2,
1000 Output Voltage Headroom; (mV) Output Voltage Headroom, (mV)
5.5V
0.01
Output Current Magnitude (mA)
Ambient Temperature (°C)
FIGURE 2-25: Output Voltage Headroom Output Current Magnitude.
FIGURE 2-28: Output Voltage Headroom Ambient Temperature.
Maximum Output Voltage Swing
5.5V High-to-Low
Slew Rate (V/ms)
5.5V
1.4V
Low-to-High 1.4V
Ambient Temperature (°C)
1.E+01
1.E+02 1.E+03 Frequency (Hz)
1.E+04
FIGURE 2-26: Temperature.
Output Voltage (5mV/div)
Slew Rate Ambient
FIGURE 2-29: Maximum Output Voltage Swing Frequency.
Voltage mV/div)
Time (100 µs/div)
Time (100 µs/div)
FIGURE 2-27: Pulse Response.
Small Signal Non-inverting
FIGURE 2-30: Response.
Small Signal Inverting Pulse
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
Note: Unless otherwise indicated, +25°C, +1.4V +6.0V, GND, VDD/2, VOUT VDD/2, VDD/2,
Output Voltage Time (15ms/div) Output Voltage Time (15ms/div)
5.0V
5.0V
FIGURE 2-31: Pulse Response.
-2.5 -5.0 -7.5 -10.0 -12.5 -15.0 -17.5 -20.0 Voltage
Large Signal Non-inverting
FIGURE 2-34: Response.
-0.5
High-to-Low VOUT Active
Large Signal Inverting Pulse
5.0V Output VOUT High-Z High-Z
Output Voltage
-0.5
Internal Switch Output
5.0V
Low-to-High
Hysteresis VOUT High-Z
Time ms/div)
Input Voltage
FIGURE 2-32: Chip Select (CS) Amplifier Output Response Time (MCP6043 only).
1.E-02 1.E-03 100µ 1.E-04 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10 1.E-11 1.E-12
FIGURE 2-35: (MCP6043 only).
Chip Select (CS) Hysteresis
Input Current Magnitude
+125°C +85°C +25°C -40°C
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 Input Voltage
FIGURE 2-33: Input Current Input Voltage (below VSS).
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
DESCRIPTIONS
Descriptions pins listed Table 3-1.
TABLE 3-1:
MCP6041 PDIP, SOIC, MSOP
FUNCTION TABLE
MCP6042 PDIP, SOIC, MSOP MCP6043 PDIP, SOIC, MSOP SOT-23-6 MCP6044 PDIP, SOIC, TSSOP Symbol Description
SOT-23-5
VOUT, VOUTA Analog Output VIN-, VINA- Inverting Input VIN+, VINA+ Non-inverting Input VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD Positive Power Supply Non-inverting Input Inverting Input Analog Output Analog Output Inverting Input Non-inverting Input Negative Power Supply Non-inverting Input Inverting Input Analog Output Chip Select Internal Connection
Analog Outputs
Power Supply Pins
output pins low-impedance voltage sources.
Analog Inputs
non-inverting inverting inputs high-impedance CMOS inputs with bias currents.
positive power supply (VDD) 1.4V 6.0V higher than negative power supply (VSS). normal operation, other pins voltages between VDD. Typically, these parts used single (positive) supply configuration. this case, connected ground connected supply. will need bypass capacitors.
Chip Select Digital Input
This CMOS, Schmitt-triggered input that places part into power mode operation.
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
APPLICATIONS INFORMATION
MCP6041/2/3/4 family amps manufactured using Microchip's state CMOS process These amps unity gain stable suitable wide range general purpose, power applications. Microchip's related MCP6141/2/3/4 family amps applications, gain higher, needing greater bandwidth. dump currents onto VDD. When implemented shown, resistors also limit current through (minimum expected (minimum expected MCP604X VOUT
4.1.1
Rail-to-Rail Input
PHASE REVERSAL
MCP6041/2/3/4 amps designed exhibit phase inversion when input pins exceed supply voltages. Figure 2-10 shows input voltage exceeding both supplies with phase inversion.
