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GaAs MMIC MIXER HMC256 ideal for: Microwave Radio VSAT Featu
Top Searches for this datasheetHMC256 GaAs MMIC MIXER HMC256 ideal for: Microwave Radio VSAT Features High Image Rejection: Input IP3: Wideband Size: MIXERS MIXERS CHIP Test Instrumentation Military Radios Radar Space Functional Diagram General Description HMC256 chip compact, 2.08 mm2, Mixer MMIC which used Image Reject Mixer (IRM) Single Sideband (SSB) upconverter. chip utilizes standard Hittite double-balanced mixer cells Lange Coupler realized GaAs MESFET technology. data with chip test fixture connected 0.025 mil) diameter wire bonds minimal length <0.51 (<20 mils). frequency quadrature hybrid used interface MMIC ports output. This provides example Mixer application. used from GHz. This Mixer more reliable, much smaller replacement hybrid drop-in style Mixer assemblies. Electrical Specifi cations, +25° Parameter Min. Frequency Range, Frequency Range, Frequency Range, Conversion Loss Noise Figure (SSB) Image Rejection (IR) Isolation Isolation Isolation (Input) Gain Compression (Input) Typ. 10.5 10.5 Max. Min. Typ. 11.7 11.7 10.5 10.5 Max. Units price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com HMC256 GaAs MMIC MIXER Conversion Gain Desired Sideband Temperature dBm, CONVERSION GAIN (dB) Conversion Gain Desired Sideband Drive, CONVERSION GAIN (dB) -40C +25C +85C FREQUENCY (GHz) FREQUENCY (GHz) Image Rejection Temperature dBm, Image Rejection Drive, IMAGE REJECTION (dB) IMAGE REJECTION (dB) -30C +25C +85C FREQUENCY (GHz) FREQUENCY (GHz) Return Loss RETURN LOSS (dB) Isolations ISOLATION (dB) RF/IF LO/IF LO/RF FREQUENCY (GHz) FREQUENCY (GHz) price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com MIXERS MIXERS CHIP HMC256 GaAs MMIC MIXER Bandwidth CONVERSION GAIN RETURN LOSS (dB) FREQUENCY (GHz) Conversion Gain Return Loss Input Drive, THIRD ORDER INTERCEPT (dBm) MIXERS MIXERS CHIP FREQUENCY (GHz) Absolute Maximum Ratings Input Drive Channel Temperature Continuous Pdiss (derate 9.36 mW/°C above Thermal Resistance (RTH) (junction bottom) Storage Temperature Operating Temperature 0.61 106.8 °C/W +150 price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com HMC256 GaAs MMIC MIXER Outline Drawing MIXERS MIXERS CHIP NOTES: DIMENSIONS INCHES [MM]. BOND PADS .004" SQUARE. TYPICAL BOND SPACING CENTER CENTER .006". BACKSIDE METALLIZATION: GOLD. BOND METALLIZATION: GOLD. BACKSIDE METAL GROUND. CONNECTION REQUIRED UNLABELED BOND PADS. Packaging Information Standard WP-3 (Waffle Pack) Alternate Refer "Packaging Information" section packaging dimensions. alternate packaging information contact Hittite Microwave Corporation. price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com HMC256 GaAs MMIC MIXER Descriptions Number Function Description Interface Schematic MIXERS MIXERS CHIP This coupled matched Ohm. This coupled matched Ohm. IF1, This coupled. operation must sink/source more than current failure result. Backside backside must connect ground. price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com HMC256 GaAs MMIC MIXER Image Reject Mixer Suggested Application Circuit Below Figure photo Figure schematic HMC256 image reject mixer MMIC connected quadrature hybrid (120 MHz) manufactured Merrimac Industries West Caldwell, (P/N QHZ-2A-120). Data presented HMC256 MMIC obtained using circuit described here. Please note that image rejection isolation performance dependent selection frequency hybrid. performance specification frequency quadrature hybrid well phase balance VSWR interface circuit HMC256 MMIC will effect overall performance. MIXERS MIXERS CHIP Figure Complete Assembly Figure Schematic HMC256 MMIC Connected Quadrature Hybrid Handling Precautions Follow these precautions avoid permanent damage. Storage: bare placed either Waffle based protective containers, then sealed protective shipment. Once sealed protective been opened, should stored nitrogen environment. Cleanliness: Handle chips clean environment. attempt clean chip using liquid cleaning systems. Static Sensitivity: Follow precautions protect against strikes. Transients: Suppress instrument bias supply transients while bias applied. shielded signal bias cables minimize inductive pick-up. General Handling: Handle chip along edges with vacuum collet with sharp pair bent tweezers. surface chip fragile bridges should touched with vacuum collet, tweezers, fingers. Mounting chip back-metallized mounted with AuSn eutectic preforms with electrically conductive epoxy. mounting surface should clean flat. Eutectic Attach: 80/20 gold preform recommended with work surface temperature tool temperature When 90/10 nitrogen/hydrogen applied, tool temperature should expose chip temperature greater than more than seconds. more than seconds scrubbing should required attachment. Epoxy Attach: Apply minimum amount epoxy mounting surface that thin epoxy fillet observed around perimeter chip once placed into position. Cure epoxy manufacturer's schedule. Wire Bonding Ball wedge bond with 0.025 mil) diameter pure gold wire. Thermosonic wirebonding with nominal stage temperature ball bonding force grams wedge bonding force grams recommended. minimum level ultrasonic energy achieve reliable wirebonds. Wirebonds should started chip terminated package substrate. bonds should short possible <0.31 mils). price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com Other recent searchesSK3351DP - SK3351DP SK3351DP Datasheet SK3351HP - SK3351HP SK3351HP Datasheet SK3351GP - SK3351GP SK3351GP Datasheet SK3351AP - SK3351AP SK3351AP Datasheet SK3351DR - SK3351DR SK3351DR Datasheet SCCS043C - SCCS043C SCCS043C Datasheet KIC7WZ08FK - KIC7WZ08FK KIC7WZ08FK Datasheet IXF1010 - IXF1010 IXF1010 Datasheet GHB-1206L-O - GHB-1206L-O GHB-1206L-O Datasheet ED-014UR - ED-014UR ED-014UR Datasheet 2N3771 - 2N3771 2N3771 Datasheet 2N3772 - 2N3772 2N3772 Datasheet
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