SURMOUNT Diode Switch Element with Thermal Terminal Specified Ban

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SURMOUNT Diode Switch Element with Thermal Terminal Specified Ban

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MASW-001150-1316
SURMOUNT Diode Switch Element with Thermal Terminal
Specified Bandwidth: 30MHz-2.5GHz Useable 3.0GHz Loss <0.5dB High isolation >40dB High C.W. Incident Power, 500MHz Unique Thermal Terminal Series Diode Surface Mount Device Wire Bonds) Rugged Silicon-Glass Construction Silicon Nitride Passivation Protective Polymer Scratch Protection RoHS Compliant
Description
This device diode series-shunt switch element with unique integrated thermal terminal dissipating heat series diode created input power. thermal terminal allows optimum heat dissipation providing direct thermal path from series diode circuit thermal ground while also being electrically isolated. chip designed provide heat transfer conduit that does interfere with diode anode (input) cathode (output) electrical terminals, especially with respect performance. silicon-glass diode chip fabricated using M/A-COM Technology Solutions patented HMICprocess. This device features silicon pedestals embedded loss, dispersion glass. Selective backside metallization applied producing surface mount device. topside fully encapsulated with silicon nitride additional polymer layer protect against damage during handling assembly.
Ordering Information
Part Number MASW-001150-13160W MASW-001150-13160P Package WAFFLE PACK POCKET TAPE
Reference Application Note M513 reel size information.
Absolute Maximum Ratings
Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Temperature Dissipated Power C.W. Incident Power Mounting Temperature Absolute Maximum 100mA 180V -55°C +125°C -55°C +150°C +175°C 500MHz, 500MHz, +260°C seconds Class Class Class
Applications
This diode series-shunt switch element particularly advantageous higher average power, switch applications from 30MHZ 3000GHz. addition, backside D.C., thermal ports allow direct solder re-flow attachments micro-strip circuit surface mount assembly. particular interest, thermal terminal which provides power dissipating series diode direct connection circuit thermal ground unprecedented heat transfer. This thermal terminal electrically isolated from other ports. chip configured either reflective absorptive switch.
North America Tel: 800.366.2266 Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 Solutions under development. Performance based engineering tests. Specifications Visit www.macomtech.com additional data sheets product information. typical. Mechanical outline been fixed. Engineering samples and/or test data available. Commitment produce volume guaranteed. M/A-COM Technology Solutions Inc. affiliates reserve right make changes product(s) information contained herein without notice.
MASW-001150-1316
SURMOUNT Diode Switch Element with Thermal Terminal
Electrical Specifications TAMB +25°C Symbol
Series Series Shunt Shunt Series Series Series Series Shunt Shunt RqJL
Parameter
Total Capacitance Total Capacitance Total Capacitance Total Capacitance Series Resistance Series Resistance Series Resistance Series Resistance Series Resistance Series Resistance Forward Voltage Forward Voltage Reverse Leakage Current Thermal Resistance Series Minority Carrier Lifetime
Conditions
-25V ,30MHz -25V, 1800MHz -25V, 30MHz -25V, 1800MHz 20mA, 30MHz 20mA,1800MHz 50mA, 30MHz 50mA,1800MHz 10mA, 30MHz 10mA, 1800MHz 20mA 50mA -180V Steady State 10mA/IR-6mA
Units
°C/W
Typical
0.52 0.37 0.54 0.39 1.13 1.25 0.93 1.07 1.00 0.99 0.82 0.88 36.0
Maximum
0.85 0.90 -10.0
Measured from control voltage output voltage
Parameter Units
Insertion Loss
Port
50mA 50mA 50mA 50mA 50mA 50mA 50mA 50mA 50mA
Port
-25V -25V -25V -25V -25V -25V +25V +25V +25V
Conditions
30MHz 1000MHZ 2500MHz 30MHz 1000MHZ 2500MHz 30MHz 1000MHZ 2500MHz -50mA -25V 500MHz 505MHz +40dBm(each tone) 50mA -25V 500MHz /+35dBm 50mA -25V 500MHz /+35dBm
Minimum
Typical
0.07 0.30 0.60
Maximum
0.10 0.45 0.80
Return Loss
Isolation
Input
50mA
-25V
Harmonic Harmonic
50mA 50mA
-25V -25V
North America Tel: 800.366.2266 Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 Solutions under development. Performance based engineering tests. Specifications Visit www.macomtech.com additional data sheets product information. typical. Mechanical outline been fixed. Engineering samples and/or test data available. Commitment produce volume guaranteed. M/A-COM Technology Solutions Inc. affiliates reserve right make changes product(s) information contained herein without notice.
MASW-001150-1316
SURMOUNT Diode Switch Element with Thermal Terminal
Typical Small Signal Performance
MASW-001150-13160 Insertion Loss, Isolation, Return Loss From 45-3000
Isolation_+5mA Return loss_-50 Insertion Loss_-50mA
-0.1 -0.2 Insertion Loss (dB) -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 Frequency (GHz)
Isolation Return Loss (dB)
North America Tel: 800.366.2266 Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 Solutions under development. Performance based engineering tests. Specifications Visit www.macomtech.com additional data sheets product information. typical. Mechanical outline been fixed. Engineering samples and/or test data available. Commitment produce volume guaranteed. M/A-COM Technology Solutions Inc. affiliates reserve right make changes product(s) information contained herein without notice.
MASW-001150-1316
SURMOUNT Diode Switch Element with Thermal Terminal
Note:
bias circuits provided schematic above assumes current sources available. only voltage sources available, resistor will need added Input (J1) Bias Return Network. When using D.C. voltage 25V, resistor must used draw 50mA current into switch.
North America Tel: 800.366.2266 Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 Solutions under development. Performance based engineering tests. Specifications Visit www.macomtech.com additional data sheets product information. typical. Mechanical outline been fixed. Engineering samples and/or test data available. Commitment produce volume guaranteed. M/A-COM Technology Solutions Inc. affiliates reserve right make changes product(s) information contained herein without notice.