4.1.2
INPUT VOLTAGE CURRENT LIMITS
protection inputs depicted shown Figure 4-1. This structure chosen protect input transistors, minimize input bias current (IB). input diodes clamp inputs when they more than diode drop below VSS. They also clamp voltages that above VDD; their breakdown voltage high enough allow normal operation, enough bypass quick events within specified limits. Bond
FIGURE 4-2: Inputs.
Protecting Analog
also possible connect diodes left resistor this case, currents through diodes need limited some other mechanism. resistors then serve in-rush current limiters; current into input pins (VIN+ VIN-) should very small. significant amount current flow inputs (through diodes) when common mode voltage (VCM) below ground (VSS); Figure 2-33. Applications that high impedance need limit useable voltage range.
VIN+ Bond
Input Stage
Bond VIN-
4.1.3
NORMAL OPERATION
Bond
FIGURE 4-1: Structures.
Simplified Analog Input
input stage MCP6041/2/3/4 amps uses differential input stages parallel. operates common mode input voltage (VCM), while other operates high VCM. With this topology, device operates with above below VSS. input offset voltage measured 0.3V 0.3V ensure proper operation. There transitions input behavior changed. first occurs, when near 0.4V, second occurs when near 0.5V (see Figure Figure 2-6). best distortion performance with non-inverting gains, avoid these regions operation.
order prevent damage and/or improper operation these amplifiers, circuit must limit currents (and voltages) input pins (see Absolute Maximum Ratings beginning Section "Electrical Characteristics"). Figure shows recommended approach protecting these inputs. internal diodes prevent input pins (VIN+ VIN-) from going below ground, resistors limit possible current drawn input pins. Diodes prevent input pins (VIN+ VIN-) from going above VDD,
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
Rail-to-Rail Output Capacitive Loads
There specifications that describe output swing capability MCP6041/2/3/4 family amps. first specification (Maximum Output Voltage Swing) defines absolute maximum swing that achieved under specified load condition. Thus, output voltage swings within either supply rail with load VDD/2. Figure 2-10 shows output voltage limited when input goes beyond linear region operation. second specification that describes output swing capability these amplifiers Linear Output Voltage Range. This specification defines maximum output swing that achieved while amplifier still operates linear region. verify linear operation this range, large signal Open-Loop Gain (AOL) measured points inside supply rails. measurement must meet specified condition specification table. Driving large capacitive loads cause stability problems voltage feedback amps. load capacitance increases, feedback loop's phase margin decreases closed-loop bandwidth reduced. This produces gain peaking frequency response, with overshoot ringing step response. unity gain buffer most sensitive capacitive loads, although gains show same general behavior. When driving large capacitive loads with these amps (e.g., when +1), small series resistor output (RISO Figure 4-3) improves feedback loop's phase margin (stability) making output load resistive higher frequencies. bandwidth will generally lower than bandwidth with capacitive load.
Output Loads Battery Life
RISO MCP604X VOUT
MCP6041/2/3/4 family outstanding quiescent current, which supports battery-powered applications. There minimal quiescent current glitching when Chip Select (CS) raised lowered. This prevents excessive current draw, reduced battery life, when part turned Heavy resistive loads output cause excessive battery drain. Driving voltage 2.5V across load resistor will cause supply current increase depleting battery times fast (0.6 typical) alone. High frequency signals (fast edge rate) across capacitive loads will also significantly increase supply current. instance, capacitor output presents impedance 15.9 (1/2fC) sinewave. shown that average power drawn from battery Vp-p sinewave (1.77 Vrms), under these conditions,
FIGURE 4-3: Output Resistor, RISO stabilizes large capacitive loads.
Figure gives recommended RISO values different capacitive loads gains. x-axis normalized load capacitance (CL/GN), where circuit's noise gain. non-inverting gains, Signal Gain equal. inverting gains, 1+|Signal Gain| (e.g., gives V/V).
100,000 100k Recommended RISO
10,000
EQUATION 4-1:
PSupply (VDD VSS) VL(p-p) (5V)(0.6 5.0Vp-p 100Hz 0.1µF) This will drain battery times fast alone.
