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BTM7751G TrilithIC Automotive Power BTM7751G Table
Top Searches for this datasheetData Sheet, Rev. 1.0, June 2008 BTM7751G TrilithIC Automotive Power BTM7751G Table Contents Table Contents Overview Configuration Assignment Terms Block Diagram Circuit Description Input Circuit Output Stages Short Circuit Protection Overtemperature Protection Undervoltage Lockout Open Load Detection Status Flag Electrical Characteristics Absolute Maximum Ratings Functional Range Thermal Resistance Electrical Characteristics Application Information Package Outlines Revision History Data Sheet Rev. 1.0, 2008-06-27 TrilithIC BTM7751G Features Overview Quad D-MOS switch driver Free configurable bridge quad-switch Optimized motor management applications High side: typ. 25°C, max. 150°C side: typ. 25°C, max. 150°C Maximum peak current: typ. Very quiescent current: typ. Small outline, enhanced power PG-DSO-package Operates frequencies Status flag diagnosis Short-circuit-protection Overtemperature shut down with hysteresis Internal clamp diodes Open load detection Off-mode Under-voltage detection with hysteresis Green Product (RoHS compliant) Qualified PG-DSO-28-22 Description BTM7751G part TrilithIC family containing three dies package: double high-side switch low-side switches. drains these three vertical DMOS chips mounted separated lead frames. sources connected individual pins, BTM7751G used H-bridge- well other configuration. Both double high-side low-side switches BTM7751G manufactured SMART SIPMOS® technology which combines vertical DMOS power stages with CMOS circuitry control, protection diagnosis. Type BTM7751G Data Sheet Package PG-DSO-28-22 Marking BTM7751G Rev. 1.0, 2008-06-27 BTM7751G Configuration Assignment N.C. DHVS LS-Leadframe HS-Leadframe DHVS DHVS LS-Leadframe DHVS N.C. Figure Assignment BTM7751G (Top View) Data Sheet Rev. 1.0, 2008-06-27 BTM7751G Table 16,17 20,21 22,23 26,27 Definitions Functions Symbol Function N.C. N.C. Drain low-side switch1, lead frame Analog input low-side switch1 connected Drain high-side switches power supply voltage, lead frame Ground Digital input high-side switch1 Status high-side switches; open Drain output Digital input high-side switch2 connected Drain low-side switch2, lead frame Analog input low-side switch2 Source low-side switch2 Source high-side switch2 Source high-side switch1 Source low-side switch1 DHVS reduce thermal resistance these pins direct connected metal bridges lead frame. Pins written bold type need power wiring. Data Sheet Rev. 1.0, 2008-06-27 BTM7751G Terms VS=12V 470nF 100µF IFH1,2 DHVS 5,10,19,24 VDSH2 -VFH2 Diagnosis Biasing Protection VDSH1 -VFH1 VSTL VSTZ IIH1 Gate Driver 20,21 12,14,15,18 IIH1 VIH1 VIH2 ISH2 IDL2 VUVON VUVOFF IGND ILKCL Gate Driver 22,23 ISH1 IDL1 Protection IIL1 1,3,25,28 Gate Driver Protection VIL1 VIL2 26,27 IIL2 Gate Driver 16,17 VDSL1 -VFL1 VDSL2 -VFL2 ISCP ISL1 ISCP ISL2 Figure Table Terms BTM7751G HS-Source-Current Named during Short Circuit Named during Leakage-Cond. ISH1,2 ISCP Data Sheet Rev. 1.0, 2008-06-27 BTM7751G Block Diagram DHVS 5,10,19,24 Diagnosis Biasing Protection Gate Driver 20,21 Gate Driver 12,14,15,18 22,23 Protection 1,3,25,28 Gate Driver Protection 26,27 Gate Driver 16,17 Figure Block Diagram BTM7751G Data Sheet Rev. 1.0, 2008-06-27 BTM7751G Circuit Description Input Circuit control inputs IH1,2 consist TTL/CMOS compatible Schmitt-Triggers with hysteresis. Buffer amplifiers driven these stages convert logic signal into necessary form driving power output stages. inputs protected clamp-diodes. inputs connected internal gate-driving units N-channel vertical power-MOS-FETs. Output Stages output stages consist RDSON Power-MOS H-bridge. H-bridge configuration, D-MOS body diodes used freewheeling when communicating inductive loads. high-side switches used single switches, positive negative voltage spikes which occur when driving inductive loads limited integrated power clamp diodes. Short Circuit Protection outputs protected against output short circuit ground output short circuit supply voltage, overload (load short circuit). internal OP-Amp controls Drain-Source-Voltage comparing DS-Voltage-Drop with internal reference voltage. Above this trip point OP-Amp reduces output current depending junction temperature drop voltage. Overtemperature Protection high-side low-side switches also incorporate over temperature protection circuit with hysteresis which switches output transistors. case high-side switches, status output low. Undervoltage Lockout When reaches switch-on voltage VUVON becomes active with hysteresis. High-Side output transistors switched supply voltage drops below switch value