Non-Unity Gain Rail-to-Rail Input/Output Amps Quiescent Current:
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MCP6141/2/3/4
Non-Unity Gain Rail-to-Rail Input/Output Amps
Quiescent Current: nA/amplifier (typical) Gain Bandwidth Product: (typical) Stable gains higher Rail-to-Rail Input/Output Wide Supply Voltage Range: 1.4V 6.0V Available Single, Dual, Quad Chip Select (CS) with MCP6143 Available 5-lead 6-lead SOT-23 Packages Temperature Ranges: Industrial: -40°C +85°C Extended: -40°C +125°C
Description:
MCP6141/2/3/4 family non-unity gain stable operational amplifiers amps) from Microchip Technology Inc. operate with single supply voltage 1.4V, while drawing less than (maximum) quiescent current amplifier. These devices also designed support rail-to-rail input output operation. This combination features supports battery-powered portable applications. MCP6141/2/3/4 amplifiers have gain bandwidth product (typical) stable gains higher. These specifications make these amps appropriate battery powered applications where higher frequency response from amplifier required. MCP6141/2/3/4 family operational amplifiers offered single (MCP6141), single with Chip Select (CS) (MCP6143), dual (MCP6142) quad (MCP6144) configurations. MCP6141 device available 5-lead SOT-23 package, MCP6143 device available 6-lead SOT-23 package.
Applications:
Toll Booth Tags Wearable Products Temperature Measurement Battery Powered
Design Aids:
SPICE Macro Models FilterLab® Software MindiSimulation Tool Microchip Advanced Part Selector (MAPS) Analog Demonstration Evaluation Boards Application Notes
Package Types
MCP6141 PDIP, SOIC, MSOP
VIN- VIN+ VOUT
MCP6143 PDIP, SOIC, MSOP
VIN- VIN+ VOUT
Related Devices:
MCP6041/2/3/4: Unity Gain Stable Amps
MCP6141 SOT-23-5
VOUT VIN+ VIN-
MCP6143 SOT-23-6
VOUT VIN+ VIN-
Typical Application
MCP614X VREF Inverting, Summing Amplifier VOUT
MCP6142 PDIP, SOIC, MSOP
VOUTA VINA- VINA+
MCP6144 PDIP, SOIC, TSSOP
VOUTA VOUTD VIND- VIND+ VINC+ VINC- VOUTC
VOUTB VINA- VINB- VINA+ VINB+ VINB+ VINB- VOUTB
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ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability. Section 4.1.2 "Input Voltage Current Limits".
Absolute Maximum Ratings
.7.0V Current Analog Input Pins Analog Inputs (VIN+, VIN-) 1.0V 1.0V Other Inputs Outputs 0.3V 0.3V Difference Input Voltage |VDD VSS| Output Short Circuit Current Continuous Current Output Supply Pins .±30 Storage Temperature -65°C +150°C Maximum Junction Temperature (TJ). .+150°C Protection Pins (HBM; 400V
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, +1.4V +5.5V, GND, +25°C, VDD/2, VOUT VDD/2, VDD/2, tied (refer Figure Figure 1-3).
Parameters
Input Offset Input Offset Voltage Drift with Temperature
VOS/TA VOS/TA
VSS-0.3
±1.8 1200 1013||6
5000 VDD+0.3
Units
µV/°C µV/°C ||pF ||pF
Conditions
VSS, -40°C +85°C VSS, +85°C +125°C
Power Supply Rejection Input Bias Current Impedance Input Bias Current Industrial Temperature Extended Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode Common-Mode Input Range Common-Mode Rejection Ratio
PSRR ZDIFF VCMR CMRR CMRR CMRR
+85° +125°
-0.3V 5.3V 2.5V 5.3V -0.3V 2.5V VOUT 0.1V VDD-0.1V 0.5V input overdrive 1.4V 5.5V Note
Open-Loop Gain Open-Loop Gain (large signal) Output Maximum Output Voltage Swing Linear Region Output Voltage Swing Output Short Circuit Current Power Supply Supply Voltage Quiescent Current Amplifier VOL, VOVR
Note
parts with date codes February 2008 later have been screened ensure operation 6.0V. However, other minimum maximum specifications measured 1.8V 5.5V
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ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, +1.4V +5.5V, GND, +25°C, VDD/2, VOUT VDD/2, VDD/2, tied (refer Figure Figure 1-3).