1,000 1.E+01
100p 1.E+02 1.E+03 1.E+04 Normalized Load Capacitance; L/GN
FIGURE 4-4: Recommended RISO Values Capacitive Loads.
After selecting RISO your circuit, double check resulting frequency response peaking step response overshoot. Modify RISO's value until response reasonable. Bench evaluation simulations with MCP6041/2/3/4 SPICE macro model helpful.
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
MCP6043 Chip Select Surface Leakage
MCP6043 single with Chip Select (CS). When pulled high, supply current drops (typical) flows through VSS. When this happens, amplifier output into high impedance state. pulling low, amplifier enabled. left floating, amplifier operate properly. Figure shows output voltage supply current response pulse. applications where input bias current critical, printed circuit board (PCB) surface leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current flow, which greater than MCP6041/2/3/4 family's bias current +25°C typical). easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. Figure shows example this type layout. Guard Ring VIN- VIN+
Supply Bypass
With this family operational amplifiers, power supply (VDD single supply) should have local bypass capacitor (i.e., 0.01 within good high frequency performance. bulk capacitor (i.e., larger) within provide large, slow currents. This bulk capacitor required most applications shared with nearby analog parts.
Unused Amps
FIGURE 4-6: Inverting Gain.
unused quad package (MCP6044) should configured shown Figure 4-5. These circuits prevent output from toggling causing crosstalk. Circuits sets minimum noise gain. resistor divider produces desired reference voltage within output voltage range amp; buffers that reference voltage. Circuit uses minimum number components operates comparator, draw more current. MCP6044 VREF MCP6044
Example Guard Ring Layout
Non-inverting Gain Unity Gain Buffer: Connect non-inverting (VIN+) input with wire that does touch surface. Connect guard ring inverting input (VIN-). This biases guard ring common mode input voltage. Inverting Gain Transimpedance Gain (convert current voltage, such photo detectors) amplifiers: Connect guard ring non-inverting input (VIN+). This biases guard ring same reference voltage (e.g., VDD/2 ground). Connect inverting (VIN-) input with wire that does touch surface.
FIGURE 4-5:
Unused Amps.
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
4.9.1
Application Circuits
BATTERY CURRENT SENSING
4.9.2
INSTRUMENTATION AMPLIFIER
MCP6041/2/3/4 amps' Common Mode Input Range, which goes 0.3V beyond both supply rails, supports their high side side battery current sensing applications. very quiescent current (0.6 typical) help prolong battery life, rail-to-rail output supports detection currents. Figure shows high side battery current sensor circuit. resistor sized minimize power losses. battery current (IDD) through resistor causes terminal more negative than bottom terminal. This keeps common mode input voltage below VDD, which within allowed range. output will also below VDD, which within Maximum Output Voltage Swing specification.
MCP6041/2/3/4 well suited conditioning sensor signals battery-powered applications. Figure shows instrumentation amplifier, using MCP6042, that works well applications requiring rejection common mode noise higher gains. reference voltage (VREF) supplied impedance source. single supply applications, VREF typically VDD/2.
VREF VOUT
MCP6042 MCP6042
1.4V 6.0V MCP604X
VOUT
FIGURE 4-8: Instrumentation Amplifier.
FIGURE 4-7: Sensor.
High Side Battery Current
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
DESIGN AIDS
Microchip provides basic design tools needed MCP6041/2/3/4 family amps.
Analog Demonstration Evaluation Boards
SPICE Macro Model
latest SPICE macro model MCP6041/2/3/4 amps available Microchip site www.microchip.com. This model intended initial design tool that works well amp's linear region operation over temperature range. model file information capabilities. Bench testing very important part design cannot replaced with simulations. Also, simulation results using this macro model need validated comparing them data sheet specifications characteristic curves.
