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IPI06CNE8N IPP06CNE8N OptiMOS®2 Power-Transistor Features N-
Top Searches for this datasheetIPB06CNE8N IPI06CNE8N IPP06CNE8N OptiMOS®2 Power-Transistor Features N-channel, normal level Excellent gate charge DS(on) product (FOM) Very on-resistance DS(on) operating temperature Pb-free lead plating; RoHS compliant Qualified according JEDEC1) target application Product Summary DS(on),max (TO263) Ideal high-frequency switching synchronous rectification Type IPB06CNE8N IPI06CNE8N IPP06CNE8N Package Marking PG-TO263-3 06CNE8N PG-TO262-3 06CNE8N PG-TO220-3 06CNE8N Maximum ratings, j=25 unless otherwise specified Parameter Continuous drain current Symbol Conditions C=25 °C2) C=100 Pulsed drain current3) Avalanche energy, single pulse Reverse diode Gate source voltage4) Power dissipation Operating storage temperature climatic category; 68-1 D,pulse C=25 C=25 D=100 GS=25 D=100 DS=68 =100 A/µs, j,max=175 Value 55/175/56 kV/µs Unit Rev. 1.05 page 2008-06-23 IPB06CNE8N IPI06CNE8N IPP06CNE8N Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics Thermal resistance, junction case Thermal resistance, junction ambient thJC thJA minimal footprint cooling area5) Electrical characteristics, j=25 unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current (BR)DSS GS=0 GS(th) DS=V D=180 DS=68 GS=0 j=25 DS=68 GS=0 j=125 Gate-source leakage current Drain-source on-state resistance DS(on) GS=20 DS=0 GS=10 D=100 TO220, TO262 GS=10 D=100 TO263 Gate resistance Transconductance DS|>2|I DS(on)max, D=100 J-STD20 JESD22 Current limited bondwire; with thJC=0.7 chip able carry figure Tjmax=150 duty cycle D=0.01 Vgs<-5V Device epoxy with (one layer, thick) copper area drain connection. vertical still air. Rev. 1.05 page 2008-06-23 IPB06CNE8N IPI06CNE8N IPP06CNE8N Parameter Symbol Conditions min. Values typ. max. Unit Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate source charge Gate drain charge Switching charge Gate charge total Gate plateau voltage Output charge Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge d(on) d(off) DD=40 GS=10 D=50 G=1.6 GS=0 DS=40 6950 1310 9240 1740 plateau DD=40 GS=0 DD=40 D=100 GS=0 S,pulse C=25 GS=0 F=100 j=25 R=40 F/dt =100 A/µs figure gate charge parameter definition Rev. 1.05 page 2008-06-23 IPB06CNE8N IPI06CNE8N IPP06CNE8N Power dissipation tot=f(T Drain current D=f(T GS10 [°C] [°C] Safe operating area D=f(V DS); C=25 parameter: Max. transient thermal impedance thJC=f(t parameter: 0.05 0.02 0.01 single pulse thJC [K/W] 10-1 10-3 10-5 10-4 10-3 10-2 10-1 Rev. 1.05 page 2008-06-23 IPB06CNE8N IPI06CNE8N IPP06CNE8N Typ. output characteristics D=f(V DS); j=25 parameter: Typ. drain-source resistance DS(on)=f(I j=25 parameter: DS(on) Typ. transfer characteristics D=f(V GS); DS|>2|I DS(on)max parameter: Typ. forward transconductance fs=f(I j=25 Rev. 1.05 page 2008-06-23 IPB06CNE8N IPI06CNE8N IPP06CNE8N Drain-source on-state resistance DS(on)=f(T D=100 GS=10 Typ. gate threshold voltage GS(th)=f(T GS=V parameter: 1800 DS(on) GS(th) [°C] [°C] Typ. capacitances =f(V DS); GS=0 Forward characteristics reverse diode F=f(V parameter: Ciss Coss [pF] Crss Rev. 1.05 page 2008-06-23 IPB06CNE8N IPI06CNE8N IPP06CNE8N Avalanche characteristics AS=f(t AV); GS=25 parameter: j(start) 1000 Typ. gate charge GS=f(Q gate); D=100 pulsed parameter: 1000 [µs] gate [nC] Drain-source breakdown voltage BR(DSS)=f(T Gate charge waveforms BR(DSS) s(th) g(th) [°C] Rev. 1.05 page 2008-06-23 IPB06CNE8N IPI06CNE8N IPP06CNE8N PG-TO220-3: Outline Rev. 1.05 page 2008-06-23 IPB06CNE8N IPI06CNE8N IPP06CNE8N PG-TO262-3-1 Rev. 1.05 page 2008-06-23 IPB06CNE8N IPI06CNE8N IPP06CNE8N PG-TO-263 Rev. 1.05 page 2008-06-23 IPB06CNE8N IPI06CNE8N IPP06CNE8N Published Infineon Technologies 81726 Munich, Germany 2008 Infineon Technologies Rights Reserved. Legal Disclaimer information given this document shall event regarded guarantee conditions characteristics. With respect examples hints given herein, typical values stated herein and/or information regarding application device, Infineon Technologies hereby disclaims warranties liabilities kind, including without limitation, warranties non-infringement intellectual property rights third party. Information further information technology, delivery terms conditions prices, please contact nearest Infineon Technologies Office (www.infineon.com). Warnings technical requirements, components contain dangerous substances. information types question, please contact nearest Infineon Technologies Office. Infineon Technologies components used life-support devices systems only with express written approval Infineon Technologies, failure such components reasonably expected cause failure that life-support device system affect safety effectiveness that device system. Life support devices systems intended implanted human body support and/or maintain sustain and/or protect human life. they fail, reasonable assume that health user other persons endangered. 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