HMICSilicon Diode Switch with Integrated Bias Network Features Br

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HMICSilicon Diode Switch with Integrated Bias Network Features Br

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MASW-005102-13600
HMICSilicon Diode Switch with Integrated Bias Network Features
Broad Bandwidth Specified Usable Integrated Bias Network Insertion Loss High Isolation Rugged, Glass Encapsulated Construction Fully Monolithic
RoHS Compliant* 260°C Reflow Compatible
Rev.
Description
MASW-005102-13600 device SP5T broadband switch with integrated bias network utilizing M/A-COM Technology Solutions HMIC(Heterolithic Microwave Integrated Circuit) process, Patent 5,268,310. This process allows incorporation silicon pedestals that form series shunt diodes vias imbedding them loss, dispersion glass. using small spacing between elements, this combination silicon glass gives HMIC devices loss high isolation performance with exceptional repeatability through millimeter frequencies. Large bond pads facilitate inductance ribbon bonds, while gold backside metallization allows manual automatic chip bonding 80/20 Au/Sn, 62/36/2 Sn/Pb/Ag solders electrically conductive silver epoxy.
Yellow areas denote wire bond pads
Parameter Operating Temperature Storage Temperature Junction Temperature Applied Reverse Voltage
Absolute Maximum -65oC +125oC -65oC +150oC +175oC +33dBm C.W. ±20mA
Applications
These high performance switches suitable multi-band ECM, Radar, instrumentation control circuits where high isolation insertion loss ratios required. With standard +5V/-5V, controlled diode driver, 80nS switching speeds achieved.
Incident Power Bias Current +25°C
Note: Maximum operating conditions combination power, D.C. bias temperature: +33dBm 15mA (per diode) @+85°C
Restrictions Hazardous Substances, European Union Directive 2002/95/EC.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.
MASW-005102-13600
HMICSilicon Diode Switch with Integrated Bias Network MASW-005102-13600 (SP5T) Electrical Specifications TAMB +25oC, 10mA Bias current
PARAMETER FREQUENCY BAND 2GHz 6GHZ 12GHz 18GHz 2GHz 6GHZ 12GHz 18GHz 6GHZ 12GHz 18GHz 2GHz 6GHZ 12GHz 18GHz 10GHz UNITS
Rev.
INSERTION LOSS
ISOLATION
INPUT RETURN LOSS
OUTPUT RETURN LOSS
SWITCHING SPEED
Note:
1.Typical switching speed measured from detected signal driven compatible drivers using output spiking network, 560pF.
Operation MASW-005102-13600
Operation MASW Series switches achieved simultaneous application negative current loss port positive current remaining isolated switching ports Driver Connections table below. control currents should supplied constant current sources. insertion loss, -10mA bias results approximately -2V, Isolation ,+10mA yields approximately +0.9V respective bias nodes. backside area return ground plane.
Driver Connections
CONTROL LEVEL CURRENT) -10mA +10mA +10mA +10mA +10mA
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.
CONDITION OUTPUT +10mA +10mA +10mA +10mA -10mA J2-J1 Loss Isolation Isolation Isolation Isolation J3-J1 Isolation J4-J1 Isolation J5-J1 Isolation Isolation Isolation Loss Isolation J6-J1 Isolation Isolation Isolation Isolation Loss
+10mA -10mA +10mA +10mA +10mA
+10mA +10mA -10mA +10mA +10mA
+10mA +10mA +10mA -10mA +10mA
Loss Isolation Isolation Loss Isolation Isolation Isolation Isolation
MASW-005102-13600
HMICSilicon Diode Switch with Integrated Bias Network
Rev.
MASW-005102-13600 TYPICAL INSERTION LOSS
0.00 -1.00 -2.00
-3.00 -4.00 -5.00 2.00
4.00
6.00
8.00
10.00
12.00
14.00
16.00
18.00
FREQUENCY
MASW-005102-13600 TYPICAL ISOLATION
0.00 -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00
FREQUENCY
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.
MASW-005102-13600
HMICSilicon Diode Switch with Integrated Bias Network
Rev.
MASW-005102-13600 TYPICAL INPUT RETURN LOSS
0.00 -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 2.00
4.00
6.00
8.00
10.00
12.00
14.00
16.00
18.00
FREQUENCY
MASW5102-13600 TYPICAL OUTPUT RETURN LOSS
0.00 -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 2.00
4.00
6.00
8.00
10.00
12.00
14.00
16.00
18.00
FREQUENCY
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.
MASW-005102-13600
HMICSilicon Diode Switch with Integrated Bias Network
Rev.
MASW-005102-13600 Schematic
(Input Common Port)
Bias
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.
MASW-005102-13600
HMICSilicon Diode Switch with Integrated Bias Network
Rev.
MASW-005102-13600 Chip Outline Drawing1,2
Mils
Millimeters
Bond Pads (J1-J6) Bond Pads (B2B6) Chip Thickness Notes:
118.5 120.5 .007 .005 REF. .005 .005 REF. 0.005 REF.
1.37 1.40 0.69 0.71 0.76 0.79 0.79 0.81 0.48 0.51 3.01 3.06 0.89 0.91 .178 .127 REF. .127 .127 REF. 0.127 REF.
Topside backside metallization gold 2.5µm thick typical. Yellow areas indicate wire bonding pads
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.
MASW-005102-13600
HMICSilicon Diode Switch with Integrated Bias Network
Rev.
Wire/Ribbon Attachment Recommendations
Cleanliness
These chips should handled clean environment.
Wire Bonding
Thermosonic wedge wire bonding using 0.00025" 0.003" ribbon 0.001" diameter gold wire recommended. heat stage temperature 150oC force grams should used. Ultrasonic energy should adjusted minimum required achieve good bond. bond wires should kept short straight possible.
Mounting
HMIC switches have Ti-Pt-Au back metal. They mounted with gold-tin eutectic solder preform conductive epoxy. Mounting surface must clean flat.
Eutectic Attachment
80/20, gold-tin, eutectic solder preform recommended with work surface temperature 255oC tool temperature 265oC. When applied, tool temperature should 290oC. chip should exposed temperatures greater than 320oC more than seconds. more than three seconds should required attachment. Solders containing should used.
Epoxy Attachment
minimum amount epoxy should used. thin epoxy fillet should visible around perimeter chip after placement. Cure epoxy manufacturer's schedule. (typically 125-150oC).
Ordering Information
Part Number MASW-005102-13600W
Package Waffle Pack
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.

HMICSilicon Diode Switch with Integrated Bias Network Features Br

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