Parameters
Response Gain Bandwidth Product Slew Rate Phase Margin Noise Input Voltage Noise Input Voltage Noise Density Input Current Noise Density
GBWP
Units
V/ms µVP-P
Conditions
nV/Hz fA/Hz
MCP6143 CHIP SELECT (CS) ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, +1.4V +5.5V, GND, +25°C, VDD/2, VOUT VDD/2, VDD/2, (refer Figure Figure 1-3).
Parameters
Specifications Logic Threshold, Input Current, High Specifications Logic Threshold, High Input Current, High Input High, Current Amplifier Output Leakage, High Dynamic Specifications Amplifier Output Turn-on Time High Amplifier Output High-Z Hysteresis
Units
Conditions
ICSL ICSH IOLEAK tOFF VHYST
VSS+0.3
VDD-0.3
V/V, 0.3V VOUT 0.9VDD/2 V/V, VDD-0.3V VOUT 0.1VDD/2 5.0V
tOFF High-Z -0.6 (typical)
VOUT High-Z (typical) (typical)
(typical) (typical)
FIGURE 1-1: Chip Select (CS) Timing Diagram (MCP6143 only).
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TEMPERATURE CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, +1.4V +5.5V, GND. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SOT-23 Thermal Resistance, 6L-SOT-23 Thermal Resistance, 8L-MSOP Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W +125 +125 +150 Industrial Temperature parts Extended Temperature parts (Note Sym. Min. Typ. Max. Units Conditions
MCP6141/2/3/4 family Industrial Temperature amps operates over this extended range, with reduced performance. case, internal Junction Temperature (TJ) must exceed Absolute Maximum specification +150°C.
Test Circuits
test circuits used tests shown Figure Figure 1-2. bypass capacitors laid according rules discussed Section "Supply Bypass". VOUT VDD/2
MCP614X
FIGURE 1-2: Test Circuit Most Non-Inverting Gain Conditions.
VOUT
VDD/2
MCP614X
FIGURE 1-3: Test Circuit Most Inverting Gain Conditions.
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Note:
TYPICAL PERFORMANCE CURVES
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Note: Unless otherwise indicated, +25°C, +1.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
Percentage Occurrences
Input Offset Voltage (mV)
Percentage Occurrences
2396 Samples
Samples Representative 1.4V +85°C +125°C
Input Offset Voltage Drift (µV/°C)
FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4: Input Offset Voltage Drift with +85°C +125°C 1.4V.
Percentage Occurrences
Samples Representative 5.5V +85°C +125°C
Percentage Occurrences
2267 Samples -40°C +85°C
Input Offset Voltage Drift (µV/°C)
Input Offset Voltage Drift (µV/°C)
FIGURE 2-2: Input Offset Voltage Drift with -40°C +85°C.
1000 -200 -400 -600 -800 -1000
FIGURE 2-5: Input Offset Voltage Drift with +85°C +125°C 5.5V.
1000 -200 -400 -600 -800 -1000
Input Offset Voltage (µV)
1.4V +125°C +85°C
Input Offset Voltage (µV)
5.5V +125°C +85°C
+25°C -40°C
+25°C -40°C
-0.4
-0.2
-0.5
Common Mode Input Voltage
Common Mode Input Voltage
FIGURE 2-3: Input Offset Voltage Common Mode Input Voltage with 1.4V.
FIGURE 2-6: Input Offset Voltage Common Mode Input Voltage with 5.5V.
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Note: Unless otherwise indicated, +25°C, +1.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
Input Offset Voltage (µV) Output Voltage
1.4V
Input, Output Voltages
5.0V
5.5V
VOUT
Time ms/div)
FIGURE 2-7: Output Voltage.
