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IPP070N06N IPI070N06N OptiMOS® Power-Transistor Features gat
Top Searches for this datasheetIPB070N06N IPP070N06N IPI070N06N OptiMOS® Power-Transistor Features gate charge fast switching applications N-channel enhancement normal level operating temperature Avalanche rated Pb-free lead plating, RoHS compliant Product Summary DS(on),max SMDversion Type IPB070N06N IPP070N06N IPI070N06N Type IPB066N06N Package IPP066N06N Marking Package PG-TO263-3 P-TO263-3-2 070N06N P-TO220-3-1 Marking PG-TO220-3 066N06N 070N06N 066N06N PG-TO262-3 070N06N Maximum ratings, j=25 unless otherwise specified Parameter Continuous drain current Symbol Conditions C=25 °C1) C=100 Pulsed drain current Avalanche energy, single pulse D,pulse C=25 °C2) D=80 GS=25 D=80 DS=48 =200 A/s, j,max=175 Value Unit Reverse diode kV/s Gate source voltage Power dissipation Operating storage temperature climatic category; 68-1 C=25 55/175/56 Current limited bondwire; with thJC=0.6 chip able carry figure Rev. page 2007-09-13 IPB070N06N IPP070N06N IPI070N06N Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics Thermal resistance, junction case version, device thJC thJA minimal footprint cooling area3) Electrical characteristics, j=25 unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current (BR)DSS GS=0 GS(th) DS=V D=180 DS=60 GS=0 j=25 DS=60 GS=0 j=125 Gate-source leakage current Drain-source on-state resistance DS(on) GS=20 DS=60 GS=10 D=80 GS=10 D=80 version Gate resistance Transconductance DS|>2|I DS(on)max, D=80 0.01 Device epoxy with (one layer, thick) copper area drain connection. vertical still air. Rev. page 2007-09-13 IPB070N06N IPP070N06N IPI070N06N Parameter Symbol Conditions min. Values typ. max. Unit Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate source charge Gate charge threshold Gate drain charge Switching charge Gate charge total Gate plateau voltage Output charge Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge d(on) d(off) DD=30 GS=10 D=80 G=3.3 GS=0 DS=30 3100 4100 1100 g(th) plateau DD=30 GS=0 DD=30 D=80 GS=0 S,pulse C=25 GS=0 F=80 j=25 R=30 F/dt =100 0.95 figure gate charge parameter definition Rev. page 2007-09-13 IPB070N06N IPP070N06N IPI070N06N Power dissipation tot=f(T Drain current D=f(T [°C] [°C] Safe operating area D=f(V DS); C=25 parameter: limited on-state resistance Max. transient thermal impedance thJC=f(t parameter: thJC [K/W] 0.05 0.02 0.01 single pulse 10-1 10-2 10-5 10-4 10-3 10-2 10-1 Rev. page 2007-09-13 IPB070N06N IPP070N06N IPI070N06N Typ. output characteristics D=f(V DS); j=25 parameter: Typ. drain-source resistance DS(on)=f(I j=25 parameter: DS(on) Typ. transfer characteristics D=f(V GS); DS|>2|I DS(on)max parameter: Typ. forward transconductance fs=f(I j=25 125°C Rev. page 2007-09-13 IPB070N06N IPP070N06N IPI070N06N Drain-source on-state resistance DS(on)=f(T D=80 GS=10 Typ. gate threshold voltage GS(th)=f(T GS=V parameter: 1800 180A DS(on) GS(th) [°C] [°C] Typ. capacitances =f(V DS); GS=0 Forward characteristics reverse diode F=f(V parameter: Ciss 175°C [pF] Coss 25°C Crss 10-1 Rev. page 2007-09-13 IPB070N06N IPP070N06N IPI070N06N Avalanche characteristics AS=f(t AV); GS=25 parameter: j(start) Typ. gate charge GS=f(Q gate); D=80 pulsed parameter: gate [nC] Drain-source breakdown voltage BR(DSS)=f(T Gate charge waveforms BR(DSS) s(th) g(th) [°C] Rev. page 2007-09-13 IPB070N06N IPP070N06N IPI070N06N PG-TO-263-3 Rev. page 2007-09-13 IPB070N06N IPP070N06N IPI070N06N PG-TO220-3: Outline Rev. page 2007-09-13 IPB070N06N IPP070N06N IPI070N06N PG-TO262-3: Outline Rev. page 2007-09-13 IPB070N06N IPP070N06N IPI070N06N Published Infineon Technologies 81726 Munich, Germany Infineon Technologies 2007. 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Infineon Technologies Components only used life-support devices systems with express written approval Infineon Technologies, failure such components reasonably expected cause failure that life-support device system, affect safety effectiveness that device system. Life support devices systems intended implanted human body, support and/or maintain sustain and/or protect human life. they fail, reasonable assume that health user other persons endangered. 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