GNSG70-500E GNSG70-700E GNSG70-900E GNSG70-B00E STANDARD CHIP 70M
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SEMICONDUCTOR TECHNICAL SPECIFICATION
GNSG70-500E GNSG70-700E GNSG70-900E GNSG70-B00E
STANDARD CHIP 70MIL
PRODUCT SPECIFICATIONS
CHIPS GPP/SOLDERING TYPE TYPE: GNSG70 SERIES
CHIP APPEARANCE CHIP DIMENSIONS
CHIP SIZE
47mil 70mil
GNSG70-500E
GNSG70-700E
GNSG70-900E
GNSG70-B00E
mils
Contact area
mils
Total CHIP THICKNESS
mils
10.2mil
11mil
SOLDERABLE METALLIZATION
FEATURES Silicon chip with Boron Phosphorus dopants Solderable metallization Glass passivated junction
RATINGS Maximum Recurrent Peak Reverse Voltage Maximum Average Forward Rectified Current Derating Case Temperature Maximum Instantaneous Forward Voltage Maximum Average Reverse Current Rated Blocing Voltage Operating Temperature Range Storage Temperature Range TA=25OC TA=100OC
SYMBOL
GNSG70-500E
GNSG70-700E
GNSG70-900E
GNSG70-B00E 1000
UNITS Volts Amps Volts
uAmps
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