1,000 Input Noise Voltage Density (nV/Hz)
Input Offset Voltage
FIGURE 2-10: MCP6141/2/3/4 Family Shows Phase Reversal.
-0.5 Common Mode Input Voltage
Input Noise Voltage Density (nV/Hz)
5.0V
Frequency (Hz) 1000
FIGURE 2-8: Frequency.
CMRR, PSRR (dB)
Referred Input
Input Noise Voltage Density
FIGURE 2-11: Input Noise Voltage Density Common Mode Input Voltage.
PSRR, CMRR (dB)
CMRR (VDD 5.0V, -0.3V +5.3V) PSRR (VCM VSS)
PSRR- PSRR+ CMRR
1,000 Frequency (Hz)
10,000
Ambient Temperature (°C)
FIGURE 2-9: Frequency.
CMRR, PSRR
FIGURE 2-12: Temperature.
CMRR, PSRR Ambient
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Note: Unless otherwise indicated, +25°C, +1.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
Input Bias Offset Currents (pA) 10000 1000 Ambient Temperature (°C)
Input Bias, Offset Currents (pA)
5.5V
10000 1000
+125°C
5.5V
+85°C
Common Mode Input Voltage
FIGURE 2-13: Input Bias, Offset Currents Ambient Temperature.
Open-Loop Gain (dB)
Gain Phase
FIGURE 2-16: Input Bias, Offset Currents Common Mode Input Voltage.
Open-Loop Gain (dB)
-120 -150 -180 -210 Open-Loop Phase
1.E+02
VOUT 0.1V 0.1V 1.4V 5.5V
-240 0.01 1.E- 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 100k 1.E+ 1.E- Frequency (Hz)03
1.E+03 1.E+04 Load Resistance
100k 1.E+05
FIGURE 2-14: Frequency.
Open-Loop Gain, Phase
FIGURE 2-17: Load Resistance.
Open-Loop Gain (dB) 0.00
Open-Loop Gain
Open-Loop Gain (dB)
5.5V
Power Supply Voltage
VOUT 0.1V 0.1V
1.4V
0.05 0.10 0.15 0.20 Output Voltage Headroom;
0.25
FIGURE 2-15: Open-Loop Gain Power Supply Voltage.
FIGURE 2-18: Open-Loop Gain Output Voltage Headroom.
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Note: Unless otherwise indicated, +25°C, +1.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
Channel-to-Channel Separation (dB)
Input Referred
1.E+03
-0.5
+10)
5.0V
Frequency (Hz)
1.E+04
Common Mode Input Voltage
FIGURE 2-19: Channel Channel Separation Frequency (MCP6142 MCP6144 only).
Gain Bandwidth Product (kHz) Ambient Temperature (°C)
1.4V GBWP
FIGURE 2-22: Gain Bandwidth Product, Phase Margin Common Mode Input Voltage.
Gain Bandwidth Product (kHz)
+10)
Phase Margin
Ambient Temperature (°C)
5.5V +10) GBWP
Phase Margin
FIGURE 2-20: Gain Bandwidth Product, Phase Margin Ambient Temperature with 1.4V.
Quiescent Current (µA/Amplifier) Power Supply Voltage
+125°C +85°C +25°C -40°C
FIGURE 2-23: Gain Bandwidth Product, Phase Margin Ambient Temperature with 5.5V.
Output Short Circuit Current Magnitude (mA) Ambient Temperature (°C)
-40°C +25°C +85°C +125°C
FIGURE 2-21: Quiescent Current Power Supply Voltage.
FIGURE 2-24: Output Short Circuit Current Power Supply Voltage.
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Phase Margin
GBWP
Gain Bandwidth Product (kHz)
MCP6141/2/3/4
Note: Unless otherwise indicated, +25°C, +1.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
1000 Output Voltage Headroom; (mV)
0.01
Output Voltage Headroom, (mV)
5.5V
Output Current Magnitude (mA)
Ambient Temperature (°C)
FIGURE 2-25: Output Voltage Headroom Output Current Magnitude.
