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GM5GC96270A Light Emitting Diode High brightness (1300 Green
Top Searches for this datasheetGM5GC96270A GM5GC96270A Light Emitting Diode High brightness (1300 Green (color derived from InGaN LED) Agency Approvals/Compliance RoHS compliant Applications General indication Audio visual equipment Home appliances Telecommunications equipment Tooling machines/Factory automation Notice content data sheet subject change without prior notice. absence confirmation device specification sheets, SHARP takes responsibility defects that occur equipment using SHARP devices shown catalogs, data books, etc. Contact SHARP order obtain latest device specification sheets before using SHARP device. Sheet No.: DG-072009 Date February 2007 ©SHARP Corporation GM5GC96270A External Dimensions (2.4) (2.2) Polarity Mark (0.8) Equivalent Circuit (0.15) Anode Cathode Arrangement Name Anode Cathode (1.9) NOTES: Units: Unspecified tolerence: ±0.3 Reference dimensions Case temperature (Tc) measurement point Sheet No.: DG-072009 GM5GC96270A Absolute Maximum Ratings Parameter Power dissipation Forward current Peak pulsed forward current Forward current derating factor Reverse current Operating temperature Storage temperature Soldering temperature Symbol Pulse Tstg Tsol 25°C) Rating +100 +100 Unit mA/°C mA/°C Duty ratio 1/10, Pulse width Case temperature (See Outline Dimensions page Each terminal must soldered with soldering iron within seconds under 295°C. Reflow Soldering information, Fig. Operating current values here follow derating curves shown Fig. through Fig. This device uses leads heat sinking, therefore Operating Temperature range prescribed Electro-optical Characteristics Parameter Forward voltage Luminous intensity Dominant wavelength Symbol Conditions MIN. TYP. 1300 MAX. 25°C) Unit Measured EG&G Model (Radiometer/Photometer) after drive (Tolerance: ±15%) Measured Ohtsuka Electronics Model MCPD-2000 after drive (Tolerance: x,y: ±0.02) Luminous Intensity Rank table page Dominant Wavelength Rank table page Sheet No.: DG-072009 GM5GC96270A Derating Curves Fig. Forward Current Case Temperature Forward Current (mA) Characteristic Diagrams (TYP.*) *Characteristics data typical data guaranteed data. Fig. Relative Luminous Intensity Forward Current 25°C) 1000 Relative Luminous Intensity Case Temperature (°C) Forward Current (mA) Fig. Peak Forward Current Duty Ratio 25°C) Peak Forward Current (mA) 1/100 1/10 Duty Ratio Fig. Forward Current Forward Voltage 25°C) Forward Current (mA) Forward Voltage Fig. Peak Forward Current Case Temperature Peak Forward Current (mA) Fig. Relative Luminous Intensity Case Temperature 1000 Relative Luminous Intensity Case Temperature (°C) Case Temperature (°C) Sheet No.: DG-072009 GM5GC96270A Tape Specifications Fig. Tape Shape Dimensions Cathode Anode Tape Dimension Specifications Parameter Vertical Concave square hole parts insertion Horizontal Pitch Diameter Round sprocket hole Pitch Position Center center distance Cover tape Carrier tape Thickness entire unit Vertical Horizontal Width Thickness Width Thickness Symbol Dimension (mm) 1.75 With cover tape carrier tape combined Accumulated error ±0.5 mm/10 pitch Distance between edge tape center hole Distance between center line concave square hole round sprocket hole Remarks Dimension excluded corner bottom inside Sheet No.: DG-072009 GM5GC96270A Reel Specifications Fig. Reel Shape Dimensions SHARP CORPORATION PART QUANTITY Label Reel Dimension Specifications Parameter Diameter Flange Thickness Inner space direction External diameter Spindle hole diameter slit width slit depth Symbol Dimension (mm) Shaft core dimension Remarks Label side flange: part number, quantity, number, rank. Material: described flange. Sheet No.: DG-072009 GM5GC96270A Taping Specifications Leader tape standard: C0806 Fig. Leader Tape Pull Beginning Empty pitch more Stuffed Leading pitch more Cover tape peel resistance: less). Fig. Fig. Tape Separation Cover tape Carrier tape Tape speed: mm/s Forward Tape bending resistance: Cover tape will remain place radii more. Under radii, cover separate. Joints allowed cover tape. Parts packed with average quantity 2000 pieces reel. Product mass: (approximately) Sharp guarantees following: contiguous empty spaces tape Missing parts will make more than 0.1% total quantity. Parts will easily removed from packing. Parts will stick cover tape peeled. Sheet No.: DG-072009 GM5GC96270A Label Marking Information Fig. Label Contents SHARP CORPORATION PART QUANTITY GM5GC96270A 2000 Part number Quantity EIAJ code EIAJ code MI07A01 RANK EIAJ MADE PHILIPPINES Indication (example) number rank Indication (example) production country Number Production plant code (alphabetically) Production (single double digits) Production year (the last digits year) Production month indicated alphabetically with January corresponding Production date Rank Luminous intensity rank Dominant Wavelength rank Luminous Intensity Rank Table 25°C) Rank Luminous Intensity 1548 1144 2229 1648 3210 Unit Condition Parts marked highest rank their tested luminosity level. Quantity each rank decided Sharp. Dominant Wavelength Ranking 25°C) Rank Dominant Wavelength 517.0 523.0 522.0 528.0 527.0 533.0 532.0 538.0 Unit Condition Table rankings based upon table conditions, such guaranteed data Quantity each rank decided Sharp. Sheet No.: DG-072009 GM5GC96270A Design Notes This product designed resist electromagnetic ionized-particle radiation. Moreover, designed directly resist excessive moisture, such condensation; corrosive (salt) corrosive gases, such H2S, NH3, SO2, NOX. allow circuit design apply reverse voltage LEDs. This part easily damaged external stress. Make sure they mechanically stressed during after assembly. This part very high light output. Looking directly during full power output cause injury. Sharp recommends taking proper personal environmental static control precautions when handling this part. Materials high thermal conductivity incorporated this device allow generated heat effectively transferred from circuit board. best reliability, Sharp recommends against locating other sources heat near LED, design circuit board such that heat easily escape from circuit board. Sharp also recommends