Microchip offers broad spectrum Analog Demonstration Evaluation Boards that designed help achieve faster time market. complete listing these boards their corresponding user's guides technical information, visit Microchip site www.microchip.com/ analogtools. boards that especially useful are: SOIC8EV: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board SOIC14EV: 14-Pin SOIC/TSSOP/DIP Evaluation Board
Application Notes
FilterLab® Software
Microchip's FilterLab® software innovative software tool that simplifies analog active filter (using amps) design. Available cost from Microchip site www.microchip.com/filterlab, FilterLab design tool provides full schematic diagrams filter circuit with component values. also outputs filter circuit SPICE format, which used with macro model simulate actual filter performance.
following Microchip Application Notes available Microchip site www.microchip. com/ appnotes recommended supplemental reference resources. ADN003: "Select Right Operational Amplifier your Filtering Circuits", DS21821 AN722: "Operational Amplifier Topologies Specifications", DS00722 AN723: "Operational Amplifier Specifications Applications", DS00723 AN884: "Driving Capacitive Loads With Amps", DS00884 AN990: "Analog Sensor Conditioning Circuits Overview", DS00990 These application notes others listed design guide: "Signal Chain Design Guide", DS21825
MindiCircuit Designer Simulator
Microchip's MindiCircuit Designer Simulator aids design various circuits useful active filter, amplifier power-management applications. free online circuit designer simulator available from Microchip site www.microchip.com/mindi. This interactive circuit designer simulator enables designers quickly generate circuit diagrams, simulate circuits. Circuits developed using Mindi Circuit Designer Simulator downloaded personal computer workstation.
MAPS (Microchip Advanced Part Selector)
MAPS software tool that helps semiconductor professionals efficiently identify Microchip devices that particular design requirement. Available cost from Microchip website www.microchip.com/ maps, MAPS overall selection tool Microchip's product portfolio that includes Analog, Memory, MCUs DSCs. Using this tool define filter sort features parametric search devices export side-by-side technical comparasion reports. Helpful links also provided Datasheets, Purchase, Sampling Microchip parts.
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
PACKAGING INFORMATION
Package Marking Information
5-Lead SOT-23 (MCP6041)
I-Temp Code
SPNN
Example:
Device
XXNN
E-Temp Code
SBNN
MCP6041/T-E/OT
SB25
6-Lead SOT-23 (MCP6043)
I-Temp Code
SCNN
Example:
E-Temp Code
SDNN
Device
XXNN
8-Lead MSOP XXXXXX YWWNNN
MCP6043T-E/CH
SC25
Example: 6043I 722256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Example: MCP6041 I/P256 0722 MCP6041 e3256 0722
8-Lead SOIC (150 mil)
Example: MCP6042 I/SN0722 MCP6042I 0722
XXXXXXXX XXXXYYWW
Legend: XX.X Note:
Customer-specific information Year code (last digit calendar year) Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code Pb-free JEDEC designator Matte (Sn) This package Pb-free. Pb-free JEDEC designator found outer packaging this package.
event full Microchip part number cannot marked line, will carried over next line, thus limiting number available characters customer-specific information.
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP6044) Example:
XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
MCP6044-I/P 0722256
MCP6044 0722256
14-Lead SOIC (150 mil) (MCP6044)
Example:
XXXXXXXXXX XXXXXXXXXX YYWWNNN
MCP6044ISL 0722256
MCP6044 E/SL^^ 0722256
14-Lead TSSOP (MCP6044)
Example:
XXXXXXXX YYWW
6044ST 0722
6044EST 0722
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
/HDG 3ODVWLF 6PDOO 2XWOLQH 7UDQVLVWRU >627@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV /HDG 3LWFK 2XWVLGH /HDG 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV 0,//,0(7(56
/HDG :LGWK 1RWHV 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
/HDG 3ODVWLF 6PDOO 2XWOLQH 7UDQVLVWRU >627@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
LASER MARK