VUVOFF. Open Load Detection open load detection BTM7751G works condition based voltage measurement source high side switch. order open load detection connected pull resistor. Because this pull resistor would connect bridge output supply needs disconnected whenever high side switch This done transistor shown application example (Figure "Application Example BTM7751G" Page 15). check open load: (both high side switches off) LOW, HIGH (only side switch Connect (open load pull transistor load connected properly will pull down voltage value close load disconnected resistor will pull voltage value close Vcc. voltage higher than open load detection voltage VOUT(OL) then will pulled down. Data Sheet Rev. 1.0, 2008-06-27 BTM7751G Status Flag status flag output open drain output with zener-diode which requires pull-up resistor, shown application circuit Figure "Application Example BTM7751G" Page Various errors listed table "Diagnosis" reported switching open drain output low. Table Flag Truth table Diagnosis (valid only High-Side-Switches) Remarks Outputs stand-by mode switch2 active switch1 active both switches active detected detected Inputs Normal operation; identical with functional truth table Open load high-side switch Open load high-side switch Overtemperature high-side switch1 Overtemperature high-side switch2 Overtemperature both high-side switches detected detected detected detected detected Under voltage Inputs: Logic Logic HIGH don't care Outputs: Output tristate condition Output sink condition Output source condition Voltage level undefined Status: error Error Data Sheet Rev. 1.0, 2008-06-27 BTM7751G Electrical Characteristics Absolute Maximum Ratings Absolute Maximum Ratings1) Pos. Parameter Symbol Limit Values min. High-Side-Switches (Pins DHVS, IH1,2 SH1,2) 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 5.1.6 5.1.7 5.1.8 5.1.9 5.1.10 5.1.11 5.1.12 5.1.13 5.1.14 5.1.15 5.1.16 5.1.17 5.1.18 5.1.19 Unit Remarks max. Supply voltage Supply voltage full short circuit protection HS-drain current2) HS-input current HS-input voltage Status pull voltage Status Output current Drain-Source-Clamp voltage VS(SCP) 25°C; Status Output Low-Side-Switches (Pins DL1,2, IL1,2 SL1,2) VDSL Supply voltage short circuit protection VDSL(SCP) LS-drain current LS-input voltage Junction temperature Storage temperature Input LS-Switch Input HS-Switch Status HS-Switch Output HS-Switch Tstg VESD VESD VESD VESD 25°C; Temperatures Protection4) other pins connected Ground subject production test; specified design Single pulse Internally limited susceptibility according EIA/JESD22-A114-B (1.5k, 100pF) Note: Stresses above ones listed here cause permanent damage device. Exposure absolute maximum rating conditions extended periods affect device reliability. Note: Integrated protection functions designed prevent destruction under fault conditions described data sheet. Fault conditions considered "outside" normal operating range. Protection functions designed continuous repetitive operation. Data Sheet Rev. 1.0, 2008-06-27 BTM7751G Pos. 5.2.20 5.2.21 5.2.22 5.2.23 5.2.24 Functional Range Parameter Supply voltage Input voltage Input voltage Status output current Junction temperature Symbol Limit Values min. max. After rising above VUVON Unit Remarks VUVOFF Note: Within functional range operates described circuit description. electrical characteristics specified within conditions given related electrical characteristics table Pos. 5.3.25 5.3.26 5.3.27 Thermal Resistance Parameter LS-junction soldering point1) HS-junction soldering point Junction Ambient Symbol Min. Limit Values Typ. Max. Unit Conditions measured measured RthJA Tj(HS) (P(HS)+ P(LS)) RthJSP RthJSP RthJA subject production test, specified design. Specified RthJA value according Jedec JESD51-2,-5,-7 natural convection 2s2p board; Product (chip+package) simulated 76.2 114.3 board with inner copper layers 70µm 35µm Cu). Data Sheet Rev. 1.0, 2008-06-27 BTM7751G Electrical Characteristics ISH1 ISH2 ISL1 ISL2 unless otherwise specified Pos. Parameter Symbol Limit Values min. typ. max. Unit Test Condition Current Consumption HS-switch 5.4.28 Quiescent current 5.4.29 5.4.30 5.4.31 5.4.32 Supply current; HS-switch active Supply current; both HS-switches active Leakage current high-side switch Leakage current through logic free wheeling condition Input current ILKCL normal operation failure mode Current Consumption LS-switch 5.4.33 5.4.34 Leakage current low-side switch VDSL increasing decreasing VUVON VUVOFF Under Voltage Lockout HS-switch 5.4.35 5.4.36 5.4.37 5.4.38 5.4.39 5.4.40 Switch-ON voltage Switch-OFF voltage Switch ON/OFF hysteresis Inverse diode high-side switch; Forward-voltage Inverse diode low-side