Slew Rate (V/ms) Ambient Temperature (°C)
1.4V Low-to-High 5.5V High-to-Low
FIGURE 2-28: Output Voltage Headroom Ambient Temperature.
Maximum Output Voltage Swing (VP-P)
5.5V
1.4V
1.E+02
1.E+03 Frequency (Hz)
1.E+04
FIGURE 2-26: Temperature.
Output Voltage mV/div)
Slew Rate Ambient
FIGURE 2-29: Maximum Output Voltage Swing Frequency.
Voltage mV/div)
Time (100 µs/div)
Time (100 µs/div)
FIGURE 2-27: Pulse Response.
Small Signal Non-inverting
FIGURE 2-30: Response.
Small Signal Inverting Pulse
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Note: Unless otherwise indicated, +25°C, +1.4V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low.
Output Voltage Time (200 µs/div) Output Voltage Time (200 µs/div)
5.0V
5.0V
FIGURE 2-31: Pulse Response.
25.0 22.5 20.0 17.5 15.0 12.5 Voltage 10.0
Large Signal Non-inverting
FIGURE 2-34: Response.
Large Signal Inverting Pulse
Output Voltage
Internal Switch Output
5.0V +3.0V
VOUT Hysteresis High-to-Low Low-to-High VOUT High-Z 5.0V 3.0V
High-Z
VOUT
Time ms/div)7
Voltage
FIGURE 2-32: Chip Select (CS) Amplifier Output Response Time (MCP6143 only).
1.E-02 1.E-03 100µ 1.E-04 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10
FIGURE 2-35: Internal Chip Select (CS) Hysteresis (MCP6143 only).
Input Current Magnitude
1.E-11 1.E-12 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 Input Voltage
+125°C +85°C +25°C -40°C
FIGURE 2-33: Input Current Input Voltage (Below VSS).
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DESCRIPTIONS
Descriptions pins listed Table 3-1.
TABLE 3-1:
MCP6141 MSOP, PDIP, SOIC
FUNCTION TABLE
MCP6142 MSOP, PDIP, SOIC
MCP6143 MSOP, PDIP, SOIC
MCP6144 MSOP, PDIP, SOIC
SOT-23-5
SOT-23-6
Symbol
Description
VOUT, VOUTA VIN-, VINA- VIN+, VINA+ VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD
Analog Output Inverting Input Non-inverting Input Positive Power Supply Non-inverting Input Inverting Input Analog Output Analog Output Inverting Input Non-inverting Input Negative Power Supply Non-inverting Input Inverting Input Analog Output Chip Select Internal Connection
Analog Outputs
Power Supply Pins
output pins low-impedance voltage sources.
Analog Inputs
non-inverting inverting inputs high-impedance CMOS inputs with bias currents.
positive power supply (VDD) 1.4V 6.0V higher than negative power supply (VSS). normal operation, other pins voltages between VDD. Typically, these parts used single (positive) supply configuration. this case, connected ground connected supply. will need bypass capacitors.
Digital Input
This CMOS, Schmitt-triggered input that places part into power mode operation.
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APPLICATIONS INFORMATION
MCP6141/2/3/4 family amps manufactured using Microchip's state CMOS process These amps stable gains higher. They suitable wide range general purpose, power applications. Microchip's related MCP6041/2/3/4 family amps applications needing unity gain stability. dump currents onto VDD. When implemented shown, resistors also limit current through (minimum expected (minimum expected MCP604X VOUT
4.1.1
Rail-to-Rail Input
PHASE REVERSAL
MCP6141/2/3/4 amps designed exhibit phase inversion when input pins exceed supply voltages. Figure 2-10 shows input voltage exceeding both supplies with phase inversion.
4.1.2
INPUT VOLTAGE CURRENT LIMITS
protection inputs depicted shown Figure 4-1. This structure chosen protect input transistors, minimize input bias current (IB). input diodes clamp inputs when they more than diode drop below VSS. They also clamp voltages that above VDD; their breakdown voltage high enough allow normal operation, enough bypass quick events within specified limits. Bond
FIGURE 4-2: Inputs.