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 2XWVLGH /HDG 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV 0,//,0(7(56
/HDG :LGWK 1RWHV 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
/HDG 3ODVWLF 0LFUR 6PDOO 2XWOLQH 3DFNDJH >0623@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
NOTE
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV
0,//,0(7(56
/HDG :LGWK 1RWHV YLVXDO LQGH[ IHDWXUH YDU\ PXVW ORFDWHG ZLWKLQ KDWFKHG DUHD 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 5HIHUHQFH 'LPHQVLRQ XVXDOO\ ZLWKRXW WROHUDQFH LQIRUPDWLRQ SXUSRVHV RQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
/HDG 3ODVWLF 'XDO ,Q/LQH %RG\ >3',3@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
NOTE
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 6HDWLQJ 3ODQH 0ROGHG 3DFNDJH 7KLFNQHVV %DVH 6HDWLQJ 3ODQH 6KRXOGHU 6KRXOGHU :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK 6HDWLQJ 3ODQH /HDG 7KLFNQHVV 8SSHU /HDG :LGWK /RZHU /HDG :LGWK 2YHUDOO 6SDFLQJ
,1&+(6
1RWHV YLVXDO LQGH[ IHDWXUH YDU\ PXVW ORFDWHG ZLWK KDWFKHG DUHD 6LJQLILFDQW &KDUDFWHULVWLF 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
/HDG 3ODVWLF 'XDO ,Q/LQH %RG\ >3',3@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
NOTE
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 6HDWLQJ 3ODQH 0ROGHG 3DFNDJH 7KLFNQHVV %DVH 6HDWLQJ 3ODQH 6KRXOGHU 6KRXOGHU :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK 6HDWLQJ 3ODQH /HDG 7KLFNQHVV 8SSHU /HDG :LGWK /RZHU /HDG :LGWK 2YHUDOO 6SDFLQJ ,1&+(6
1RWHV YLVXDO LQGH[ IHDWXUH YDU\ PXVW ORFDWHG ZLWK KDWFKHG DUHD 6LJQLILFDQW &KDUDFWHULVWLF 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
/HDG 3ODVWLF 6PDOO 2XWOLQH 1DUURZ %RG\ >62,&@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
NOTE
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK &KDPIHU RSWLRQDO )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV /HDG :LGWK 0ROG 'UDIW $QJOH 0ROG 'UDIW $QJOH %RWWRP
0,//,0(7(56
1RWHV YLVXDO LQGH[ IHDWXUH YDU\ PXVW ORFDWHG ZLWKLQ KDWFKHG DUHD 6LJQLILFDQW &KDUDFWHULVWLF 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 5HIHUHQFH 'LPHQVLRQ XVXDOO\ ZLWKRXW WROHUDQFH LQIRUPDWLRQ SXUSRVHV RQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
/HDG 3ODVWLF 6PDOO 2XWOLQH 1DUURZ %RG\ >62,&@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
/HDG 3ODVWLF 6PDOO 2XWOLQH 1DUURZ %RG\ >62,&@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
NOTE
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK &KDPIHU RSWLRQDO )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV /HDG :LGWK 0ROG 'UDIW $QJOH 0ROG 'UDIW $QJOH %RWWRP
0,//,0(7(56
1RWHV YLVXDO LQGH[ IHDWXUH YDU\ PXVW ORFDWHG ZLWKLQ KDWFKHG DUHD 6LJQLILFDQW &KDUDFWHULVWLF 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 5HIHUHQFH 'LPHQVLRQ XVXDOO\ ZLWKRXW WROHUDQFH LQIRUPDWLRQ SXUSRVHV RQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
/HDG 3ODVWLF 7KLQ 6KULQN 6PDOO 2XWOLQH %RG\ >76623@
1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ
NOTE
8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 0ROGHG 3DFNDJH /HQJWK )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV
0,//,0(7(56
/HDG :LGWK 1RWHV YLVXDO LQGH[ IHDWXUH YDU\ PXVW ORFDWHG ZLWKLQ KDWFKHG DUHD 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 5HIHUHQFH 'LPHQVLRQ XVXDOO\ ZLWKRXW WROHUDQFH LQIRUPDWLRQ SXUSRVHV RQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
NOTES:
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
APPENDIX REVISION HISTORY
Revision (February 2008)
following list modifications: Updated Figure Figure 2-5. Updated trademark Sales listing pages. Expanded this family: Added SOT-23-6 package MCP6043 with Chip Select. Added Extended Temperature (-40°C +125°C) parts. Expanded Analog Input Absolute Voltage Range (applies retroactively). Expanded operating maximum 6.0V. Section "Electrical Characteristics" updated. Section "Typical Performance Curves" updated. Section "Pin Descriptions" added. Section "Applications Information". Added Section "Unused Amps". Updated input stage explanation. Section "Design Aids" updated. Section "Packaging Information". Added SOT-23-6 package. Corrected package marking information. Appendix "Revision History" added.
