GM5ZV96270A Light Emitting Diode High brightness (600 Amber

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

GM5ZV96270A Light Emitting Diode High brightness (600 Amber

Datasheet Thumbnail

Top Searches for this datasheet

GM5ZV96270A
GM5ZV96270A
Light Emitting Diode
High brightness (600 Amber color, from AlGaInP/GaP chip
Agency Approvals/Compliance
RoHS compliant
Applications
General indication Office automation/computers Measuring equipment Audio visual equipment Home appliances Telecommunications equipment Tooling machines/Factory automation
Notice content data sheet subject change without prior notice. absence confirmation device specification sheets, SHARP takes responsibility defects that occur equipment using SHARP devices shown catalogs, data books, etc. Contact SHARP order obtain latest device specification sheets before using SHARP device.
Sheet No.: DG-072018 Date: February 2007 ©SHARP Corporation
GM5ZV96270A External Dimensions
(2.4)
(2.2)
Polarity Mark
(0.15)
(0.8)
Equivalent Circuit
Anode Cathode
Arrangement Name Anode Cathode
(1.9) NOTES: Units: Unspecified tolerence: ±0.3 Reference dimensions Case temperature (Tc) measurement point
Sheet No.: DG-072018
GM5ZV96270A Absolute Maximum Ratings
Parameter Power dissipation Forward current Peak pulsed forward current Forward current derating factor Reverse voltage Operating temperature Storage temperature Soldering temperature Symbol Pulse Tstg Tsol +100 +100
25°C)
Rating
Unit mA/°C mA/°C
Duty ratio 1/10, Pulse width Case temperature (See Outline Dimensions page Each terminal must soldered with soldering iron within seconds under 295°C. Reflow Soldering information, Fig. Operating current values here follow derating curves shown Fig. through Fig. This device uses leads heat sinking, therefore Operating Temperature range prescribed
Electro-optical Characteristics
Parameter Forward voltage Luminous intensity Dominant wavelength Reverse current Symbol Conditions MIN. TYP. MAX.
25°C)
Unit
drive (Tolerance: Measured EG&G Model (Radiometer/Photometer) afterms drive (Tolerance: y:±15%) Measured Ohtsuka Electronics ±0.02) Luminous Rank table pageModel MCPD-2000 after Dominant Wavelength Rank table page
Sheet No.: DG-072018
GM5ZV96270A Derating Curves Fig. Forward Current Case Temperature
Forward Current (mA)
Relative Luminous Intensity
Characteristic Diagrams (TYP.*)
*Characteristics data typical data guaranteed data.
Fig. Relative Luminous Intensity Forward Current
25°C) 1000
Case Temperature (°C)
Fig. Peak Forward Current Duty Ratio
25°C
Forward Current (mA)
Fig. Forward Current Forward Voltage
25°C)
Peak Forward Current (mA)
Forward Current (mA)
1/100
1/10 Duty Ratio
Forward Voltage
Fig. Peak Forward Current Case Temperature
Peak Forward Current (mA)
Fig. Relative Luminous Intensity Case Temperature
1000
Relative Luminous Intensity
GM5ZV96270A
Case Temperature (°C)
Case Temperature (°C)
Sheet No.: DG-072018
GM5ZV96270A Tape Specifications Fig. Tape Shape Dimensions
Cathode
Anode
Tape Dimension Specifications
Parameter Vertical Concave square hole parts insertion Horizontal Pitch Diameter Round sprocket hole Pitch Position Center center distance Cover tape Carrier tape Thickness entire unit Vertical Horizontal Width Thickness Width Thickness Symbol Dimension (mm) 1.75 With cover tape carrier tape combined Accumulated error ±0.5 mm/10 pitch Distance between edge tape center hole Distance between center line concave square hole round sprocket hole Remarks Dimension excludes corner bottom inside
Sheet No.: DG-072018
GM5ZV96270A Reel Specifications Fig. Reel Shape Dimensions
SHARP CORPORATION
PART QUANTITY
Label
Reel Dimension Specifications
Parameter Diameter Flange Thickness Inner space direction External diameter Spindle hole diameter slit width slit depth Symbol Dimension (mm) Dimension shaft core Remarks
Label side flange: part name, quantity, number. Material: described flange.
Sheet No.: DG-072018
GM5ZV96270A Taping Specifications
Leader tape standard: C0806
Fig. Leader Tape
Pull Beginning
Empty pitch more
Stuffed
Leading pitch more
Cover tape peel resistance: less). Fig.
Fig. Tape Separation
Cover tape Carrier tape Tape speed: mm/s
Forward
Tape bending resistance: Cover tape will remain place radii more. Under radii, cover separate. Joints allowed cover tape. Parts packed with average quantity 2000 pieces reel. Product mass: (approximately) Sharp guarantees following: contiguous empty spaces tape Missing parts will make more than 0.1% total quantity. Parts will easily removed from packing. Parts will stick cover tape peeled.