Protecting Analog
also possible connect diodes left resistor this case, currents through diodes need limited some other mechanism. resistors then serve in-rush current limiters; current into input pins (VIN+ VIN-) should very small. significant amount current flow inputs (through diodes) when common mode voltage (VCM) below ground (VSS); Figure 2-33. Applications that high impedance need limit usable voltage range.
4.1.3
VIN+ Bond Input Stage Bond
NORMAL OPERATION
Bond
input stage MCP6141/2/3/4 amps uses differential input stages parallel. operates common mode input voltage (VCM), while other operates high VCM. With this topology, device operates with above below VSS. input offset voltage measured 0.3V 0.3V ensure proper operation. There transitions input behavior changed. first occurs, when near 0.4V, second occurs when near 0.5V (see Figure Figure 2-6). best distortion performance with non-inverting gains, avoid these regions operation.
FIGURE 4-1: Structures.
Simplified Analog Input
order prevent damage and/or improper operation these amplifiers, circuit must limit currents (and voltages) input pins (see Absolute Maximum Ratings beginning Section "Electrical Characteristics"). Figure shows recommended approach protecting these inputs. internal diodes prevent input pins (VIN+ VIN-) from going below ground, resistors limit possible current drawn input pins. Diodes prevent input pins (VIN+ VIN-) from going above VDD,
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Rail-to-Rail Output
4.4.1
Stability
NOISE GAIN
There specifications that describe output swing capability MCP6141/2/3/4 family amps. first specification (Maximum Output Voltage Swing) defines absolute maximum swing that achieved under specified load condition. Thus, output voltage swings within either supply rail with load VDD/2. Figure 2-10 shows output voltage limited when input goes beyond linear region operation. second specification that describes output swing capability these amplifiers Linear Output Voltage Range. This specification defines maximum output swing that achieved while amplifier still operates linear region. verify linear operation this range, large signal Open-Loop Gain (AOL) measured points inside supply rails. measurement must meet specified condition specification table.
MCP6141/2/3/4 family designed give high bandwidth slew rate circuits with high noise gain (GN) signal gain. gain applications should realized using MCP6041/2/3/4 family; this simplifies design implementation issues. Noise gain defined gain from voltage source non-inverting input output when other voltage sources zeroed (shorted out). Noise gain independent signal gain depends only components feedback loop. amplifier circuits Figure Figure have their noise gain calculated follows:
EQUATION 4-2:
order amplifiers stable, noise gain should meet specified minimum noise gain. Note that noise gain corresponds non-inverting signal gain V/V, inverting signal gain V/V. MCP614X VOUT
Output Loads Battery Life
MCP6141/2/3/4 family outstanding quiescent current, which supports battery-powered applications. There minimal quiescent current glitching when Chip Select (CS) raised lowered. This prevents excessive current draw, reduced battery life, when part turned Heavy resistive loads output cause excessive battery drain. Driving voltage 2.5V across load resistor will cause supply current increase depleting battery times fast (0.6 typical) alone. High frequency signals (fast edge rate) across capacitive loads will also significantly increase supply current. instance, capacitor output presents impedance 15.9 (1/2fC) sinewave. shown that average power drawn from battery VP-P sinewave (1.77 Vrms), under these conditions,
FIGURE 4-3: Noise Gain Non-inverting Gain Configuration.
MCP614X VOUT
EQUATION 4-1:
PSupply (VDD VSS) VL(p-p) (5V)(0.6 5.0Vp-p 100Hz 0.1µF) This will drain battery times fast alone.
FIGURE 4-4: Noise Gain Inverting Gain Configuration.
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Figure shows three example circuits that unstable when used with MCP6141/2/3/4 family. unity gain buffer gain amplifier (non-inverting inverting) gains that stability (see Equation 4-2).The Miller integrator's capacitor makes reach unity gain high frequencies, causing instability. Note: three circuits shown Figure used with MCP6141/2/3/4 amps. They included illustrative purposes only. When driving large capacitive loads with these amps (e.g., when +10), small series resistor output (RISO Figure 4-6) improves feedback loop's phase margin (stability) making output load resistive higher frequencies. bandwidth will generally lower than bandwidth with capacitive load. MCP614X Unity Gain Buffer RISO VOUT
MCP614X Gain Amplifier MCP614X
VOUT
FIGURE 4-6: Output Resistor, RISO stabilizes large capacitive loads.
