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PNP/PNP matched double transistor Rev. August 2009 Product data s
Top Searches for this datasheetBCM62B PNP/PNP matched double transistor Rev. August 2009 Product data sheet General description PNP/PNP matched double transistor SOT143B small Surface-Mounted Device (SMD) plastic package. Matched version BCV62. NPN/NPN equivalent: BCM61B Features Current gain matching Applications Current mirror Differential amplifier Quick reference data Table Symbol VCEO Quick reference data Parameter collector-emitter voltage current gain Conditions open base Unit transistor transistor device IC1/IE2 current matching VCE1 Tamb collector current -100 Device mounted Printed-Circuit Board (PCB), single-sided copper, tin-plated standard footprint. Semiconductors BCM62B PNP/PNP matched double transistor Pinning information Table Pinning Description collector TR2, base collector emitter emitter 006aaa843 Simplified outline Symbol Ordering information Table Ordering information Package Name BCM62B Description plastic surface-mounted package; leads Version SOT143B Type number Marking Table BCM62B made Hong Kong made Hong Kong made Malaysia made China Marking codes Marking code[1] Type number BCM62B_2 B.V. 2009. rights reserved. Product data sheet Rev. August 2009 Semiconductors BCM62B PNP/PNP matched double transistor Limiting values Table Limiting values accordance with Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBS Ptot device Ptot Tamb Tstg Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current total power dissipation total power dissipation junction temperature ambient temperature storage temperature Conditions open emitter open base single pulse; Tamb Tamb -100 -200 +150 +150 Unit transistor transistor Device mounted PCB, single-sided copper, tin-plated standard footprint. Thermal characteristics Table Symbol Rth(j-a) device Rth(j-a) Thermal characteristics Parameter thermal resistance from junction ambient thermal resistance from junction ambient Conditions free Unit transistor free Device mounted PCB, single-sided copper, tin-plated standard footprint. BCM62B_2 B.V. 2009. rights reserved. Product data sheet Rev. August 2009 Semiconductors BCM62B PNP/PNP matched double transistor Characteristics Table Characteristics Tamb unless otherwise specified. Symbol ICBO Parameter collector-base cut-off current Conditions IEBO emitter-base cut-off current current gain -100 VCEsat collector-emitter saturation voltage -0.5 -100 VBEsat base-emitter saturation voltage -0.5 -100 base-emitter voltage collector capacitance -0.5 -0.2 15.7 -0.2 kHz; BCM62B_2 Unit transistor -200 -760 -920 -650 -100 -200 -400 -700 -760 -600 emitter capacitance transition frequency noise figure B.V. 2009. rights reserved. Product data sheet Rev. August 2009 Semiconductors BCM62B PNP/PNP matched double transistor Table Characteristics .continued Tamb unless otherwise specified. Symbol VEBS Parameter emitter-base voltage Conditions device IC1/IE2 current matching VCE1 Tamb VCE1 Tamb VCE1 Tamb VCE1 Tamb Unit transistor 1.02 1.22 0.95 1.05 1.15 VBEsat decreases about mV/K with increasing temperature. decreases about mV/K with increasing temperature. Device mounted PCB, single-sided copper, tin-plated standard footprint. BCM62B_2 B.V. 2009. rights reserved. Product data sheet Rev. August 2009 Semiconductors BCM62B PNP/PNP matched double transistor -0.20 -0.16 006aaa832 (mA) -2.5 -2.25 006aaa833 -1.75 -1.5 -1.25 -0.12 -0.75 -0.5 -0.25 -0.08 -0.04 -10-2 -10-1 -102 -103 (mA) Tamb Tamb Tamb Tamb Collector current function collector-emitter voltage; typical values 006aaa834 current gain function collector current; typical values 006aaa835 -1.3 VBEsat -0.9 VCEsat -0.5 -10-1 -0.1 -10-1 -102 (mA) -103 -10-2 -10-1 -102 (mA) -103 IC/IB Tamb Tamb Tamb IC/IB Tamb Tamb Tamb Base-emitter saturation voltage function collector current; typical values Collector-emitter saturation voltage function collector current; typical values BCM62B_2 B.V. 2009. rights reserved. Product data sheet Rev. August 2009 Semiconductors BCM62B PNP/PNP matched double transistor -1.0 -0.8 006aaa836 006aaa837 (MHz) -0.6 -0.4 -10-1 -102 (mA) -103 (mA) -102 Tamb Tamb Base-emitter voltage function collector current; typical values 006aaa838 Transition frequency function collector current; typical values 006aaa839 (pF) (pF) MHz; Tamb MHz; Tamb Collector capacitance function collector-base voltage; typical values Emitter capacitance function emitter-base voltage; typical values BCM62B_2 B.V. 2009. rights reserved. Product data sheet Rev. August 2009 Semiconductors BCM62B PNP/PNP matched double transistor IC1/IE2 006aaa840 -10-1 (mA) -102 VCE1 VCE1 VCE1 Current matching function emitter current typical values Test information -VCE1 constant 006aaa841 Test circuit current matching BCM62B_2 B.V. 2009. rights reserved. Product data sheet Rev. August 2009 Semiconductors BCM62B PNP/PNP matched double transistor Package outline 0.45 0.15 0.88 0.78 Dimensions 0.48 0.38 0.15 0.09 04-11-16 Package outline SOT143B Packing information Table Packing methods indicated -xxx last three digits 12NC ordering code.[1] Type number Package BCM62B Description Packing quantity 3000 10000 -235 -215 SOT143B pitch, tape reel further information availability packing methods, Section BCM62B_2 B.V. 2009. rights reserved. Product data sheet Rev. August 2009 Semiconductors BCM62B PNP/PNP matched double transistor Soldering 3.25 0.60 (3x) 0.50 (3x) solder lands 0.60 (4x) 2.70 1.30 3.00 occupied area solder paste solder resist msa441 0.90 1.00 2.50 Dimensions Reflow soldering footprint SOT143B 4.45 1.20 1.15 4.00 4.60 solder lands solder resist occupied area Dimensions 1.00 3.40 preferred transport direction during soldering msa422 Dimensions Wave soldering footprint SOT143B BCM62B_2 B.V. 2009. rights reserved. Product data sheet Rev. August 2009 Semiconductors BCM62B PNP/PNP matched double transistor Revision history Table Revision history Release date 20090828 Data sheet status Product data sheet Change notice Supersedes BCM62B_1 Document BCM62B_2 Modifications: This data sheet changed reflect company name Semiconductors, including legal definitions disclaimers. changes were made technical content. Figure "Wave soldering footprint SOT143B":updated Product data sheet BCM62B_1 20060919 BCM62B_2 B.V. 2009. rights reserved. Product data sheet Rev. August 2009 Semiconductors BCM62B PNP/PNP matched double transistor Legal information 13.