Revision (June 2002)
following list modifications. Undocumented changes.
Revision (August 2001)
Original data sheet release.
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
NOTES:
DS21669C-page
2008 Microchip Technology Inc.
MCP6041/2/3/4
PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device Temperature Range Package Examples:
MCP6041-I/P: Industrial Temp., PDIP package. MCP6041T-E/OT: Tape Reel, Extended Temp., SOT-23 package.
MCP6041: Single MCP6041T Single (Tape Reel SOT-23, SOIC, MSOP) MCP6042 Dual MCP6042T Dual (Tape Reel SOIC MSOP) MCP6043 Single Chip Select MCP6043T Single Chip Select (Tape Reel SOT-23, SOIC, MSOP) MCP6044 Quad MCP6044T Quad (Tape Reel SOIC TSSOP)
MCP6042-I/SN:
Industrial Temp., SOIC package. MCP6042T-E/MS: Tape Reel, Extended Temp., SOT-23 package.
MCP6043-I/P:
Industrial Temp., PDIP package. MCP6043T-E/CH: Tape Reel, Extended Temp., SOT-23 package. Industrial Temp., 14LD PDIP package. MCP6044T-E/ST: Tape Reel, Extended Temp., 14LD TSSOP package.
Temperature Range -40°C +85°C -40°C +125°C
MCP6044-I/SL:
Package
Plastic Small Outline Transistor (SOT-23), 6-lead (Tape Reel MCP6043 only) Plastic Micro Small Outline (MSOP), 8-lead Plastic Small Outline Transistor (SOT-23), 5-lead (Tape Reel MCP6041 only) Plastic (300 Body), 8-lead, 14-lead Plastic SOIC (150 Body), 14-lead Plastic SOIC (150 Body), 8-lead Plastic TSSOP (4.4 Body), 14-lead
2008 Microchip Technology Inc.
DS21669C-page
MCP6041/2/3/4
NOTES:
DS21669C-page
2008 Microchip Technology Inc.
Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip devices life support and/or safety applications entirely buyer's risk, buyer agrees defend, indemnify hold harmless Microchip from damages, claims, suits, expenses resulting from such use. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights.
Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, MATE, rfPIC SmartShunt registered trademarks Microchip Technology Incorporated U.S.A. other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, UNI/O, WiperLock ZENA trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2008, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper.
Microchip received ISO/TS-16949:2002 certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona; Gresham, Oregon design centers California India. Company's quality system processes procedures PIC® MCUs dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified.
2008 Microchip Technology Inc.
DS21669C-page
WORLDWIDE SALES SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Address: www.microchip.com Atlanta Duluth, Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, Tel: 765-864-8360 Fax: 765-864-8387 Angeles Mission Viejo, Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 China Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049
ASIA/PACIFIC
India Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934 Malaysia Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Hsin Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
01/02/08
DS21669C-page
2008 Microchip Technology Inc.
Other recent searches
SN74ALVTH16260 - SN74ALVTH16260 SN74ALVTH16260 Datasheet
SN54ALVTH16260 - SN54ALVTH16260 SN54ALVTH16260 Datasheet
SCT601 - SCT601 SCT601 Datasheet
MC2007S8 - MC2007S8 MC2007S8 Datasheet
LM5030 - LM5030 LM5030 Datasheet
LDTD143EWT1G - LDTD143EWT1G LDTD143EWT1G Datasheet
IRFP250 - IRFP250 IRFP250 Datasheet
CXA2547Q - CXA2547Q CXA2547Q Datasheet
BFR93AF - BFR93AF BFR93AF Datasheet
APM9986CO - APM9986CO APM9986CO Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