Figure gives recommended RISO values different capacitive loads gains. x-axis normalized load capacitance (CL/GN), where circuit's noise gain. non-inverting gains, Signal Gain equal. inverting gains, |Signal Gain| (e.g., gives V/V).
100,000 100k Recommended
VOUT
10,000
Miller Integrator MCP614X VOUT
1,000 100p 1.E+00 1.E+01 1.E+02 1.E+03 Normalized Load Capacitance; CL/GN
FIGURE 4-7: Recommended RISO Values Capacitive Loads. FIGURE 4-5: Examples Unstable Circuits MCP6141/2/3/4 Family. 4.4.2 CAPACITIVE LOADS
After selecting RISO your circuit, double check resulting frequency response peaking step response overshoot. Modify RISO's value until response reasonable. Bench evaluation simulations with MCP6141/2/3/4 SPICE macro model helpful.
Driving large capacitive loads cause stability problems voltage feedback amps. load capacitance increases, feedback loop's phase margin decreases closed-loop bandwidth reduced. This produces gain peaking frequency response, with overshoot ringing step response. unity gain buffer most sensitive capacitive loads, though gains show same general behavior.
MCP6143 Chip Select
MCP6143 single with Chip Select (CS). When pulled high, supply current drops (typical) flows through VSS. When this happens, amplifier output into high impedance state. pulling low, amplifier enabled. left floating, amplifier will operate properly. Figure shows output voltage supply current response pulse.
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Supply Bypass
Guard Ring VIN- VIN+ With this family operational amplifiers, power supply (VDD single supply) should have local bypass capacitor (i.e., 0.01 within good high frequency performance. bulk capacitor (i.e., larger) within provide large, slow currents. This bulk capacitor required most applications shared with other nearby analog parts.
FIGURE 4-9: Inverting Gain.
Example Guard Ring Layout
Unused Amps
unused quad package (MCP6144) should configured shown Figure 4-8. These circuits prevent output from toggling causing crosstalk. Circuits sets near minimum noise gain. resistor divider produces desired reference voltage within output voltage range amp; buffers that reference voltage. Circuit uses minimum number components operates comparator, draw more current. MCP6144 MCP6144
Non-inverting Gain Unity Gain Buffer: Connect non-inverting (VIN+) input with wire that does touch surface. Connect guard ring inverting input (VIN-). This biases guard ring common mode input voltage. Inverting Gain Transimpedance Gain (convert current voltage, such photo detectors) amplifiers: Connect guard ring non-inverting input (VIN+). This biases guard ring same reference voltage (e.g., VDD/2 ground). Connect inverting (VIN-) input with wire that does touch surface.
VREF
FIGURE 4-8:
Unused Amps.
Surface Leakage
applications where input bias current critical, printed circuit board (PCB) surface leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current flow, which greater than MCP6141/2/3/4 family's bias current +25°C typical). easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. example this type layout shown Figure 4-9.
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4.9.1
Application Circuits
BATTERY CURRENT SENSING
4.9.2
INVERTING SUMMING AMPLIFIER
MCP6141/2/3/4 amps' Common Mode Input Range, which goes 0.3V beyond both supply rails, supports their high side side battery current sensing applications. very quiescent current (0.6 typical) help prolong battery life, rail-to-rail output supports detection currents. Figure 4-10 shows high side battery current sensor circuit. resistor sized minimize power losses. battery current (IDD) through resistor causes terminal more negative than bottom terminal. This keeps common mode input voltage below VDD, which within allowed range. When current flowing, output will Maximum Output Voltage Swing (VOH), which virtually VDD.
MCP6141/2/3/4 well suited inverting summing amplifier shown Figure 4-11 when resistors input (R1, make noise gain least V/V. output voltage (VOUT) weighted inputs (V1, V3), shifted VREF input. necessary calculations follow Equation 4-3.