designing circuit board that part's case temperature always kept under 100°C (when turned including self-heating. Sharp recommends handling these parts clean, non-dusty environment since surface dust difficult remove affect optical performance part. Sharp recommends confirming part's performance, reliability, resistance these conditions, used these environments: Direct sunlight, outdoor exposure, dusty conditions water, oil, medical fluids, organic solvents Excessive moisture, such condensation Corrosive (salt) corrosive gases, such H2S, NH3, SO2, Sheet No.: DG-072009 GM5GC96270A Manufacturing Guidelines Storage Handling Moisture-proofing: These parts shipped vacuum-sealed packaging keep them ready use. Fig. Fig. Factory Moisture-proof Packaging Label Aluminum package Silica Reel Label Store these parts between 30°C, relative humidity less than 60%. After breaking package seal, maintain environment within 30°C, relative humidity less than 60%. Solder parts within days. parts will used immediately, repack them box, re-vacuum-seal them with desiccant. parts exposed more than days, silica telltale indicates moisture contamination, bake parts: When tape carrier, bake them temperature 95°C 100°C, hours. When loose metal tray) PCB, bake them temperature 110°C 120°C, hours. Note that reels become distorted they stack when baking. Confirm that parts have cooled room temperature after baking. Cleaning Instructions Sharp does recommend cleaning printed circuit boards containing this device. Process chemicals will affect structural optical characteristics this device. solder paste that does require cleaning. Avoid using ultrasonic cleaning possible. ultrasonic cleaning cannot avoided, verify process before beginning production. Compatible solvents water isopropyl alcohol. This device affected ultrasonic cleaning; factors considered size bath, ultrasonic output, duration, size PCB, device's mounting method. Sheet No.: DG-072009 GM5GC96270A Soldering Instructions When soldering with reflow methods, Sharp recommends following soldering profile Fig. subject package excessive mechanical force during soldering cause deformation defects plated connections. Internal connections severed mechanical force placed package flexing during soldering process. When using second reflow, second process should carried soon possible after first. Electrodes this part silver-plated. part exposed corrosive environment, plating damaged, thereby affecting solderability. Reflow Profile shown Fig. should considered maximum parameters. Since this part uses leads heatsinking, peak temperature should kept cool possible cooldown period lengthened much possible. Thermal conduction into will affected performance reflow process, verification reflow process recommended. These parts used nitrogen reflow process. Fig. Temperature Profile (MAX) Temperature (°C) 4°C/s 2.5°C/s (MAX) 120s 4°C/s Time (MAX) Recommended Solder Design Solderability depends reflow conditions, solder paste, circuit board materials. Check entire process before production commences. Fig. shows recommended solder pattern this part. When using back side methods, Sharp recommends checking process carefully: board warping from heat cause mechanical failure these parts, addition high heat conducted into part through leads. Performing reflow after recommended, with interval between short possible. Fig. Recommended Solder Pattern Product center NOTE: Unit: Sheet No.: DG-072009 GM5GC96270A Presence ODCs This product shall contain following materials, they used production process this product: Regulated substances: CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform). Specific brominated flame retardants such PBBOs PBBs used this product all. This product shall contain following materials banned RoHS Directive (2002/95/EC). Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: DG-072009 GM5GC96270A Important Notices circuit application examples this publication provided explain representative applications SHARP devices intended guarantee circuit design license intellectual property rights. SHARP takes responsibility problems related intellectual property right third party resulting from SHARP's devices. Contact SHARP order obtain latest device specification sheets before using SHARP device. SHARP reserves right make changes specifications, characteristics, data materials, structure, other contents described herein time without notice order improve design reliability. Manufacturing locations also subject change without notice. Observe following points when using devices this publication. SHARP takes responsibility damage caused improper devices which does meet conditions absolute maximum ratings used specified relevant specification sheet meet following conditions: devices this publication designed general electronic equipment designs such Personal computers Office automation equipment Telecommunication equipment (terminal) Test measurement equipment Industrial control Audio visual equipment Consumer electronics (ii) Measures such fail-safe function redundant design should taken ensure reliability safety when SHARP devices used connection with equipment that requires higher reliabilty such Transportation control safety equipment (i.e., aircraft, trains, automobiles, etc.) Traffic signals leakage sensor breakers Alarm equipment Various safety devices, etc. (iii) SHARP devices shall used connection with equipment that requires extremely high level reliability safety such Space applications Telecommunication equipment (trunk lines) Nuclear power control equipment Medical other life support equipment (e.g. scuba) SHARP devices listed this publication fall within scope strategic products described Foreign Exchange Foreign Trade Japan, necessary obtain approval export such SHARP devices. This publication proprietary product SHARP copyrighted, with rights reserved. Under copyright laws, part this publication reproduced transmitted form means, electronic mechanical, purpose, whole part, without express written permission SHARP. Express written permission also required before this publication made third party. Contact consult with SHARP representative there questions about contents this publication. 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