Sheet No.: DG-072018
GM5ZV96270A Label Marking Information Fig. Label Contents
SHARP CORPORATION
PART QUANTITY GM5ZV96270A 2000
Part number Quantity EIAJ code
EIAJ code
MI07A01 RANK
EIAJ MADE PHILIPPINES
Indication (example) number rank Indication (example) production country
Number
Production plant code (alphabetically) Production (single double digits) Production year (the last digits year) Production month indicated alphabetically with January corresponding Production date Rank Luminous intensity rank Dominant Wavelength rank
Luminous Intensity Rank Table 25°C)
Rank Luminous Intensity 1075 1548 Unit Condition
Parts marked highest rank their tested luminosity level. Tolerance: ±15%. Quantity each rank decided Sharp.
Dominant Wavelength Rank Table 25°C)
Rank Luminous Intensity 580.5 585.0 584.0 588.5 587.5 592.0 591.0 595.5 Unit Condition
Ranks this table derived using typical device, driven noted here; therefore guaranteed data. Tolerance: ±1.5nm. Quantity each rank decided Sharp.
Sheet No.: DG-072018
GM5ZV96270A Design Notes
This product designed resist electromagnetic ionized-particle radiation. Moreover, designed directly resist excessive moisture, such condensation; corrosive (salt) corrosive gases, such H2S, NH3, SO2, NOX. allow circuit design apply reverse voltage LEDs. This part easily damaged external stress. Make sure they mechanically stressed during after assembly. This part very high light output. Looking directly during full power output cause injury. Sharp recommends taking proper personal environmental static control precautions when handling this part. Materials high thermal conductivity incorporated this device allow generated heat effectively transferred from circuit board. best reliability, Sharp recommends against locating other sources heat near LED, design circuit board such that heat easily escape from circuit board. Sharp also recommends designing circuit board that part's case temperature always kept under 100°C (when turned including self-heating. Sharp recommends handling these parts clean, non-dusty environment since surface dust difficult remove affect optical performance part. Sharp recommends confirming part's performance, reliability, resistance these conditions, used these environments: Direct sunlight, outdoor exposure, dusty conditions water, oil, medical fluids, organic solvents Excessive moisture, such condensation Corrosive (salt) corrosive gases, such H2S, NH3, SO2,
Sheet No.: DG-072018
GM5ZV96270A Manufacturing Guidelines Storage Handling
Moisture-proofing: These parts shipped vacuum-sealed packaging keep them ready use. Fig.
Fig. Factory Moisture-proof Packaging
Label Aluminum package
Silica Reel Label
Store these parts between 30°C, relative humidity less than 60%. After breaking package seal, maintain environment within 30°C, relative humidity less than 60%. Solder parts within days. parts will used immediately, repack them box, re-vacuum-seal them with desiccant. parts exposed more than days, silica telltale indicates moisture contamination, bake parts: When tape carrier, bake them temperature 95°C 100°C, hours. When loose metal tray) PCB, bake them temperature 110°C 120°C, hours. Note that reels become distorted they stack when baking. Confirm that parts have cooled room temperature after baking.
Cleaning Instructions
Sharp does recommend cleaning printed circuit boards containing this device. Process chemicals will affect structural optical characteristics this device. Sharp recommends solder paste that does require cleaning. Avoid cleaning this part ultrasonically. ultrasonic cleaning unavoidable, verify process before use, size bath, duration, ultrasonic intensity, size shape affect process. Recommended solvents water isopropyl alcohol.
Sheet No.: DG-072018
GM5ZV96270A Soldering Instructions
