HMICSilicon Diode Switch RoHs Compliant FEATURES Ultra Broad Band
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MASW-005100-1194
HMICSilicon Diode Switch RoHs Compliant FEATURES
Ultra Broad Bandwidth: 50MHz 26GHz Insertion Loss Isolation 20GHz Reliable. Fully Monolithic Glass Encapsulated Construction +33dBm Input Power
DESCRIPTION
MASW-005100-1194 SP5T Series-Shunt broad band switch made with M/A-COM's HMIC(Heterolithic Microwave Integrated Circuit) process, Patent 5,268,310. This process allows incorporation silicon pedestals that form series shunt diodes vias imbedding them loss, dispersion glass. This hybrid combination Silicon Glass gives HMIC Switches exceptional loss remarkable high isolation through millimeter-wave frequencies.
APPLICATIONS
These high performance switches suitable multi-band ECM, Radar, instrumentation control circuits where high isolation insertion loss ratios required. With standard V/-5 controlled diode driver, 50ns switching speeds achieved.
ABSOLUTE MAXIMUM RATINGS
TAMB +25°C Unless otherwise specified
PARAMETER OPERATING TEMPERATURE STORAGE TEMPERATURE C.W. INCIDENT POWER BIAS CURRENT FORWARD APPLIED VOLTAGE REVERSE VALUE 65°C +150°C 65°C +175°C +33dBm 20mA
Note:Exceeding these values result permanent damage. Maximum operating conditions combination power, D.C. bias temperature: +30dBm C.W., 15mA diode @+85°C
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-005100-1194
HMICSilicon Diode Switch RoHs Compliant
TYPICAL DRIVER CONNECTIONS
CONTROL LEVEL CURRENT
CONDITION OUTPUT
J2-J1
Loss
J3-J1 Isolation
Loss
J4-J1 Isolation Isolation
Loss
J5-J1 Isolation Isolation Isolation
Loss
J6-J1 Isolation Isolation Isolation Isolation
Loss
Isolation Isolation Isolation Isolation
Isolation Isolation Isolation
Isolation Isolation
Isolation
Electrical Specifications TAMB 25°C, bias current (on-wafer measurements)
SPECIFICATIONS PARAMETER INSERTION LOSS ISOLATION INPUT RETURN LOSS OUTPUT RETURN LOSS SWITCHING SPEED FREQUENCY 20GHz 20GHz 20GHz 20GHz 10GHz
UNITS
Note: Typical switching speed measured from detected voltage driven compatible driver. Driver output parallel network uses capacitor between 390pF 560pF resistor between achieve 50ns rise fall times.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-005100-1194
HMICSilicon Diode Switch RoHs Compliant
Typical Microwave Performance
INSERTION LOSS
0.000 LOSS -0.200 -0.400 -0.600 -0.800 -1.000 10.0 12.0 14.0 16.0 18.0 20.0 FREQUENCY
ISOLATION
ISOLATION
10.0 12.0 14.0 16.0 18.0 20.0
FREQUENCY
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-005100-1194
HMICSilicon Diode Switch RoHs Compliant
Typical Microwave Performance
OUTPUT RETURN LOSS
0.000 -5.000 LOSS -10.000 -15.000 -20.000 -25.000 -30.000 -35.000 -40.000 10.0 12.0 14.0 16.0 18.0 20.0
FREQUENCY
INPUT RETURN LOSS -10. -15. LOSS -20. (dB) -25. -30. -35. -40. 10.0 12.0 14.0 16.0 18.0 20.0
FREQUENCY
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-005100-1194
HMICSilicon Diode Switch RoHs Compliant
Operation MASW-005100-1194 Switch
simultaneous application negative current Loss Port positive current remaining Isolated Ports shown Figure achieves operation MASW-005100-1194 diode switch. backside area return ground plane. return achieved common Port Constant current sources should supply control currents. voltages these points will exceed ±1.5 volts (1.2 volts typical) supply currents Loss state, Series Diode must forward biased Shunt Diode reverse biased. isolated ports, Shunt Diode forward biased Series Diode reverse biased. bias network design should yield isolation. Best Insertion Loss, P1dB, IP3, switching speed achieved using voltage pull-up resistor return path, minimum value recommended this return node, which achievable with standard controlled diode driver. typical bias schematic 2-18 operation shown Figure
Bias Network Schematic
Bias
HMIC Switch
Fig.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-005100-1194
HMICSilicon Diode Switch RoHs Compliant ASSEMBLY INSTRUCTIONS
Cleanliness These chips should handled clean environment free organic contamination. Electro-Static Sensitivity MASW-00 Series switches ESD, Class sensitive (HBM). proper handling procedures must used.
Wire Bonding
Thermosonic wedge wire bonding using 0.003" 0.00025" ribbon 0.001" diameter gold wire recommended. stage temperature 150°C force grams should used. Ultrasonic energy should adjusted minimum required. ribbon wire bonds should kept short possible minimize parasitic inductance.
Mounting
These chips have Ti-Pt-Au back metal. They mounted with 80Au/20Sn electrically conductive epoxy. Mounting surface must flat clean oils contaminants.
Eutectic Attachment 80/20 gold-tin eutectic solder preform recommended with work surface temperature 255°C tool temperature 265°C. When applied, tool temperature should 290°C. chip should exposed temperatures greater than 320°C more than seconds. more than seconds should required attachment. Silver Epoxy Attachment Assembly should preheated 125°C-150°C. Controlled thickness mils recommended best electrical thermal conductivity. thin epoxy fillet should visible around perimeter chip after placement ensure complete coverage. Cure epoxy manufacturer's recommended schedule.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-005100-1194
HMICSilicon Diode Switch RoHs Compliant
MASW-005100-1194 Chip Dimensions
Chip Dimensions*
INCHES 0.0680 0.0340 0.0580 0.0370 0.0295 0.0295 0.0325 .005 .005 0.005 1723 1473
Pads Thickness
*All chip dimension tolerances ±.0005"
ORDERING INFORMATION
Part Number
MASW-005100-11940W MASW-005100-11940G
Package
Waffle Pack
Pack
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
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