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GM5GC96270A Light Emitting Diode High brightness (1300 Green


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GM5GC96270A
GM5GC96270A
Light Emitting Diode
High brightness (1300 Green (color derived from InGaN LED)
Agency Approvals/Compliance
RoHS compliant
Applications
General indication Audio visual equipment Home appliances Telecommunications equipment Tooling machines/Factory automation
Notice content data sheet subject change without prior notice. absence confirmation device specification sheets, SHARP takes responsibility defects that occur equipment using SHARP devices shown catalogs, data books, etc. Contact SHARP order obtain latest device specification sheets before using SHARP device.
Sheet No.: DG-072009 Date February 2007 ©SHARP Corporation
GM5GC96270A External Dimensions
(2.4)
(2.2)
Polarity Mark
(0.8)
Equivalent Circuit (0.15)
Anode Cathode Arrangement Name Anode Cathode
(1.9) NOTES: Units: Unspecified tolerence: ±0.3 Reference dimensions Case temperature (Tc) measurement point
Sheet No.: DG-072009
GM5GC96270A Absolute Maximum Ratings
Parameter Power dissipation Forward current Peak pulsed forward current Forward current derating factor Reverse current Operating temperature Storage temperature Soldering temperature Symbol Pulse Tstg Tsol
25°C)
Rating +100 +100
Unit mA/°C mA/°C
Duty ratio 1/10, Pulse width Case temperature (See Outline Dimensions page Each terminal must soldered with soldering iron within seconds under 295°C. Reflow Soldering information, Fig. Operating current values here follow derating curves shown Fig. through Fig. This device uses leads heat sinking, therefore Operating Temperature range prescribed
Electro-optical Characteristics
Parameter Forward voltage Luminous intensity Dominant wavelength Symbol Conditions MIN. TYP. 1300 MAX.
25°C)
Unit
Measured EG&G Model (Radiometer/Photometer) after drive (Tolerance: ±15%) Measured Ohtsuka Electronics Model MCPD-2000 after drive (Tolerance: x,y: ±0.02) Luminous Intensity Rank table page Dominant Wavelength Rank table page
Sheet No.: DG-072009
GM5GC96270A Derating Curves Fig. Forward Current Case Temperature
Forward Current (mA)
Characteristic Diagrams (TYP.*)
*Characteristics data typical data guaranteed data.
Fig. Relative Luminous Intensity Forward Current
25°C) 1000
Relative Luminous Intensity
Case Temperature (°C)
Forward Current (mA)
Fig. Peak Forward Current Duty Ratio
25°C) Peak Forward Current (mA) 1/100 1/10 Duty Ratio
Fig. Forward Current Forward Voltage
25°C)
Forward Current (mA)
Forward Voltage
Fig. Peak Forward Current Case Temperature
Peak Forward Current (mA)
Fig. Relative Luminous Intensity Case Temperature
1000
Relative Luminous Intensity
Case Temperature (°C)
Case Temperature (°C)
Sheet No.: DG-072009
GM5GC96270A Tape Specifications Fig. Tape Shape Dimensions
Cathode
Anode
Tape Dimension Specifications
Parameter Vertical Concave square hole parts insertion Horizontal Pitch Diameter Round sprocket hole Pitch Position Center center distance Cover tape Carrier tape Thickness entire unit Vertical Horizontal Width Thickness Width Thickness Symbol Dimension (mm) 1.75 With cover tape carrier tape combined Accumulated error ±0.5 mm/10 pitch Distance between edge tape center hole Distance between center line concave square hole round sprocket hole Remarks Dimension excluded corner bottom inside
Sheet No.: DG-072009
GM5GC96270A Reel Specifications Fig. Reel Shape Dimensions
SHARP CORPORATION
PART QUANTITY
Label
Reel Dimension Specifications
Parameter Diameter Flange Thickness Inner space direction External diameter Spindle hole diameter slit width slit depth Symbol Dimension (mm) Shaft core dimension Remarks
Label side flange: part number, quantity, number, rank. Material: described flange.
Sheet No.: DG-072009
GM5GC96270A Taping Specifications
Leader tape standard: C0806
Fig. Leader Tape
Pull Beginning
Empty pitch more
Stuffed
Leading pitch more
Cover tape peel resistance: less). Fig.
Fig. Tape Separation
Cover tape Carrier tape Tape speed: mm/s
Forward
Tape bending resistance: Cover tape will remain place radii more. Under radii, cover separate. Joints allowed cover tape. Parts packed with average quantity 2000 pieces reel. Product mass: (approximately) Sharp guarantees following: contiguous empty spaces tape Missing parts will make more than 0.1% total quantity. Parts will easily removed from packing. Parts will stick cover tape peeled.
Sheet No.: DG-072009
GM5GC96270A Label Marking Information Fig. Label Contents
SHARP CORPORATION
PART QUANTITY GM5GC96270A 2000
Part number Quantity EIAJ code
EIAJ code
MI07A01 RANK
EIAJ MADE PHILIPPINES
Indication (example) number rank Indication (example) production country
Number
Production plant code (alphabetically) Production (single double digits) Production year (the last digits year) Production month indicated alphabetically with January corresponding Production date Rank Luminous intensity rank Dominant Wavelength rank
Luminous Intensity Rank Table 25°C)
Rank Luminous Intensity 1548 1144 2229 1648 3210 Unit Condition
Parts marked highest rank their tested luminosity level. Quantity each rank decided Sharp.
Dominant Wavelength Ranking 25°C)
Rank Dominant Wavelength 517.0 523.0 522.0 528.0 527.0 533.0 532.0 538.0 Unit Condition
Table rankings based upon table conditions, such guaranteed data Quantity each rank decided Sharp.
