HMICSP4T Surface Mount Silicon Diode Switch RoHS Compliant Rev.

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

HMICSP4T Surface Mount Silicon Diode Switch RoHS Compliant Rev.

Datasheet Thumbnail

Top Searches for this datasheet

MASW-004240-13170W
HMICSP4T Surface Mount Silicon Diode Switch RoHS Compliant
Rev.
Frequency Operation 2GHz 2GHz Surface Mount Device Integrated Bias Network Wire Bonds Required Current Consumption State/0V Condition Rugged, Glass Encapsulated Construction Fully Monolithic Polymer Scratch Protection
Description
MASW-004240-13170W surface mount SP4T switch chip with integrated bias network. utilizes M/A-COM's HMIC(Heterolithic Microwave Integrated Circuit) process, Patent 5,268,310, which allows incorporation silicon pedestals that form series shunt diodes vias imbedding them loss, dispersion glass. using small spacing between elements, this combination silicon glass gives HMIC devices loss high isolation performance with exceptional repeatability through millimeter frequencies. Patterned gold backside metal allows manual re-flow soldering without need wire bond connections bias ports. chip soldered using 80Au/20Sn, RoHS compliant solders electrically conductive silver epoxy. bond pads labeled J1-J5 375x375µM (15x15mils) square. bias bond pads labeled B2-B5 also 375x375µM (15x15mils) square.
Yellow areas denote backside soldering points bias connections.
Parameter Operating Temperature Storage Temperature Junction Temperature Applied Forward Current Incident Power Mounting Temperature
Absolute Maximum -65oC +125oC -65oC +150oC +175oC +40mA +30dBm C.W. +280 Seconds
Applications
MASW-004240-13170W been designed 24GHz automotive radar sensor applications also ideally suited 10GHz. switch turned applying forward current +12mA appropriate bias port turned bias network been incorporated into design ease space considerations.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-004240-13170W
HMICSP4T Surface Mount Silicon Diode Switch RoHS Compliant
Rev.
MASW-004240-13170W (SP4T) Electrical Specifications TAMB +25oC
Parameter
Frequency 10GHz 24GHz
Port
Port
Stimulus 12mA 12mA 12mA 12mA 12mA 12mA 12mA 12mA 12mA 12mA 12mA 12mA
Minimum
Typical
Maximum 3.5dB 3.5dB 3.5dB 3.5dB
Insertion Loss
Isolation
10GHz 24GHz
40dB 40dB 40dB 40dB
Input Return Loss
10GHz 24GHz
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-004240-13170W
HMICSP4T Surface Mount Silicon Diode Switch RoHS Compliant
Rev.
TYPICAL INSERTION LOSS
-0.5 -1.0
TYPICAL ISOLATION
Insertion Loss
-1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5 -5.0
Isolation (dB)
Frequency (GHz)
Frequency (Ghz)
TYPICAL INPUT RETURN LOSS
TYPICAL OUTPUT RETURN LOSS
utput Return Loss
Input Return Loss (dB)
Frequency (GHz)
Frequency (GHz)
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-004240-13170W
HMICSP4T Surface Mount Silicon Diode Switch RoHS Compliant
Rev.
MASW-004240-13170W Schematic
Operation MASW-004240-13170W
Operation MASW-00420-13170W diode switch achieved simultaneously applying current +12mA bias port remaining isolated arms.
Driver Connections
Control Level Current Port
-12mA
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
Condition Output
J1-J2 Loss Isolation Isolation Isolation J1-J3 Isolation Loss Isolation Isolation J1-J4 Isolation Isolation Loss Isolation J1-J5 Isolation Isolation Isolation Loss
-12mA
-12mA
-12mA
changes product(s) information contained herein without notice.
MASW-004240-13170W
HMICSP4T Surface Mount Silicon Diode Switch RoHS Compliant
Rev.
Chip Dimensions Locations1,2,3
Chip Dimensions Mils Millimeters Min. Min. 132.0 134.0 3.350 3.400 128.5 129.0 3.270 3.280 0.102 0.152 67.0 71.0 0.170 0.180 14.5 15.0 0.370 0.380 43.3 43.7 1.100 1.110 28.3 28.7 0.720 0.730 10.0 0.245 0.255
R.F. ground
Bond Centers Mils Millimeters -1.450 1.450 -1.450 1.450 1.450 -1.450 1.450 -1.450 -0.145 1.450 0.380 0.313 1.450 -0.313 1.450 -1.450 0.380
Notes:
Backside metallization thickness is.01µM. Hatched areas indicate backside ohmic gold contacts Bond centers referenced from chip center.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-004240-13170W
HMICSP4T Surface Mount Silicon Diode Switch RoHS Compliant
Rev.
Attachment Handling Guidelines
Handling
semiconductor chips should handled with care avoid damage contamination from perspiration skin oils. plastic tipped tweezers vacuum pickups strongly recommended individual components. Bulk handling should insure that abrasion mechanical shock minimized.
Bonding
Attachment circuit board made simple through surface mount technology. Mounting pads conveniently located bottom surface these devices removed from active junction locations. These devices well suited solder conductive epoxy attachment onto hard soft substrates. 60Pb/40Sn, 80Au/20Sn RoHS lead-free solder recommended achieve lowest series resistance optimum heat sink. When soldering these devices oven re-flow process preferred. recommend utilizing vacuum applying downward force grams surface device. When soldering, position that mounting pads aligned with circuit board mounting pads reflow solder heating circuit trace near mounting pads while applying grams force perpendicular surface die. mounting pads should heated simultaneously that solder under pads flows same time. Avoid soldering pads time doing would produce un-equal heat flow potentially create thermal stress chip. Solder reflow should performed causing heat flow through surface die. should uniformly heated re-flow oven. typical heating profile handling instructions provided Application Notes, M538 Surface Mounting Instructions M541 Bonding Handling Procedures MA-COM website www.macom.com Conductive silver epoxy also used attachment, lower Incident power applications where average power <1W. Apply thin controlled amount approximately mils thick minimize ohmic thermal stresses. Take care bridge between chip pads with epoxy. thin epoxy fillet should visible around perimeter pads after placement ensure full coverage. Cure epoxy manufacturer's recommended schedule. Typically 150°C hour.
Ordering Information
Part Number MASW-004240-13170W Package Waffle Pack
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.

HMICSP4T Surface Mount Silicon Diode Switch RoHS Compliant Rev.

Top Searches for this datasheet

Other recent searches