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BF824 medium frequency transistor Product data sheet Supersedes d


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BF824 medium frequency transistor
Product data sheet Supersedes data 1999 2004
Semiconductors
Product data sheet
medium frequency transistor
FEATURES current (max. voltage (max. APPLICATIONS stages front-ends common base configuration. DESCRIPTION medium frequency transistor SOT23 plastic package.
BF824
PINNING base emitter collector DESCRIPTION
handbook, halfpage
MARKING TYPE NUMBER BF824 Note Made Hong Kong. Made Malaysia. Made China. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BF824 DESCRIPTION plastic surface mounted package; leads MARKING CODE(1)
view
MAM256
Fig.1 Simplified outline (SOT23) symbol.
VERSION SOT23
2004
Semiconductors
Product data sheet
medium frequency transistor
LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 60134). SYMBOL VCBO VCEO VEBO Ptot Tstg Tamb Note Transistor mounted printed-circuit board. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Note Transistor mounted printed-circuit board. CHARACTERISTICS unless otherwise specified. SYMBOL ICBO IEBO PARAMETER collector cut-off current emitter cut-off current current gain base-emitter voltage feedback capacitance transition frequency CONDITIONS MIN. TYP. PARAMETER thermal resistance from junction ambient CONDITIONS note VALUE PARAMETER collector-base voltage collector-emitter voltage emitter-base voltage collector current (DC) peak collector current total power dissipation storage temperature junction temperature operating ambient temperature Tamb note CONDITIONS open emitter open base open collector MIN. MAX. +150 +150
BF824
UNIT
UNIT
MAX. -100 -900
UNIT
2004
Semiconductors
Product data sheet
medium frequency transistor
PACKAGE OUTLINE
Plastic surface-mounted package; leads
BF824
SOT23
detail
scale
DIMENSIONS original dimensions) UNIT max. 0.48 0.38 0.15 0.09 0.95 0.45 0.15 0.55 0.45
OUTLINE VERSION SOT23
REFERENCES JEDEC TO-236AB JEITA
EUROPEAN PROJECTION
ISSUE DATE 04-11-04 06-03-16
2004
Semiconductors
Product data sheet
medium frequency transistor
DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet Notes Please consult most recently issued document before initiating completing design. PRODUCT STATUS(2) Development Qualification Production DEFINITION
BF824
This document contains data from objective specification product development. This document contains data from preliminary specification. This document contains product specification.
product status device(s) described this document have changed since this document published differ case multiple devices. latest product status information available Internet http://www.nxp.com. DISCLAIMERS General Information this document believed accurate reliable. However, Semiconductors does give representations warranties, expressed implied, accuracy completeness such information shall have liability consequences such information. Right make changes Semiconductors reserves right make changes information published this document, including without limitation specifications product descriptions, time without notice. This document supersedes replaces information supplied prior publication hereof. Suitability Semiconductors products designed, authorized warranted suitable medical, military, aircraft, space life support equipment, applications where failure malfunction Semiconductors product reasonably expected result personal injury, death severe property environmental damage. Semiconductors accepts liability inclusion and/or Semiconductors products such equipment applications therefore such inclusion and/or customer's risk. Applications Applications that described herein these products illustrative purposes only. Semiconductors makes representation warranty that such applications will suitable specified without further testing modification. Limiting values Stress above more limiting values defined Absolute Maximum Ratings System 60134) cause permanent damage device. Limiting values stress ratings only operation device these other conditions above those given Characteristics sections this document implied. Exposure limiting values extended periods affect device reliability. Terms conditions sale Semiconductors products sold subject general terms conditions commercial sale, published including those pertaining warranty, intellectual property rights infringement limitation liability, unless explicitly otherwise agreed writing Semiconductors. case inconsistency conflict between information this document such terms conditions, latter will prevail. offer sell license Nothing this document interpreted construed offer sell products that open acceptance grant, conveyance implication license under copyrights, patents other industrial intellectual property rights. Export control This document well item(s) described herein subject export control regulations. Export might require prior authorization from national authorities. Quick reference data Quick reference data extract product data given Limiting values Characteristics sections this document, such complete, exhaustive legally binding.
2004
Semiconductors
Customer notification This data sheet changed reflect company name Semiconductors, including legal definitions disclaimers. changes were made technical content, except package outline drawings which were updated latest version.
Contact information additional information please visit: http://www.nxp.com sales offices addresses send e-mail salesaddresses@nxp.com
B.V. 2009 rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Printed Netherlands R75/04/pp6 Date release: 2004 Document order number: 9397 12415

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