Sheet No.: DG-072009
GM5GC96270A Design Notes
This product designed resist electromagnetic ionized-particle radiation. Moreover, designed directly resist excessive moisture, such condensation; corrosive (salt) corrosive gases, such H2S, NH3, SO2, NOX. allow circuit design apply reverse voltage LEDs. This part easily damaged external stress. Make sure they mechanically stressed during after assembly. This part very high light output. Looking directly during full power output cause injury. Sharp recommends taking proper personal environmental static control precautions when handling this part. Materials high thermal conductivity incorporated this device allow generated heat effectively transferred from circuit board. best reliability, Sharp recommends against locating other sources heat near LED, design circuit board such that heat easily escape from circuit board. Sharp also recommends designing circuit board that part's case temperature always kept under 100°C (when turned including self-heating. Sharp recommends handling these parts clean, non-dusty environment since surface dust difficult remove affect optical performance part. Sharp recommends confirming part's performance, reliability, resistance these conditions, used these environments: Direct sunlight, outdoor exposure, dusty conditions water, oil, medical fluids, organic solvents Excessive moisture, such condensation Corrosive (salt) corrosive gases, such H2S, NH3, SO2,
Sheet No.: DG-072009
GM5GC96270A Manufacturing Guidelines Storage Handling
Moisture-proofing: These parts shipped vacuum-sealed packaging keep them ready use. Fig.
Fig. Factory Moisture-proof Packaging
Label Aluminum package
Silica Reel Label
Store these parts between 30°C, relative humidity less than 60%. After breaking package seal, maintain environment within 30°C, relative humidity less than 60%. Solder parts within days. parts will used immediately, repack them box, re-vacuum-seal them with desiccant. parts exposed more than days, silica telltale indicates moisture contamination, bake parts: When tape carrier, bake them temperature 95°C 100°C, hours. When loose metal tray) PCB, bake them temperature 110°C 120°C, hours. Note that reels become distorted they stack when baking. Confirm that parts have cooled room temperature after baking.
Cleaning Instructions
Sharp does recommend cleaning printed circuit boards containing this device. Process chemicals will affect structural optical characteristics this device. solder paste that does require cleaning. Avoid using ultrasonic cleaning possible. ultrasonic cleaning cannot avoided, verify process before beginning production. Compatible solvents water isopropyl alcohol. This device affected ultrasonic cleaning; factors considered size bath, ultrasonic output, duration, size PCB, device's mounting method.
Sheet No.: DG-072009
GM5GC96270A Soldering Instructions
When soldering with reflow methods, Sharp recommends following soldering profile Fig. subject package excessive mechanical force during soldering cause deformation defects plated connections. Internal connections severed mechanical force placed package flexing during soldering process. When using second reflow, second process should carried soon possible after first. Electrodes this part silver-plated. part exposed corrosive environment, plating damaged, thereby affecting solderability. Reflow Profile shown Fig. should considered maximum parameters. Since this part uses leads heatsinking, peak temperature should kept cool possible cooldown period lengthened much possible. Thermal conduction into will affected performance reflow process, verification reflow process recommended. These parts used nitrogen reflow process.
Fig. Temperature Profile
(MAX)
Temperature (°C)
4°C/s
2.5°C/s
(MAX) 120s 4°C/s Time
(MAX)
Recommended Solder Design
Solderability depends reflow conditions, solder paste, circuit board materials. Check entire process before production commences. Fig. shows recommended solder pattern this part. When using back side methods, Sharp recommends checking process carefully: board warping from heat cause mechanical failure these parts, addition high heat conducted into part through leads. Performing reflow after recommended, with interval between short possible.
Fig. Recommended Solder Pattern
Product center
NOTE: Unit:
Sheet No.: DG-072009
GM5GC96270A Presence ODCs
This product shall contain following materials, they used production process this product: Regulated substances: CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform). Specific brominated flame retardants such PBBOs PBBs used this product all. This product shall contain following materials banned RoHS Directive (2002/95/EC). Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).
Sheet No.: DG-072009
GM5GC96270A Important Notices
circuit application examples this publication provided explain representative applications SHARP devices intended guarantee circuit design license intellectual property rights. SHARP takes responsibility problems related intellectual property right third party resulting from SHARP's devices. Contact SHARP order obtain latest device specification sheets before using SHARP device. SHARP reserves right make changes specifications, characteristics, data materials, structure, other contents described herein time without notice order improve design reliability. Manufacturing locations also subject change without notice. Observe following points when using devices this publication. SHARP takes responsibility damage caused improper devices which does meet conditions absolute maximum ratings used specified relevant specification sheet meet following conditions: devices this publication designed general electronic equipment designs such Personal computers Office automation equipment Telecommunication equipment (terminal) Test measurement equipment Industrial control Audio visual equipment Consumer electronics (ii) Measures such fail-safe function redundant design should taken ensure reliability safety when SHARP devices used connection with equipment that requires higher reliabilty such
Transportation control safety equipment (i.e., aircraft, trains, automobiles, etc.) Traffic signals leakage sensor breakers Alarm equipment Various safety devices, etc. (iii) SHARP devices shall used connection with equipment that requires extremely high level reliability safety such Space applications Telecommunication equipment (trunk lines) Nuclear power control equipment Medical other life support equipment (e.g. scuba) SHARP devices listed this publication fall within scope strategic products described Foreign Exchange Foreign Trade Japan, necessary obtain approval export such SHARP devices. This publication proprietary product SHARP copyrighted, with rights reserved. Under copyright laws, part this publication reproduced transmitted form means, electronic mechanical, purpose, whole part, without express written permission SHARP. Express written permission also required before this publication made third party. Contact consult with SHARP representative there questions about contents this publication.
Sheet No.: DG-072009

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