Broad Bandwidth Specified from 50MHz 20GHz Usable from 50MHz 26.5GHz L
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MASW-001100-1190 MASW-002100-1191 MASW-003100-1192 HMICSilicon Diode Switches RoHs Compliant
Broad Bandwidth Specified from 50MHz 20GHz Usable from 50MHz 26.5GHz Lower Insertion Loss Higher Isolation than pHempt Rugged Fully Monolithic, Glass Encapsulated Construction +33dBm C.W. Power Handling Rev.
MASW-001100-1190
Description
MASW-001100-1190, MASW-002100-1191 MASW-003100-1192 broadband monolithic switches using series shunt connected silicon diodes. They designed high performance switches applications 26.5GHz. They provide performance levels superior those realized hybrid designs incorporating beamlead chip diodes that require chip wire assembly. These switches fabricated using M/A-COM's patented HMIC(Heterolithic Microwave Integrated Circuit) process, Patent 5,268,310. This process allows incorporation silicon pedestals that form series shunt diodes vias imbedding them loss, dispersion glass. using small spacing between elements, this combination silicon glass gives HMIC devices loss high isolation performance through millimeter frequencies. Large bond pads facilitate inductance ribbon leads, while gold backside metallization allows manual automatic chip bonding 80/20, AuSn solder conductive epoxy. Parameter Operating Temperature Storage Temperature Junction Temperature Applied Reverse Voltage C.W. Incident Power Bias Current +25°C Absolute Maximum -65oC +125oC -65oC +150oC +175oC +33dBm C.W. ±20mA
MASW-002100-1191
MASW-003100-1192
operating Conditions Combination Power, D.C. Bias Temperature: +33dBm 15mA (per diode) @+85°C
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-001100-1190 MASW-002100-1191 MASW-003100-1192 HMICSilicon Diode Switches RoHs Compliant
MASW-001100-1190 (SPST) Electrical Specifications +25oC, 20mA Bias
Parameter
Insertion Loss
Rev.
Frequency
6GHz 13GHz 20GHz 6GHz 13GHz 20GHz 6GHz 13GHz 20GHz 1GHz
Minimum
Nominal
Maximum
Units
Isolation
Input Return Loss Switching Speed1 Voltage Rating2 Signal Compression (500mW)
MASW-002100-1191 (SPDT) Electrical Specifications +25oC, 20mA Bias
Parameter
Insertion Loss
Typical Switching Speed measured from detected signal driven compatible drivers. Maximum reverse leakage current either shunt series diodes shall 10mA maximum volts.
Frequency
6GHz 13GHz 20GHz 6GHz 13GHz 20GHz 6GHz 13GHz 20GHz 1GHz
Minimum
Nominal
Maximum
Units
Isolation
Input Return Loss Switching Speed1 Voltage Rating2 Signal Compression (500mW)
MASW-003100-1192 (SP3T) Electrical Specifications +25oC, 20mA Bias
Parameter
Insertion Loss
Typical Switching Speed measured from detected signal driven compatible drivers. Maximum reverse leakage current either shunt series diodes shall 10mA maximum volts.
Frequency
6GHz 13GHz 20GHz 6GHz 13GHz 20GHz 6GHz 13GHz 20GHz 1GHz
Minimum
Nominal
Maximum
Isolation
Input Return Loss Switching Speed1 Voltage Rating2 Signal Compression (500mW)
Units
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-001100-1190 MASW-002100-1191 MASW-003100-1192 HMICSilicon Diode Switches RoHs Compliant Typical Performance Curves +25°C, 20mA Bias Current
MASW-001100-1190 RETURN LOSS FREQUENCY
-0.2
Rev.
MASW-001100-1190 INSERTION LOSS FREQUENCY
INSERTION LOSS
-0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9
RETURN LOSS (dB)
Output Return Loss
Input Return Loss
FREQUENCY (GHz)
FREQUENCY (GHz)
MASW-002100-1191 RETURN LOSS FREQUENCY
MASW-002100-1191 INSERTION LOSS FREQUENCY
-0.2
INSERTION LOSS
-0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9
RETURN LOSS (dB)
Output Return Loss
Input Return Loss
FREQUENCY (GHz)
FREQUENCY (GHz)
MASW-003100-1192 RETURN LOSS FREQUENCY
MASW-003100-1192 INSERTION LOSS FREQUENCY
-0.3
INSERTION LOSS
-0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1.1 -1.2
RETURN LOSS (dB)
Output Return Loss
Input Return Loss
FREQUENCY (GHz)
FREQUENCY (GHz)
S-Parameters: S-Parameter data these devices available upon request.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-001100-1190 MASW-002100-1191 MASW-003100-1192 HMICSilicon Diode Switches RoHs Compliant Typical Performance Curves +25°C, 20mA Bias Current
MASW-001100-1190 ISOLATION FREQUENCY
Rev.
INPUT RETURN LOSS BIAS CURRENT
INPUT RETURN LOSS
ISOLATION (dB)
CURRENT
OUTPUT RETURN LOSS BIAS CURRENT@
OUTPUT RETURN LOSS
-21.5 -22.5 -23.5 -24.5 -25.5
FREQUENCY (GHz)
MASW-002100-1191 ISOLATION FREQUENCY
ISOLATION (dB)
CURRENT
INSERTION LOSS BIAS CURRENT
-0.35
INSERTION LOSS
-0.4 -0.45 -0.5 -0.55 -0.6 -0.65 -0.7
FREQUENCY (GHz)
MASW-003100-1192 ISOLATION FREQUENCY
CURRENT (mA)
ISOLATION (dB)
ISOLATION BIAS CURRENT
ISOLATION
FREQUENCY (GHz)
CURRENT (mA)
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-001100-1190 MASW-002100-1191 MASW-003100-1192 HMICSilicon Diode Switches RoHs Compliant
Operation MASW Series Switches
Operation MASW series switches achieved simultaneous application negative current loss switching positive current remaining switching arms shown bias connection circuits. return achieved control currents should supplied constant current sources. voltages these points will exceed +1.5 volts (1.2V typical) currents +20mA. loss state, series diode must forward biased shunt diode reverse biased. isolated arm, shunt diode forward biased series diode reverse biased.