When soldering with reflow methods, Sharp recommends following soldering profile Fig. Electrodes this part silver-plated. part exposed corrosive environment, plating damaged, thereby affecting solderability. subject package excessive mechanical force during soldering cause deformation defects plated connections. Internal connections severed mechanical force placed package flexing during soldering process. Both design solder reflow machine specifications will affect amount heat conducted into this part during production process. When using backside methods, Sharp recommends giving careful consideration process, board warping from heat occur heat itself conducted into package. Reflow after recommended, they performed opposite order; keep interval between processes short possible. When using second reflow, second process should carried soon possible after first, unless there water-wash solvent-wash process. Then parts must baked specified Storage Handling before performing second reflow. Reflow Profile shown Fig. should considered maximum parameters. Since this part uses leads heatsinking, peak temperature should kept cool possible cooldown period lengthened much possible. Thermal conduction into will affected performance reflow process, verification reflow process recommended. These parts used nitrogen reflow process. Sharp recommends verifying processes before production begins.
Fig. Temperature Profile
(MAX)
Temperature (°C)
4°C/s
2.5°C/s
(MAX) 120s 4°C/s Time (MAX)
Sheet No.: DG-072018
GM5ZV96270A Recommended Solder Design
Solderability depends reflow conditions, solder paste, circuit board materials. Check entire process before production commences. Fig. shows recommended solder pattern this part. When using back side methods, Sharp recommends checking process carefully: board warping from heat cause mechanical failure these parts, addition high heat conducted into part through leads. Performing reflow after recommended, with interval between short possible.
Fig. Recommended Solder Design
Product center
NOTE: Unit:
Presence ODCs
This product shall contain following materials, they used production process this product: Regulated substances: CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform). Specific brominated flame retardants such PBBOs PBBs used this product all. This product shall contain following materials banned RoHS Directive (2002/95/EC). Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).
Sheet No.: DG-072018
GM5ZV96270A Important Notices
circuit application examples this publication provided explain representative applications SHARP devices intended guarantee circuit design license intellectual property rights. SHARP takes responsibility problems related intellectual property right third party resulting from SHARP's devices. Contact SHARP order obtain latest device specification sheets before using SHARP device. SHARP reserves right make changes specifications, characteristics, data materials, structure, other contents described herein time without notice order improve design reliability. Manufacturing locations also subject change without notice. Observe following points when using devices this publication. SHARP takes responsibility damage caused improper devices which does meet conditions absolute maximum ratings used specified relevant specification sheet meet following conditions: devices this publication designed general electronic equipment designs such Personal computers Office automation equipment Telecommunication equipment (terminal) Test measurement equipment Industrial control Audio visual equipment Consumer electronics (ii) Measures such fail-safe function redundant design should taken ensure reliability safety when SHARP devices used connection with equipment that requires higher reliabilty such
Transportation control safety equipment (i.e., aircraft, trains, automobiles, etc.) Traffic signals leakage sensor breakers Alarm equipment Various safety devices, etc. (iii) SHARP devices shall used connection with equipment that requires extremely high level reliability safety such Space applications Telecommunication equipment (trunk lines) Nuclear power control equipment Medical other life support equipment (e.g. scuba) SHARP devices listed this publication fall within scope strategic products described Foreign Exchange Foreign Trade Japan, necessary obtain approval export such SHARP devices. This publication proprietary product SHARP copyrighted, with rights reserved. Under copyright laws, part this publication reproduced transmitted form means, electronic mechanical, purpose, whole part, without express written permission SHARP. Express written permission also required before this publication made third party. Contact consult with SHARP representative there questions about contents this publication.
Sheet No.: DG-072018

GM5ZV96270A Light Emitting Diode High brightness (600 Amber

Top Searches for this datasheet

Other recent searches