HMICSilicon Diode Switches with Integrated Bias Network Features

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HMICSilicon Diode Switches with Integrated Bias Network Features

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MASW-002102-13580 MASW-003102-13590
HMICSilicon Diode Switches with Integrated Bias Network Features
Broad Bandwidth Specified Usable Integrated Bias Network Insertion Loss High Isolation Rugged Fully Monolithic Glass Encapsulate Construction RoHS Compliant* 260°C Reflow Compatible
Rev.
MASW-002102-13580
Description
MASW-002102-13580 MASW-003102-13590 devices SP2T SP3T broad band switches with integrated bias networks utilizing M/A-COM Technology Solutions HMIC(Heterolithic Microwave Integrated Circuit) process, Patent 5,268,310. This process allows incorporation silicon pedestals that form series shunt diodes vias imbedding them loss, dispersion glass. using small spacing between elements, this combination silicon glass gives HMIC devices loss high isolation performance with exceptional repeatability through millimeter frequencies. Large bond pads facilitate inductance ribbon bonds, while gold backside metallization allows manual automatic chip bonding 80/20 Au/Sn, 62/36/2 Sn/Pb/Ag solders electrically conductive silver epoxy.
MASW-003102-13590
Parameter Operating Temperature Storage Temperature Junction Temperature Applied Reverse Voltage Incident Power Bias Current +25°C
Absolute Maximum -65oC +125oC -65oC +150oC +175oC +33dBm C.W. ±20mA
Max. operating conditions combination power, D.C. bias temperature: +33dBm 15mA (per diode) @+85°C
Yellow areas denote wire bond pads
Restrictions Hazardous Substances, European Union Directive 2002/95/EC.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.
MASW-002102-13580 MASW-003102-13590
HMICSilicon Diode Switches with Integrated Bias Network
MASW-002102-13580 (SPDT) Electrical Specifications TAMB +25oC, 20mA Bias current
Rev.
Parameter
Frequency
Minimum
Nominal
0.70 0.90
Maximum
Units
Insertion Loss
13.0
Isolation
Input Return Loss Switching Speed
MASW-003102-13590 (SP3T) Electrical Specifications TAMB +25oC, 20mA Bias current
Parameter
Frequency
Minimum
Nominal
Maximum
Units
Insertion Loss
Isolation
Input Return Loss Switching Speed1 Note:
Typical switching speed measured from detected signal driven compatible drivers using output spiking network, 560pF.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.
MASW-002102-13580 MASW-003102-13590
HMICSilicon Diode Switches with Integrated Bias Network Typical Performance +25°C, 20mA Bias Current
ISOLATION FREQUENCY MASW-002102-13580
Rev.
ISOLATION FREQUENCY MASW-003102-13590 ISOLATION,
ISOLATION,
FREQUENCY,
FREQUENCY,
INSERTION LOSS FREQUENCY MASW-002102-13580 INSERTION LOSS,
INSERTION LOSS,
INSERTION LOSS FREQUENCY MASW-003102-13590
FREQUENCY,
FREQUENCY,
RETURN LOSS FREQUENCY MASW-003102-13590
RETURN LOSS,
FREQUENCY,
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.
MASW-002102-13580 MASW-003102-13590
HMICSilicon Diode Switches with Integrated Bias Network
MASW-002102-13580 Junction Temperature Incident Power
Rev.
Series Diode_5mA Series Diode_10mA Series Diode_20mA Series Diode_40mA
Tjunction Deg.
10.00
15.00
20.00
25.00
30.00
35.00
C.W. Incident Power
MASW-002102-13580 Compression Power Incident Power
0.80
0.70
Series Diode_5mA Series Diode_10mA Series Diode_20mA
0.60
Series Diode_40mA
pression
0.50 0.40 0.30 0.20
0.10
0.00 10.00
15.00
20.00
25.00
30.00
35.00
C.W. Incident Power
Note: diodes MASW-002102-13580 MASW-003102-13590 have same electrical characteristics will have similar performance.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.
MASW-002102-13580 MASW-003102-13590