INPUT
Rev. MASW-001100-1190 Bias Connections1
20pF
20nH BIAS 20pF 20nH
20pF
20pF
Switch Chip
OUTPUT
Driver Connections
MASW-001100-1190
Control Level Current)
-20mA +20mA
Condition Output
J1-J2 Loss Isolation
MASW-002100-1191 Bias Connections1
INPUT 20pF BIAS 20nH BIAS
MASW-002100-1191
Control Level Current)
-20mA +20mA +20mA -20mA
20nH 20pF 20pF 20nH 20pF
Condition Output
J1-J2 Loss Isolation
Condition Output
J1-J3 Isolation Loss
20pF OUTPUT
Switch Chip
20pF
OUTPUT
MASW-003100-1192
Control Level Current)
-20mA +20mA +20mA +20mA -20mA +20mA +20mA +20mA -20mA
MASW-003100-1192 Bias Connections1
INPUT 20pF BIAS 20nH BIAS
Cond. Cond. Cond. Output Output Output
J1-J2 Loss Isolation Isolation J1-J3 Isolation Loss Isolation J1-J4 Isolation Isolation Loss
20pF 20nH 20pF
20nH 20pF
20pF OUTPUT
20pF
OUTPUT
Handling Considerations
Cleanliness: These chips should handled clean environment. Electro-Static Sensitivity: MASW series switches ESD, Class sensitive (HBM). proper handling procedures should used.
20pF 20nH BIAS 20pF OUTPUT
Notes: values operation frequency 2-18GHz bias current 20mA diode.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-001100-1190 MASW-002100-1191 MASW-003100-1192 HMICSilicon Diode Switches RoHs Compliant
Wire Bonding
Thermosonic wedge wire bonding using 0.003" 0.00025" ribbon 0.001" diameter gold wire recommended. heat stage temperature approximately 200oC force grams should used. Ultrasonic energy should adjusted minimum required achieve good bond. bond wires should kept short possible. Rev.
Mounting
HMIC switches have TiPtAu back metal. They mounted with gold-tin eutectic solder preform conductive epoxy. Mounting surface must clean flat. Eutectic Attachment: 80/20 gold-tin eutectic solder preform recommended with work surface temperature 255oC tool temperature 265oC. When applied, tool temperature should 290oC. chip should exposed temperatures greater than 320oC more than seconds. more than three seconds should required attachment. Solders containing should used. Epoxy Attachment: Surface assembly should preheated 125-150oC. minimum amount epoxy should used. thin epoxy fillet should visible around perimeter chip after placement. Cure epoxy manufacturer's schedule.
Chip Outline Drawing1,2
INCHES MIN. MAX. 0.018 0.029 MIN. 0.35 0.64
MAX. 0.45 0.74
0.014 0.025
0.008 0.004 0.006
0.20 0.10 0.15
0.004 0.003 0.003 0.020
0.10 0.08 0.08 0.52
Notes:
Topside backside surface metallization gold, 2.5m thick typical. Yellow areas indicate wire bonding pads.
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-001100-1190 MASW-002100-1191 MASW-003100-1192 HMICSilicon Diode Switches RoHs Compliant
Rev.
Chip Outline Drawing1,2
MASW-002100-1191
MIN. 0.029 0.004
INCHES MAX. 0.033 0.006 MIN. 0.73 0.10
MAX. 0.83 0.15 0.10 0.13 0.23 0.58 0.17 0.10
0.004 0.005 0.009 0.023 0.007 0.004
Notes:
Topside backside surface metallization gold 2.5m thick typical. Yellow areas indicate wire bonding pads
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-001100-1190 MASW-002100-1191 MASW-003100-1192 HMICSilicon Diode Switches RoHs Compliant
Rev.
Chip Outline Drawing
MASW-003100-1192
MIN.
INCHES MAX. MIN. 0.046 0.050 0.036 0.040 0.019 0.014 0.004 0.005 0.004 0.006 0.005 0.004
MAX. 1.16 1.26 0.92 1.02 0.48 0.36 0.10 0.13 0.10 0.15 0.12 0.10
Notes:
Topside backside surface metallization gold 2.5m thick typical. Yellow areas indicate wire bonding pads
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
MASW-001100-1190 MASW-002100-1191 MASW-003100-1192 HMICSilicon Diode Switches RoHs Compliant
Rev.
Ordering Information
Part Number
MASW-001100-11900W MASW-001100-11900G MASW-002100-11910W MASW-002100-11910G MASW-003100-11920W MASW-003100-11920G
Package
Waffle Pack
Pack
Waffle Pack Pack Waffle Pack Pack
ADVANCED: Data Sheets contain information regarding product M/A-COM Technology Solutions North America Tel: 800.366.2266 Fax: 978.366.2266 considering development. Performance based target specifications, simulated results, Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 and/or prototype measurements. Commitment develop guaranteed. Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding product M/A-COM Technology Visit www.macomtech.com additional data sheets product information. Solutions under development. Performance based engineering tests. Specifications typical. Mechanical outline been fixed. Engineering samples and/or test data available. M/A-COM Technology Solutions Inc. affiliates reserve right make Commitment produce volume guaranteed.
changes product(s) information contained herein without notice.
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