switch; Forward-voltage Static drain-source on-resistance high-side switch VUVON VUVOFF VUVHY Output stages 5.4.41 Static drain-source on-resistance low-side switch Data Sheet Rev. 1.0, 2008-06-27 BTM7751G ISH1 ISH2 ISL1 ISL2 unless otherwise specified Pos. Parameter Symbol Limit Values min. typ. max. Unit Test Condition Short Circuit high-side switch 5.4.42 Initial peak current tdel VDSH ISCP VDSL Short Circuit high-side switch 5.4.43 5.4.44 Output pull-down-resistor Initial peak current VDSL 12V; tdel ISCP 11.5 Short Circuit low-side switch Thermal Shutdown 5.4.45 5.4.46 5.4.47 5.4.48 5.4.49 5.4.50 5.4.51 5.4.52 Thermal shutdown junction temperature Thermal switch-on junction temperature Temperature hysteresis output voltage Leakage current Zener-limit-voltage Open load detection voltage with TjSD TjSO Status Flag Output high-side switch Open load detection condition VOUT(OL) Status change after neg. input slope td(OL) Data Sheet Rev. 1.0, 2008-06-27 BTM7751G ISH1 ISH2 ISL1 ISL2 unless otherwise specified Pos. Parameter Symbol Limit Values min. typ. max. Unit Test Condition Switching times high-side switch 5.4.53 5.4.54 5.4.55 5.4.56 5.4.57 5.4.58 5.4.59 5.4.60 Turn-ON-time Turn-OFF-time Slew rate Slew rate tOFF dV/dtON -dV/dtOFF tOFF -dV/dtON RLoad Switching times low-side switch Turn-ON-time Turn-OFF-time Slew rate Slew rate RLoad dV/dtOFF RLoad Control Inputs high-side switches 5.4.61 5.4.62 5.4.63 5.4.64 5.4.65 5.4.66 5.4.67 5.4.68 H-input voltage L-input voltage Input voltage hysteresis H-input current L-input current Input series resistance Zener limit voltage Gate-threshold-voltage High High Control Inputs IL1, subject production test; specified design Note: listed characteristics ensured over operating range integrated circuit. Typical characteristics specified mean values expected over production spread. otherwise specified, typical characteristics apply given supply voltage. Data Sheet Rev. 1.0, 2008-06-27 BTM7751G Application Information Note: following simplified application examples given hint implementation device only shall regarded description warranty certain functionality, condition quality device. function described circuits must verified real application Watchdog Reset 4278G 47nF VS=12V 22µF 10µF DHVS 5,10,19,24 BCR192W Diagnosis Biasing Protection Gate Driver 20,21 12,14,15,18 optional open load Gate Driver XC866 22,23 Protection 1,3,25,28 Gate Driver Protection Gate Driver 26,27 16,17 case VDSL<-0.6V reverse battery current into might limited external resitors protect Figure Application Example BTM7751G Data Sheet Rev. 1.0, 2008-06-27 BTM7751G Package Outlines 2.65 0.35 +0.09 2.45 -0.2 -0.1 1.27 0.35 +0.15 +0.8 10.3 ±0.3 Index Marking 18.1 -0.4 Does include plastic metal protrusions 0.15 side Does include dambar protrusion 0.05 side Figure PG-DSO-28-22 (Plastic Transistor Single Outline Package) Green Product (RoHS compliant) meet world-wide customer requirements environmentally friendly products compliant with government regulations device available green product. Green products RoHS-Compliant (i.e Pb-free finish leads suitable Pb-free soldering according IPC/JEDEC J-STD-020). further information alternative packages, please visit website: Data Sheet 0.23 GPS05123 Dimensions Rev. 1.0, 2008-06-27 -0.2 BTM7751G Rev. Date Revision History Changes Initial Version 2008-06-27 Data Sheet Rev. 1.0, 2008-06-27 Edition 2008-06-27 Published Infineon Technologies 81726 Munich, Germany 6/27/08 Infineon Technologies Rights Reserved. Legal Disclaimer information given this document shall event regarded guarantee conditions characteristics. With respect examples hints given herein, typical values stated herein and/or information regarding application device, Infineon Technologies hereby disclaims warranties liabilities kind, including without limitation, warranties non-infringement intellectual property rights third party. Information further information technology, delivery terms conditions prices, please contact nearest Infineon Technologies Office (www.infineon.com). Warnings technical requirements, components contain dangerous substances. information types question, please contact nearest Infineon Technologies Office. Infineon Technologies components used life-support devices systems only with express written approval Infineon Technologies, failure such components reasonably expected cause failure that life-support device system affect safety effectiveness that device system. Life support devices systems intended implanted human body support and/or maintain sustain and/or protect human life. they fail, reasonable assume that health user other persons endangered. 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