HMICSilicon Diode Switches with Integrated Bias Network
Rev.
Operation MASW-002102-13580 MASW-003102-13590
Operation MASW-002102-13580 MASW-003102-13590 diode switches achieved simultaneous application currents bias pads. required levels different states shown tables below. on-chip pull-up resistor shown schematic below, value must taken into consideration when defining drive circuitry.
Driver Connections MASW-002102-13580
Condition Output Loss Isolation Condition Output Isolation Loss
Driver Connections MASW-003102-13590
Control Level Condition Condition Condition Output Output Output Loss Isolation Isolation Isolation Loss Isolation Isolation Isolation Loss
Control Level -20mA +20mA +20mA -20mA
-20mA +20mA +20mA -20mA +20mA +20mA +20mA -20mA
Equivalent Circuit MASW-002102-13580
Equivalent Circuit MASW-003102-13590
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.
MASW-002102-13580 MASW-003102-13590
HMICSilicon Diode Switches with Integrated Bias Network
Rev.
Wire/Ribbon Attachment Recommendations
Wire Bonding
Thermosonic wedge wire bonding using 0.00025" 0.003" ribbon 0.001" diameter gold wire recommended. heat stage temperature 150oC force grams should used. Ultrasonic energy should adjusted minimum required achieve good bond. bond wires should kept short straight possible.
Mounting
HMIC switches have Ti-Pt-Au back metal. They mounted with gold-tin eutectic solder preform conductive epoxy. Mounting surface must clean flat. Eutectic Attachment: 80/20, gold-tin, eutectic solder preform recommended with work surface temperature 255oC tool temperature 265oC. When applied, tool temperature should 290oC. chip should exposed temperatures greater than 320oC more than seconds. more than three seconds should required attachment. Solders containing should used. Epoxy Attachment: minimum amount epoxy should used. thin epoxy fillet should visible around perimeter chip after placement. Cure epoxy manufacturer's schedule (typically 125150oC).
MASW-002102-13580 Chip Outline Drawing1,2
INCHES 0.066 0.048 0.004 0.004 0.012 0.029 0.030 0.029 0.005 0.005 0.070 0.052 0.006 0.006 0.013 0.030 0.031 0.030 REF. REF. MILLIMETERS 1.680 1.230 0.100 0.090 0.292 0.735 0.766 0.732 0.129 0.129 1.780 1.330 0.150 0.140 0.317 0.760 0.791 0.757 REF. REF.
Notes:
Topside backside metallization gold, 2.5um thick typical. Yellow areas indicate wire bonding pads
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.
MASW-002102-13580 MASW-003102-13590
HMICSilicon Diode Switches with Integrated Bias Network
Rev.
MASW-003102-13590 Chip Outline Drawing1,2
INCHES 0.0697 0.0693 0.0039 0.0310 0.0289 0.0055 0.0035 0.0044 0.0338 0.0632 0.0660 0.0051 0.0046 0,0736 0.0732 0.0059 0.0319 0.0299 0.0075 0.0055 0.0064 0.0358 0.0652 0.0680 REF. REF. MILLIMETERS 1.770 1.760 0.100 0.787 0.734 0.140 0.089 0.113 0.859 1.610 1.680 0.1290 0.1180 1.870 1.860 0.150 0.812 0.759 0.190 0.139 0.163 0.909 1.660 1.730 REF. REF.
Notes:
Topside backside metallization gold 2.5um thick typical. Yellow areas indicate wire bonding pads
Ordering Information
Part Number MASW-002102-13580G MASW-003102-13590G Package Pack Pack
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400 considering development. Performance based target specifications, simulated results, India Tel: +91.80.43537383 China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment develop guaranteed. Visit www.macomtech.com additional data sheets product information. PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed. changes product(s) information contained herein without notice.

HMICSilicon Diode Switches with Integrated Bias Network Features

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