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet Product status[3] Development Qualification Production Definition This document contains data from objective specification product development. This document contains data from preliminary specification. This document contains product specification. Please consult most recently issued document before initiating completing design. term `short data sheet' explained section "Definitions". product status device(s) described this document have changed since this document published differ case multiple devices. latest product status information available Internet http://www.nxp.com. 13.2 Definitions Draft document draft version only. content still under internal review subject formal approval, which result modifications additions. Semiconductors does give representations warranties accuracy completeness information included herein shall have liability consequences such information. Short data sheet short data sheet extract from full data sheet with same product type number(s) title. short data sheet intended quick reference only should relied upon contain detailed full information. detailed full information relevant full data sheet, which available request local Semiconductors sales office. case inconsistency conflict with short data sheet, full data sheet shall prevail. damage. Semiconductors accepts liability inclusion and/or Semiconductors products such equipment applications therefore such inclusion and/or customer's risk. Applications Applications that described herein these products illustrative purposes only. Semiconductors makes representation warranty that such applications will suitable specified without further testing modification. Limiting values Stress above more limiting values defined Absolute Maximum Ratings System 60134) cause permanent damage device. Limiting values stress ratings only operation device these other conditions above those given Characteristics sections this document implied. Exposure limiting values extended periods affect device reliability. Terms conditions sale Semiconductors products sold subject general terms conditions commercial sale, published including those pertaining warranty, intellectual property rights infringement limitation liability, unless explicitly otherwise agreed writing Semiconductors. case inconsistency conflict between information this document such terms conditions, latter will prevail. offer sell license Nothing this document interpreted construed offer sell products that open acceptance grant, conveyance implication license under copyrights, patents other industrial intellectual property rights. Export control This document well item(s) described herein subject export control regulations. Export might require prior authorization from national authorities. Quick reference data Quick reference data extract product data given Limiting values Characteristics sections this document, such complete, exhaustive legally binding. 13.3 Disclaimers General Information this document believed accurate reliable. However, Semiconductors does give representations warranties, expressed implied, accuracy completeness such information shall have liability consequences such information. Right make changes Semiconductors reserves right make changes information published this document, including without limitation specifications product descriptions, time without notice. This document supersedes replaces information supplied prior publication hereof. Suitability Semiconductors products designed, authorized warranted suitable medical, military, aircraft, space life support equipment, applications where failure malfunction Semiconductors product reasonably expected result personal injury, death severe property environmental 13.4 Trademarks Notice: referenced brands, product names, service names trademarks property their respective owners. Contact information more information, please visit: http://www.nxp.com sales office addresses, please send email salesaddresses@nxp.com BCM62B_2 B.V. 2009. rights reserved. Product data sheet Rev. August 2009 Semiconductors BCM62B PNP/PNP matched double transistor Contents 13.1 13.2 13.3 13.4 Product profile General description. Features Applications Quick reference data. Pinning information Ordering information Marking Limiting values. Thermal characteristics. Characteristics Test information Package outline Packing information. Soldering Revision history Legal information. Data sheet status Definitions Disclaimers Trademarks Contact information. Contents Please aware that important notices concerning this document product(s) described herein, have been included section `Legal information'. B.V. 2009. rights reserved. more information, please visit: http://www.nxp.com sales office addresses, please send email salesaddresses@nxp.com Date release: August 2009 Document identifier: BCM62B_2 Other recent searchesSSM3J02F - SSM3J02F SSM3J02F Datasheet sr-1 - sr-1 sr-1 Datasheet SLED-56HF3 - SLED-56HF3 SLED-56HF3 Datasheet MCR100-8 - MCR100-8 MCR100-8 Datasheet LSD3222-XX-PF - LSD3222-XX-PF LSD3222-XX-PF Datasheet DDS-505-008 - DDS-505-008 DDS-505-008 Datasheet A31T15 - A31T15 A31T15 Datasheet
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