MCP614X VREF VOUT
1.4V 6.0V MCP6141
FIGURE 4-11: EQUATION 4-3:
VOUT Noise Gain:
Summing Amplifier.
Signal Gains: Output Signal:
FIGURE 4-10: Sensor.
High Side Battery Current
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DESIGN AIDS
Microchip provides basic design tools needed MCP6141/2/3/4 family amps.
Analog Demonstration Evaluation Boards
SPICE Macro Model
latest SPICE macro model MCP6141/2/3/4 amps available Microchip site www.microchip.com. This model intended initial design tool that works well amp's linear region operation over temperature range. model file information capabilities. Bench testing very important part design cannot replaced with simulations. Also, simulation results using this macro model need validated comparing them data sheet specifications characteristic curves.
Microchip offers broad spectrum Analog Demonstration Evaluation Boards that designed help achieve faster time market. complete listing these boards their corresponding user's guides technical information, visit Microchip site www.microchip.com/ analogtools. boards that especially useful are: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board, SOIC8EV 14-Pin SOIC/TSSOP/DIP Evaluation Board, SOIC14EV
Application Notes
FilterLab® Software
Microchip's FilterLab® software innovative software tool that simplifies analog active filter (using amps) design. Available cost from Microchip site www.microchip.com/filterlab, FilterLab design tool provides full schematic diagrams filter circuit with component values. also outputs filter circuit SPICE format, which used with macro model simulate actual filter performance.
following Microchip Analog Design Note Application Notes available Microchip site www.microchip.com/appnotes recommended supplemental reference resources. ADN003: "Select Right Operational Amplifier your Filtering Circuits", DS21821 AN722: "Operational Amplifier Topologies Specifications", DS00722 AN723: "Operational Amplifier Specifications Applications", DS00723 AN884: "Driving Capacitive Loads With Amps", DS00884 AN990: "Analog Sensor Conditioning Circuits Overview", DS00990 These application notes others listed design guide: "Signal Chain Design Guide", DS21825
MindiSimulation Tool
Microchip's Mindisimulation tool aids design various circuits useful active filter, amplifier power-management applications. free online simulation tool available from Microchip site www.microchip.com/mindi. This interactive simulator enables designers quickly generate circuit diagrams, simulate circuits. Circuits developed using Mindi simulation tool downloaded personal computer workstation.
Microchip Advanced Part Selector (MAPS)
MAPS software tool that helps semiconductor professionals efficiently identify Microchip devices that particular design requirement. Available cost from Microchip website www.microchip.com/ maps, MAPS overall selection tool Microchip's product portfolio that includes Analog, Memory, MCUs DSCs. Using this tool define filter sort features parametric search devices export side-by-side technical comparison reports. Helpful links also provided Data sheets, Purchase, Sampling Microchip parts.
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PACKAGING INFORMATION
Package Marking Information
5-Lead SOT-23 (MCP6141)
Device E-Temp Code ASNN
Example:
XXNN
MCP6141
Note: Applies 5-Lead SOT-23
AS25
Example:
6-Lead SOT-23 (MCP6143)
Device
E-Temp Code AWNN
XXNN
8-Lead MSOP XXXXXX YWWNNN
MCP6143
Note: Applies 6-Lead SOT-23
AW25
Example: 6143I 918256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Example: MCP6141 I/P256 0918 MCP6141 0918
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW
Example: MCP6142 I/SN0918 MCP6142E 0918
Legend: XX.X Note:
Customer-specific information Year code (last digit calendar year) Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code Pb-free JEDEC designator Matte (Sn) This package Pb-free. Pb-free JEDEC designator found outer packaging this package.
event full Microchip part number cannot marked line, will carried over next line, thus limiting number available characters customer-specific information.
