HMICSilicon Diode Switch RoHs Compliant Ultra Broad Bandwidth: 50

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HMICSilicon Diode Switch RoHs Compliant Ultra Broad Bandwidth: 50

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MASW-004100-1193
HMICSilicon Diode Switch RoHs Compliant
Ultra Broad Bandwidth: 50MHz 26GHz Insertion Loss 34dB Isolation 20GHz 50nS Switching Speed Reliable, Fully Monolithic, Glass Encapsulated Construction +33dBm Power Handling
Description
MASW-004100-1193 SP4T series-shunt broad band switch made with M/A-COM's unique HMIC(Heterolithic Microwave Integrated Circuit) process, Patent 5,268,310. This process allows incorporation silicon pedestals that form series shunt diodes vias imbedding them loss, dispersion glass. This hybrid combination silicon glass gives HMIC switches exceptional loss remarkable high isolation through millimeter-wave frequencies.
Applications
These high performance switches suitable multi-band ECM, radar, instrumentation control circuits where high isolation insertion loss ratios required. With standard +5V/-5V, controlled diode driver, 50nS switching speeds achieved.
Absolute Maximum Ratings
TAMB +25°C Unless Otherwise Specified
Parameter Operating Temperature Storage Temperature C.W. Incident Power 20mA) Bias Current Forward Applied Voltage Reverse
Value -65°C +125°C -65°C +150°C +33dBm 20mA Volts
Notes:
Exceeding these limits cause permanent damage.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-004100-1193
HMICSilicon Diode Switch RoHs Compliant
Typical Driver Connections
Condition Output J1-J2 Loss Isolation Isolation Isolation Condition Output J1-J3 Isolation Loss Isolation Isolation Condition Output J1-J4 Isolation Isolation Loss Isolation Condition Output J1-J5 Isolation Isolation Isolation Loss
Control Level Current Port -20mA +20mA +20mA +20mA +20mA -20mA +20mA +20mA +20mA +20mA -20mA +20mA +20mA +20mA +20mA -20mA
Electrical Specifications TAMB +25oC, 20mA Bias Current (On-Wafer Measurements)
Parameter Insertion Loss Isolation Input Return Loss Output Return Loss Switching Speed
Frequency
Minimum
Nominal
Maximum
Units
Notes:
Typical switching speed measured from detected voltage driven compatible driver. Driver output parallel network uses capacitor between 390pF 560pF resistor between achieve 50nS rise fall times.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-004100-1193
HMICSilicon Diode Switch RoHs Compliant
Operation MASW-004100-1193 Switch
Operation MASW-004100-1193 switch achieved simultaneous application negative current loss port positive current remaining isolated switching ports shown Figure backside area return ground plane. return achieved common port, control currents should supplied constant current source. voltages these points will exceed ±1.5 volts (1.2 volts typical) supply currents loss state, series diode must forward biased shunt diode reverse biased. isolated ports, shunt diode forward biased series diode reverse biased. bias network design should yield isolation. Best insertion loss, P1dB, IP3, switching speed achieved using voltage pull-up resistor return path, minimum value |-2V| recommended this return node, which achievable with standard,
Bias Network Schematic
Bias 22nH
22nH
HMIC Switch
Fig.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-004100-1193
HMICSilicon Diode Switch RoHs Compliant
Typical Microwave Performance
MASW-004100-1193 INSERTION LOSS
Loss (dB) -0.5 -1.0 -1.5 -2.0 10.0 15.0 Frequency (GHz) 20.0 25.0 30.0
J1-J2 J1-J3 J1-J4 J1-J5
MASW-004100-1193 INPUT RETURN LOSS
Loss (dB)
J1-J2 J1-J3 J1-J4 J1-J5
Frequency (GHz)
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-004100-1193
HMICSilicon Diode Switch RoHs Compliant
Typical Microwave Performance
MASW-004100-1193 OUTPUT RETURN LOSS
Loss(dB) Frequency (GHz)
MASW-004100-1193 ISOLATION
Isolation (dB) Frequency (GHz)
J1-J2 J1-J3 J1-J4 J1-J5
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-004100-1193
HMICSilicon Diode Switch RoHs Compliant
ASSEMBLY INSTRUCTIONS
Cleanliness
These chips should handled clean environment free organic contamination.
Electro-Static Sensitivity
MASW-00 Series switches ESD, Class sensitive (HBM). proper handling procedures must used.
Wire Bonding
Thermosonic wedge wire bonding using 0.003" 0.00025" ribbon 0.001" diameter gold wire recommended. stage temperature 150°C force grams should used. Ultrasonic energy should adjusted minimum required achieve good bond. wire ribbon bonds should kept short possible minimize parasitic inductance.
Mounting
These chips have Ti-Pt-Au back metal. They mounted with 80Au/20Sn electrically conductive epoxy. Mounting surface must flat clean oils contaminants.
Eutectic Attachment
80/20 gold-tin eutectic solder preform recommended with work surface temperature 255°C tool temperature 265°C. When applied, tool temperature should 290°C. chip should exposed temperatures greater than 320°C more than seconds. more than seconds should required attachment.
Silver Epoxy Attachment
Assembly should preheated 125°C-150°C. Controlled thickness mils recommended best electrical thermal conductivity. thin epoxy fillet should visible around perimeter chip after placement ensure complete coverage. Cure epoxy manufacturer's recommended schedule.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-004100-1193
HMICSilicon Diode Switch RoHs Compliant
MASW-004100-1193 Chip Dimensions
Thickness Bond Pads
INCHES NOMINAL .066 .047 .054 .012 .043 .009 .004 .004 .033 .061 .005 .005X.005
NOMINAL 1.67 1.19 1.37 0.31 1.08 0.22 0.11 0.11 0.84 1.56 .120 0.120X.0120
Notes:
Topside backside metallization gold 2.5mm thick typical. Yellow areas indicate wire bonding pads
Ordering Information
Part Number
MASW-004100-11930W MASW-004100-11930G
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
Package
Waffle Pack
Pack
changes product(s) information contained herein without notice.

HMICSilicon Diode Switch RoHs Compliant Ultra Broad Bandwidth: 50

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