MASW-001150-1316
SURMOUNT Diode Switch Element with Thermal Terminal
Note:
bias circuits provided schematic above assumes current sources available. only voltage sources available, resistor will need added Input (J1) Bias Return Network. When using D.C. voltage 25V, resistor must used draw 50mA current into switch.
North America Tel: 800.366.2266 Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 Solutions under development. Performance based engineering tests. Specifications Visit www.macomtech.com additional data sheets product information. typical. Mechanical outline been fixed. Engineering samples and/or test data available. Commitment produce volume guaranteed. M/A-COM Technology Solutions Inc. affiliates reserve right make changes product(s) information contained herein without notice.
MASW-001150-1316
SURMOUNT Diode Switch Element with Thermal Terminal
Thermal Circuit Footprint Topview
+0/-2
Output Trace Direction Output
+0/-2
Input
Input Trace Direction
Thermal Terminal
Shunt Cathode Return
Thermal Circuit Vias Ground Trace Direction
North America Tel: 800.366.2266 Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 Solutions under development. Performance based engineering tests. Specifications Visit www.macomtech.com additional data sheets product information. typical. Mechanical outline been fixed. Engineering samples and/or test data available. Commitment produce volume guaranteed. M/A-COM Technology Solutions Inc. affiliates reserve right make changes product(s) information contained herein without notice.
MASW-001150-1316
SURMOUNT Diode Switch Element with Thermal Terminal
Chip Outline Port Designations
View
Dimension Inches min. max. 0.0665 0.0673 0.0665 0.0673 0.0045 0.0053 0.0195 0.0205 0.0195 0.0205 0.0195 0.0205 0.0195 0.0205 Millimeters min. max. 1.69 1.71 1.69 1.71 0.115 0.135 0.495 0.520 0.495 0.520 0.495 0.520 0.495 0.520
Ports
Function Input Thermal Terminal Series Diode (Electrically isolated from other ports) Shunt Diode (Cathode Return) Output D.C. bias
Notes:
Backside Metal: 2.5m thick Hatched yellow areas ports (die solder pads)
Bottom View
Ordering Information
Part Number
MASW-001150-13160W MASW-001150-13160P
North America Tel: 800.366.2266 Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 Solutions under development. Performance based engineering tests. Specifications Visit www.macomtech.com additional data sheets product information. typical. Mechanical outline been fixed. Engineering samples and/or test data available. Commitment produce volume guaranteed. M/A-COM Technology Solutions Inc. affiliates reserve right make changes product(s) information contained herein without notice.
Packaging
Waffle Tray Pocket Tape
MASW-001150-1316
SURMOUNT Diode Switch Element with Thermal Terminal
Component
Value 0.01F 100pF 390nH
Case Size 0402 0402 0603
Manufacturer Murata Murata Coilcraft
Ordering Information Test Board Part Number
MASW-001150-001SMB
North America Tel: 800.366.2266 Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 Solutions under development. Performance based engineering tests. Specifications Visit www.macomtech.com additional data sheets product information. typical. Mechanical outline been fixed. Engineering samples and/or test data available. Commitment produce volume guaranteed. M/A-COM Technology Solutions Inc. affiliates reserve right make changes product(s) information contained herein without notice.
MASW-001150-1316
SURMOUNT Diode Switch Element with Thermal Terminal
Assembly Guidelines
Handling
semiconductor chips should handled with care avoid damage contamination from perspiration skin oils. plastic tipped tweezers vacuum pickups strongly recommended individual components. Bulk handling should insure that abrasion mechanical shock minimized.
Bonding
Attachment circuit board made simple through surface mount technology. Mounting pads conveniently located bottom surface these devices removed from active junction locations. These devices well suited solder conductive epoxy attachment onto hard soft substrates. 60/40, Pb/Sn, 80/20, Au/Sn RoHS lead-free solder recommended achieve lowest series resistance optimum heat sink. thermal terminal electrically conductive soldered directly appropriate heat sink without affecting performance. When soldering these devices hard substrate, bonding preferred. recommend utilizing vacuum applying force grams surface device. When soldering, position that mounting pads aligned with circuit board mounting pads reflow solder heating circuit trace near mounting pads while applying grams force perpendicular surface die. mounting pads should heated simultaneously that solder under pads flows same time. Avoid soldering pads time doing would produce un-equal heat flow potentially create thermal stress chip. Solder reflow should performed causing heat flow through surface die. should uniformly heated re-flow oven. Proper flow easily determined looking down from since HMIC glass transparent edges mounting pads visually inspected through after attachment complete. typical soldering process profile handling instructions provided Application Notes, M538 Surface Mounting Instructions M541 Bonding Handling Procedures MA-COM Technology Solutions website www.macomtech.com Conductive silver epoxy also used attachment, lower Incident power applications where average power <1W. Apply thin controlled amount approximately mils thick minimize ohmic thermal stresses. Take care bridge between chip pads with epoxy. thin epoxy fillet should visible around perimeter pads after placement ensure full coverage. Cure epoxy manufacturer's recommended schedule.
North America Tel: 800.366.2266 Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 Solutions under development. Performance based engineering tests. Specifications Visit www.macomtech.com additional data sheets product information. typical. Mechanical outline been fixed. Engineering samples and/or test data available. Commitment produce volume guaranteed. M/A-COM Technology Solutions Inc. affiliates reserve right make changes product(s) information contained herein without notice.

SURMOUNT Diode Switch Element with Thermal Terminal Specified Ban

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