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Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP6144) Example:
XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
MCP6144-I/P 0918256
MCP6144 0918256
Example:
14-Lead SOIC (150 mil) (MCP6144)
XXXXXXXXXX XXXXXXXXXX YYWWNNN
MCP6144ISL 0918256
MCP6144 I/SL^^ 0918256
14-Lead TSSOP (MCP6144)
Example:
XXXXXXXX YYWW
6144ST 0918
6144EST 0918
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2009 Microchip Technology Inc.
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APPENDIX REVISION HISTORY
Revision (September 2002)
Original Release this Document.
Revision (May 2009)
following list modifications: Electrical Charactistics table: Corrected formatting issue Output section. Electrical Characteristics table: Slew Rate changed typical value from Changed Phase Margin from Changed Phase Margin Condition from G=+1 G=+10 V/V. Updated Package Outline Drawings Updated Revision History.
Revision (December 2007)
Updated Figures Expanded Analog Input Absolute Voltage Range (applies retroactively) Expanded maximum operating (going forward) Section "Electrical Characteristics" updated Section "Typical Performance Curves" updated Section "Applications Information" Updated input stage explanation Section "Design Aids" updated
Revision (November 2005)
following list modifications: Added following: SOT-23-5 package MCP6141 single amps. SOT-23-6 package MCP6143 single amps with Chip Select. Extended Temperature (-40°C +125°C) amps. Updated specifications Section "Electrical Characteristics" E-temp parts. Corrected updated plots Section "Typical Performance Curves". Added Section "Pin Descriptions". Updated Section "Applications Information" added section unused amps. Updated Section "Design Aids" include FilterLab. Added SOT-23-5 SOT-23-6 packages corrected package marking information Section "Packaging Information". Added Appendix "Revision History".
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PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office.
PART Device
Temperature Range
MCP6141: MCP6141T: MCP6142: MCP6142T: MCP6143: MCP6143T: MCP6144: MCP6144T:
Package
Examples:
MCP6141-I/P: Industrial Temperature lead PDIP package. MCP6141T-E/OT: Tape Reel, Extended Temperature lead SOT-23 package.
Device:
Single Single (Tape Reel SOT-23, SOIC, MSOP) Dual Dual (Tape Reel SOIC MSOP) Single Single (Tape Reel SOT-23, SOIC, MSOP) Quad Quad (Tape Reel SOIC TSSOP)
MCP6142-I/SN:
Industrial Temperature lead SOIC package. MCP6142T-E/MS: Tape Reel, Extended Temperature lead MSOP package.
Industrial Temperature, lead PDIP package. MCP6143T-E/CH: Tape Reel, Extended Temperature lead SOT-23 package. MCP6144-I/SL: Industrial Temperature lead PDIP package. MCP6144T-E/ST: Tape Reel, Extended Temperature lead TSSOP package.
MCP6143-I/P:
Temperature Range: Package: -40°C +85°C (industrial) -40°C +125°C (extended) Plastic Small Outline Transistor (SOT-23), 6-lead (Tape Reel MCP6143 only) Plastic Micro Small Outline (MSOP), 8-lead Plastic Small Outline Transistor (SOT-23), 5-lead (Tape Reel MCP6141 only) Plastic (300 body), 8-lead, 14-lead Plastic SOIC (3.9 body), 14-lead Plastic SOIC (3.9 body), 8-lead Plastic TSSOP (4.4 body), 14-lead
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NOTES:
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Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip devices life support and/or safety applications entirely buyer's risk, buyer agrees defend, indemnify hold harmless Microchip from damages, claims, suits, expenses resulting from such use. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights.
Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt UNI/O registered trademarks Microchip Technology Incorporated U.S.A. other countries. FilterLab, Hampshire, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, WiperLock ZENA trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2009, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper.
Microchip received ISO/TS-16949:2002 certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona; Gresham, Oregon design centers California India. Company's quality system processes procedures PIC® MCUs dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified.
2009 Microchip Technology Inc.
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WORLDWIDE SALES SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Address: www.microchip.com Atlanta Duluth, Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, Tel: 765-864-8360 Fax: 765-864-8387 Angeles Mission Viejo, Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 China Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049
ASIA/PACIFIC
India Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4080 India Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934 Malaysia Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Hsin Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/26/09
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